The global Integrated Circuits (IC) Packaging & Testing market was valued at US$ 89440 million in 2023 and is anticipated to reach US$ 125970 million by 2030, witnessing a CAGR of 5.1% during the forecast period 2024-2030.

Integrated Circuits (IC) Packaging & Testing Market

A process wherein a semiconductor chip is packaged in a form suitable for the electronic device.

Semiconductor packaging is a process of protecting the chip from the external environment, and electrically packaging it to connect the terminals. The integrated circuit (IC) is a component of circuit boards and electronic devices. ICs need to be electrically packaged in a form fitting to where they’re installed. They are responsible for interconnects, supplying electrical power, and heat dissipation. Packaging also protects the semiconductor chips, shielding the integrated circuits from external factors such as high temperatures, impurities, and physical impact. Each chip is tested to verify normal operation after the packaging process has been completed. This testing is called the package test. The package test is conducted on finished chip products. Chips are placed in a testing apparatus and tested under various conditions to sort out defective products.

The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing. According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.

This report studies the Integrated Circuits (IC) Packaging and Testing Service.

The key IDMs include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi; and the key OSATs include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation and ChipMOS TECHNOLOGIES, etc.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.27% year-on-year.

This report aims to provide a comprehensive presentation of the global market for Integrated Circuits (IC) Packaging & Testing, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Integrated Circuits (IC) Packaging & Testing.

The Integrated Circuits (IC) Packaging & Testing market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Integrated Circuits (IC) Packaging & Testing market comprehensively. Regional market sizes, concerning products by Business Model, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Integrated Circuits (IC) Packaging & Testing companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Business Model, by Application, and by regions.

Market Segmentation

Scope of Integrated Circuits (IC) Packaging & Testing Market Report

Report Metric	Details
Report Name	Integrated Circuits (IC) Packaging & Testing Market
Accounted market size in 2023	US$ 89440 million
Forecasted market size in 2030	US$ 125970 million
CAGR	5.1%
Base Year	2023
Forecasted years	2024 - 2030
Segment by Business Model	IDM OSAT
Segment by Application	Analog IC Packaging & Testing MPU & MCUs IC Packaging & Testing Logic IC Packaging & Testing Memory IC Packaging & Testing
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Western Digital, Infineon, NXP, Analog Devices, Inc. (ADI), Renesas, Microchip Technology, Onsemi, Sony Semiconductor Solutions Corporation, Panasonic, Winbond, Nanya Technology, ISSI (Integrated Silicon Solution Inc.), Macronix, Giantec Semiconductor, Sharp, Magnachip, Toshiba, JS Foundry KK., Hitachi, Murata, Skyworks Solutions Inc, Wolfspeed, Littelfuse, Diodes Incorporated, Rohm, Fuji Electric, Vishay Intertechnology, Mitsubishi Electric, Nexperia, Ampleon, CR Micro, Hangzhou Silan Integrated Circuit, ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Hefei Chipmore Technology Co.,Ltd., HT-tech, Chippacking
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Business Model, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Integrated Circuits (IC) Packaging & Testing company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Business Model, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Integrated Circuits (IC) Packaging & Testing Market growing?

Ans: The Integrated Circuits (IC) Packaging & Testing Market witnessing a CAGR of 5.1% during the forecast period 2024-2030.

What is the Integrated Circuits (IC) Packaging & Testing Market size in 2030?

Ans: The Integrated Circuits (IC) Packaging & Testing Market size in 2030 will be US$ 125970 million.

What is the Integrated Circuits (IC) Packaging & Testing Market share by region?

Ans: Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year.

Who are the main players in the Integrated Circuits (IC) Packaging & Testing Market report?

Ans: The main players in the Integrated Circuits (IC) Packaging & Testing Market are Samsung, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Western Digital, Infineon, NXP, Analog Devices, Inc. (ADI), Renesas, Microchip Technology, Onsemi, Sony Semiconductor Solutions Corporation, Panasonic, Winbond, Nanya Technology, ISSI (Integrated Silicon Solution Inc.), Macronix, Giantec Semiconductor, Sharp, Magnachip, Toshiba, JS Foundry KK., Hitachi, Murata, Skyworks Solutions Inc, Wolfspeed, Littelfuse, Diodes Incorporated, Rohm, Fuji Electric, Vishay Intertechnology, Mitsubishi Electric, Nexperia, Ampleon, CR Micro, Hangzhou Silan Integrated Circuit, ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Hefei Chipmore Technology Co.,Ltd., HT-tech, Chippacking

What are the Application segmentation covered in the Integrated Circuits (IC) Packaging & Testing Market report?

Ans: The Applications covered in the Integrated Circuits (IC) Packaging & Testing Market report are Analog IC Packaging & Testing, MPU & MCUs IC Packaging & Testing, Logic IC Packaging & Testing, Memory IC Packaging & Testing

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Business Model

1.2.1 Global Integrated Circuits (IC) Packaging & Testing Market Size Growth Rate by Business Model: 2019 VS 2023 VS 2030

1.2.2 IDM

1.2.3 OSAT

1.3 Market by Application

1.3.1 Global Integrated Circuits (IC) Packaging & Testing Market Growth by Application: 2019 VS 2023 VS 2030

1.3.2 Analog IC Packaging & Testing

1.3.3 MPU & MCUs IC Packaging & Testing

1.3.4 Logic IC Packaging & Testing

1.3.5 Memory IC Packaging & Testing

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Integrated Circuits (IC) Packaging & Testing Market Perspective (2019-2030)

2.2 Global Integrated Circuits (IC) Packaging & Testing Growth Trends by Region

2.2.1 Global Integrated Circuits (IC) Packaging & Testing Market Size by Region: 2019 VS 2023 VS 2030

2.2.2 Integrated Circuits (IC) Packaging & Testing Historic Market Size by Region (2019-2024)

2.2.3 Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Region (2025-2030)

2.3 Integrated Circuits (IC) Packaging & Testing Market Dynamics

2.3.1 Integrated Circuits (IC) Packaging & Testing Industry Trends

2.3.2 Integrated Circuits (IC) Packaging & Testing Market Drivers

2.3.3 Integrated Circuits (IC) Packaging & Testing Market Challenges

2.3.4 Integrated Circuits (IC) Packaging & Testing Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Integrated Circuits (IC) Packaging & Testing Players by Revenue

3.1.1 Global Top Integrated Circuits (IC) Packaging & Testing Players by Revenue (2019-2024)

3.1.2 Global Integrated Circuits (IC) Packaging & Testing Revenue Market Share by Players (2019-2024)

3.2 Global Integrated Circuits (IC) Packaging & Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Integrated Circuits (IC) Packaging & Testing Revenue

3.4 Global Integrated Circuits (IC) Packaging & Testing Market Concentration Ratio

3.4.1 Global Integrated Circuits (IC) Packaging & Testing Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Integrated Circuits (IC) Packaging & Testing Revenue in 2023

3.5 Global Key Players of Integrated Circuits (IC) Packaging & Testing Head office and Area Served

3.6 Global Key Players of Integrated Circuits (IC) Packaging & Testing, Product and Application

3.7 Global Key Players of Integrated Circuits (IC) Packaging & Testing, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Integrated Circuits (IC) Packaging & Testing Breakdown Data by Business Model

4.1 Global Integrated Circuits (IC) Packaging & Testing Historic Market Size by Business Model (2019-2024)

4.2 Global Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Business Model (2025-2030)

5 Integrated Circuits (IC) Packaging & Testing Breakdown Data by Application

5.1 Global Integrated Circuits (IC) Packaging & Testing Historic Market Size by Application (2019-2024)

5.2 Global Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Application (2025-2030)

6 North America

6.1 North America Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)

6.2 North America Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

6.3 North America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024)

6.4 North America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)

7.2 Europe Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

7.3 Europe Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024)

7.4 Europe Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)

8.2 Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

8.3 Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size by Region (2019-2024)

8.4 Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size by Region (2025-2030)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)

9.2 Latin America Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

9.3 Latin America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024)

9.4 Latin America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size (2019-2030)

10.2 Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Growth Rate by Country: 2019 VS 2023 VS 2030

10.3 Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024)

10.4 Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Samsung

11.1.1 Samsung Company Details

11.1.2 Samsung Business Overview

11.1.3 Samsung Integrated Circuits (IC) Packaging & Testing Introduction

11.1.4 Samsung Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.1.5 Samsung Recent Development

11.2 Intel

11.2.1 Intel Company Details

11.2.2 Intel Business Overview

11.2.3 Intel Integrated Circuits (IC) Packaging & Testing Introduction

11.2.4 Intel Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.2.5 Intel Recent Development

11.3 SK Hynix

11.3.1 SK Hynix Company Details

11.3.2 SK Hynix Business Overview

11.3.3 SK Hynix Integrated Circuits (IC) Packaging & Testing Introduction

11.3.4 SK Hynix Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.3.5 SK Hynix Recent Development

11.4 Micron Technology

11.4.1 Micron Technology Company Details

11.4.2 Micron Technology Business Overview

11.4.3 Micron Technology Integrated Circuits (IC) Packaging & Testing Introduction

11.4.4 Micron Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.4.5 Micron Technology Recent Development

11.5 Texas Instruments (TI)

11.5.1 Texas Instruments (TI) Company Details

11.5.2 Texas Instruments (TI) Business Overview

11.5.3 Texas Instruments (TI) Integrated Circuits (IC) Packaging & Testing Introduction

11.5.4 Texas Instruments (TI) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.5.5 Texas Instruments (TI) Recent Development

11.6 STMicroelectronics

11.6.1 STMicroelectronics Company Details

11.6.2 STMicroelectronics Business Overview

11.6.3 STMicroelectronics Integrated Circuits (IC) Packaging & Testing Introduction

11.6.4 STMicroelectronics Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.6.5 STMicroelectronics Recent Development

11.7 Kioxia

11.7.1 Kioxia Company Details

11.7.2 Kioxia Business Overview

11.7.3 Kioxia Integrated Circuits (IC) Packaging & Testing Introduction

11.7.4 Kioxia Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.7.5 Kioxia Recent Development

11.8 Western Digital

11.8.1 Western Digital Company Details

11.8.2 Western Digital Business Overview

11.8.3 Western Digital Integrated Circuits (IC) Packaging & Testing Introduction

11.8.4 Western Digital Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.8.5 Western Digital Recent Development

11.9 Infineon

11.9.1 Infineon Company Details

11.9.2 Infineon Business Overview

11.9.3 Infineon Integrated Circuits (IC) Packaging & Testing Introduction

11.9.4 Infineon Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.9.5 Infineon Recent Development

11.10 NXP

11.10.1 NXP Company Details

11.10.2 NXP Business Overview

11.10.3 NXP Integrated Circuits (IC) Packaging & Testing Introduction

11.10.4 NXP Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.10.5 NXP Recent Development

11.11 Analog Devices, Inc. (ADI)

11.11.1 Analog Devices, Inc. (ADI) Company Details

11.11.2 Analog Devices, Inc. (ADI) Business Overview

11.11.3 Analog Devices, Inc. (ADI) Integrated Circuits (IC) Packaging & Testing Introduction

11.11.4 Analog Devices, Inc. (ADI) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.11.5 Analog Devices, Inc. (ADI) Recent Development

11.12 Renesas

11.12.1 Renesas Company Details

11.12.2 Renesas Business Overview

11.12.3 Renesas Integrated Circuits (IC) Packaging & Testing Introduction

11.12.4 Renesas Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.12.5 Renesas Recent Development

11.13 Microchip Technology

11.13.1 Microchip Technology Company Details

11.13.2 Microchip Technology Business Overview

11.13.3 Microchip Technology Integrated Circuits (IC) Packaging & Testing Introduction

11.13.4 Microchip Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.13.5 Microchip Technology Recent Development

11.14 Onsemi

11.14.1 Onsemi Company Details

11.14.2 Onsemi Business Overview

11.14.3 Onsemi Integrated Circuits (IC) Packaging & Testing Introduction

11.14.4 Onsemi Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.14.5 Onsemi Recent Development

11.15 Sony Semiconductor Solutions Corporation

11.15.1 Sony Semiconductor Solutions Corporation Company Details

11.15.2 Sony Semiconductor Solutions Corporation Business Overview

11.15.3 Sony Semiconductor Solutions Corporation Integrated Circuits (IC) Packaging & Testing Introduction

11.15.4 Sony Semiconductor Solutions Corporation Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.15.5 Sony Semiconductor Solutions Corporation Recent Development

11.16 Panasonic

11.16.1 Panasonic Company Details

11.16.2 Panasonic Business Overview

11.16.3 Panasonic Integrated Circuits (IC) Packaging & Testing Introduction

11.16.4 Panasonic Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.16.5 Panasonic Recent Development

11.17 Winbond

11.17.1 Winbond Company Details

11.17.2 Winbond Business Overview

11.17.3 Winbond Integrated Circuits (IC) Packaging & Testing Introduction

11.17.4 Winbond Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.17.5 Winbond Recent Development

11.18 Nanya Technology

11.18.1 Nanya Technology Company Details

11.18.2 Nanya Technology Business Overview

11.18.3 Nanya Technology Integrated Circuits (IC) Packaging & Testing Introduction

11.18.4 Nanya Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.18.5 Nanya Technology Recent Development

11.19 ISSI (Integrated Silicon Solution Inc.)

11.19.1 ISSI (Integrated Silicon Solution Inc.) Company Details

11.19.2 ISSI (Integrated Silicon Solution Inc.) Business Overview

11.19.3 ISSI (Integrated Silicon Solution Inc.) Integrated Circuits (IC) Packaging & Testing Introduction

11.19.4 ISSI (Integrated Silicon Solution Inc.) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.19.5 ISSI (Integrated Silicon Solution Inc.) Recent Development

11.20 Macronix

11.20.1 Macronix Company Details

11.20.2 Macronix Business Overview

11.20.3 Macronix Integrated Circuits (IC) Packaging & Testing Introduction

11.20.4 Macronix Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.20.5 Macronix Recent Development

11.21 Giantec Semiconductor

11.21.1 Giantec Semiconductor Company Details

11.21.2 Giantec Semiconductor Business Overview

11.21.3 Giantec Semiconductor Integrated Circuits (IC) Packaging & Testing Introduction

11.21.4 Giantec Semiconductor Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.21.5 Giantec Semiconductor Recent Development

11.22 Sharp

11.22.1 Sharp Company Details

11.22.2 Sharp Business Overview

11.22.3 Sharp Integrated Circuits (IC) Packaging & Testing Introduction

11.22.4 Sharp Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.22.5 Sharp Recent Development

11.23 Magnachip

11.23.1 Magnachip Company Details

11.23.2 Magnachip Business Overview

11.23.3 Magnachip Integrated Circuits (IC) Packaging & Testing Introduction

11.23.4 Magnachip Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.23.5 Magnachip Recent Development

11.24 Toshiba

11.24.1 Toshiba Company Details

11.24.2 Toshiba Business Overview

11.24.3 Toshiba Integrated Circuits (IC) Packaging & Testing Introduction

11.24.4 Toshiba Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.24.5 Toshiba Recent Development

11.25 JS Foundry KK.

11.25.1 JS Foundry KK. Company Details

11.25.2 JS Foundry KK. Business Overview

11.25.3 JS Foundry KK. Integrated Circuits (IC) Packaging & Testing Introduction

11.25.4 JS Foundry KK. Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.25.5 JS Foundry KK. Recent Development

11.26 Hitachi

11.26.1 Hitachi Company Details

11.26.2 Hitachi Business Overview

11.26.3 Hitachi Integrated Circuits (IC) Packaging & Testing Introduction

11.26.4 Hitachi Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.26.5 Hitachi Recent Development

11.27 Murata

11.27.1 Murata Company Details

11.27.2 Murata Business Overview

11.27.3 Murata Integrated Circuits (IC) Packaging & Testing Introduction

11.27.4 Murata Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.27.5 Murata Recent Development

11.28 Skyworks Solutions Inc

11.28.1 Skyworks Solutions Inc Company Details

11.28.2 Skyworks Solutions Inc Business Overview

11.28.3 Skyworks Solutions Inc Integrated Circuits (IC) Packaging & Testing Introduction

11.28.4 Skyworks Solutions Inc Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.28.5 Skyworks Solutions Inc Recent Development

11.29 Wolfspeed

11.29.1 Wolfspeed Company Details

11.29.2 Wolfspeed Business Overview

11.29.3 Wolfspeed Integrated Circuits (IC) Packaging & Testing Introduction

11.29.4 Wolfspeed Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.29.5 Wolfspeed Recent Development

11.30 Littelfuse

11.30.1 Littelfuse Company Details

11.30.2 Littelfuse Business Overview

11.30.3 Littelfuse Integrated Circuits (IC) Packaging & Testing Introduction

11.30.4 Littelfuse Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.30.5 Littelfuse Recent Development

11.31 Diodes Incorporated

11.31.1 Diodes Incorporated Company Details

11.31.2 Diodes Incorporated Business Overview

11.31.3 Diodes Incorporated Integrated Circuits (IC) Packaging & Testing Introduction

11.31.4 Diodes Incorporated Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.31.5 Diodes Incorporated Recent Development

11.32 Rohm

11.32.1 Rohm Company Details

11.32.2 Rohm Business Overview

11.32.3 Rohm Integrated Circuits (IC) Packaging & Testing Introduction

11.32.4 Rohm Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.32.5 Rohm Recent Development

11.33 Fuji Electric

11.33.1 Fuji Electric Company Details

11.33.2 Fuji Electric Business Overview

11.33.3 Fuji Electric Integrated Circuits (IC) Packaging & Testing Introduction

11.33.4 Fuji Electric Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.33.5 Fuji Electric Recent Development

11.34 Vishay Intertechnology

11.34.1 Vishay Intertechnology Company Details

11.34.2 Vishay Intertechnology Business Overview

11.34.3 Vishay Intertechnology Integrated Circuits (IC) Packaging & Testing Introduction

11.34.4 Vishay Intertechnology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.34.5 Vishay Intertechnology Recent Development

11.35 Mitsubishi Electric

11.35.1 Mitsubishi Electric Company Details

11.35.2 Mitsubishi Electric Business Overview

11.35.3 Mitsubishi Electric Integrated Circuits (IC) Packaging & Testing Introduction

11.35.4 Mitsubishi Electric Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.35.5 Mitsubishi Electric Recent Development

11.36 Nexperia

11.36.1 Nexperia Company Details

11.36.2 Nexperia Business Overview

11.36.3 Nexperia Integrated Circuits (IC) Packaging & Testing Introduction

11.36.4 Nexperia Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.36.5 Nexperia Recent Development

11.37 Ampleon

11.37.1 Ampleon Company Details

11.37.2 Ampleon Business Overview

11.37.3 Ampleon Integrated Circuits (IC) Packaging & Testing Introduction

11.37.4 Ampleon Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.37.5 Ampleon Recent Development

11.38 CR Micro

11.38.1 CR Micro Company Details

11.38.2 CR Micro Business Overview

11.38.3 CR Micro Integrated Circuits (IC) Packaging & Testing Introduction

11.38.4 CR Micro Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.38.5 CR Micro Recent Development

11.39 Hangzhou Silan Integrated Circuit

11.39.1 Hangzhou Silan Integrated Circuit Company Details

11.39.2 Hangzhou Silan Integrated Circuit Business Overview

11.39.3 Hangzhou Silan Integrated Circuit Integrated Circuits (IC) Packaging & Testing Introduction

11.39.4 Hangzhou Silan Integrated Circuit Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.39.5 Hangzhou Silan Integrated Circuit Recent Development

11.40 ASE (SPIL)

11.40.1 ASE (SPIL) Company Details

11.40.2 ASE (SPIL) Business Overview

11.40.3 ASE (SPIL) Integrated Circuits (IC) Packaging & Testing Introduction

11.40.4 ASE (SPIL) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

11.40.5 ASE (SPIL) Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

Texas Instruments (Ti)

Analog Devices, Inc. (ADI)

Renesas

Microchip Technology

Onsemi

Sony Semiconductor Solutions Corporation

Panasonic

Winbond

Nanya Technology

ISSI, Integrated Silicon Solution Inc

Macronix

Giantec Semiconductor

Skyworks Solutions Inc.

Vishay Intertechnology

Hangzhou Silan Integrated Circuit

ASE(SPIL)

Amkor

JCET (STATS ChipPAC)

Tongfu Microelectronics (TFME)

Powertech Technology Inc. (PTI)

Carsem

King Yuan Electronics Corp. (KYEC)

SFA Semicon

Unisem Group

Chipbond Technology Corporation

ChipMOS TECHNOLOGIES

OSE CORP

Sigurd Microelectronics

Natronix Semiconductor Technology

Nepes

Forehope Electronic (Ningbo) Co.,Ltd.

Union Semiconductor (Hefei) Co., Ltd.

Hefei Chipmore Technology Co.,Ltd.

HT-tech

Chippacking

List of Tables

Table 1. Global Integrated Circuits (IC) Packaging & Testing Market Size Growth Rate by Business Model (US$ Million): 2019 VS 2023 VS 2030

Table 2. Key Players of IDM

Table 3. Key Players of OSAT

Table 4. Global Integrated Circuits (IC) Packaging & Testing Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030

Table 5. Global Integrated Circuits (IC) Packaging & Testing Market Size by Region (US$ Million): 2019 VS 2023 VS 2030

Table 6. Global Integrated Circuits (IC) Packaging & Testing Market Size by Region (2019-2024) & (US$ Million)

Table 7. Global Integrated Circuits (IC) Packaging & Testing Market Share by Region (2019-2024)

Table 8. Global Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Region (2025-2030) & (US$ Million)

Table 9. Global Integrated Circuits (IC) Packaging & Testing Market Share by Region (2025-2030)

Table 10. Integrated Circuits (IC) Packaging & Testing Market Trends

Table 11. Integrated Circuits (IC) Packaging & Testing Market Drivers

Table 12. Integrated Circuits (IC) Packaging & Testing Market Challenges

Table 13. Integrated Circuits (IC) Packaging & Testing Market Restraints

Table 14. Global Integrated Circuits (IC) Packaging & Testing Revenue by Players (2019-2024) & (US$ Million)

Table 15. Global Integrated Circuits (IC) Packaging & Testing Market Share by Players (2019-2024)

Table 16. Global Top Integrated Circuits (IC) Packaging & Testing Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Integrated Circuits (IC) Packaging & Testing as of 2023)

Table 17. Ranking of Global Top Integrated Circuits (IC) Packaging & Testing Companies by Revenue (US$ Million) in 2023

Table 18. Global 5 Largest Players Market Share by Integrated Circuits (IC) Packaging & Testing Revenue (CR5 and HHI) & (2019-2024)

Table 19. Global Key Players of Integrated Circuits (IC) Packaging & Testing, Headquarters and Area Served

Table 20. Global Key Players of Integrated Circuits (IC) Packaging & Testing, Product and Application

Table 21. Global Key Players of Integrated Circuits (IC) Packaging & Testing, Date of Enter into This Industry

Table 22. Mergers & Acquisitions, Expansion Plans

Table 23. Global Integrated Circuits (IC) Packaging & Testing Market Size by Business Model (2019-2024) & (US$ Million)

Table 24. Global Integrated Circuits (IC) Packaging & Testing Revenue Market Share by Business Model (2019-2024)

Table 25. Global Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Business Model (2025-2030) & (US$ Million)

Table 26. Global Integrated Circuits (IC) Packaging & Testing Revenue Market Share by Business Model (2025-2030)

Table 27. Global Integrated Circuits (IC) Packaging & Testing Market Size by Application (2019-2024) & (US$ Million)

Table 28. Global Integrated Circuits (IC) Packaging & Testing Revenue Market Share by Application (2019-2024)

Table 29. Global Integrated Circuits (IC) Packaging & Testing Forecasted Market Size by Application (2025-2030) & (US$ Million)

Table 30. Global Integrated Circuits (IC) Packaging & Testing Revenue Market Share by Application (2025-2030)

Table 31. North America Integrated Circuits (IC) Packaging & Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 32. North America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024) & (US$ Million)

Table 33. North America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030) & (US$ Million)

Table 34. Europe Integrated Circuits (IC) Packaging & Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 35. Europe Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024) & (US$ Million)

Table 36. Europe Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030) & (US$ Million)

Table 37. Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 38. Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size by Region (2019-2024) & (US$ Million)

Table 39. Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size by Region (2025-2030) & (US$ Million)

Table 40. Latin America Integrated Circuits (IC) Packaging & Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 41. Latin America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024) & (US$ Million)

Table 42. Latin America Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030) & (US$ Million)

Table 43. Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 44. Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size by Country (2019-2024) & (US$ Million)

Table 45. Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size by Country (2025-2030) & (US$ Million)

Table 46. Samsung Company Details

Table 47. Samsung Business Overview

Table 48. Samsung Integrated Circuits (IC) Packaging & Testing Product

Table 49. Samsung Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 50. Samsung Recent Development

Table 51. Intel Company Details

Table 52. Intel Business Overview

Table 53. Intel Integrated Circuits (IC) Packaging & Testing Product

Table 54. Intel Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 55. Intel Recent Development

Table 56. SK Hynix Company Details

Table 57. SK Hynix Business Overview

Table 58. SK Hynix Integrated Circuits (IC) Packaging & Testing Product

Table 59. SK Hynix Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 60. SK Hynix Recent Development

Table 61. Micron Technology Company Details

Table 62. Micron Technology Business Overview

Table 63. Micron Technology Integrated Circuits (IC) Packaging & Testing Product

Table 64. Micron Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 65. Micron Technology Recent Development

Table 66. Texas Instruments (TI) Company Details

Table 67. Texas Instruments (TI) Business Overview

Table 68. Texas Instruments (TI) Integrated Circuits (IC) Packaging & Testing Product

Table 69. Texas Instruments (TI) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 70. Texas Instruments (TI) Recent Development

Table 71. STMicroelectronics Company Details

Table 72. STMicroelectronics Business Overview

Table 73. STMicroelectronics Integrated Circuits (IC) Packaging & Testing Product

Table 74. STMicroelectronics Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 75. STMicroelectronics Recent Development

Table 76. Kioxia Company Details

Table 77. Kioxia Business Overview

Table 78. Kioxia Integrated Circuits (IC) Packaging & Testing Product

Table 79. Kioxia Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 80. Kioxia Recent Development

Table 81. Western Digital Company Details

Table 82. Western Digital Business Overview

Table 83. Western Digital Integrated Circuits (IC) Packaging & Testing Product

Table 84. Western Digital Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 85. Western Digital Recent Development

Table 86. Infineon Company Details

Table 87. Infineon Business Overview

Table 88. Infineon Integrated Circuits (IC) Packaging & Testing Product

Table 89. Infineon Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 90. Infineon Recent Development

Table 91. NXP Company Details

Table 92. NXP Business Overview

Table 93. NXP Integrated Circuits (IC) Packaging & Testing Product

Table 94. NXP Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 95. NXP Recent Development

Table 96. Analog Devices, Inc. (ADI) Company Details

Table 97. Analog Devices, Inc. (ADI) Business Overview

Table 98. Analog Devices, Inc. (ADI) Integrated Circuits (IC) Packaging & Testing Product

Table 99. Analog Devices, Inc. (ADI) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 100. Analog Devices, Inc. (ADI) Recent Development

Table 101. Renesas Company Details

Table 102. Renesas Business Overview

Table 103. Renesas Integrated Circuits (IC) Packaging & Testing Product

Table 104. Renesas Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 105. Renesas Recent Development

Table 106. Microchip Technology Company Details

Table 107. Microchip Technology Business Overview

Table 108. Microchip Technology Integrated Circuits (IC) Packaging & Testing Product

Table 109. Microchip Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 110. Microchip Technology Recent Development

Table 111. Onsemi Company Details

Table 112. Onsemi Business Overview

Table 113. Onsemi Integrated Circuits (IC) Packaging & Testing Product

Table 114. Onsemi Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 115. Onsemi Recent Development

Table 116. Sony Semiconductor Solutions Corporation Company Details

Table 117. Sony Semiconductor Solutions Corporation Business Overview

Table 118. Sony Semiconductor Solutions Corporation Integrated Circuits (IC) Packaging & Testing Product

Table 119. Sony Semiconductor Solutions Corporation Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 120. Sony Semiconductor Solutions Corporation Recent Development

Table 121. Panasonic Company Details

Table 122. Panasonic Business Overview

Table 123. Panasonic Integrated Circuits (IC) Packaging & Testing Product

Table 124. Panasonic Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 125. Panasonic Recent Development

Table 126. Winbond Company Details

Table 127. Winbond Business Overview

Table 128. Winbond Integrated Circuits (IC) Packaging & Testing Product

Table 129. Winbond Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 130. Winbond Recent Development

Table 131. Nanya Technology Company Details

Table 132. Nanya Technology Business Overview

Table 133. Nanya Technology Integrated Circuits (IC) Packaging & Testing Product

Table 134. Nanya Technology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 135. Nanya Technology Recent Development

Table 136. ISSI (Integrated Silicon Solution Inc.) Company Details

Table 137. ISSI (Integrated Silicon Solution Inc.) Business Overview

Table 138. ISSI (Integrated Silicon Solution Inc.) Integrated Circuits (IC) Packaging & Testing Product

Table 139. ISSI (Integrated Silicon Solution Inc.) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 140. ISSI (Integrated Silicon Solution Inc.) Recent Development

Table 141. Macronix Company Details

Table 142. Macronix Business Overview

Table 143. Macronix Integrated Circuits (IC) Packaging & Testing Product

Table 144. Macronix Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 145. Macronix Recent Development

Table 146. Giantec Semiconductor Company Details

Table 147. Giantec Semiconductor Business Overview

Table 148. Giantec Semiconductor Integrated Circuits (IC) Packaging & Testing Product

Table 149. Giantec Semiconductor Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 150. Giantec Semiconductor Recent Development

Table 151. Sharp Company Details

Table 152. Sharp Business Overview

Table 153. Sharp Integrated Circuits (IC) Packaging & Testing Product

Table 154. Sharp Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 155. Sharp Recent Development

Table 156. Magnachip Company Details

Table 157. Magnachip Business Overview

Table 158. Magnachip Integrated Circuits (IC) Packaging & Testing Product

Table 159. Magnachip Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 160. Magnachip Recent Development

Table 161. Toshiba Company Details

Table 162. Toshiba Business Overview

Table 163. Toshiba Integrated Circuits (IC) Packaging & Testing Product

Table 164. Toshiba Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 165. Toshiba Recent Development

Table 166. JS Foundry KK. Company Details

Table 167. JS Foundry KK. Business Overview

Table 168. JS Foundry KK. Integrated Circuits (IC) Packaging & Testing Product

Table 169. JS Foundry KK. Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 170. JS Foundry KK. Recent Development

Table 171. Hitachi Company Details

Table 172. Hitachi Business Overview

Table 173. Hitachi Integrated Circuits (IC) Packaging & Testing Product

Table 174. Hitachi Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 175. Hitachi Recent Development

Table 176. Murata Company Details

Table 177. Murata Business Overview

Table 178. Murata Integrated Circuits (IC) Packaging & Testing Product

Table 179. Murata Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 180. Murata Recent Development

Table 181. Skyworks Solutions Inc Company Details

Table 182. Skyworks Solutions Inc Business Overview

Table 183. Skyworks Solutions Inc Integrated Circuits (IC) Packaging & Testing Product

Table 184. Skyworks Solutions Inc Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 185. Skyworks Solutions Inc Recent Development

Table 186. Wolfspeed Company Details

Table 187. Wolfspeed Business Overview

Table 188. Wolfspeed Integrated Circuits (IC) Packaging & Testing Product

Table 189. Wolfspeed Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 190. Wolfspeed Recent Development

Table 191. Littelfuse Company Details

Table 192. Littelfuse Business Overview

Table 193. Littelfuse Integrated Circuits (IC) Packaging & Testing Product

Table 194. Littelfuse Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 195. Littelfuse Recent Development

Table 196. Diodes Incorporated Company Details

Table 197. Diodes Incorporated Business Overview

Table 198. Diodes Incorporated Integrated Circuits (IC) Packaging & Testing Product

Table 199. Diodes Incorporated Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 200. Diodes Incorporated Recent Development

Table 201. Rohm Company Details

Table 202. Rohm Business Overview

Table 203. Rohm Integrated Circuits (IC) Packaging & Testing Product

Table 204. Rohm Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 205. Rohm Recent Development

Table 206. Fuji Electric Company Details

Table 207. Fuji Electric Business Overview

Table 208. Fuji Electric Integrated Circuits (IC) Packaging & Testing Product

Table 209. Fuji Electric Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 210. Fuji Electric Recent Development

Table 211. Vishay Intertechnology Company Details

Table 212. Vishay Intertechnology Business Overview

Table 213. Vishay Intertechnology Integrated Circuits (IC) Packaging & Testing Product

Table 214. Vishay Intertechnology Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 215. Vishay Intertechnology Recent Development

Table 216. Mitsubishi Electric Company Details

Table 217. Mitsubishi Electric Business Overview

Table 218. Mitsubishi Electric Integrated Circuits (IC) Packaging & Testing Product

Table 219. Mitsubishi Electric Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 220. Mitsubishi Electric Recent Development

Table 221. Nexperia Company Details

Table 222. Nexperia Business Overview

Table 223. Nexperia Integrated Circuits (IC) Packaging & Testing Product

Table 224. Nexperia Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 225. Nexperia Recent Development

Table 226. Ampleon Company Details

Table 227. Ampleon Business Overview

Table 228. Ampleon Integrated Circuits (IC) Packaging & Testing Product

Table 229. Ampleon Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 230. Ampleon Recent Development

Table 231. CR Micro Company Details

Table 232. CR Micro Business Overview

Table 233. CR Micro Integrated Circuits (IC) Packaging & Testing Product

Table 234. CR Micro Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 235. CR Micro Recent Development

Table 236. Hangzhou Silan Integrated Circuit Company Details

Table 237. Hangzhou Silan Integrated Circuit Business Overview

Table 238. Hangzhou Silan Integrated Circuit Integrated Circuits (IC) Packaging & Testing Product

Table 239. Hangzhou Silan Integrated Circuit Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 240. Hangzhou Silan Integrated Circuit Recent Development

Table 241. ASE (SPIL) Company Details

Table 242. ASE (SPIL) Business Overview

Table 243. ASE (SPIL) Integrated Circuits (IC) Packaging & Testing Product

Table 244. ASE (SPIL) Revenue in Integrated Circuits (IC) Packaging & Testing Business (2019-2024) & (US$ Million)

Table 245. ASE (SPIL) Recent Development

Table 246. Research Programs/Design for This Report

Table 247. Key Data Information from Secondary Sources

Table 248. Key Data Information from Primary Sources

Table 249. Authors List of This Report

List of Figures

Figure 1. Integrated Circuits (IC) Packaging & Testing Picture

Figure 2. Global Integrated Circuits (IC) Packaging & Testing Market Size Comparison by Business Model (2024-2030) & (US$ Million)

Figure 3. Global Integrated Circuits (IC) Packaging & Testing Market Share by Business Model: 2023 VS 2030

Figure 4. IDM Features

Figure 5. OSAT Features

Figure 6. Global Integrated Circuits (IC) Packaging & Testing Market Size by Application (2024-2030) & (US$ Million)

Figure 7. Global Integrated Circuits (IC) Packaging & Testing Market Share by Application: 2023 VS 2030

Figure 8. Analog IC Packaging & Testing Case Studies

Figure 9. MPU & MCUs IC Packaging & Testing Case Studies

Figure 10. Logic IC Packaging & Testing Case Studies

Figure 11. Memory IC Packaging & Testing Case Studies

Figure 12. Integrated Circuits (IC) Packaging & Testing Report Years Considered

Figure 13. Global Integrated Circuits (IC) Packaging & Testing Market Size (US$ Million), Year-over-Year: 2019-2030

Figure 14. Global Integrated Circuits (IC) Packaging & Testing Market Size, (US$ Million), 2019 VS 2023 VS 2030

Figure 15. Global Integrated Circuits (IC) Packaging & Testing Market Share by Region: 2023 VS 2030

Figure 16. Global Integrated Circuits (IC) Packaging & Testing Market Share by Players in 2023

Figure 17. Global Top Integrated Circuits (IC) Packaging & Testing Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Integrated Circuits (IC) Packaging & Testing as of 2023)

Figure 18. The Top 10 and 5 Players Market Share by Integrated Circuits (IC) Packaging & Testing Revenue in 2023

Figure 19. North America Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 20. North America Integrated Circuits (IC) Packaging & Testing Market Share by Country (2019-2030)

Figure 21. United States Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 22. Canada Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 23. Europe Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 24. Europe Integrated Circuits (IC) Packaging & Testing Market Share by Country (2019-2030)

Figure 25. Germany Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 26. France Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 27. U.K. Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 28. Italy Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 29. Russia Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 30. Nordic Countries Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 31. Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 32. Asia-Pacific Integrated Circuits (IC) Packaging & Testing Market Share by Region (2019-2030)

Figure 33. China Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 34. Japan Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 35. South Korea Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 36. Southeast Asia Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 37. India Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 38. Australia Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 39. Latin America Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 40. Latin America Integrated Circuits (IC) Packaging & Testing Market Share by Country (2019-2030)

Figure 41. Mexico Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 42. Brazil Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 43. Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 44. Middle East & Africa Integrated Circuits (IC) Packaging & Testing Market Share by Country (2019-2030)

Figure 45. Turkey Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 46. Saudi Arabia Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 47. UAE Integrated Circuits (IC) Packaging & Testing Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 48. Samsung Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 49. Intel Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 50. SK Hynix Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 51. Micron Technology Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 52. Texas Instruments (TI) Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 53. STMicroelectronics Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 54. Kioxia Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 55. Western Digital Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 56. Infineon Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 57. NXP Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 58. Analog Devices, Inc. (ADI) Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 59. Renesas Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 60. Microchip Technology Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 61. Onsemi Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 62. Sony Semiconductor Solutions Corporation Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 63. Panasonic Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 64. Winbond Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 65. Nanya Technology Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 66. ISSI (Integrated Silicon Solution Inc.) Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 67. Macronix Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 68. Giantec Semiconductor Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 69. Sharp Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 70. Magnachip Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 71. Toshiba Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 72. JS Foundry KK. Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 73. Hitachi Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 74. Murata Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 75. Skyworks Solutions Inc Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 76. Wolfspeed Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 77. Littelfuse Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 78. Diodes Incorporated Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 79. Rohm Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 80. Fuji Electric Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 81. Vishay Intertechnology Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 82. Mitsubishi Electric Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 83. Nexperia Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 84. Ampleon Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 85. CR Micro Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 86. Hangzhou Silan Integrated Circuit Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 87. ASE (SPIL) Revenue Growth Rate in Integrated Circuits (IC) Packaging & Testing Business (2019-2024)

Figure 88. Bottom-up and Top-down Approaches for This Report

Figure 89. Data Triangulation

Figure 90. Key Executives Interviewed

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