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Global Flip Chip Packages Market Research Report 2025
Published Date: July 2025
|
Report Code: QYRE-Auto-24D5847
Home | Market Reports | Computers & Electronics
Global Flip Chip Packages Market Insights and Forecast to 2028
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Global Flip Chip Packages Market Research Report 2025

Code: QYRE-Auto-24D5847
Report
July 2025
Pages:63
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Advanced Semiconductor Engineering
Chipbond Technology
Intel
Siliconware Precision Industries
Taiwan Semiconductor Manufacturing Company

Flip Chip Packages Market

The global market for Flip Chip Packages was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps.
The North America region Flip Chip Packages market is projected to grow at the highest CAGR during the forecast period.
This report aims to provide a comprehensive presentation of the global market for Flip Chip Packages, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip Packages.
The Flip Chip Packages market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Flip Chip Packages market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Flip Chip Packages companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Flip Chip Packages Market Report

Report Metric Details
Report Name Flip Chip Packages Market
Segment by Type
  • Organic Material
  • Ceramic Materials
  • Flexible Material
Segment by Application
  • Electronic Products
  • Mechanical Circuit Board
  • Other
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company Advanced Semiconductor Engineering, Chipbond Technology, Intel, Siliconware Precision Industries, Taiwan Semiconductor Manufacturing Company
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of Flip Chip Packages company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Flip Chip Packages Market report?

Ans: The main players in the Flip Chip Packages Market are Advanced Semiconductor Engineering, Chipbond Technology, Intel, Siliconware Precision Industries, Taiwan Semiconductor Manufacturing Company

What are the Application segmentation covered in the Flip Chip Packages Market report?

Ans: The Applications covered in the Flip Chip Packages Market report are Electronic Products, Mechanical Circuit Board, Other

What are the Type segmentation covered in the Flip Chip Packages Market report?

Ans: The Types covered in the Flip Chip Packages Market report are Organic Material, Ceramic Materials, Flexible Material

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Flip Chip Packages Market Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 Organic Material
1.2.3 Ceramic Materials
1.2.4 Flexible Material
1.3 Market by Application
1.3.1 Global Flip Chip Packages Market Growth by Application: 2020 VS 2024 VS 2031
1.3.2 Electronic Products
1.3.3 Mechanical Circuit Board
1.3.4 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Flip Chip Packages Market Perspective (2020-2031)
2.2 Global Flip Chip Packages Growth Trends by Region
2.2.1 Global Flip Chip Packages Market Size by Region: 2020 VS 2024 VS 2031
2.2.2 Flip Chip Packages Historic Market Size by Region (2020-2025)
2.2.3 Flip Chip Packages Forecasted Market Size by Region (2026-2031)
2.3 Flip Chip Packages Market Dynamics
2.3.1 Flip Chip Packages Industry Trends
2.3.2 Flip Chip Packages Market Drivers
2.3.3 Flip Chip Packages Market Challenges
2.3.4 Flip Chip Packages Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Flip Chip Packages Players by Revenue
3.1.1 Global Top Flip Chip Packages Players by Revenue (2020-2025)
3.1.2 Global Flip Chip Packages Revenue Market Share by Players (2020-2025)
3.2 Global Flip Chip Packages Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Flip Chip Packages Revenue
3.4 Global Flip Chip Packages Market Concentration Ratio
3.4.1 Global Flip Chip Packages Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Flip Chip Packages Revenue in 2024
3.5 Global Key Players of Flip Chip Packages Head office and Area Served
3.6 Global Key Players of Flip Chip Packages, Product and Application
3.7 Global Key Players of Flip Chip Packages, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Flip Chip Packages Breakdown Data by Type
4.1 Global Flip Chip Packages Historic Market Size by Type (2020-2025)
4.2 Global Flip Chip Packages Forecasted Market Size by Type (2026-2031)
5 Flip Chip Packages Breakdown Data by Application
5.1 Global Flip Chip Packages Historic Market Size by Application (2020-2025)
5.2 Global Flip Chip Packages Forecasted Market Size by Application (2026-2031)
6 North America
6.1 North America Flip Chip Packages Market Size (2020-2031)
6.2 North America Flip Chip Packages Market Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America Flip Chip Packages Market Size by Country (2020-2025)
6.4 North America Flip Chip Packages Market Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Flip Chip Packages Market Size (2020-2031)
7.2 Europe Flip Chip Packages Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe Flip Chip Packages Market Size by Country (2020-2025)
7.4 Europe Flip Chip Packages Market Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Flip Chip Packages Market Size (2020-2031)
8.2 Asia-Pacific Flip Chip Packages Market Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific Flip Chip Packages Market Size by Region (2020-2025)
8.4 Asia-Pacific Flip Chip Packages Market Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Flip Chip Packages Market Size (2020-2031)
9.2 Latin America Flip Chip Packages Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America Flip Chip Packages Market Size by Country (2020-2025)
9.4 Latin America Flip Chip Packages Market Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Flip Chip Packages Market Size (2020-2031)
10.2 Middle East & Africa Flip Chip Packages Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa Flip Chip Packages Market Size by Country (2020-2025)
10.4 Middle East & Africa Flip Chip Packages Market Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Advanced Semiconductor Engineering
11.1.1 Advanced Semiconductor Engineering Company Details
11.1.2 Advanced Semiconductor Engineering Business Overview
11.1.3 Advanced Semiconductor Engineering Flip Chip Packages Introduction
11.1.4 Advanced Semiconductor Engineering Revenue in Flip Chip Packages Business (2020-2025)
11.1.5 Advanced Semiconductor Engineering Recent Development
11.2 Chipbond Technology
11.2.1 Chipbond Technology Company Details
11.2.2 Chipbond Technology Business Overview
11.2.3 Chipbond Technology Flip Chip Packages Introduction
11.2.4 Chipbond Technology Revenue in Flip Chip Packages Business (2020-2025)
11.2.5 Chipbond Technology Recent Development
11.3 Intel
11.3.1 Intel Company Details
11.3.2 Intel Business Overview
11.3.3 Intel Flip Chip Packages Introduction
11.3.4 Intel Revenue in Flip Chip Packages Business (2020-2025)
11.3.5 Intel Recent Development
11.4 Siliconware Precision Industries
11.4.1 Siliconware Precision Industries Company Details
11.4.2 Siliconware Precision Industries Business Overview
11.4.3 Siliconware Precision Industries Flip Chip Packages Introduction
11.4.4 Siliconware Precision Industries Revenue in Flip Chip Packages Business (2020-2025)
11.4.5 Siliconware Precision Industries Recent Development
11.5 Taiwan Semiconductor Manufacturing Company
11.5.1 Taiwan Semiconductor Manufacturing Company Company Details
11.5.2 Taiwan Semiconductor Manufacturing Company Business Overview
11.5.3 Taiwan Semiconductor Manufacturing Company Flip Chip Packages Introduction
11.5.4 Taiwan Semiconductor Manufacturing Company Revenue in Flip Chip Packages Business (2020-2025)
11.5.5 Taiwan Semiconductor Manufacturing Company Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
FEATURED COMPANIES
Advanced Semiconductor Engineering
Chipbond Technology
Intel
Siliconware Precision Industries
Taiwan Semiconductor Manufacturing Company
List of Tables
 Table 1. Global Flip Chip Packages Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031
 Table 2. Key Players of Organic Material
 Table 3. Key Players of Ceramic Materials
 Table 4. Key Players of Flexible Material
 Table 5. Global Flip Chip Packages Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031
 Table 6. Global Flip Chip Packages Market Size by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 7. Global Flip Chip Packages Market Size by Region (2020-2025) & (US$ Million)
 Table 8. Global Flip Chip Packages Market Share by Region (2020-2025)
 Table 9. Global Flip Chip Packages Forecasted Market Size by Region (2026-2031) & (US$ Million)
 Table 10. Global Flip Chip Packages Market Share by Region (2026-2031)
 Table 11. Flip Chip Packages Market Trends
 Table 12. Flip Chip Packages Market Drivers
 Table 13. Flip Chip Packages Market Challenges
 Table 14. Flip Chip Packages Market Restraints
 Table 15. Global Flip Chip Packages Revenue by Players (2020-2025) & (US$ Million)
 Table 16. Global Flip Chip Packages Market Share by Players (2020-2025)
 Table 17. Global Top Flip Chip Packages Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Flip Chip Packages as of 2024)
 Table 18. Ranking of Global Top Flip Chip Packages Companies by Revenue (US$ Million) in 2024
 Table 19. Global 5 Largest Players Market Share by Flip Chip Packages Revenue (CR5 and HHI) & (2020-2025)
 Table 20. Global Key Players of Flip Chip Packages, Headquarters and Area Served
 Table 21. Global Key Players of Flip Chip Packages, Product and Application
 Table 22. Global Key Players of Flip Chip Packages, Date of Enter into This Industry
 Table 23. Mergers & Acquisitions, Expansion Plans
 Table 24. Global Flip Chip Packages Market Size by Type (2020-2025) & (US$ Million)
 Table 25. Global Flip Chip Packages Revenue Market Share by Type (2020-2025)
 Table 26. Global Flip Chip Packages Forecasted Market Size by Type (2026-2031) & (US$ Million)
 Table 27. Global Flip Chip Packages Revenue Market Share by Type (2026-2031)
 Table 28. Global Flip Chip Packages Market Size by Application (2020-2025) & (US$ Million)
 Table 29. Global Flip Chip Packages Revenue Market Share by Application (2020-2025)
 Table 30. Global Flip Chip Packages Forecasted Market Size by Application (2026-2031) & (US$ Million)
 Table 31. Global Flip Chip Packages Revenue Market Share by Application (2026-2031)
 Table 32. North America Flip Chip Packages Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 33. North America Flip Chip Packages Market Size by Country (2020-2025) & (US$ Million)
 Table 34. North America Flip Chip Packages Market Size by Country (2026-2031) & (US$ Million)
 Table 35. Europe Flip Chip Packages Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 36. Europe Flip Chip Packages Market Size by Country (2020-2025) & (US$ Million)
 Table 37. Europe Flip Chip Packages Market Size by Country (2026-2031) & (US$ Million)
 Table 38. Asia-Pacific Flip Chip Packages Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 39. Asia-Pacific Flip Chip Packages Market Size by Region (2020-2025) & (US$ Million)
 Table 40. Asia-Pacific Flip Chip Packages Market Size by Region (2026-2031) & (US$ Million)
 Table 41. Latin America Flip Chip Packages Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 42. Latin America Flip Chip Packages Market Size by Country (2020-2025) & (US$ Million)
 Table 43. Latin America Flip Chip Packages Market Size by Country (2026-2031) & (US$ Million)
 Table 44. Middle East & Africa Flip Chip Packages Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 45. Middle East & Africa Flip Chip Packages Market Size by Country (2020-2025) & (US$ Million)
 Table 46. Middle East & Africa Flip Chip Packages Market Size by Country (2026-2031) & (US$ Million)
 Table 47. Advanced Semiconductor Engineering Company Details
 Table 48. Advanced Semiconductor Engineering Business Overview
 Table 49. Advanced Semiconductor Engineering Flip Chip Packages Product
 Table 50. Advanced Semiconductor Engineering Revenue in Flip Chip Packages Business (2020-2025) & (US$ Million)
 Table 51. Advanced Semiconductor Engineering Recent Development
 Table 52. Chipbond Technology Company Details
 Table 53. Chipbond Technology Business Overview
 Table 54. Chipbond Technology Flip Chip Packages Product
 Table 55. Chipbond Technology Revenue in Flip Chip Packages Business (2020-2025) & (US$ Million)
 Table 56. Chipbond Technology Recent Development
 Table 57. Intel Company Details
 Table 58. Intel Business Overview
 Table 59. Intel Flip Chip Packages Product
 Table 60. Intel Revenue in Flip Chip Packages Business (2020-2025) & (US$ Million)
 Table 61. Intel Recent Development
 Table 62. Siliconware Precision Industries Company Details
 Table 63. Siliconware Precision Industries Business Overview
 Table 64. Siliconware Precision Industries Flip Chip Packages Product
 Table 65. Siliconware Precision Industries Revenue in Flip Chip Packages Business (2020-2025) & (US$ Million)
 Table 66. Siliconware Precision Industries Recent Development
 Table 67. Taiwan Semiconductor Manufacturing Company Company Details
 Table 68. Taiwan Semiconductor Manufacturing Company Business Overview
 Table 69. Taiwan Semiconductor Manufacturing Company Flip Chip Packages Product
 Table 70. Taiwan Semiconductor Manufacturing Company Revenue in Flip Chip Packages Business (2020-2025) & (US$ Million)
 Table 71. Taiwan Semiconductor Manufacturing Company Recent Development
 Table 72. Research Programs/Design for This Report
 Table 73. Key Data Information from Secondary Sources
 Table 74. Key Data Information from Primary Sources
 Table 75. Authors List of This Report


List of Figures
 Figure 1. Flip Chip Packages Picture
 Figure 2. Global Flip Chip Packages Market Size Comparison by Type (2020-2031) & (US$ Million)
 Figure 3. Global Flip Chip Packages Market Share by Type: 2024 VS 2031
 Figure 4. Organic Material Features
 Figure 5. Ceramic Materials Features
 Figure 6. Flexible Material Features
 Figure 7. Global Flip Chip Packages Market Size by Application (2020-2031) & (US$ Million)
 Figure 8. Global Flip Chip Packages Market Share by Application: 2024 VS 2031
 Figure 9. Electronic Products Case Studies
 Figure 10. Mechanical Circuit Board Case Studies
 Figure 11. Other Case Studies
 Figure 12. Flip Chip Packages Report Years Considered
 Figure 13. Global Flip Chip Packages Market Size (US$ Million), Year-over-Year: 2020-2031
 Figure 14. Global Flip Chip Packages Market Size, (US$ Million), 2020 VS 2024 VS 2031
 Figure 15. Global Flip Chip Packages Market Share by Region: 2024 VS 2031
 Figure 16. Global Flip Chip Packages Market Share by Players in 2024
 Figure 17. Global Top Flip Chip Packages Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Flip Chip Packages as of 2024)
 Figure 18. The Top 10 and 5 Players Market Share by Flip Chip Packages Revenue in 2024
 Figure 19. North America Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 20. North America Flip Chip Packages Market Share by Country (2020-2031)
 Figure 21. United States Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 22. Canada Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 23. Europe Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 24. Europe Flip Chip Packages Market Share by Country (2020-2031)
 Figure 25. Germany Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 26. France Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 27. U.K. Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 28. Italy Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 29. Russia Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 30. Nordic Countries Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 31. Asia-Pacific Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 32. Asia-Pacific Flip Chip Packages Market Share by Region (2020-2031)
 Figure 33. China Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 34. Japan Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 35. South Korea Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 36. Southeast Asia Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 37. India Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 38. Australia Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 39. Latin America Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 40. Latin America Flip Chip Packages Market Share by Country (2020-2031)
 Figure 41. Mexico Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 42. Brazil Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 43. Middle East & Africa Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 44. Middle East & Africa Flip Chip Packages Market Share by Country (2020-2031)
 Figure 45. Turkey Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 46. Saudi Arabia Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 47. UAE Flip Chip Packages Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 48. Advanced Semiconductor Engineering Revenue Growth Rate in Flip Chip Packages Business (2020-2025)
 Figure 49. Chipbond Technology Revenue Growth Rate in Flip Chip Packages Business (2020-2025)
 Figure 50. Intel Revenue Growth Rate in Flip Chip Packages Business (2020-2025)
 Figure 51. Siliconware Precision Industries Revenue Growth Rate in Flip Chip Packages Business (2020-2025)
 Figure 52. Taiwan Semiconductor Manufacturing Company Revenue Growth Rate in Flip Chip Packages Business (2020-2025)
 Figure 53. Bottom-up and Top-down Approaches for This Report
 Figure 54. Data Triangulation
 Figure 55. Key Executives Interviewed
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