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Global IC Packaging Solder Ball Market Research Report 2025
Published Date: July 2025
|
Report Code: QYRE-Auto-9E7657
Home | Market Reports | Computers & Electronics
Global IC Packaging Solder Ball Market Insights Forecast to 2028
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Global IC Packaging Solder Ball Market Research Report 2025

Code: QYRE-Auto-9E7657
Report
July 2025
Pages:103
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Senju Metal
Accurus
DS HiMetal
MKE
PMTC
Indium Corporation
YCTC
SHENMAO Technology
Shanghai hiking solder material
Nippon Micrometal
Jovy Systems

IC Packaging Solder Ball Market Size

The global market for IC Packaging Solder Ball was valued at US$ 251 million in the year 2024 and is projected to reach a revised size of US$ 388 million by 2031, growing at a CAGR of 6.5% during the forecast period.

IC Packaging Solder Ball Market

IC Packaging Solder Ball Market

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share.

Report Scope

This report aims to provide a comprehensive presentation of the global market for IC Packaging Solder Ball, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Solder Ball.
The IC Packaging Solder Ball market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global IC Packaging Solder Ball market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging Solder Ball manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of IC Packaging Solder Ball Market Report

Report Metric Details
Report Name IC Packaging Solder Ball Market
Accounted market size in year US$ 251 million
Forecasted market size in 2031 US$ 388 million
CAGR 6.5%
Base Year year
Forecasted years 2025 - 2031
by Type
  • Lead Solder Ball
  • Lead Free Solder Ball
by Application
  • BGA
  • CSP & WLCSP
  • Flip-Chip & Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of IC Packaging Solder Ball manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of IC Packaging Solder Ball by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of IC Packaging Solder Ball in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is IC Packaging Solder Ball Market growing?

Ans: The IC Packaging Solder Ball Market witnessing a CAGR of 6.5% during the forecast period 2025-2031.

What is the IC Packaging Solder Ball Market size in 2031?

Ans: The IC Packaging Solder Ball Market size in 2031 will be US$ 388 million.

What is the Senju Metal, Accurus, DS HiMetal share in IC Packaging Solder Ball Market?

Ans: Senju Metal, Accurus and DS HiMetal occupy more than 73% of the global market share.

Who are the main players in the IC Packaging Solder Ball Market report?

Ans: The main players in the IC Packaging Solder Ball Market are Senju Metal, DS HiMetal, MKE, YCTC, Nippon Micrometal, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology, Indium Corporation, Jovy Systems

What are the Application segmentation covered in the IC Packaging Solder Ball Market report?

Ans: The Applications covered in the IC Packaging Solder Ball Market report are BGA, CSP & WLCSP, Flip-Chip & Others

What are the Type segmentation covered in the IC Packaging Solder Ball Market report?

Ans: The Types covered in the IC Packaging Solder Ball Market report are Lead Solder Ball, Lead Free Solder Ball

1 IC Packaging Solder Ball Market Overview
1.1 Product Definition
1.2 IC Packaging Solder Ball by Type
1.2.1 Global IC Packaging Solder Ball Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Lead Solder Ball
1.2.3 Lead Free Solder Ball
1.3 IC Packaging Solder Ball by Application
1.3.1 Global IC Packaging Solder Ball Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 BGA
1.3.3 CSP & WLCSP
1.3.4 Flip-Chip & Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global IC Packaging Solder Ball Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global IC Packaging Solder Ball Production Estimates and Forecasts (2020-2031)
1.4.4 Global IC Packaging Solder Ball Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging Solder Ball Production Market Share by Manufacturers (2020-2025)
2.2 Global IC Packaging Solder Ball Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of IC Packaging Solder Ball, Industry Ranking, 2023 VS 2024
2.4 Global IC Packaging Solder Ball Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global IC Packaging Solder Ball Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of IC Packaging Solder Ball, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging Solder Ball, Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging Solder Ball, Date of Enter into This Industry
2.9 IC Packaging Solder Ball Market Competitive Situation and Trends
2.9.1 IC Packaging Solder Ball Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging Solder Ball Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging Solder Ball Production by Region
3.1 Global IC Packaging Solder Ball Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global IC Packaging Solder Ball Production Value by Region (2020-2031)
3.2.1 Global IC Packaging Solder Ball Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of IC Packaging Solder Ball by Region (2026-2031)
3.3 Global IC Packaging Solder Ball Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global IC Packaging Solder Ball Production Volume by Region (2020-2031)
3.4.1 Global IC Packaging Solder Ball Production by Region (2020-2025)
3.4.2 Global Forecasted Production of IC Packaging Solder Ball by Region (2026-2031)
3.5 Global IC Packaging Solder Ball Market Price Analysis by Region (2020-2025)
3.6 Global IC Packaging Solder Ball Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe IC Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)
3.6.3 China IC Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan IC Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea IC Packaging Solder Ball Production Value Estimates and Forecasts (2020-2031)
4 IC Packaging Solder Ball Consumption by Region
4.1 Global IC Packaging Solder Ball Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global IC Packaging Solder Ball Consumption by Region (2020-2031)
4.2.1 Global IC Packaging Solder Ball Consumption by Region (2020-2025)
4.2.2 Global IC Packaging Solder Ball Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America IC Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America IC Packaging Solder Ball Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe IC Packaging Solder Ball Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging Solder Ball Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific IC Packaging Solder Ball Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa IC Packaging Solder Ball Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global IC Packaging Solder Ball Production by Type (2020-2031)
5.1.1 Global IC Packaging Solder Ball Production by Type (2020-2025)
5.1.2 Global IC Packaging Solder Ball Production by Type (2026-2031)
5.1.3 Global IC Packaging Solder Ball Production Market Share by Type (2020-2031)
5.2 Global IC Packaging Solder Ball Production Value by Type (2020-2031)
5.2.1 Global IC Packaging Solder Ball Production Value by Type (2020-2025)
5.2.2 Global IC Packaging Solder Ball Production Value by Type (2026-2031)
5.2.3 Global IC Packaging Solder Ball Production Value Market Share by Type (2020-2031)
5.3 Global IC Packaging Solder Ball Price by Type (2020-2031)
6 Segment by Application
6.1 Global IC Packaging Solder Ball Production by Application (2020-2031)
6.1.1 Global IC Packaging Solder Ball Production by Application (2020-2025)
6.1.2 Global IC Packaging Solder Ball Production by Application (2026-2031)
6.1.3 Global IC Packaging Solder Ball Production Market Share by Application (2020-2031)
6.2 Global IC Packaging Solder Ball Production Value by Application (2020-2031)
6.2.1 Global IC Packaging Solder Ball Production Value by Application (2020-2025)
6.2.2 Global IC Packaging Solder Ball Production Value by Application (2026-2031)
6.2.3 Global IC Packaging Solder Ball Production Value Market Share by Application (2020-2031)
6.3 Global IC Packaging Solder Ball Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Senju Metal
7.1.1 Senju Metal IC Packaging Solder Ball Company Information
7.1.2 Senju Metal IC Packaging Solder Ball Product Portfolio
7.1.3 Senju Metal IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Senju Metal Main Business and Markets Served
7.1.5 Senju Metal Recent Developments/Updates
7.2 DS HiMetal
7.2.1 DS HiMetal IC Packaging Solder Ball Company Information
7.2.2 DS HiMetal IC Packaging Solder Ball Product Portfolio
7.2.3 DS HiMetal IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.2.4 DS HiMetal Main Business and Markets Served
7.2.5 DS HiMetal Recent Developments/Updates
7.3 MKE
7.3.1 MKE IC Packaging Solder Ball Company Information
7.3.2 MKE IC Packaging Solder Ball Product Portfolio
7.3.3 MKE IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.3.4 MKE Main Business and Markets Served
7.3.5 MKE Recent Developments/Updates
7.4 YCTC
7.4.1 YCTC IC Packaging Solder Ball Company Information
7.4.2 YCTC IC Packaging Solder Ball Product Portfolio
7.4.3 YCTC IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.4.4 YCTC Main Business and Markets Served
7.4.5 YCTC Recent Developments/Updates
7.5 Nippon Micrometal
7.5.1 Nippon Micrometal IC Packaging Solder Ball Company Information
7.5.2 Nippon Micrometal IC Packaging Solder Ball Product Portfolio
7.5.3 Nippon Micrometal IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Nippon Micrometal Main Business and Markets Served
7.5.5 Nippon Micrometal Recent Developments/Updates
7.6 Accurus
7.6.1 Accurus IC Packaging Solder Ball Company Information
7.6.2 Accurus IC Packaging Solder Ball Product Portfolio
7.6.3 Accurus IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Accurus Main Business and Markets Served
7.6.5 Accurus Recent Developments/Updates
7.7 PMTC
7.7.1 PMTC IC Packaging Solder Ball Company Information
7.7.2 PMTC IC Packaging Solder Ball Product Portfolio
7.7.3 PMTC IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.7.4 PMTC Main Business and Markets Served
7.7.5 PMTC Recent Developments/Updates
7.8 Shanghai hiking solder material
7.8.1 Shanghai hiking solder material IC Packaging Solder Ball Company Information
7.8.2 Shanghai hiking solder material IC Packaging Solder Ball Product Portfolio
7.8.3 Shanghai hiking solder material IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Shanghai hiking solder material Main Business and Markets Served
7.8.5 Shanghai hiking solder material Recent Developments/Updates
7.9 Shenmao Technology
7.9.1 Shenmao Technology IC Packaging Solder Ball Company Information
7.9.2 Shenmao Technology IC Packaging Solder Ball Product Portfolio
7.9.3 Shenmao Technology IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Shenmao Technology Main Business and Markets Served
7.9.5 Shenmao Technology Recent Developments/Updates
7.10 Indium Corporation
7.10.1 Indium Corporation IC Packaging Solder Ball Company Information
7.10.2 Indium Corporation IC Packaging Solder Ball Product Portfolio
7.10.3 Indium Corporation IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Indium Corporation Main Business and Markets Served
7.10.5 Indium Corporation Recent Developments/Updates
7.11 Jovy Systems
7.11.1 Jovy Systems IC Packaging Solder Ball Company Information
7.11.2 Jovy Systems IC Packaging Solder Ball Product Portfolio
7.11.3 Jovy Systems IC Packaging Solder Ball Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Jovy Systems Main Business and Markets Served
7.11.5 Jovy Systems Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging Solder Ball Industry Chain Analysis
8.2 IC Packaging Solder Ball Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging Solder Ball Production Mode & Process Analysis
8.4 IC Packaging Solder Ball Sales and Marketing
8.4.1 IC Packaging Solder Ball Sales Channels
8.4.2 IC Packaging Solder Ball Distributors
8.5 IC Packaging Solder Ball Customer Analysis
9 IC Packaging Solder Ball Market Dynamics
9.1 IC Packaging Solder Ball Industry Trends
9.2 IC Packaging Solder Ball Market Drivers
9.3 IC Packaging Solder Ball Market Challenges
9.4 IC Packaging Solder Ball Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
Senju Metal
Accurus
DS HiMetal
MKE
PMTC
Indium Corporation
YCTC
SHENMAO Technology
Shanghai hiking solder material
Nippon Micrometal
Jovy Systems
List of Tables
 Table 1. Global IC Packaging Solder Ball Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global IC Packaging Solder Ball Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global IC Packaging Solder Ball Production Capacity (Million Units) by Manufacturers in 2024
 Table 4. Global IC Packaging Solder Ball Production by Manufacturers (2020-2025) & (Million Units)
 Table 5. Global IC Packaging Solder Ball Production Market Share by Manufacturers (2020-2025)
 Table 6. Global IC Packaging Solder Ball Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global IC Packaging Solder Ball Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of IC Packaging Solder Ball, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in IC Packaging Solder Ball as of 2024)
 Table 10. Global Market IC Packaging Solder Ball Average Price by Manufacturers (USD/Million Units) & (2020-2025)
 Table 11. Global Key Manufacturers of IC Packaging Solder Ball, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of IC Packaging Solder Ball, Product Offered and Application
 Table 13. Global Key Manufacturers of IC Packaging Solder Ball, Date of Enter into This Industry
 Table 14. Global IC Packaging Solder Ball Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global IC Packaging Solder Ball Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global IC Packaging Solder Ball Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global IC Packaging Solder Ball Production Value Market Share by Region (2020-2025)
 Table 19. Global IC Packaging Solder Ball Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global IC Packaging Solder Ball Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global IC Packaging Solder Ball Production Comparison by Region: 2020 VS 2024 VS 2031 (Million Units)
 Table 22. Global IC Packaging Solder Ball Production (Million Units) by Region (2020-2025)
 Table 23. Global IC Packaging Solder Ball Production Market Share by Region (2020-2025)
 Table 24. Global IC Packaging Solder Ball Production (Million Units) Forecast by Region (2026-2031)
 Table 25. Global IC Packaging Solder Ball Production Market Share Forecast by Region (2026-2031)
 Table 26. Global IC Packaging Solder Ball Market Average Price (USD/Million Units) by Region (2020-2025)
 Table 27. Global IC Packaging Solder Ball Market Average Price (USD/Million Units) by Region (2026-2031)
 Table 28. Global IC Packaging Solder Ball Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Million Units)
 Table 29. Global IC Packaging Solder Ball Consumption by Region (2020-2025) & (Million Units)
 Table 30. Global IC Packaging Solder Ball Consumption Market Share by Region (2020-2025)
 Table 31. Global IC Packaging Solder Ball Forecasted Consumption by Region (2026-2031) & (Million Units)
 Table 32. Global IC Packaging Solder Ball Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America IC Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Units)
 Table 34. North America IC Packaging Solder Ball Consumption by Country (2020-2025) & (Million Units)
 Table 35. North America IC Packaging Solder Ball Consumption by Country (2026-2031) & (Million Units)
 Table 36. Europe IC Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Units)
 Table 37. Europe IC Packaging Solder Ball Consumption by Country (2020-2025) & (Million Units)
 Table 38. Europe IC Packaging Solder Ball Consumption by Country (2026-2031) & (Million Units)
 Table 39. Asia Pacific IC Packaging Solder Ball Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Million Units)
 Table 40. Asia Pacific IC Packaging Solder Ball Consumption by Region (2020-2025) & (Million Units)
 Table 41. Asia Pacific IC Packaging Solder Ball Consumption by Region (2026-2031) & (Million Units)
 Table 42. Latin America, Middle East & Africa IC Packaging Solder Ball Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Units)
 Table 43. Latin America, Middle East & Africa IC Packaging Solder Ball Consumption by Country (2020-2025) & (Million Units)
 Table 44. Latin America, Middle East & Africa IC Packaging Solder Ball Consumption by Country (2026-2031) & (Million Units)
 Table 45. Global IC Packaging Solder Ball Production (Million Units) by Type (2020-2025)
 Table 46. Global IC Packaging Solder Ball Production (Million Units) by Type (2026-2031)
 Table 47. Global IC Packaging Solder Ball Production Market Share by Type (2020-2025)
 Table 48. Global IC Packaging Solder Ball Production Market Share by Type (2026-2031)
 Table 49. Global IC Packaging Solder Ball Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global IC Packaging Solder Ball Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global IC Packaging Solder Ball Production Value Market Share by Type (2020-2025)
 Table 52. Global IC Packaging Solder Ball Production Value Market Share by Type (2026-2031)
 Table 53. Global IC Packaging Solder Ball Price (USD/Million Units) by Type (2020-2025)
 Table 54. Global IC Packaging Solder Ball Price (USD/Million Units) by Type (2026-2031)
 Table 55. Global IC Packaging Solder Ball Production (Million Units) by Application (2020-2025)
 Table 56. Global IC Packaging Solder Ball Production (Million Units) by Application (2026-2031)
 Table 57. Global IC Packaging Solder Ball Production Market Share by Application (2020-2025)
 Table 58. Global IC Packaging Solder Ball Production Market Share by Application (2026-2031)
 Table 59. Global IC Packaging Solder Ball Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global IC Packaging Solder Ball Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global IC Packaging Solder Ball Production Value Market Share by Application (2020-2025)
 Table 62. Global IC Packaging Solder Ball Production Value Market Share by Application (2026-2031)
 Table 63. Global IC Packaging Solder Ball Price (USD/Million Units) by Application (2020-2025)
 Table 64. Global IC Packaging Solder Ball Price (USD/Million Units) by Application (2026-2031)
 Table 65. Senju Metal IC Packaging Solder Ball Company Information
 Table 66. Senju Metal IC Packaging Solder Ball Specification and Application
 Table 67. Senju Metal IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 68. Senju Metal Main Business and Markets Served
 Table 69. Senju Metal Recent Developments/Updates
 Table 70. DS HiMetal IC Packaging Solder Ball Company Information
 Table 71. DS HiMetal IC Packaging Solder Ball Specification and Application
 Table 72. DS HiMetal IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 73. DS HiMetal Main Business and Markets Served
 Table 74. DS HiMetal Recent Developments/Updates
 Table 75. MKE IC Packaging Solder Ball Company Information
 Table 76. MKE IC Packaging Solder Ball Specification and Application
 Table 77. MKE IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 78. MKE Main Business and Markets Served
 Table 79. MKE Recent Developments/Updates
 Table 80. YCTC IC Packaging Solder Ball Company Information
 Table 81. YCTC IC Packaging Solder Ball Specification and Application
 Table 82. YCTC IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 83. YCTC Main Business and Markets Served
 Table 84. YCTC Recent Developments/Updates
 Table 85. Nippon Micrometal IC Packaging Solder Ball Company Information
 Table 86. Nippon Micrometal IC Packaging Solder Ball Specification and Application
 Table 87. Nippon Micrometal IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 88. Nippon Micrometal Main Business and Markets Served
 Table 89. Nippon Micrometal Recent Developments/Updates
 Table 90. Accurus IC Packaging Solder Ball Company Information
 Table 91. Accurus IC Packaging Solder Ball Specification and Application
 Table 92. Accurus IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 93. Accurus Main Business and Markets Served
 Table 94. Accurus Recent Developments/Updates
 Table 95. PMTC IC Packaging Solder Ball Company Information
 Table 96. PMTC IC Packaging Solder Ball Specification and Application
 Table 97. PMTC IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 98. PMTC Main Business and Markets Served
 Table 99. PMTC Recent Developments/Updates
 Table 100. Shanghai hiking solder material IC Packaging Solder Ball Company Information
 Table 101. Shanghai hiking solder material IC Packaging Solder Ball Specification and Application
 Table 102. Shanghai hiking solder material IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 103. Shanghai hiking solder material Main Business and Markets Served
 Table 104. Shanghai hiking solder material Recent Developments/Updates
 Table 105. Shenmao Technology IC Packaging Solder Ball Company Information
 Table 106. Shenmao Technology IC Packaging Solder Ball Specification and Application
 Table 107. Shenmao Technology IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 108. Shenmao Technology Main Business and Markets Served
 Table 109. Shenmao Technology Recent Developments/Updates
 Table 110. Indium Corporation IC Packaging Solder Ball Company Information
 Table 111. Indium Corporation IC Packaging Solder Ball Specification and Application
 Table 112. Indium Corporation IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 113. Indium Corporation Main Business and Markets Served
 Table 114. Indium Corporation Recent Developments/Updates
 Table 115. Jovy Systems IC Packaging Solder Ball Company Information
 Table 116. Jovy Systems IC Packaging Solder Ball Specification and Application
 Table 117. Jovy Systems IC Packaging Solder Ball Production (Million Units), Value (US$ Million), Price (USD/Million Units) and Gross Margin (2020-2025)
 Table 118. Jovy Systems Main Business and Markets Served
 Table 119. Jovy Systems Recent Developments/Updates
 Table 120. Key Raw Materials Lists
 Table 121. Raw Materials Key Suppliers Lists
 Table 122. IC Packaging Solder Ball Distributors List
 Table 123. IC Packaging Solder Ball Customers List
 Table 124. IC Packaging Solder Ball Market Trends
 Table 125. IC Packaging Solder Ball Market Drivers
 Table 126. IC Packaging Solder Ball Market Challenges
 Table 127. IC Packaging Solder Ball Market Restraints
 Table 128. Research Programs/Design for This Report
 Table 129. Key Data Information from Secondary Sources
 Table 130. Key Data Information from Primary Sources
 Table 131. Authors List of This Report


List of Figures
 Figure 1. Product Picture of IC Packaging Solder Ball
 Figure 2. Global IC Packaging Solder Ball Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global IC Packaging Solder Ball Market Share by Type: 2024 VS 2031
 Figure 4. Lead Solder Ball Product Picture
 Figure 5. Lead Free Solder Ball Product Picture
 Figure 6. Global IC Packaging Solder Ball Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global IC Packaging Solder Ball Market Share by Application: 2024 VS 2031
 Figure 8. BGA
 Figure 9. CSP & WLCSP
 Figure 10. Flip-Chip & Others
 Figure 11. Global IC Packaging Solder Ball Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 12. Global IC Packaging Solder Ball Production Value (US$ Million) & (2020-2031)
 Figure 13. Global IC Packaging Solder Ball Production Capacity (Million Units) & (2020-2031)
 Figure 14. Global IC Packaging Solder Ball Production (Million Units) & (2020-2031)
 Figure 15. Global IC Packaging Solder Ball Average Price (USD/Million Units) & (2020-2031)
 Figure 16. IC Packaging Solder Ball Report Years Considered
 Figure 17. IC Packaging Solder Ball Production Share by Manufacturers in 2024
 Figure 18. Global IC Packaging Solder Ball Production Value Share by Manufacturers (2024)
 Figure 19. IC Packaging Solder Ball Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 20. The Global 5 and 10 Largest Players: Market Share by IC Packaging Solder Ball Revenue in 2024
 Figure 21. Global IC Packaging Solder Ball Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 22. Global IC Packaging Solder Ball Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 23. Global IC Packaging Solder Ball Production Comparison by Region: 2020 VS 2024 VS 2031 (Million Units)
 Figure 24. Global IC Packaging Solder Ball Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 25. North America IC Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 26. Europe IC Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. China IC Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Japan IC Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. South Korea IC Packaging Solder Ball Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Global IC Packaging Solder Ball Consumption by Region: 2020 VS 2024 VS 2031 (Million Units)
 Figure 31. Global IC Packaging Solder Ball Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 32. North America IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 33. North America IC Packaging Solder Ball Consumption Market Share by Country (2020-2031)
 Figure 34. U.S. IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 35. Canada IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 36. Europe IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 37. Europe IC Packaging Solder Ball Consumption Market Share by Country (2020-2031)
 Figure 38. Germany IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 39. France IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 40. U.K. IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 41. Italy IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 42. Netherlands IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 43. Asia Pacific IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 44. Asia Pacific IC Packaging Solder Ball Consumption Market Share by Region (2020-2031)
 Figure 45. China IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 46. Japan IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 47. South Korea IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 48. China Taiwan IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 49. Southeast Asia IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 50. India IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 51. Latin America, Middle East & Africa IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 52. Latin America, Middle East & Africa IC Packaging Solder Ball Consumption Market Share by Country (2020-2031)
 Figure 53. Mexico IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 54. Brazil IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 55. Israel IC Packaging Solder Ball Consumption and Growth Rate (2020-2031) & (Million Units)
 Figure 56. Global Production Market Share of IC Packaging Solder Ball by Type (2020-2031)
 Figure 57. Global Production Value Market Share of IC Packaging Solder Ball by Type (2020-2031)
 Figure 58. Global IC Packaging Solder Ball Price (USD/Million Units) by Type (2020-2031)
 Figure 59. Global Production Market Share of IC Packaging Solder Ball by Application (2020-2031)
 Figure 60. Global Production Value Market Share of IC Packaging Solder Ball by Application (2020-2031)
 Figure 61. Global IC Packaging Solder Ball Price (USD/Million Units) by Application (2020-2031)
 Figure 62. IC Packaging Solder Ball Value Chain
 Figure 63. Channels of Distribution (Direct Vs Distribution)
 Figure 64. Bottom-up and Top-down Approaches for This Report
 Figure 65. Data Triangulation
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