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Global Chip Encapsulation Material Market Research Report 2025

Published Date: March 2025

Report Code: QYRE-Auto-36K10195

Global Chip Encapsulation Material Market Research Report 2022

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Global Chip Encapsulation Material Market Research Report 2025

Code: QYRE-Auto-36K10195

Report

March 2025

Pages:88

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Panasonic

Henkel

Sumitomo Bakelite

Kangqiang Electronics

Kyocera

Mitsui High-tec, Inc

Chang Wah Technology

Heraeus

Tanaka

Shennan Circuit Company Limited

Xingsen Technology

Chip Encapsulation Material Market Size

The global market for Chip Encapsulation Material was valued at US$ 26960 million in the year 2024 and is projected to reach a revised size of US$ 37600 million by 2031, growing at a CAGR of 4.9% during the forecast period.

Chip Encapsulation Material Market

Global key players of chip encapsulation material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, etc. Global top five manufacturers hold a share over 19%. In terms of product, substrate is the largest segment, with a share over 32%. And in terms of application, the largest application is consumer electronics, with a share over 35%.

This report aims to provide a comprehensive presentation of the global market for Chip Encapsulation Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Encapsulation Material.

The Chip Encapsulation Material market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Chip Encapsulation Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Chip Encapsulation Material companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Chip Encapsulation Material Market Report

Report Metric	Details
Report Name	Chip Encapsulation Material Market
Accounted market size in year	US$ 26960 million
Forecasted market size in 2031	US$ 37600 million
CAGR	4.9%
Base Year	year
Forecasted years	2025 - 2031
Segment by Type	Substrates Lead Frame Bonding Wires Encapsulating Resin Others
Segment by Application	Consumer Electronics Automotive Electronics IT and Communication Industry Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, Mitsui High-tec, Inc., Chang Wah Technology, Panasonic, Henkel, Sumitomo Bakelite, Heraeus, Tanaka
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Encapsulation Material company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Chip Encapsulation Material Market growing?

Ans: The Chip Encapsulation Material Market witnessing a CAGR of 4.9% during the forecast period 2025-2031.

What is the Chip Encapsulation Material Market size in 2031?

Ans: The Chip Encapsulation Material Market size in 2031 will be US$ 37600 million.

What is the market share of major companies in Chip Encapsulation Material Market?

Ans: Global top five manufacturers hold a share over 19%.

What is the Chip Encapsulation Material Market share by application?

Ans: And in terms of application, the largest application is consumer electronics, with a share over 35%.

Who are the main players in the Chip Encapsulation Material Market report?

Ans: The main players in the Chip Encapsulation Material Market are Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, Mitsui High-tec, Inc., Chang Wah Technology, Panasonic, Henkel, Sumitomo Bakelite, Heraeus, Tanaka

What are the Application segmentation covered in the Chip Encapsulation Material Market report?

Ans: The Applications covered in the Chip Encapsulation Material Market report are Consumer Electronics, Automotive Electronics, IT and Communication Industry, Others

What are the Type segmentation covered in the Chip Encapsulation Material Market report?

Ans: The Types covered in the Chip Encapsulation Material Market report are Substrates, Lead Frame, Bonding Wires, Encapsulating Resin, Others

Recommended Reports

Encapsulation Materials

Electronic Packaging

Photovoltaic Encapsulation

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Chip Encapsulation Material Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 Substrates

1.2.3 Lead Frame

1.2.4 Bonding Wires

1.2.5 Encapsulating Resin

1.2.6 Others

1.3 Market by Application

1.3.1 Global Chip Encapsulation Material Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 Consumer Electronics

1.3.3 Automotive Electronics

1.3.4 IT and Communication Industry

1.3.5 Others

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Chip Encapsulation Material Market Perspective (2020-2031)

2.2 Global Chip Encapsulation Material Growth Trends by Region

2.2.1 Global Chip Encapsulation Material Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 Chip Encapsulation Material Historic Market Size by Region (2020-2025)

2.2.3 Chip Encapsulation Material Forecasted Market Size by Region (2026-2031)

2.3 Chip Encapsulation Material Market Dynamics

2.3.1 Chip Encapsulation Material Industry Trends

2.3.2 Chip Encapsulation Material Market Drivers

2.3.3 Chip Encapsulation Material Market Challenges

2.3.4 Chip Encapsulation Material Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Chip Encapsulation Material Players by Revenue

3.1.1 Global Top Chip Encapsulation Material Players by Revenue (2020-2025)

3.1.2 Global Chip Encapsulation Material Revenue Market Share by Players (2020-2025)

3.2 Global Chip Encapsulation Material Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Chip Encapsulation Material Revenue

3.4 Global Chip Encapsulation Material Market Concentration Ratio

3.4.1 Global Chip Encapsulation Material Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Chip Encapsulation Material Revenue in 2024

3.5 Global Key Players of Chip Encapsulation Material Head office and Area Served

3.6 Global Key Players of Chip Encapsulation Material, Product and Application

3.7 Global Key Players of Chip Encapsulation Material, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Chip Encapsulation Material Breakdown Data by Type

4.1 Global Chip Encapsulation Material Historic Market Size by Type (2020-2025)

4.2 Global Chip Encapsulation Material Forecasted Market Size by Type (2026-2031)

5 Chip Encapsulation Material Breakdown Data by Application

5.1 Global Chip Encapsulation Material Historic Market Size by Application (2020-2025)

5.2 Global Chip Encapsulation Material Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America Chip Encapsulation Material Market Size (2020-2031)

6.2 North America Chip Encapsulation Material Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America Chip Encapsulation Material Market Size by Country (2020-2025)

6.4 North America Chip Encapsulation Material Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Chip Encapsulation Material Market Size (2020-2031)

7.2 Europe Chip Encapsulation Material Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe Chip Encapsulation Material Market Size by Country (2020-2025)

7.4 Europe Chip Encapsulation Material Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Chip Encapsulation Material Market Size (2020-2031)

8.2 Asia-Pacific Chip Encapsulation Material Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific Chip Encapsulation Material Market Size by Region (2020-2025)

8.4 Asia-Pacific Chip Encapsulation Material Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Chip Encapsulation Material Market Size (2020-2031)

9.2 Latin America Chip Encapsulation Material Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America Chip Encapsulation Material Market Size by Country (2020-2025)

9.4 Latin America Chip Encapsulation Material Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Chip Encapsulation Material Market Size (2020-2031)

10.2 Middle East & Africa Chip Encapsulation Material Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa Chip Encapsulation Material Market Size by Country (2020-2025)

10.4 Middle East & Africa Chip Encapsulation Material Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Shennan Circuit Company Limited

11.1.1 Shennan Circuit Company Limited Company Details

11.1.2 Shennan Circuit Company Limited Business Overview

11.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Introduction

11.1.4 Shennan Circuit Company Limited Revenue in Chip Encapsulation Material Business (2020-2025)

11.1.5 Shennan Circuit Company Limited Recent Development

11.2 Xingsen Technology

11.2.1 Xingsen Technology Company Details

11.2.2 Xingsen Technology Business Overview

11.2.3 Xingsen Technology Chip Encapsulation Material Introduction

11.2.4 Xingsen Technology Revenue in Chip Encapsulation Material Business (2020-2025)

11.2.5 Xingsen Technology Recent Development

11.3 Kangqiang Electronics

11.3.1 Kangqiang Electronics Company Details

11.3.2 Kangqiang Electronics Business Overview

11.3.3 Kangqiang Electronics Chip Encapsulation Material Introduction

11.3.4 Kangqiang Electronics Revenue in Chip Encapsulation Material Business (2020-2025)

11.3.5 Kangqiang Electronics Recent Development

11.4 Kyocera

11.4.1 Kyocera Company Details

11.4.2 Kyocera Business Overview

11.4.3 Kyocera Chip Encapsulation Material Introduction

11.4.4 Kyocera Revenue in Chip Encapsulation Material Business (2020-2025)

11.4.5 Kyocera Recent Development

11.5 Mitsui High-tec, Inc.

11.5.1 Mitsui High-tec, Inc. Company Details

11.5.2 Mitsui High-tec, Inc. Business Overview

11.5.3 Mitsui High-tec, Inc. Chip Encapsulation Material Introduction

11.5.4 Mitsui High-tec, Inc. Revenue in Chip Encapsulation Material Business (2020-2025)

11.5.5 Mitsui High-tec, Inc. Recent Development

11.6 Chang Wah Technology

11.6.1 Chang Wah Technology Company Details

11.6.2 Chang Wah Technology Business Overview

11.6.3 Chang Wah Technology Chip Encapsulation Material Introduction

11.6.4 Chang Wah Technology Revenue in Chip Encapsulation Material Business (2020-2025)

11.6.5 Chang Wah Technology Recent Development

11.7 Panasonic

11.7.1 Panasonic Company Details

11.7.2 Panasonic Business Overview

11.7.3 Panasonic Chip Encapsulation Material Introduction

11.7.4 Panasonic Revenue in Chip Encapsulation Material Business (2020-2025)

11.7.5 Panasonic Recent Development

11.8 Henkel

11.8.1 Henkel Company Details

11.8.2 Henkel Business Overview

11.8.3 Henkel Chip Encapsulation Material Introduction

11.8.4 Henkel Revenue in Chip Encapsulation Material Business (2020-2025)

11.8.5 Henkel Recent Development

11.9 Sumitomo Bakelite

11.9.1 Sumitomo Bakelite Company Details

11.9.2 Sumitomo Bakelite Business Overview

11.9.3 Sumitomo Bakelite Chip Encapsulation Material Introduction

11.9.4 Sumitomo Bakelite Revenue in Chip Encapsulation Material Business (2020-2025)

11.9.5 Sumitomo Bakelite Recent Development

11.10 Heraeus

11.10.1 Heraeus Company Details

11.10.2 Heraeus Business Overview

11.10.3 Heraeus Chip Encapsulation Material Introduction

11.10.4 Heraeus Revenue in Chip Encapsulation Material Business (2020-2025)

11.10.5 Heraeus Recent Development

11.11 Tanaka

11.11.1 Tanaka Company Details

11.11.2 Tanaka Business Overview

11.11.3 Tanaka Chip Encapsulation Material Introduction

11.11.4 Tanaka Revenue in Chip Encapsulation Material Business (2020-2025)

11.11.5 Tanaka Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

Panasonic

Henkel

Sumitomo Bakelite

Kangqiang Electronics

Kyocera

Mitsui High-tec, Inc

Chang Wah Technology

Heraeus

Tanaka

Shennan Circuit Company Limited

Xingsen Technology

List of Tables

Table 1. Global Chip Encapsulation Material Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of Substrates

Table 3. Key Players of Lead Frame

Table 4. Key Players of Bonding Wires

Table 5. Key Players of Encapsulating Resin

Table 6. Key Players of Others

Table 7. Global Chip Encapsulation Material Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 8. Global Chip Encapsulation Material Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 9. Global Chip Encapsulation Material Market Size by Region (2020-2025) & (US$ Million)

Table 10. Global Chip Encapsulation Material Market Share by Region (2020-2025)

Table 11. Global Chip Encapsulation Material Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 12. Global Chip Encapsulation Material Market Share by Region (2026-2031)

Table 13. Chip Encapsulation Material Market Trends

Table 14. Chip Encapsulation Material Market Drivers

Table 15. Chip Encapsulation Material Market Challenges

Table 16. Chip Encapsulation Material Market Restraints

Table 17. Global Chip Encapsulation Material Revenue by Players (2020-2025) & (US$ Million)

Table 18. Global Chip Encapsulation Material Market Share by Players (2020-2025)

Table 19. Global Top Chip Encapsulation Material Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Chip Encapsulation Material as of 2024)

Table 20. Ranking of Global Top Chip Encapsulation Material Companies by Revenue (US$ Million) in 2024

Table 21. Global 5 Largest Players Market Share by Chip Encapsulation Material Revenue (CR5 and HHI) & (2020-2025)

Table 22. Global Key Players of Chip Encapsulation Material, Headquarters and Area Served

Table 23. Global Key Players of Chip Encapsulation Material, Product and Application

Table 24. Global Key Players of Chip Encapsulation Material, Date of Enter into This Industry

Table 25. Mergers & Acquisitions, Expansion Plans

Table 26. Global Chip Encapsulation Material Market Size by Type (2020-2025) & (US$ Million)

Table 27. Global Chip Encapsulation Material Revenue Market Share by Type (2020-2025)

Table 28. Global Chip Encapsulation Material Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 29. Global Chip Encapsulation Material Revenue Market Share by Type (2026-2031)

Table 30. Global Chip Encapsulation Material Market Size by Application (2020-2025) & (US$ Million)

Table 31. Global Chip Encapsulation Material Revenue Market Share by Application (2020-2025)

Table 32. Global Chip Encapsulation Material Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 33. Global Chip Encapsulation Material Revenue Market Share by Application (2026-2031)

Table 34. North America Chip Encapsulation Material Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 35. North America Chip Encapsulation Material Market Size by Country (2020-2025) & (US$ Million)

Table 36. North America Chip Encapsulation Material Market Size by Country (2026-2031) & (US$ Million)

Table 37. Europe Chip Encapsulation Material Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 38. Europe Chip Encapsulation Material Market Size by Country (2020-2025) & (US$ Million)

Table 39. Europe Chip Encapsulation Material Market Size by Country (2026-2031) & (US$ Million)

Table 40. Asia-Pacific Chip Encapsulation Material Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 41. Asia-Pacific Chip Encapsulation Material Market Size by Region (2020-2025) & (US$ Million)

Table 42. Asia-Pacific Chip Encapsulation Material Market Size by Region (2026-2031) & (US$ Million)

Table 43. Latin America Chip Encapsulation Material Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 44. Latin America Chip Encapsulation Material Market Size by Country (2020-2025) & (US$ Million)

Table 45. Latin America Chip Encapsulation Material Market Size by Country (2026-2031) & (US$ Million)

Table 46. Middle East & Africa Chip Encapsulation Material Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 47. Middle East & Africa Chip Encapsulation Material Market Size by Country (2020-2025) & (US$ Million)

Table 48. Middle East & Africa Chip Encapsulation Material Market Size by Country (2026-2031) & (US$ Million)

Table 49. Shennan Circuit Company Limited Company Details

Table 50. Shennan Circuit Company Limited Business Overview

Table 51. Shennan Circuit Company Limited Chip Encapsulation Material Product

Table 52. Shennan Circuit Company Limited Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 53. Shennan Circuit Company Limited Recent Development

Table 54. Xingsen Technology Company Details

Table 55. Xingsen Technology Business Overview

Table 56. Xingsen Technology Chip Encapsulation Material Product

Table 57. Xingsen Technology Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 58. Xingsen Technology Recent Development

Table 59. Kangqiang Electronics Company Details

Table 60. Kangqiang Electronics Business Overview

Table 61. Kangqiang Electronics Chip Encapsulation Material Product

Table 62. Kangqiang Electronics Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 63. Kangqiang Electronics Recent Development

Table 64. Kyocera Company Details

Table 65. Kyocera Business Overview

Table 66. Kyocera Chip Encapsulation Material Product

Table 67. Kyocera Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 68. Kyocera Recent Development

Table 69. Mitsui High-tec, Inc. Company Details

Table 70. Mitsui High-tec, Inc. Business Overview

Table 71. Mitsui High-tec, Inc. Chip Encapsulation Material Product

Table 72. Mitsui High-tec, Inc. Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 73. Mitsui High-tec, Inc. Recent Development

Table 74. Chang Wah Technology Company Details

Table 75. Chang Wah Technology Business Overview

Table 76. Chang Wah Technology Chip Encapsulation Material Product

Table 77. Chang Wah Technology Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 78. Chang Wah Technology Recent Development

Table 79. Panasonic Company Details

Table 80. Panasonic Business Overview

Table 81. Panasonic Chip Encapsulation Material Product

Table 82. Panasonic Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 83. Panasonic Recent Development

Table 84. Henkel Company Details

Table 85. Henkel Business Overview

Table 86. Henkel Chip Encapsulation Material Product

Table 87. Henkel Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 88. Henkel Recent Development

Table 89. Sumitomo Bakelite Company Details

Table 90. Sumitomo Bakelite Business Overview

Table 91. Sumitomo Bakelite Chip Encapsulation Material Product

Table 92. Sumitomo Bakelite Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 93. Sumitomo Bakelite Recent Development

Table 94. Heraeus Company Details

Table 95. Heraeus Business Overview

Table 96. Heraeus Chip Encapsulation Material Product

Table 97. Heraeus Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 98. Heraeus Recent Development

Table 99. Tanaka Company Details

Table 100. Tanaka Business Overview

Table 101. Tanaka Chip Encapsulation Material Product

Table 102. Tanaka Revenue in Chip Encapsulation Material Business (2020-2025) & (US$ Million)

Table 103. Tanaka Recent Development

Table 104. Research Programs/Design for This Report

Table 105. Key Data Information from Secondary Sources

Table 106. Key Data Information from Primary Sources

Table 107. Authors List of This Report

List of Figures

Figure 1. Chip Encapsulation Material Picture

Figure 2. Global Chip Encapsulation Material Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global Chip Encapsulation Material Market Share by Type: 2024 VS 2031

Figure 4. Substrates Features

Figure 5. Lead Frame Features

Figure 6. Bonding Wires Features

Figure 7. Encapsulating Resin Features

Figure 8. Others Features

Figure 9. Global Chip Encapsulation Material Market Size by Application (2020-2031) & (US$ Million)

Figure 10. Global Chip Encapsulation Material Market Share by Application: 2024 VS 2031

Figure 11. Consumer Electronics Case Studies

Figure 12. Automotive Electronics Case Studies

Figure 13. IT and Communication Industry Case Studies

Figure 14. Others Case Studies

Figure 15. Chip Encapsulation Material Report Years Considered

Figure 16. Global Chip Encapsulation Material Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 17. Global Chip Encapsulation Material Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 18. Global Chip Encapsulation Material Market Share by Region: 2024 VS 2031

Figure 19. Global Chip Encapsulation Material Market Share by Players in 2024

Figure 20. Global Top Chip Encapsulation Material Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Chip Encapsulation Material as of 2024)

Figure 21. The Top 10 and 5 Players Market Share by Chip Encapsulation Material Revenue in 2024

Figure 22. North America Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 23. North America Chip Encapsulation Material Market Share by Country (2020-2031)

Figure 24. United States Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 25. Canada Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 26. Europe Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. Europe Chip Encapsulation Material Market Share by Country (2020-2031)

Figure 28. Germany Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. France Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. U.K. Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Italy Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 32. Russia Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 33. Nordic Countries Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 34. Asia-Pacific Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. Asia-Pacific Chip Encapsulation Material Market Share by Region (2020-2031)

Figure 36. China Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. Japan Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. South Korea Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Southeast Asia Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 40. India Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 41. Australia Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 42. Latin America Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Latin America Chip Encapsulation Material Market Share by Country (2020-2031)

Figure 44. Mexico Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 45. Brazil Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 46. Middle East & Africa Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. Middle East & Africa Chip Encapsulation Material Market Share by Country (2020-2031)

Figure 48. Turkey Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 49. Saudi Arabia Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 50. UAE Chip Encapsulation Material Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 51. Shennan Circuit Company Limited Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 52. Xingsen Technology Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 53. Kangqiang Electronics Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 54. Kyocera Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 55. Mitsui High-tec, Inc. Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 56. Chang Wah Technology Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 57. Panasonic Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 58. Henkel Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 59. Sumitomo Bakelite Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 60. Heraeus Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 61. Tanaka Revenue Growth Rate in Chip Encapsulation Material Business (2020-2025)

Figure 62. Bottom-up and Top-down Approaches for This Report

Figure 63. Data Triangulation

Figure 64. Key Executives Interviewed

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Global Chip Encapsulation Material Market Research Report 2025

Published Date: March 2025

Report Code: QYRE-Auto-36K10195

Global Chip Encapsulation Material Market Research Report 2025

FEATURED COMPANIES

Chip Encapsulation Material Market Size

Chip Encapsulation Material Market

Scope of Chip Encapsulation Material Market Report

Chapter Outline

FAQ for this report

How fast is Chip Encapsulation Material Market growing?

What is the Chip Encapsulation Material Market size in 2031?

What is the market share of major companies in Chip Encapsulation Material Market?

What is the Chip Encapsulation Material Market share by application?

Who are the main players in the Chip Encapsulation Material Market report?

What are the Application segmentation covered in the Chip Encapsulation Material Market report?

What are the Type segmentation covered in the Chip Encapsulation Material Market report?

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