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Global Small Outline Integrated Circuit (SOIC) Package Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-2L13278
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Global Small Outline Integrated Circuit SOIC Package Market Research Report 2023
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Global Small Outline Integrated Circuit (SOIC) Package Market Research Report 2025

Code: QYRE-Auto-2L13278
Report
March 2025
Pages:110
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
3M
Enplas Corporation
Toshiba Electronic Devices and Storage Corporation
Intel Corporation
Loranger International Corporation
Komachine
Aries Electronics Inc
Mill-Max Manufacturing Corporation
Molex
Foxconn
Sensata Technologies
Plastronics
TE Connectivity
ChipMOS TECHNOLOGIES INC
Yamaichi Electronics
Johnstech International
Socionext America Inc
WinWay Technology Co

Small Outline Integrated Circuit (SOIC) Package Market

The global market for Small Outline Integrated Circuit (SOIC) Package was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins.
The global Small Outline Integrated Circuit (SOIC) package market refers to the market for a type of surface mount integrated circuit (IC) package known as SOIC. SOIC packages are widely used in the electronics industry for their compact size, ease of manufacturing, and compatibility with automated assembly processes.
Here are some key factors driving the growth of the global SOIC package market:
Miniaturization and High-Density Packaging: As electronic devices continue to become smaller and more compact, there is a growing demand for IC packages that offer high-density integration. SOIC packages are known for their small outline and compact size, allowing for efficient use of space on printed circuit boards (PCBs) and enabling the miniaturization of devices.
Wide Application in Various Industries: SOIC packages are used in a wide range of industries, including consumer electronics, automotive, industrial, telecommunications, and healthcare. They are suitable for applications such as power management, signal processing, microcontrollers, memory, and interface circuits. The broad applicability of SOIC packages contributes to their market growth.
Cost-Effectiveness and Manufacturing Efficiency: SOIC packages are cost-effective to manufacture compared to other types of IC packages, such as quad flat no-leads (QFN) or ball grid array (BGA). Additionally, their compatibility with automated assembly processes makes them highly efficient for high-volume production, reducing manufacturing costs and increasing productivity.
Thermal Performance and Reliability: SOIC packages have good thermal performance due to their exposed leads, which allows heat to be dissipated effectively. This feature is particularly important for power-related applications where heat dissipation is critical. Furthermore, SOIC packages offer good electrical performance and reliability, meeting the stringent requirements of various industries.
Compatibility with Legacy Systems: SOIC packages have been widely used for many years, and they have become a standard package type for many ICs. This compatibility with legacy systems makes them attractive for replacement or upgrade purposes, allowing for seamless integration into existing designs without major changes.
Advancements in Technology: The SOIC package market has benefited from advancements in semiconductor manufacturing technology. These advancements have led to the development of smaller pitch sizes, higher pin counts, and higher operating speeds for SOIC packages, expanding their capabilities and increasing their adoption in new applications.
Growing Demand for Portable and Wearable Devices: The increasing popularity of portable electronics, such as smartphones, tablets, wearables, and IoT devices, fuels the demand for compact and lightweight IC packages like SOIC. These devices require smaller and more energy-efficient components, driving the growth of the SOIC package market.
In conclusion, the global SOIC package market is driven by the need for miniaturization, high-density packaging, wide application in various industries, cost-effectiveness, manufacturing efficiency, thermal performance, compatibility with legacy systems, advancements in technology, and the demand for portable and wearable devices. As the electronics industry continues to evolve and demand for small, reliable, and high-performance IC packages increases, the market for SOIC packages is expected to grow significantly.The global Small Outline Integrated Circuit (SOIC) package market refers to the market for a type of surface mount integrated circuit (IC) package known as SOIC. SOIC packages are widely used in the electronics industry for their compact size, ease of manufacturing, and compatibility with automated assembly processes.
Here are some key factors driving the growth of the global SOIC package market:
Miniaturization and High-Density Packaging: As electronic devices continue to become smaller and more compact, there is a growing demand for IC packages that offer high-density integration. SOIC packages are known for their small outline and compact size, allowing for efficient use of space on printed circuit boards (PCBs) and enabling the miniaturization of devices.
Wide Application in Various Industries: SOIC packages are used in a wide range of industries, including consumer electronics, automotive, industrial, telecommunications, and healthcare. They are suitable for applications such as power management, signal processing, microcontrollers, memory, and interface circuits. The broad applicability of SOIC packages contributes to their market growth.
Cost-Effectiveness and Manufacturing Efficiency: SOIC packages are cost-effective to manufacture compared to other types of IC packages, such as quad flat no-leads (QFN) or ball grid array (BGA). Additionally, their compatibility with automated assembly processes makes them highly efficient for high-volume production, reducing manufacturing costs and increasing productivity.
Thermal Performance and Reliability: SOIC packages have good thermal performance due to their exposed leads, which allows heat to be dissipated effectively. This feature is particularly important for power-related applications where heat dissipation is critical. Furthermore, SOIC packages offer good electrical performance and reliability, meeting the stringent requirements of various industries.
Compatibility with Legacy Systems: SOIC packages have been widely used for many years, and they have become a standard package type for many ICs. This compatibility with legacy systems makes them attractive for replacement or upgrade purposes, allowing for seamless integration into existing designs without major changes.
Advancements in Technology: The SOIC package market has benefited from advancements in semiconductor manufacturing technology. These advancements have led to the development of smaller pitch sizes, higher pin counts, and higher operating speeds for SOIC packages, expanding their capabilities and increasing their adoption in new applications.
Growing Demand for Portable and Wearable Devices: The increasing popularity of portable electronics, such as smartphones, tablets, wearables, and IoT devices, fuels the demand for compact and lightweight IC packages like SOIC. These devices require smaller and more energy-efficient components, driving the growth of the SOIC package market.
In conclusion, the global SOIC package market is driven by the need for miniaturization, high-density packaging, wide application in various industries, cost-effectiveness, manufacturing efficiency, thermal performance, compatibility with legacy systems, advancements in technology, and the demand for portable and wearable devices. As the electronics industry continues to evolve and demand for small, reliable, and high-performance IC packages increases, the market for SOIC packages is expected to grow significantly.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Small Outline Integrated Circuit (SOIC) Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Small Outline Integrated Circuit (SOIC) Package.
The Small Outline Integrated Circuit (SOIC) Package market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Small Outline Integrated Circuit (SOIC) Package market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Small Outline Integrated Circuit (SOIC) Package manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Small Outline Integrated Circuit (SOIC) Package Market Report

Report Metric Details
Report Name Small Outline Integrated Circuit (SOIC) Package Market
by Type
  • Mini-SOIC
  • Small Outline J-Lead Package
  • Others
by Application
  • Industrial
  • Consumer Electronics
  • Automotive
  • Medical Devices
  • Military and Defense
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company 3M, Enplas Corporation, Toshiba Electronic Devices and Storage Corporation, Intel Corporation, Loranger International Corporation, Komachine, Aries Electronics Inc, Johnstech International, Mill-Max Manufacturing Corporation, Molex, Foxconn, Sensata Technologies, Plastronics, TE Connectivity, Socionext America Inc, WinWay Technology Co, ChipMOS Technologies Inc, Yamaichi Electronics
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Small Outline Integrated Circuit (SOIC) Package manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Small Outline Integrated Circuit (SOIC) Package by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Small Outline Integrated Circuit (SOIC) Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Small Outline Integrated Circuit (SOIC) Package Market report?

Ans: The main players in the Small Outline Integrated Circuit (SOIC) Package Market are 3M, Enplas Corporation, Toshiba Electronic Devices and Storage Corporation, Intel Corporation, Loranger International Corporation, Komachine, Aries Electronics Inc, Johnstech International, Mill-Max Manufacturing Corporation, Molex, Foxconn, Sensata Technologies, Plastronics, TE Connectivity, Socionext America Inc, WinWay Technology Co, ChipMOS Technologies Inc, Yamaichi Electronics

What are the Application segmentation covered in the Small Outline Integrated Circuit (SOIC) Package Market report?

Ans: The Applications covered in the Small Outline Integrated Circuit (SOIC) Package Market report are Industrial, Consumer Electronics, Automotive, Medical Devices, Military and Defense

What are the Type segmentation covered in the Small Outline Integrated Circuit (SOIC) Package Market report?

Ans: The Types covered in the Small Outline Integrated Circuit (SOIC) Package Market report are Mini-SOIC, Small Outline J-Lead Package, Others

1 Small Outline Integrated Circuit (SOIC) Package Market Overview
1.1 Product Definition
1.2 Small Outline Integrated Circuit (SOIC) Package by Type
1.2.1 Global Small Outline Integrated Circuit (SOIC) Package Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Mini-SOIC
1.2.3 Small Outline J-Lead Package
1.2.4 Others
1.3 Small Outline Integrated Circuit (SOIC) Package by Application
1.3.1 Global Small Outline Integrated Circuit (SOIC) Package Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Industrial
1.3.3 Consumer Electronics
1.3.4 Automotive
1.3.5 Medical Devices
1.3.6 Military and Defense
1.4 Global Market Growth Prospects
1.4.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Small Outline Integrated Circuit (SOIC) Package Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Small Outline Integrated Circuit (SOIC) Package Production Estimates and Forecasts (2020-2031)
1.4.4 Global Small Outline Integrated Circuit (SOIC) Package Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Manufacturers (2020-2025)
2.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Small Outline Integrated Circuit (SOIC) Package, Industry Ranking, 2023 VS 2024
2.4 Global Small Outline Integrated Circuit (SOIC) Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Small Outline Integrated Circuit (SOIC) Package Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Product Offered and Application
2.8 Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Date of Enter into This Industry
2.9 Small Outline Integrated Circuit (SOIC) Package Market Competitive Situation and Trends
2.9.1 Small Outline Integrated Circuit (SOIC) Package Market Concentration Rate
2.9.2 Global 5 and 10 Largest Small Outline Integrated Circuit (SOIC) Package Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Small Outline Integrated Circuit (SOIC) Package Production by Region
3.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Region (2020-2031)
3.2.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Small Outline Integrated Circuit (SOIC) Package by Region (2026-2031)
3.3 Global Small Outline Integrated Circuit (SOIC) Package Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Small Outline Integrated Circuit (SOIC) Package Production Volume by Region (2020-2031)
3.4.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Small Outline Integrated Circuit (SOIC) Package by Region (2026-2031)
3.5 Global Small Outline Integrated Circuit (SOIC) Package Market Price Analysis by Region (2020-2025)
3.6 Global Small Outline Integrated Circuit (SOIC) Package Production and Value, Year-over-Year Growth
3.6.1 North America Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Small Outline Integrated Circuit (SOIC) Package Production Value Estimates and Forecasts (2020-2031)
4 Small Outline Integrated Circuit (SOIC) Package Consumption by Region
4.1 Global Small Outline Integrated Circuit (SOIC) Package Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2020-2031)
4.2.1 Global Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2020-2025)
4.2.2 Global Small Outline Integrated Circuit (SOIC) Package Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Type (2020-2031)
5.1.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Type (2020-2025)
5.1.2 Global Small Outline Integrated Circuit (SOIC) Package Production by Type (2026-2031)
5.1.3 Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Type (2020-2031)
5.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Type (2020-2031)
5.2.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Type (2020-2025)
5.2.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Type (2026-2031)
5.2.3 Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Type (2020-2031)
5.3 Global Small Outline Integrated Circuit (SOIC) Package Price by Type (2020-2031)
6 Segment by Application
6.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Application (2020-2031)
6.1.1 Global Small Outline Integrated Circuit (SOIC) Package Production by Application (2020-2025)
6.1.2 Global Small Outline Integrated Circuit (SOIC) Package Production by Application (2026-2031)
6.1.3 Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Application (2020-2031)
6.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Application (2020-2031)
6.2.1 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Application (2020-2025)
6.2.2 Global Small Outline Integrated Circuit (SOIC) Package Production Value by Application (2026-2031)
6.2.3 Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Application (2020-2031)
6.3 Global Small Outline Integrated Circuit (SOIC) Package Price by Application (2020-2031)
7 Key Companies Profiled
7.1 3M
7.1.1 3M Small Outline Integrated Circuit (SOIC) Package Company Information
7.1.2 3M Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.1.3 3M Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.1.4 3M Main Business and Markets Served
7.1.5 3M Recent Developments/Updates
7.2 Enplas Corporation
7.2.1 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
7.2.2 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.2.3 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Enplas Corporation Main Business and Markets Served
7.2.5 Enplas Corporation Recent Developments/Updates
7.3 Toshiba Electronic Devices and Storage Corporation
7.3.1 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
7.3.2 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.3.3 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Toshiba Electronic Devices and Storage Corporation Main Business and Markets Served
7.3.5 Toshiba Electronic Devices and Storage Corporation Recent Developments/Updates
7.4 Intel Corporation
7.4.1 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
7.4.2 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.4.3 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Intel Corporation Main Business and Markets Served
7.4.5 Intel Corporation Recent Developments/Updates
7.5 Loranger International Corporation
7.5.1 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
7.5.2 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.5.3 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Loranger International Corporation Main Business and Markets Served
7.5.5 Loranger International Corporation Recent Developments/Updates
7.6 Komachine
7.6.1 Komachine Small Outline Integrated Circuit (SOIC) Package Company Information
7.6.2 Komachine Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.6.3 Komachine Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Komachine Main Business and Markets Served
7.6.5 Komachine Recent Developments/Updates
7.7 Aries Electronics Inc
7.7.1 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Company Information
7.7.2 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.7.3 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Aries Electronics Inc Main Business and Markets Served
7.7.5 Aries Electronics Inc Recent Developments/Updates
7.8 Johnstech International
7.8.1 Johnstech International Small Outline Integrated Circuit (SOIC) Package Company Information
7.8.2 Johnstech International Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.8.3 Johnstech International Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Johnstech International Main Business and Markets Served
7.8.5 Johnstech International Recent Developments/Updates
7.9 Mill-Max Manufacturing Corporation
7.9.1 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
7.9.2 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.9.3 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Mill-Max Manufacturing Corporation Main Business and Markets Served
7.9.5 Mill-Max Manufacturing Corporation Recent Developments/Updates
7.10 Molex
7.10.1 Molex Small Outline Integrated Circuit (SOIC) Package Company Information
7.10.2 Molex Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.10.3 Molex Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Molex Main Business and Markets Served
7.10.5 Molex Recent Developments/Updates
7.11 Foxconn
7.11.1 Foxconn Small Outline Integrated Circuit (SOIC) Package Company Information
7.11.2 Foxconn Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.11.3 Foxconn Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Foxconn Main Business and Markets Served
7.11.5 Foxconn Recent Developments/Updates
7.12 Sensata Technologies
7.12.1 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Company Information
7.12.2 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.12.3 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Sensata Technologies Main Business and Markets Served
7.12.5 Sensata Technologies Recent Developments/Updates
7.13 Plastronics
7.13.1 Plastronics Small Outline Integrated Circuit (SOIC) Package Company Information
7.13.2 Plastronics Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.13.3 Plastronics Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Plastronics Main Business and Markets Served
7.13.5 Plastronics Recent Developments/Updates
7.14 TE Connectivity
7.14.1 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Company Information
7.14.2 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.14.3 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.14.4 TE Connectivity Main Business and Markets Served
7.14.5 TE Connectivity Recent Developments/Updates
7.15 Socionext America Inc
7.15.1 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Company Information
7.15.2 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.15.3 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Socionext America Inc Main Business and Markets Served
7.15.5 Socionext America Inc Recent Developments/Updates
7.16 WinWay Technology Co
7.16.1 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Company Information
7.16.2 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.16.3 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.16.4 WinWay Technology Co Main Business and Markets Served
7.16.5 WinWay Technology Co Recent Developments/Updates
7.17 ChipMOS Technologies Inc
7.17.1 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Company Information
7.17.2 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.17.3 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.17.4 ChipMOS Technologies Inc Main Business and Markets Served
7.17.5 ChipMOS Technologies Inc Recent Developments/Updates
7.18 Yamaichi Electronics
7.18.1 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Company Information
7.18.2 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Product Portfolio
7.18.3 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Yamaichi Electronics Main Business and Markets Served
7.18.5 Yamaichi Electronics Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Small Outline Integrated Circuit (SOIC) Package Industry Chain Analysis
8.2 Small Outline Integrated Circuit (SOIC) Package Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Small Outline Integrated Circuit (SOIC) Package Production Mode & Process Analysis
8.4 Small Outline Integrated Circuit (SOIC) Package Sales and Marketing
8.4.1 Small Outline Integrated Circuit (SOIC) Package Sales Channels
8.4.2 Small Outline Integrated Circuit (SOIC) Package Distributors
8.5 Small Outline Integrated Circuit (SOIC) Package Customer Analysis
9 Small Outline Integrated Circuit (SOIC) Package Market Dynamics
9.1 Small Outline Integrated Circuit (SOIC) Package Industry Trends
9.2 Small Outline Integrated Circuit (SOIC) Package Market Drivers
9.3 Small Outline Integrated Circuit (SOIC) Package Market Challenges
9.4 Small Outline Integrated Circuit (SOIC) Package Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
3M
Enplas Corporation
Toshiba Electronic Devices and Storage Corporation
Intel Corporation
Loranger International Corporation
Komachine
Aries Electronics Inc
Mill-Max Manufacturing Corporation
Molex
Foxconn
Sensata Technologies
Plastronics
TE Connectivity
ChipMOS TECHNOLOGIES INC
Yamaichi Electronics
Johnstech International
Socionext America Inc
WinWay Technology Co
List of Tables
 Table 1. Global Small Outline Integrated Circuit (SOIC) Package Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Small Outline Integrated Circuit (SOIC) Package Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Small Outline Integrated Circuit (SOIC) Package Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Small Outline Integrated Circuit (SOIC) Package Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Small Outline Integrated Circuit (SOIC) Package Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Small Outline Integrated Circuit (SOIC) Package Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Small Outline Integrated Circuit (SOIC) Package, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Small Outline Integrated Circuit (SOIC) Package as of 2024)
 Table 10. Global Market Small Outline Integrated Circuit (SOIC) Package Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Product Offered and Application
 Table 13. Global Key Manufacturers of Small Outline Integrated Circuit (SOIC) Package, Date of Enter into This Industry
 Table 14. Global Small Outline Integrated Circuit (SOIC) Package Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Small Outline Integrated Circuit (SOIC) Package Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Region (2020-2025)
 Table 19. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Small Outline Integrated Circuit (SOIC) Package Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Region (2020-2025)
 Table 23. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Region (2020-2025)
 Table 24. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Small Outline Integrated Circuit (SOIC) Package Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Small Outline Integrated Circuit (SOIC) Package Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Region (2020-2025)
 Table 31. Global Small Outline Integrated Circuit (SOIC) Package Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Small Outline Integrated Circuit (SOIC) Package Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Type (2020-2025)
 Table 46. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Type (2026-2031)
 Table 47. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Type (2020-2025)
 Table 48. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Type (2026-2031)
 Table 49. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Type (2020-2025)
 Table 52. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Type (2026-2031)
 Table 53. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Application (2020-2025)
 Table 56. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) by Application (2026-2031)
 Table 57. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Application (2020-2025)
 Table 58. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Application (2026-2031)
 Table 59. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Application (2020-2025)
 Table 62. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Application (2026-2031)
 Table 63. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Application (2026-2031)
 Table 65. 3M Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 66. 3M Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 67. 3M Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. 3M Main Business and Markets Served
 Table 69. 3M Recent Developments/Updates
 Table 70. Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 71. Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 72. Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Enplas Corporation Main Business and Markets Served
 Table 74. Enplas Corporation Recent Developments/Updates
 Table 75. Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 76. Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 77. Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. Toshiba Electronic Devices and Storage Corporation Main Business and Markets Served
 Table 79. Toshiba Electronic Devices and Storage Corporation Recent Developments/Updates
 Table 80. Intel Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 81. Intel Corporation Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 82. Intel Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. Intel Corporation Main Business and Markets Served
 Table 84. Intel Corporation Recent Developments/Updates
 Table 85. Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 86. Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 87. Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. Loranger International Corporation Main Business and Markets Served
 Table 89. Loranger International Corporation Recent Developments/Updates
 Table 90. Komachine Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 91. Komachine Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 92. Komachine Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. Komachine Main Business and Markets Served
 Table 94. Komachine Recent Developments/Updates
 Table 95. Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 96. Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 97. Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. Aries Electronics Inc Main Business and Markets Served
 Table 99. Aries Electronics Inc Recent Developments/Updates
 Table 100. Johnstech International Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 101. Johnstech International Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 102. Johnstech International Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Johnstech International Main Business and Markets Served
 Table 104. Johnstech International Recent Developments/Updates
 Table 105. Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 106. Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 107. Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. Mill-Max Manufacturing Corporation Main Business and Markets Served
 Table 109. Mill-Max Manufacturing Corporation Recent Developments/Updates
 Table 110. Molex Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 111. Molex Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 112. Molex Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. Molex Main Business and Markets Served
 Table 114. Molex Recent Developments/Updates
 Table 115. Foxconn Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 116. Foxconn Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 117. Foxconn Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 118. Foxconn Main Business and Markets Served
 Table 119. Foxconn Recent Developments/Updates
 Table 120. Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 121. Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 122. Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 123. Sensata Technologies Main Business and Markets Served
 Table 124. Sensata Technologies Recent Developments/Updates
 Table 125. Plastronics Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 126. Plastronics Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 127. Plastronics Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 128. Plastronics Main Business and Markets Served
 Table 129. Plastronics Recent Developments/Updates
 Table 130. TE Connectivity Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 131. TE Connectivity Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 132. TE Connectivity Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 133. TE Connectivity Main Business and Markets Served
 Table 134. TE Connectivity Recent Developments/Updates
 Table 135. Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 136. Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 137. Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 138. Socionext America Inc Main Business and Markets Served
 Table 139. Socionext America Inc Recent Developments/Updates
 Table 140. WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 141. WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 142. WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 143. WinWay Technology Co Main Business and Markets Served
 Table 144. WinWay Technology Co Recent Developments/Updates
 Table 145. ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 146. ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 147. ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 148. ChipMOS Technologies Inc Main Business and Markets Served
 Table 149. ChipMOS Technologies Inc Recent Developments/Updates
 Table 150. Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Company Information
 Table 151. Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Specification and Application
 Table 152. Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 153. Yamaichi Electronics Main Business and Markets Served
 Table 154. Yamaichi Electronics Recent Developments/Updates
 Table 155. Key Raw Materials Lists
 Table 156. Raw Materials Key Suppliers Lists
 Table 157. Small Outline Integrated Circuit (SOIC) Package Distributors List
 Table 158. Small Outline Integrated Circuit (SOIC) Package Customers List
 Table 159. Small Outline Integrated Circuit (SOIC) Package Market Trends
 Table 160. Small Outline Integrated Circuit (SOIC) Package Market Drivers
 Table 161. Small Outline Integrated Circuit (SOIC) Package Market Challenges
 Table 162. Small Outline Integrated Circuit (SOIC) Package Market Restraints
 Table 163. Research Programs/Design for This Report
 Table 164. Key Data Information from Secondary Sources
 Table 165. Key Data Information from Primary Sources
 Table 166. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Small Outline Integrated Circuit (SOIC) Package
 Figure 2. Global Small Outline Integrated Circuit (SOIC) Package Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Small Outline Integrated Circuit (SOIC) Package Market Share by Type: 2024 VS 2031
 Figure 4. Mini-SOIC Product Picture
 Figure 5. Small Outline J-Lead Package Product Picture
 Figure 6. Others Product Picture
 Figure 7. Global Small Outline Integrated Circuit (SOIC) Package Market Value by Application, (US$ Million) & (2020-2031)
 Figure 8. Global Small Outline Integrated Circuit (SOIC) Package Market Share by Application: 2024 VS 2031
 Figure 9. Industrial
 Figure 10. Consumer Electronics
 Figure 11. Automotive
 Figure 12. Medical Devices
 Figure 13. Military and Defense
 Figure 14. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 15. Global Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) & (2020-2031)
 Figure 16. Global Small Outline Integrated Circuit (SOIC) Package Production Capacity (K Units) & (2020-2031)
 Figure 17. Global Small Outline Integrated Circuit (SOIC) Package Production (K Units) & (2020-2031)
 Figure 18. Global Small Outline Integrated Circuit (SOIC) Package Average Price (US$/Unit) & (2020-2031)
 Figure 19. Small Outline Integrated Circuit (SOIC) Package Report Years Considered
 Figure 20. Small Outline Integrated Circuit (SOIC) Package Production Share by Manufacturers in 2024
 Figure 21. Global Small Outline Integrated Circuit (SOIC) Package Production Value Share by Manufacturers (2024)
 Figure 22. Small Outline Integrated Circuit (SOIC) Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 23. The Global 5 and 10 Largest Players: Market Share by Small Outline Integrated Circuit (SOIC) Package Revenue in 2024
 Figure 24. Global Small Outline Integrated Circuit (SOIC) Package Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 25. Global Small Outline Integrated Circuit (SOIC) Package Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 26. Global Small Outline Integrated Circuit (SOIC) Package Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 27. Global Small Outline Integrated Circuit (SOIC) Package Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 28. North America Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Europe Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. China Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. Japan Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. South Korea Small Outline Integrated Circuit (SOIC) Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. Global Small Outline Integrated Circuit (SOIC) Package Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 34. Global Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 35. North America Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 36. North America Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Country (2020-2031)
 Figure 37. U.S. Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 38. Canada Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Europe Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. Europe Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Country (2020-2031)
 Figure 41. Germany Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 42. France Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. U.K. Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. Italy Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Netherlands Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Asia Pacific Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Region (2020-2031)
 Figure 48. China Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 49. Japan Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. South Korea Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. China Taiwan Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. Southeast Asia Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. India Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Latin America, Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Consumption Market Share by Country (2020-2031)
 Figure 56. Mexico Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 57. Brazil Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Israel Small Outline Integrated Circuit (SOIC) Package Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 59. Global Production Market Share of Small Outline Integrated Circuit (SOIC) Package by Type (2020-2031)
 Figure 60. Global Production Value Market Share of Small Outline Integrated Circuit (SOIC) Package by Type (2020-2031)
 Figure 61. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Type (2020-2031)
 Figure 62. Global Production Market Share of Small Outline Integrated Circuit (SOIC) Package by Application (2020-2031)
 Figure 63. Global Production Value Market Share of Small Outline Integrated Circuit (SOIC) Package by Application (2020-2031)
 Figure 64. Global Small Outline Integrated Circuit (SOIC) Package Price (US$/Unit) by Application (2020-2031)
 Figure 65. Small Outline Integrated Circuit (SOIC) Package Value Chain
 Figure 66. Channels of Distribution (Direct Vs Distribution)
 Figure 67. Bottom-up and Top-down Approaches for This Report
 Figure 68. Data Triangulation
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