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Global Chip Packaging Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2025-2031
Published Date: June 2025
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Report Code: QYRE-Auto-38Q8985
Home | Market Reports | Business & Industrial| Transportation & Logistics
Global Chip Packaging Market Size Status and Forecast 2022
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Global Chip Packaging Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2025-2031

Code: QYRE-Auto-38Q8985
Report
June 2025
Pages:149
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
Nepes
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS

Chip Packaging Market Size

In 2024, the global market size of Chip Packaging was estimated to be worth US$ 35300 million and is forecast to reach approximately US$ 54520 million by 2031 with a CAGR of 6.5% during the forecast period 2025-2031.

Chip Packaging Market

Chip Packaging Market

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.
By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.
The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.
From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.
The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging.
The Chip Packaging market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Chip Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, product type, application, and regions.
Market Segmentation

Scope of Chip Packaging Market Report

Report Metric Details
Report Name Chip Packaging Market
CAGR 6.5%
Segment by Type
  • Traditional Packaging
  • Advanced Packaging
Segment by Application
  • Automotive and Traffic
  • Consumer Electronics
  • Communication
  • Other
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company ASE Group, Amkor Technology, JCET, Siliconware Precision Industries, Powertech Technology, TongFu Microelectronics, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron, OSE, Walton Advanced Engineering, NEPES, Unisem, ChipMOS, Signetics, Carsem, King Yuan ELECTRONICS
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on.
  • Chapter 2: Revenue of Chip Packaging in global and regional level.
  • Chapter 3: Detailed analysis of Chip Packaging company competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Chip Packaging revenue, gross margin, and recent development, etc.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
  • Chapter 8: Europe by Type, by Application and by country, revenue for each segment.
  • Chapter 9: Asia Pacific by Type, by Application and by region, revenue for each segment.
  • Chapter 10: Latin America by Type, by Application and by country, revenue for each segment.
  • Chapter 11: Middle East and Africa, by Type, by Application and by country, revenue for each segment.
  • Chapter 12: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.
  • Chapter 13: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 14: Research Findings and Conclusion

FAQ for this report

What is the Chip Packaging Market share by type?

Ans: The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%. Advanced packaging occupies 45% of the market share.

What is the market share of major companies in Chip Packaging Market?

Ans: These top 10 companies now account for more than 78% of the total market share.

Who are the main players in the Chip Packaging Market report?

Ans: The main players in the Chip Packaging Market are ASE Group, Amkor Technology, JCET, Siliconware Precision Industries, Powertech Technology, TongFu Microelectronics, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron, OSE, Walton Advanced Engineering, NEPES, Unisem, ChipMOS, Signetics, Carsem, King Yuan ELECTRONICS

What are the Application segmentation covered in the Chip Packaging Market report?

Ans: The Applications covered in the Chip Packaging Market report are Automotive and Traffic, Consumer Electronics, Communication, Other

What are the Type segmentation covered in the Chip Packaging Market report?

Ans: The Types covered in the Chip Packaging Market report are Traditional Packaging, Advanced Packaging

1 Study Coverage
1.1 Chip Packaging Product Introduction
1.2 Market by Type
1.2.1 Global Chip Packaging Market Size Growth Rate by Type (2020 VS 2024 VS 2031)
1.2.2 Traditional Packaging
1.2.3 Advanced Packaging
1.3 Market by Application
1.3.1 Global Chip Packaging Market Size Growth Rate by Application (2020 VS 2024 VS 2031)
1.3.2 Automotive and Traffic
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Executive Summary
2.1 Global Chip Packaging Market Size Estimates and Forecasts
2.2 Chip Packaging Market Size by Region: 2024 Versus 2031
2.2.1 Global Chip Packaging Revenue by Region: 2020-2025
2.2.2 Global Chip Packaging Revenue Forecast by Region (2026-2031)
2.2.3 Global Chip Packaging Revenue Market Share by Region (2020-2031)
3 Market Segments
3.1 Breakdown Data by Type
3.1.1 Global Chip Packaging Revenue by Type (2020-2031)
3.1.2 Global Chip Packaging Revenue Market Share by Type (2020-2031)
3.2 Breakdown Data by Application
3.2.1 Global Chip Packaging Revenue by Application (2020-2031)
3.2.2 Global Chip Packaging Revenue Market Share by Application (2020-2031)
3.3 by Type and by Application Crossing Analysis
3.3.1 Traditional Packaging of Chip Packaging Revenue Market Share by Application
3.3.2 Advanced Packaging of Chip Packaging Revenue Market Share by Application
4 Global Chip Packaging by Company
4.1 Global Chip Packaging Revenue by Company (2020-2025)
4.2 Global Chip Packaging Revenue Share by Company (2020-2025)
4.3 Competitive Landscape
4.3.1 Key Chip Packaging Companies around the World: Ranking by Revenue
4.3.2 Global Chip Packaging Market Concentration Ratio (CR5 and HHI) & (2020-2025)
4.3.3 Global Chip Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.4 Global Chip Packaging Companies Headquarters & Product Type
4.4.1 Global Chip Packaging Companies Headquarters
4.4.2 Date of International Companies Enter into Chip Packaging Market
4.4.3 Global Chip Packaging Companies Product & Service
4.4.4 Traditional Packaging Revenue Market Share of Chip Packaging by Company
4.4.5 Advanced Packaging Revenue Market Share of Chip Packaging by Company
4.5 Global Chip Packaging Mergers & Acquisitions, Expansion Plans
5 Company Profiles
5.1 ASE Group
5.1.1 ASE Group Corporation Information
5.1.2 ASE Group Description, Business Overview
5.1.3 ASE Group Chip Packaging Products Offered
5.1.4 ASE Group Chip Packaging Revenue and Gross Margin (2020-2025)
5.1.5 ASE Group Chip Packaging Revenue by Product in 2024
5.1.6 ASE Group Chip Packaging Revenue by Application in 2024
5.1.7 ASE Group Chip Packaging Revenue by Geographic Area in 2024
5.1.8 ASE Group Recent Developments
5.2 Amkor Technology
5.2.1 Amkor Technology Corporation Information
5.2.2 Amkor Technology Description, Business Overview
5.2.3 Amkor Technology Chip Packaging Products Offered
5.2.4 Amkor Technology Chip Packaging Revenue and Gross Margin (2020-2025)
5.2.5 Amkor Technology Chip Packaging Revenue by Product in 2024
5.2.6 Amkor Technology Chip Packaging Revenue by Application in 2024
5.2.7 Amkor Technology Chip Packaging Revenue by Geographic Area in 2024
5.2.8 Amkor Technology Recent Developments
5.3 JCET
5.3.1 JCET Corporation Information
5.3.2 JCET Description, Business Overview
5.3.3 JCET Chip Packaging Products Offered
5.3.4 JCET Chip Packaging Revenue and Gross Margin (2020-2025)
5.3.5 JCET Chip Packaging Revenue by Product in 2024
5.3.6 JCET Chip Packaging Revenue by Application in 2024
5.3.7 JCET Chip Packaging Revenue by Geographic Area in 2024
5.3.8 JCET Recent Developments
5.4 Siliconware Precision Industries
5.4.1 Siliconware Precision Industries Corporation Information
5.4.2 Siliconware Precision Industries Description, Business Overview
5.4.3 Siliconware Precision Industries Chip Packaging Products Offered
5.4.4 Siliconware Precision Industries Chip Packaging Revenue and Gross Margin (2020-2025)
5.4.5 Siliconware Precision Industries Chip Packaging Revenue by Product in 2024
5.4.6 Siliconware Precision Industries Chip Packaging Revenue by Application in 2024
5.4.7 Siliconware Precision Industries Chip Packaging Revenue by Geographic Area in 2024
5.4.8 Siliconware Precision Industries Recent Developments
5.5 Powertech Technology
5.5.1 Powertech Technology Corporation Information
5.5.2 Powertech Technology Description, Business Overview
5.5.3 Powertech Technology Chip Packaging Products Offered
5.5.4 Powertech Technology Chip Packaging Revenue and Gross Margin (2020-2025)
5.5.5 Powertech Technology Chip Packaging Revenue by Product in 2024
5.5.6 Powertech Technology Chip Packaging Revenue by Application in 2024
5.5.7 Powertech Technology Chip Packaging Revenue by Geographic Area in 2024
5.5.8 Powertech Technology Recent Developments
5.6 TongFu Microelectronics
5.6.1 TongFu Microelectronics Corporation Information
5.6.2 TongFu Microelectronics Description, Business Overview
5.6.3 TongFu Microelectronics Chip Packaging Products Offered
5.6.4 TongFu Microelectronics Chip Packaging Revenue and Gross Margin (2020-2025)
5.6.5 TongFu Microelectronics Chip Packaging Revenue by Product in 2024
5.6.6 TongFu Microelectronics Chip Packaging Revenue by Application in 2024
5.6.7 TongFu Microelectronics Chip Packaging Revenue by Geographic Area in 2024
5.6.8 TongFu Microelectronics Recent Developments
5.7 Tianshui Huatian Technology
5.7.1 Tianshui Huatian Technology Corporation Information
5.7.2 Tianshui Huatian Technology Description, Business Overview
5.7.3 Tianshui Huatian Technology Chip Packaging Products Offered
5.7.4 Tianshui Huatian Technology Chip Packaging Revenue and Gross Margin (2020-2025)
5.7.5 Tianshui Huatian Technology Chip Packaging Revenue by Product in 2024
5.7.6 Tianshui Huatian Technology Chip Packaging Revenue by Application in 2024
5.7.7 Tianshui Huatian Technology Chip Packaging Revenue by Geographic Area in 2024
5.7.8 Tianshui Huatian Technology Recent Developments
5.8 UTAC
5.8.1 UTAC Corporation Information
5.8.2 UTAC Description, Business Overview
5.8.3 UTAC Chip Packaging Products Offered
5.8.4 UTAC Chip Packaging Revenue and Gross Margin (2020-2025)
5.8.5 UTAC Chip Packaging Revenue by Product in 2024
5.8.6 UTAC Chip Packaging Revenue by Application in 2024
5.8.7 UTAC Chip Packaging Revenue by Geographic Area in 2024
5.8.8 UTAC Recent Developments
5.9 Chipbond Technology
5.9.1 Chipbond Technology Corporation Information
5.9.2 Chipbond Technology Description, Business Overview
5.9.3 Chipbond Technology Chip Packaging Products Offered
5.9.4 Chipbond Technology Chip Packaging Revenue and Gross Margin (2020-2025)
5.9.5 Chipbond Technology Chip Packaging Revenue by Product in 2024
5.9.6 Chipbond Technology Chip Packaging Revenue by Application in 2024
5.9.7 Chipbond Technology Chip Packaging Revenue by Geographic Area in 2024
5.9.8 Chipbond Technology Recent Developments
5.10 Hana Micron
5.10.1 Hana Micron Corporation Information
5.10.2 Hana Micron Description, Business Overview
5.10.3 Hana Micron Chip Packaging Products Offered
5.10.4 Hana Micron Chip Packaging Revenue and Gross Margin (2020-2025)
5.10.5 Hana Micron Chip Packaging Revenue by Product in 2024
5.10.6 Hana Micron Chip Packaging Revenue by Application in 2024
5.10.7 Hana Micron Chip Packaging Revenue by Geographic Area in 2024
5.10.8 Hana Micron Recent Developments
5.11 OSE
5.11.1 OSE Corporation Information
5.11.2 OSE Description, Business Overview
5.11.3 OSE Chip Packaging Products Offered
5.11.4 OSE Chip Packaging Revenue and Gross Margin (2020-2025)
5.11.5 OSE Chip Packaging Revenue by Product in 2024
5.11.6 OSE Chip Packaging Revenue by Application in 2024
5.11.7 OSE Chip Packaging Revenue by Geographic Area in 2024
5.11.8 OSE Recent Developments
5.12 Walton Advanced Engineering
5.12.1 Walton Advanced Engineering Corporation Information
5.12.2 Walton Advanced Engineering Description, Business Overview
5.12.3 Walton Advanced Engineering Chip Packaging Products Offered
5.12.4 Walton Advanced Engineering Chip Packaging Revenue and Gross Margin (2020-2025)
5.12.5 Walton Advanced Engineering Chip Packaging Revenue by Product in 2024
5.12.6 Walton Advanced Engineering Chip Packaging Revenue by Application in 2024
5.12.7 Walton Advanced Engineering Chip Packaging Revenue by Geographic Area in 2024
5.12.8 Walton Advanced Engineering Recent Developments
5.13 NEPES
5.13.1 NEPES Corporation Information
5.13.2 NEPES Description, Business Overview
5.13.3 NEPES Chip Packaging Products Offered
5.13.4 NEPES Chip Packaging Revenue and Gross Margin (2020-2025)
5.13.5 NEPES Chip Packaging Revenue by Product in 2024
5.13.6 NEPES Chip Packaging Revenue by Application in 2024
5.13.7 NEPES Chip Packaging Revenue by Geographic Area in 2024
5.13.8 NEPES Recent Developments
5.14 Unisem
5.14.1 Unisem Corporation Information
5.14.2 Unisem Description, Business Overview
5.14.3 Unisem Chip Packaging Products Offered
5.14.4 Unisem Chip Packaging Revenue and Gross Margin (2020-2025)
5.14.5 Unisem Chip Packaging Revenue by Product in 2024
5.14.6 Unisem Chip Packaging Revenue by Application in 2024
5.14.7 Unisem Chip Packaging Revenue by Geographic Area in 2024
5.14.8 Unisem Recent Developments
5.15 ChipMOS
5.15.1 ChipMOS Corporation Information
5.15.2 ChipMOS Description, Business Overview
5.15.3 ChipMOS Chip Packaging Products Offered
5.15.4 ChipMOS Chip Packaging Revenue and Gross Margin (2020-2025)
5.15.5 ChipMOS Chip Packaging Revenue by Product in 2024
5.15.6 ChipMOS Chip Packaging Revenue by Application in 2024
5.15.7 ChipMOS Chip Packaging Revenue by Geographic Area in 2024
5.15.8 ChipMOS Recent Developments
5.16 Signetics
5.16.1 Signetics Corporation Information
5.16.2 Signetics Description, Business Overview
5.16.3 Signetics Chip Packaging Products Offered
5.16.4 Signetics Chip Packaging Revenue and Gross Margin (2020-2025)
5.16.5 Signetics Chip Packaging Revenue by Product in 2024
5.16.6 Signetics Chip Packaging Revenue by Application in 2024
5.16.7 Signetics Chip Packaging Revenue by Geographic Area in 2024
5.16.8 Signetics Recent Developments
5.17 Carsem
5.17.1 Carsem Corporation Information
5.17.2 Carsem Description, Business Overview
5.17.3 Carsem Chip Packaging Products Offered
5.17.4 Carsem Chip Packaging Revenue and Gross Margin (2020-2025)
5.17.5 Carsem Chip Packaging Revenue by Product in 2024
5.17.6 Carsem Chip Packaging Revenue by Application in 2024
5.17.7 Carsem Chip Packaging Revenue by Geographic Area in 2024
5.17.8 Carsem Recent Developments
5.18 King Yuan ELECTRONICS
5.18.1 King Yuan ELECTRONICS Corporation Information
5.18.2 King Yuan ELECTRONICS Description, Business Overview
5.18.3 King Yuan ELECTRONICS Chip Packaging Products Offered
5.18.4 King Yuan ELECTRONICS Chip Packaging Revenue and Gross Margin (2020-2025)
5.18.5 King Yuan ELECTRONICS Chip Packaging Revenue by Product in 2024
5.18.6 King Yuan ELECTRONICS Chip Packaging Revenue by Application in 2024
5.18.7 King Yuan ELECTRONICS Chip Packaging Revenue by Geographic Area in 2024
5.18.8 King Yuan ELECTRONICS Recent Developments
6 North America
6.1 North America Chip Packaging Market Size YoY Growth 2020-2031
6.2 North America Chip Packaging Market Facts & Figures by Country (2020-2031)
6.3 North America Chip Packaging Revenue by Type (2020-2025)
6.4 North America Chip Packaging Revenue by Application (2020-2025)
7 Asia-Pacific
7.1 Asia-Pacific Chip Packaging Market Size YoY Growth 2020-2031
7.2 Asia-Pacific Chip Packaging Market Facts & Figures by Region (2020-2031)
7.3 Asia-Pacific Chip Packaging Revenue by Type (2020-2025)
7.4 Asia-Pacific Chip Packaging Revenue by Application (2020-2025)
8 Europe
8.1 Europe Chip Packaging Market Size YoY Growth 2020-2031
8.2 Europe Chip Packaging Market Facts & Figures by Country (2020-2031)
8.3 Europe Chip Packaging Revenue by Type (2020-2025)
8.4 Europe Chip Packaging Revenue by Application (2020-2025)
9 Latin America
9.1 Latin America Chip Packaging Market Size YoY Growth 2020-2031
9.2 Latin America Chip Packaging Market Facts & Figures by Country (2020-2031)
9.3 Latin America Chip Packaging Revenue by Type (2020-2025)
9.4 Latin America Chip Packaging Revenue by Application (2020-2025)
10 Middle East and Africa
10.1 Latin America Chip Packaging Market Size YoY Growth 2020-2031
10.2 Middle East and Africa Chip Packaging Market Facts & Figures by Country (2020-2031)
10.3 Middle East and Africa Chip Packaging Revenue by Type (2020-2025)
10.4 Middle East and Africa Chip Packaging Revenue by Application (2020-2025)
11 Supply Chain and Sales Channel analysis
11.1 Chip Packaging Supply Chain Analysis
11.2 Chip Packaging Key Raw Materials and Upstream Suppliers
11.3 Chip Packaging Clients Analysis
11.4 Chip Packaging Sales Channel and Sales Model Analysis
11.4.1 Chip Packaging Distribution Channel Analysis: Indirect Sales VS Direct Sales
11.4.2 Chip Packaging Distribution Channel Analysis: Online Sales VS Offline Sales
11.4.3 Chip Packaging Distributors
12 Chip Packaging Market Dynamics
12.1 Chip Packaging Industry Trends
12.2 Chip Packaging Market Drivers
12.3 Chip Packaging Market Challenges
12.4 Chip Packaging Market Restraints
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.1.1 Research Programs/Design
14.1.1.2 Market Size Estimation
14.1.1.3 Market Breakdown and Data Triangulation
14.1.2 Data Source
14.1.2.1 Secondary Sources
14.1.2.2 Primary Sources
14.2 Author Details
14.3 Disclaimer
FEATURED COMPANIES
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
Nepes
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
List of Tables
 Table 1. Global Chip Packaging Market Size Growth Rate (CAGR) by Type (US$ Million): 2020 VS 2024 VS 2031
 Table 2. Global Chip Packaging Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031
 Table 3. Global Chip Packaging Market Size by Region (US$ Million): 2024 VS 2031
 Table 4. Global Chip Packaging Revenue by Region (2020-2025) & (US$ Million)
 Table 5. Global Chip Packaging Revenue Forecast by Region (2026-2031) & (US$ Million)
 Table 6. Global Chip Packaging Revenue by Type (2020-2025) & (US$ Million)
 Table 7. Global Chip Packaging Revenue Forecast by Type (2026-2031) & (US$ Million)
 Table 8. Global Chip Packaging Revenue by Application (2020-2025) & (US$ Million)
 Table 9. Global Chip Packaging Revenue Forecast by Application (2026-2031) & (US$ Million)
 Table 10. Chip Packaging Revenue by Company (2020-2025) & (US$ Million)
 Table 11. Chip Packaging Revenue Share by Company (2020-2025)
 Table 12. Ranking of Global Top Chip Packaging Players by Revenue (US$ Million) in 2024
 Table 13. Global Chip Packaging Companies Market Concentration Ratio (CR5 and HHI) & (2020-2025)
 Table 14. Global Chip Packaging by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Chip Packaging as of 2024)
 Table 15. Global Chip Packaging Companies Headquarters
 Table 16. Date of International Companies Enter into Chip Packaging Market
 Table 17. Global Chip Packaging Companies Product & Service
 Table 18. Global Chip Packaging Mergers & Acquisitions, Expansion Plans
 Table 19. ASE Group Corporation Information
 Table 20. ASE Group Description and Business Overview
 Table 21. ASE Group Chip Packaging Product
 Table 22. ASE Group Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 23. ASE Group Revenue Proportion of Chip Packaging by Product in 2024
 Table 24. ASE Group Revenue Proportion of Chip Packaging by Application in 2024
 Table 25. ASE Group Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 26. ASE Group Recent Developments
 Table 27. Amkor Technology Corporation Information
 Table 28. Amkor Technology Description and Business Overview
 Table 29. Amkor Technology Chip Packaging Product
 Table 30. Amkor Technology Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 31. Amkor Technology Revenue Proportion of Chip Packaging by Product in 2024
 Table 32. Amkor Technology Revenue Proportion of Chip Packaging by Application in 2024
 Table 33. Amkor Technology Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 34. Amkor Technology Recent Developments
 Table 35. JCET Corporation Information
 Table 36. JCET Description and Business Overview
 Table 37. JCET Chip Packaging Product
 Table 38. JCET Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 39. JCET Revenue Proportion of Chip Packaging by Product in 2024
 Table 40. JCET Revenue Proportion of Chip Packaging by Application in 2024
 Table 41. JCET Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 42. JCET Recent Developments
 Table 43. Siliconware Precision Industries Corporation Information
 Table 44. Siliconware Precision Industries Description and Business Overview
 Table 45. Siliconware Precision Industries Chip Packaging Product
 Table 46. Siliconware Precision Industries Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 47. Siliconware Precision Industries Revenue Proportion of Chip Packaging by Product in 2024
 Table 48. Siliconware Precision Industries Revenue Proportion of Chip Packaging by Application in 2024
 Table 49. Siliconware Precision Industries Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 50. Siliconware Precision Industries Recent Developments
 Table 51. Powertech Technology Corporation Information
 Table 52. Powertech Technology Description and Business Overview
 Table 53. Powertech Technology Chip Packaging Product
 Table 54. Powertech Technology Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 55. Powertech Technology Revenue Proportion of Chip Packaging by Product in 2024
 Table 56. Powertech Technology Revenue Proportion of Chip Packaging by Application in 2024
 Table 57. Powertech Technology Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 58. Powertech Technology Recent Developments
 Table 59. TongFu Microelectronics Corporation Information
 Table 60. TongFu Microelectronics Description and Business Overview
 Table 61. TongFu Microelectronics Chip Packaging Product
 Table 62. TongFu Microelectronics Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 63. TongFu Microelectronics Revenue Proportion of Chip Packaging by Product in 2024
 Table 64. TongFu Microelectronics Revenue Proportion of Chip Packaging by Application in 2024
 Table 65. TongFu Microelectronics Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 66. TongFu Microelectronics Recent Developments
 Table 67. Tianshui Huatian Technology Corporation Information
 Table 68. Tianshui Huatian Technology Description and Business Overview
 Table 69. Tianshui Huatian Technology Chip Packaging Product
 Table 70. Tianshui Huatian Technology Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 71. Tianshui Huatian Technology Revenue Proportion of Chip Packaging by Product in 2024
 Table 72. Tianshui Huatian Technology Revenue Proportion of Chip Packaging by Application in 2024
 Table 73. Tianshui Huatian Technology Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 74. Tianshui Huatian Technology Recent Developments
 Table 75. UTAC Corporation Information
 Table 76. UTAC Description and Business Overview
 Table 77. UTAC Chip Packaging Product
 Table 78. UTAC Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 79. UTAC Revenue Proportion of Chip Packaging by Product in 2024
 Table 80. UTAC Revenue Proportion of Chip Packaging by Application in 2024
 Table 81. UTAC Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 82. UTAC Recent Developments
 Table 83. Chipbond Technology Corporation Information
 Table 84. Chipbond Technology Description and Business Overview
 Table 85. Chipbond Technology Chip Packaging Product
 Table 86. Chipbond Technology Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 87. Chipbond Technology Revenue Proportion of Chip Packaging by Product in 2024
 Table 88. Chipbond Technology Revenue Proportion of Chip Packaging by Application in 2024
 Table 89. Chipbond Technology Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 90. Chipbond Technology Recent Developments
 Table 91. Hana Micron Corporation Information
 Table 92. Hana Micron Description and Business Overview
 Table 93. Hana Micron Chip Packaging Product
 Table 94. Hana Micron Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 95. Hana Micron Revenue Proportion of Chip Packaging by Product in 2024
 Table 96. Hana Micron Revenue Proportion of Chip Packaging by Application in 2024
 Table 97. Hana Micron Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 98. Hana Micron Recent Developments
 Table 99. OSE Corporation Information
 Table 100. OSE Description and Business Overview
 Table 101. OSE Chip Packaging Product
 Table 102. OSE Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 103. OSE Revenue Proportion of Chip Packaging by Product in 2024
 Table 104. OSE Revenue Proportion of Chip Packaging by Application in 2024
 Table 105. OSE Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 106. OSE Recent Developments
 Table 107. Walton Advanced Engineering Corporation Information
 Table 108. Walton Advanced Engineering Description and Business Overview
 Table 109. Walton Advanced Engineering Chip Packaging Product
 Table 110. Walton Advanced Engineering Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 111. Walton Advanced Engineering Revenue Proportion of Chip Packaging by Product in 2024
 Table 112. Walton Advanced Engineering Revenue Proportion of Chip Packaging by Application in 2024
 Table 113. Walton Advanced Engineering Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 114. Walton Advanced Engineering Recent Developments
 Table 115. NEPES Corporation Information
 Table 116. NEPES Description and Business Overview
 Table 117. NEPES Chip Packaging Product
 Table 118. NEPES Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 119. NEPES Revenue Proportion of Chip Packaging by Product in 2024
 Table 120. NEPES Revenue Proportion of Chip Packaging by Application in 2024
 Table 121. NEPES Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 122. NEPES Recent Developments
 Table 123. Unisem Corporation Information
 Table 124. Unisem Description and Business Overview
 Table 125. Unisem Chip Packaging Product
 Table 126. Unisem Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 127. Unisem Revenue Proportion of Chip Packaging by Product in 2024
 Table 128. Unisem Revenue Proportion of Chip Packaging by Application in 2024
 Table 129. Unisem Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 130. Unisem Recent Developments
 Table 131. ChipMOS Corporation Information
 Table 132. ChipMOS Description and Business Overview
 Table 133. ChipMOS Chip Packaging Product
 Table 134. ChipMOS Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 135. ChipMOS Revenue Proportion of Chip Packaging by Product in 2024
 Table 136. ChipMOS Revenue Proportion of Chip Packaging by Application in 2024
 Table 137. ChipMOS Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 138. ChipMOS Recent Developments
 Table 139. Signetics Corporation Information
 Table 140. Signetics Description and Business Overview
 Table 141. Signetics Chip Packaging Product
 Table 142. Signetics Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 143. Signetics Revenue Proportion of Chip Packaging by Product in 2024
 Table 144. Signetics Revenue Proportion of Chip Packaging by Application in 2024
 Table 145. Signetics Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 146. Signetics Recent Developments
 Table 147. Carsem Corporation Information
 Table 148. Carsem Description and Business Overview
 Table 149. Carsem Chip Packaging Product
 Table 150. Carsem Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 151. Carsem Revenue Proportion of Chip Packaging by Product in 2024
 Table 152. Carsem Revenue Proportion of Chip Packaging by Application in 2024
 Table 153. Carsem Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 154. Carsem Recent Developments
 Table 155. King Yuan ELECTRONICS Corporation Information
 Table 156. King Yuan ELECTRONICS Description and Business Overview
 Table 157. King Yuan ELECTRONICS Chip Packaging Product
 Table 158. King Yuan ELECTRONICS Chip Packaging Revenue (US$ Million) and Gross Margin (2020-2025)
 Table 159. King Yuan ELECTRONICS Revenue Proportion of Chip Packaging by Product in 2024
 Table 160. King Yuan ELECTRONICS Revenue Proportion of Chip Packaging by Application in 2024
 Table 161. King Yuan ELECTRONICS Revenue Proportion of Chip Packaging by Geographic Area in 2024
 Table 162. King Yuan ELECTRONICS Recent Developments
 Table 163. North America Chip Packaging Revenue by Country (2020-2025) & (US$ Million)
 Table 164. North America Chip Packaging Revenue by Country (2026-2031) & (US$ Million)
 Table 165. North America Chip Packaging Revenue by Type (2020-2025) & (US$ Million)
 Table 166. North America Chip Packaging Revenue by Application (2020-2025) & (US$ Million)
 Table 167. Asia-Pacific Chip Packaging Revenue by Region (2020-2025) & (US$ Million)
 Table 168. Asia-Pacific Chip Packaging Revenue by Region (2026-2031) & (US$ Million)
 Table 169. Asia-Pacific Chip Packaging Revenue by Type (2020-2025) & (US$ Million)
 Table 170. Asia-Pacific Chip Packaging Revenue by Application (2020-2025) & (US$ Million)
 Table 171. Europe Chip Packaging Revenue by Country (2020-2025) & (US$ Million)
 Table 172. Europe Chip Packaging Revenue by Country (2026-2031) & (US$ Million)
 Table 173. Europe Chip Packaging Revenue by Type (2020-2025) & (US$ Million)
 Table 174. Europe Chip Packaging Revenue by Application (2020-2025) & (US$ Million)
 Table 175. Latin America Chip Packaging Revenue by Country (2020-2025) & (US$ Million)
 Table 176. Latin America Chip Packaging Revenue by Country (2026-2031) & (US$ Million)
 Table 177. Latin America Chip Packaging Revenue by Type (2020-2025) & (US$ Million)
 Table 178. Latin America Chip Packaging Revenue by Application (2020-2025) & (US$ Million)
 Table 179. Middle East and Africa Chip Packaging Revenue by Country (2020-2025) & (US$ Million)
 Table 180. Middle East and Africa Chip Packaging Revenue by Country (2026-2031) & (US$ Million)
 Table 181. Middle East and Africa Chip Packaging Revenue by Type (2020-2025) & (US$ Million)
 Table 182. Middle East and Africa Chip Packaging Revenue by Application (2020-2025) & (US$ Million)
 Table 183. Chip Packaging Key Raw Materials, Industry Status and Trend
 Table 184. Chip Packaging Key Raw Materials and Upstream Suppliers
 Table 185. Chip Packaging Clients Status and Trend
 Table 186. Chip Packaging Typical Clients
 Table 187. Chip Packaging Distributors
 Table 188. Chip Packaging Market Trends
 Table 189. Chip Packaging Market Drivers
 Table 190. Chip Packaging Market Challenges
 Table 191. Chip Packaging Market Restraints
 Table 192. Research Programs/Design for This Report
 Table 193. Key Data Information from Secondary Sources
 Table 194. Key Data Information from Primary Sources


List of Figures
 Figure 1. Chip Packaging Product Picture
 Figure 2. Global Chip Packaging Market Size by Type (US$ Million): 2020 VS 2024 VS 2031
 Figure 3. Global Chip Packaging Revenue Market Share by Type in 2024 & 2031
 Figure 4. Traditional Packaging Product Picture
 Figure 5. Advanced Packaging Product Picture
 Figure 6. Global Chip Packaging Market Size by Application (US$ Million): 2020 VS 2024 VS 2031
 Figure 7. Global Chip Packaging Revenue Market Share by Application in 2024 & 2031
 Figure 8. Automotive and Traffic
 Figure 9. Consumer Electronics
 Figure 10. Communication
 Figure 11. Other
 Figure 12. Chip Packaging Report Years Considered
 Figure 13. Global Chip Packaging Revenue, (US$ Million), 2020 VS 2024 VS 2031
 Figure 14. Global Chip Packaging Market Size (2020-2031) & (US$ Million)
 Figure 15. Global Chip Packaging Market Size Market Share by Region: 2024 Versus 2031
 Figure 16. Global Chip Packaging Revenue Market Share by Region (2020-2031)
 Figure 17. Global Chip Packaging Revenue Market Share Forecast by Type (2020-2031)
 Figure 18. Global Chip Packaging Revenue Market Share Forecast by Application (2020-2031)
 Figure 19. Traditional Packaging of Chip Packaging Revenue Market Share by Application, 2024 VS 2031
 Figure 20. Advanced Packaging of Chip Packaging Revenue Market Share by Application, 2024 VS 2031
 Figure 21. Chip Packaging Revenue Share by Company (2024)
 Figure 22. Chip Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 23. Traditional Packaging Revenue Proportion by Company in 2024
 Figure 24. Advanced Packaging Revenue Proportion by Company in 2024
 Figure 25. North America Chip Packaging Revenue 2020-2031 (US$ Million)
 Figure 26. North America Chip Packaging Revenue Market Share by Type (2020-2025)
 Figure 27. North America Chip Packaging Revenue Market Share by Application (2020-2025)
 Figure 28. Asia-Pacific Chip Packaging Revenue 2020-2031 (US$ Million)
 Figure 29. Asia-Pacific Chip Packaging Revenue Market Share by Region (2020-2031)
 Figure 30. Asia-Pacific Chip Packaging Revenue Market Share by Type (2020-2025)
 Figure 31. Asia-Pacific Chip Packaging Revenue Market Share by Application (2020-2025)
 Figure 32. Europe Chip Packaging Revenue Growth Rate 2020-2031 (US$ Million)
 Figure 33. Europe Chip Packaging Revenue Market Share by Country (2020-2031)
 Figure 34. Europe Chip Packaging Revenue Market Share by Type (2020-2025)
 Figure 35. Europe Chip Packaging Revenue Market Share by Application (2020-2025)
 Figure 36. Latin America Chip Packaging Revenue Growth Rate 2020-2031 (US$ Million)
 Figure 37. Latin America Chip Packaging Revenue Market Share by Country (2020-2031)
 Figure 38. Latin America Chip Packaging Revenue Market Share by Type (2020-2025)
 Figure 39. Latin America Chip Packaging Revenue Market Share by Application (2020-2025)
 Figure 40. Middle East and Africa Chip Packaging Revenue Growth Rate 2020-2031 (US$ Million)
 Figure 41. Middle East and Africa Chip Packaging Revenue Market Share by Country (2020-2031)
 Figure 42. Middle East and Africa Chip Packaging Revenue Market Share by Type (2020-2025)
 Figure 43. Middle East and Africa Chip Packaging Revenue Market Share by Application (2020-2025)
 Figure 44. Chip Packaging Supply Chain (Upstream and Downstream Market)
 Figure 45. Global Production Market Share of Chip Packaging Raw Materials by Region in 2024
 Figure 46. Chip Packaging Distribution Channels
 Figure 47. Global Chip Packaging Percentage 2020-2031: Indirect Sales VS Direct Sales
 Figure 48. Global Chip Packaging Percentage 2020-2031: Online Sales VS Offline Sales
 Figure 49. Bottom-up and Top-down Approaches for This Report
 Figure 50. Data Triangulation
 Figure 51. Key Executives Interviewed
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