The global market for BGA Packaging Solder Ball was valued at US$ 165 million in the year 2024 and is projected to reach a revised size of US$ 249 million by 2031, growing at a CAGR of 6.2% during the forecast period.

BGA Packaging Solder Ball Market

BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial role in connecting the integrated circuit to the printed circuit board (PCB).

Market Drivers: Miniaturization of Electronic Devices: The trend toward smaller and more compact electronic devices, such as smartphones, tablets, and wearables, drives the demand for BGA packaging with solder balls. BGA offers a high pin count in a smaller footprint, making it suitable for miniaturized electronics.

Increasing Demand for High-Performance Computing: Growing demand for high-performance computing, data centers, and graphics processing units (GPUs) fuels the adoption of advanced packaging solutions like BGA. Solder balls contribute to the reliability and thermal performance of these high-power components.

Advancements in Semiconductor Technology: Ongoing advancements in semiconductor manufacturing technologies, including finer pitch and higher pin counts, necessitate the development of solder balls with improved materials and manufacturing processes to meet the requirements of next-generation electronic devices.

Rise in Internet of Things (IoT) Devices: The proliferation of IoT devices, which require compact and efficient packaging solutions, boosts the demand for BGA packaging with solder balls. BGA technology supports the integration of sensors and processors in small form factors.

Consumer Electronics Industry Growth: The consumer electronics industry"s continual growth, driven by innovations in smartphones, laptops, gaming consoles, and other electronic gadgets, contributes significantly to the demand for BGA packaging solder balls.

Market Restrictions: Cost and Complexity of Manufacturing: The manufacturing processes involved in producing BGA packaging with solder balls can be complex and may require advanced equipment. The associated costs, including material and manufacturing expenses, could be a limitation for some manufacturers or applications.

Stringent Quality and Compliance Standards: Industries such as aerospace and automotive have stringent quality and compliance standards. Meeting these standards, including requirements for high-reliability solder joints, can be challenging and may act as a restriction for certain applications.

Report Scope

This report aims to provide a comprehensive presentation of the global market for BGA Packaging Solder Ball, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding BGA Packaging Solder Ball.

The BGA Packaging Solder Ball market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global BGA Packaging Solder Ball market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the BGA Packaging Solder Ball manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of BGA Packaging Solder Ball Market Report

Report Metric	Details
Report Name	BGA Packaging Solder Ball Market
Accounted market size in year	US$ 165 million
Forecasted market size in 2031	US$ 249 million
CAGR	6.2%
Base Year	year
Forecasted years	2025 - 2031
by Type	Up to 0.2 mm 0.2-0.5 mm Above 0.5 mm
by Application	IDM OSAT
Production by Region	North America Europe China Japan South Korea Taiwan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Senju Metal, Accurus, DS HiMetal, NMC, MKE, PMTC, Indium Corporation, YCTC, Shenmao Technology, Shanghai hiking solder material
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of BGA Packaging Solder Ball manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of BGA Packaging Solder Ball by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of BGA Packaging Solder Ball in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is BGA Packaging Solder Ball Market growing?

Ans: The BGA Packaging Solder Ball Market witnessing a CAGR of 6.2% during the forecast period 2025-2031.

What is the BGA Packaging Solder Ball Market size in 2031?

Ans: The BGA Packaging Solder Ball Market size in 2031 will be US$ 249 million.

Who are the main players in the BGA Packaging Solder Ball Market report?

Ans: The main players in the BGA Packaging Solder Ball Market are Senju Metal, Accurus, DS HiMetal, NMC, MKE, PMTC, Indium Corporation, YCTC, Shenmao Technology, Shanghai hiking solder material

What are the Application segmentation covered in the BGA Packaging Solder Ball Market report?

Ans: The Applications covered in the BGA Packaging Solder Ball Market report are IDM, OSAT

What are the Type segmentation covered in the BGA Packaging Solder Ball Market report?

Ans: The Types covered in the BGA Packaging Solder Ball Market report are Up to 0.2 mm, 0.2-0.5 mm, Above 0.5 mm

1 BGA Packaging Solder Ball Market Overview

1.1 Product Definition

1.2 BGA Packaging Solder Ball by Type

1.2.1 Global BGA Packaging Solder Ball Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Up to 0.2 mm

1.2.3 0.2-0.5 mm

1.2.4 Above 0.5 mm

1.3 BGA Packaging Solder Ball by Application

1.3.1 Global BGA Packaging Solder Ball Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 IDM

1.3.3 OSAT

1.4 Global Market Growth Prospects

1.4.1 Global BGA Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global BGA Packaging Solder Ball Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global BGA Packaging Solder Ball Production Estimates and Forecasts (2020-2031)

1.4.4 Global BGA Packaging Solder Ball Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global BGA Packaging Solder Ball Production Market Share by Manufacturers (2020-2025)

2.2 Global BGA Packaging Solder Ball Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of BGA Packaging Solder Ball, Industry Ranking, 2023 VS 2024

2.4 Global BGA Packaging Solder Ball Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global BGA Packaging Solder Ball Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of BGA Packaging Solder Ball, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of BGA Packaging Solder Ball, Product Offered and Application

2.8 Global Key Manufacturers of BGA Packaging Solder Ball, Date of Enter into This Industry

2.9 BGA Packaging Solder Ball Market Competitive Situation and Trends

2.9.1 BGA Packaging Solder Ball Market Concentration Rate

2.9.2 Global 5 and 10 Largest BGA Packaging Solder Ball Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 BGA Packaging Solder Ball Production by Region

3.1 Global BGA Packaging Solder Ball Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global BGA Packaging Solder Ball Production Value by Region (2020-2031)

3.2.1 Global BGA Packaging Solder Ball Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of BGA Packaging Solder Ball by Region (2026-2031)

3.3 Global BGA Packaging Solder Ball Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global BGA Packaging Solder Ball Production Volume by Region (2020-2031)

3.4.1 Global BGA Packaging Solder Ball Production by Region (2020-2025)

3.4.2 Global Forecasted Production of BGA Packaging Solder Ball by Region (2026-2031)

3.5 Global BGA Packaging Solder Ball Market Price Analysis by Region (2020-2025)

3.6 Global BGA Packaging Solder Ball Production and Value, Year-over-Year Growth

3.6.1 North America BGA Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe BGA Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)

3.6.3 China BGA Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan BGA Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)

3.6.5 South Korea BGA Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)

3.6.6 Taiwan BGA Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)

4 BGA Packaging Solder Ball Consumption by Region

4.1 Global BGA Packaging Solder Ball Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global BGA Packaging Solder Ball Consumption by Region (2020-2031)

4.2.1 Global BGA Packaging Solder Ball Consumption by Region (2020-2025)

4.2.2 Global BGA Packaging Solder Ball Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America BGA Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America BGA Packaging Solder Ball Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe BGA Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe BGA Packaging Solder Ball Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific BGA Packaging Solder Ball Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific BGA Packaging Solder Ball Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Israel

5 Segment by Type

5.1 Global BGA Packaging Solder Ball Production by Type (2020-2031)

5.1.1 Global BGA Packaging Solder Ball Production by Type (2020-2025)

5.1.2 Global BGA Packaging Solder Ball Production by Type (2026-2031)

5.1.3 Global BGA Packaging Solder Ball Production Market Share by Type (2020-2031)

5.2 Global BGA Packaging Solder Ball Production Value by Type (2020-2031)

5.2.1 Global BGA Packaging Solder Ball Production Value by Type (2020-2025)

5.2.2 Global BGA Packaging Solder Ball Production Value by Type (2026-2031)

5.2.3 Global BGA Packaging Solder Ball Production Value Market Share by Type (2020-2031)

5.3 Global BGA Packaging Solder Ball Price by Type (2020-2031)

6 Segment by Application

6.1 Global BGA Packaging Solder Ball Production by Application (2020-2031)

6.1.1 Global BGA Packaging Solder Ball Production by Application (2020-2025)

6.1.2 Global BGA Packaging Solder Ball Production by Application (2026-2031)

6.1.3 Global BGA Packaging Solder Ball Production Market Share by Application (2020-2031)

6.2 Global BGA Packaging Solder Ball Production Value by Application (2020-2031)

6.2.1 Global BGA Packaging Solder Ball Production Value by Application (2020-2025)

6.2.2 Global BGA Packaging Solder Ball Production Value by Application (2026-2031)

6.2.3 Global BGA Packaging Solder Ball Production Value Market Share by Application (2020-2031)

6.3 Global BGA Packaging Solder Ball Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Senju Metal

7.1.1 Senju Metal BGA Packaging Solder Ball Company Information

7.1.2 Senju Metal BGA Packaging Solder Ball Product Portfolio

7.1.3 Senju Metal BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Senju Metal Main Business and Markets Served

7.1.5 Senju Metal Recent Developments/Updates

7.2 Accurus

7.2.1 Accurus BGA Packaging Solder Ball Company Information

7.2.2 Accurus BGA Packaging Solder Ball Product Portfolio

7.2.3 Accurus BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Accurus Main Business and Markets Served

7.2.5 Accurus Recent Developments/Updates

7.3 DS HiMetal

7.3.1 DS HiMetal BGA Packaging Solder Ball Company Information

7.3.2 DS HiMetal BGA Packaging Solder Ball Product Portfolio

7.3.3 DS HiMetal BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.3.4 DS HiMetal Main Business and Markets Served

7.3.5 DS HiMetal Recent Developments/Updates

7.4 NMC

7.4.1 NMC BGA Packaging Solder Ball Company Information

7.4.2 NMC BGA Packaging Solder Ball Product Portfolio

7.4.3 NMC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.4.4 NMC Main Business and Markets Served

7.4.5 NMC Recent Developments/Updates

7.5 MKE

7.5.1 MKE BGA Packaging Solder Ball Company Information

7.5.2 MKE BGA Packaging Solder Ball Product Portfolio

7.5.3 MKE BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.5.4 MKE Main Business and Markets Served

7.5.5 MKE Recent Developments/Updates

7.6 PMTC

7.6.1 PMTC BGA Packaging Solder Ball Company Information

7.6.2 PMTC BGA Packaging Solder Ball Product Portfolio

7.6.3 PMTC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.6.4 PMTC Main Business and Markets Served

7.6.5 PMTC Recent Developments/Updates

7.7 Indium Corporation

7.7.1 Indium Corporation BGA Packaging Solder Ball Company Information

7.7.2 Indium Corporation BGA Packaging Solder Ball Product Portfolio

7.7.3 Indium Corporation BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Indium Corporation Main Business and Markets Served

7.7.5 Indium Corporation Recent Developments/Updates

7.8 YCTC

7.8.1 YCTC BGA Packaging Solder Ball Company Information

7.8.2 YCTC BGA Packaging Solder Ball Product Portfolio

7.8.3 YCTC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.8.4 YCTC Main Business and Markets Served

7.8.5 YCTC Recent Developments/Updates

7.9 Shenmao Technology

7.9.1 Shenmao Technology BGA Packaging Solder Ball Company Information

7.9.2 Shenmao Technology BGA Packaging Solder Ball Product Portfolio

7.9.3 Shenmao Technology BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Shenmao Technology Main Business and Markets Served

7.9.5 Shenmao Technology Recent Developments/Updates

7.10 Shanghai hiking solder material

7.10.1 Shanghai hiking solder material BGA Packaging Solder Ball Company Information

7.10.2 Shanghai hiking solder material BGA Packaging Solder Ball Product Portfolio

7.10.3 Shanghai hiking solder material BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)

7.10.4 Shanghai hiking solder material Main Business and Markets Served

7.10.5 Shanghai hiking solder material Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 BGA Packaging Solder Ball Industry Chain Analysis

8.2 BGA Packaging Solder Ball Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 BGA Packaging Solder Ball Production Mode & Process Analysis

8.4 BGA Packaging Solder Ball Sales and Marketing

8.4.1 BGA Packaging Solder Ball Sales Channels

8.4.2 BGA Packaging Solder Ball Distributors

8.5 BGA Packaging Solder Ball Customer Analysis

9 BGA Packaging Solder Ball Market Dynamics

9.1 BGA Packaging Solder Ball Industry Trends

9.2 BGA Packaging Solder Ball Market Drivers

9.3 BGA Packaging Solder Ball Market Challenges

9.4 BGA Packaging Solder Ball Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

Shanghai hiking solder material

List of Tables

Table 1. Global BGA Packaging Solder Ball Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global BGA Packaging Solder Ball Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global BGA Packaging Solder Ball Production Capacity (Million Units) by Manufacturers in 2024

Table 4. Global BGA Packaging Solder Ball Production by Manufacturers (2020-2025) & (Million Units)

Table 5. Global BGA Packaging Solder Ball Production Market Share by Manufacturers (2020-2025)

Table 6. Global BGA Packaging Solder Ball Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global BGA Packaging Solder Ball Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of BGA Packaging Solder Ball, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in BGA Packaging Solder Ball as of 2024)

Table 10. Global Market BGA Packaging Solder Ball Average Price by Manufacturers (US$/K Units) & (2020-2025)

Table 11. Global Key Manufacturers of BGA Packaging Solder Ball, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of BGA Packaging Solder Ball, Product Offered and Application

Table 13. Global Key Manufacturers of BGA Packaging Solder Ball, Date of Enter into This Industry

Table 14. Global BGA Packaging Solder Ball Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global BGA Packaging Solder Ball Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global BGA Packaging Solder Ball Production Value (US$ Million) by Region (2020-2025)

Table 18. Global BGA Packaging Solder Ball Production Value Market Share by Region (2020-2025)

Table 19. Global BGA Packaging Solder Ball Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global BGA Packaging Solder Ball Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global BGA Packaging Solder Ball Production Comparison by Region: 2020 VS 2024 VS 2031 (Million Units)

Table 22. Global BGA Packaging Solder Ball Production (Million Units) by Region (2020-2025)

Table 23. Global BGA Packaging Solder Ball Production Market Share by Region (2020-2025)

Table 24. Global BGA Packaging Solder Ball Production (Million Units) Forecast by Region (2026-2031)

Table 25. Global BGA Packaging Solder Ball Production Market Share Forecast by Region (2026-2031)

Table 26. Global BGA Packaging Solder Ball Market Average Price (US$/K Units) by Region (2020-2025)

Table 27. Global BGA Packaging Solder Ball Market Average Price (US$/K Units) by Region (2026-2031)

Table 28. Global BGA Packaging Solder Ball Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Million Units)

Table 29. Global BGA Packaging Solder Ball Consumption by Region (2020-2025) & (Million Units)

Table 30. Global BGA Packaging Solder Ball Consumption Market Share by Region (2020-2025)

Table 31. Global BGA Packaging Solder Ball Forecasted Consumption by Region (2026-2031) & (Million Units)

Table 32. Global BGA Packaging Solder Ball Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America BGA Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Units)

Table 34. North America BGA Packaging Solder Ball Consumption by Country (2020-2025) & (Million Units)

Table 35. North America BGA Packaging Solder Ball Consumption by Country (2026-2031) & (Million Units)

Table 36. Europe BGA Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Units)

Table 37. Europe BGA Packaging Solder Ball Consumption by Country (2020-2025) & (Million Units)

Table 38. Europe BGA Packaging Solder Ball Consumption by Country (2026-2031) & (Million Units)

Table 39. Asia Pacific BGA Packaging Solder Ball Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Million Units)

Table 40. Asia Pacific BGA Packaging Solder Ball Consumption by Region (2020-2025) & (Million Units)

Table 41. Asia Pacific BGA Packaging Solder Ball Consumption by Region (2026-2031) & (Million Units)

Table 42. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Units)

Table 43. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption by Country (2020-2025) & (Million Units)

Table 44. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption by Country (2026-2031) & (Million Units)

Table 45. Global BGA Packaging Solder Ball Production (Million Units) by Type (2020-2025)

Table 46. Global BGA Packaging Solder Ball Production (Million Units) by Type (2026-2031)

Table 47. Global BGA Packaging Solder Ball Production Market Share by Type (2020-2025)

Table 48. Global BGA Packaging Solder Ball Production Market Share by Type (2026-2031)

Table 49. Global BGA Packaging Solder Ball Production Value (US$ Million) by Type (2020-2025)

Table 50. Global BGA Packaging Solder Ball Production Value (US$ Million) by Type (2026-2031)

Table 51. Global BGA Packaging Solder Ball Production Value Market Share by Type (2020-2025)

Table 52. Global BGA Packaging Solder Ball Production Value Market Share by Type (2026-2031)

Table 53. Global BGA Packaging Solder Ball Price (US$/K Units) by Type (2020-2025)

Table 54. Global BGA Packaging Solder Ball Price (US$/K Units) by Type (2026-2031)

Table 55. Global BGA Packaging Solder Ball Production (Million Units) by Application (2020-2025)

Table 56. Global BGA Packaging Solder Ball Production (Million Units) by Application (2026-2031)

Table 57. Global BGA Packaging Solder Ball Production Market Share by Application (2020-2025)

Table 58. Global BGA Packaging Solder Ball Production Market Share by Application (2026-2031)

Table 59. Global BGA Packaging Solder Ball Production Value (US$ Million) by Application (2020-2025)

Table 60. Global BGA Packaging Solder Ball Production Value (US$ Million) by Application (2026-2031)

Table 61. Global BGA Packaging Solder Ball Production Value Market Share by Application (2020-2025)

Table 62. Global BGA Packaging Solder Ball Production Value Market Share by Application (2026-2031)

Table 63. Global BGA Packaging Solder Ball Price (US$/K Units) by Application (2020-2025)

Table 64. Global BGA Packaging Solder Ball Price (US$/K Units) by Application (2026-2031)

Table 65. Senju Metal BGA Packaging Solder Ball Company Information

Table 66. Senju Metal BGA Packaging Solder Ball Specification and Application

Table 67. Senju Metal BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 68. Senju Metal Main Business and Markets Served

Table 69. Senju Metal Recent Developments/Updates

Table 70. Accurus BGA Packaging Solder Ball Company Information

Table 71. Accurus BGA Packaging Solder Ball Specification and Application

Table 72. Accurus BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 73. Accurus Main Business and Markets Served

Table 74. Accurus Recent Developments/Updates

Table 75. DS HiMetal BGA Packaging Solder Ball Company Information

Table 76. DS HiMetal BGA Packaging Solder Ball Specification and Application

Table 77. DS HiMetal BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 78. DS HiMetal Main Business and Markets Served

Table 79. DS HiMetal Recent Developments/Updates

Table 80. NMC BGA Packaging Solder Ball Company Information

Table 81. NMC BGA Packaging Solder Ball Specification and Application

Table 82. NMC BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 83. NMC Main Business and Markets Served

Table 84. NMC Recent Developments/Updates

Table 85. MKE BGA Packaging Solder Ball Company Information

Table 86. MKE BGA Packaging Solder Ball Specification and Application

Table 87. MKE BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 88. MKE Main Business and Markets Served

Table 89. MKE Recent Developments/Updates

Table 90. PMTC BGA Packaging Solder Ball Company Information

Table 91. PMTC BGA Packaging Solder Ball Specification and Application

Table 92. PMTC BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 93. PMTC Main Business and Markets Served

Table 94. PMTC Recent Developments/Updates

Table 95. Indium Corporation BGA Packaging Solder Ball Company Information

Table 96. Indium Corporation BGA Packaging Solder Ball Specification and Application

Table 97. Indium Corporation BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 98. Indium Corporation Main Business and Markets Served

Table 99. Indium Corporation Recent Developments/Updates

Table 100. YCTC BGA Packaging Solder Ball Company Information

Table 101. YCTC BGA Packaging Solder Ball Specification and Application

Table 102. YCTC BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 103. YCTC Main Business and Markets Served

Table 104. YCTC Recent Developments/Updates

Table 105. Shenmao Technology BGA Packaging Solder Ball Company Information

Table 106. Shenmao Technology BGA Packaging Solder Ball Specification and Application

Table 107. Shenmao Technology BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 108. Shenmao Technology Main Business and Markets Served

Table 109. Shenmao Technology Recent Developments/Updates

Table 110. Shanghai hiking solder material BGA Packaging Solder Ball Company Information

Table 111. Shanghai hiking solder material BGA Packaging Solder Ball Specification and Application

Table 112. Shanghai hiking solder material BGA Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (US$/K Units) and Gross Margin (2020-2025)

Table 113. Shanghai hiking solder material Main Business and Markets Served

Table 114. Shanghai hiking solder material Recent Developments/Updates

Table 115. Key Raw Materials Lists

Table 116. Raw Materials Key Suppliers Lists

Table 117. BGA Packaging Solder Ball Distributors List

Table 118. BGA Packaging Solder Ball Customers List

Table 119. BGA Packaging Solder Ball Market Trends

Table 120. BGA Packaging Solder Ball Market Drivers

Table 121. BGA Packaging Solder Ball Market Challenges

Table 122. BGA Packaging Solder Ball Market Restraints

Table 123. Research Programs/Design for This Report

Table 124. Key Data Information from Secondary Sources

Table 125. Key Data Information from Primary Sources

Table 126. Authors List of This Report

List of Figures

Figure 1. Product Picture of BGA Packaging Solder Ball

Figure 2. Global BGA Packaging Solder Ball Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global BGA Packaging Solder Ball Market Share by Type: 2024 VS 2031

Figure 4. Up to 0.2 mm Product Picture

Figure 5. 0.2-0.5 mm Product Picture

Figure 6. Above 0.5 mm Product Picture

Figure 7. Global BGA Packaging Solder Ball Market Value by Application, (US$ Million) & (2020-2031)

Figure 8. Global BGA Packaging Solder Ball Market Share by Application: 2024 VS 2031

Figure 9. IDM

Figure 10. OSAT

Figure 11. Global BGA Packaging Solder Ball Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 12. Global BGA Packaging Solder Ball Production Value (US$ Million) & (2020-2031)

Figure 13. Global BGA Packaging Solder Ball Production Capacity (Million Units) & (2020-2031)

Figure 14. Global BGA Packaging Solder Ball Production (Million Units) & (2020-2031)

Figure 15. Global BGA Packaging Solder Ball Average Price (US$/K Units) & (2020-2031)

Figure 16. BGA Packaging Solder Ball Report Years Considered

Figure 17. BGA Packaging Solder Ball Production Share by Manufacturers in 2024

Figure 18. Global BGA Packaging Solder Ball Production Value Share by Manufacturers (2024)

Figure 19. BGA Packaging Solder Ball Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 20. The Global 5 and 10 Largest Players: Market Share by BGA Packaging Solder Ball Revenue in 2024

Figure 21. Global BGA Packaging Solder Ball Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 22. Global BGA Packaging Solder Ball Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 23. Global BGA Packaging Solder Ball Production Comparison by Region: 2020 VS 2024 VS 2031 (Million Units)

Figure 24. Global BGA Packaging Solder Ball Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 25. North America BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. Europe BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. China BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Japan BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)

Figure 29. South Korea BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)

Figure 30. Taiwan BGA Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)

Figure 31. Global BGA Packaging Solder Ball Consumption by Region: 2020 VS 2024 VS 2031 (Million Units)

Figure 32. Global BGA Packaging Solder Ball Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 33. North America BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 34. North America BGA Packaging Solder Ball Consumption Market Share by Country (2020-2031)

Figure 35. U.S. BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 36. Canada BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 37. Europe BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 38. Europe BGA Packaging Solder Ball Consumption Market Share by Country (2020-2031)

Figure 39. Germany BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 40. France BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 41. U.K. BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 42. Italy BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 43. Netherlands BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 44. Asia Pacific BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 45. Asia Pacific BGA Packaging Solder Ball Consumption Market Share by Region (2020-2031)

Figure 46. China BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 47. Japan BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 48. South Korea BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 49. China Taiwan BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 50. Southeast Asia BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 51. India BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 52. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 53. Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption Market Share by Country (2020-2031)

Figure 54. Mexico BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 55. Brazil BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 56. Israel BGA Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)

Figure 57. Global Production Market Share of BGA Packaging Solder Ball by Type (2020-2031)

Figure 58. Global Production Value Market Share of BGA Packaging Solder Ball by Type (2020-2031)

Figure 59. Global BGA Packaging Solder Ball Price (US$/K Units) by Type (2020-2031)

Figure 60. Global Production Market Share of BGA Packaging Solder Ball by Application (2020-2031)

Figure 61. Global Production Value Market Share of BGA Packaging Solder Ball by Application (2020-2031)

Figure 62. Global BGA Packaging Solder Ball Price (US$/K Units) by Application (2020-2031)

Figure 63. BGA Packaging Solder Ball Value Chain

Figure 64. Channels of Distribution (Direct Vs Distribution)

Figure 65. Bottom-up and Top-down Approaches for This Report

Figure 66. Data Triangulation

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Global BGA Packaging Solder Ball Market Research Report 2025

Published Date: June 2025

Report Code: QYRE-Auto-27L16503

Global BGA Packaging Solder Ball Market Research Report 2025

FEATURED COMPANIES

BGA Packaging Solder Ball Market Size

BGA Packaging Solder Ball Market

Report Scope

Scope of BGA Packaging Solder Ball Market Report

Chapter Outline

FAQ for this report

How fast is BGA Packaging Solder Ball Market growing?

What is the BGA Packaging Solder Ball Market size in 2031?

Who are the main players in the BGA Packaging Solder Ball Market report?

What are the Application segmentation covered in the BGA Packaging Solder Ball Market report?

What are the Type segmentation covered in the BGA Packaging Solder Ball Market report?

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