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Global Semiconductor Assembly and Packaging Equipment Market Research Report 2024

Published Date: May 2024

Report Code: QYRE-Auto-38W7560

Global Semiconductor Assembly Packaging Equipment Market Insights and Forecast to 2028

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Global Semiconductor Assembly and Packaging Equipment Market Research Report 2024

Code: QYRE-Auto-38W7560

Report

May 2024

Pages:91

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Kulicke & Soffa Industries

Accrutech

SHINKAWA

Palomar Technologies

Hesse Mechatronics

Toray Engineering

West-Bond

DIAS Automation

Advantest

KLA-Tencor

Teradyne

Amkor Technology

Tokyo Electron Limited

LAM RESEARCH CORPORATION

ASML Holding N.V.

Applied Materials

SCREEN Holdings Co., Ltd.

Hitachi High Technologies Corporation

HYBONDASM Pacific Technology

Semiconductor Assembly and Packaging Equipment Market Size

The global Semiconductor Assembly and Packaging Equipment market was valued at US$ 4150 million in 2023 and is anticipated to reach US$ 6485.8 million by 2030, witnessing a CAGR of 6.6% during the forecast period 2024-2030.

Semiconductor Assembly and Packaging Equipment Market

Semiconductor Assembly and Packaging Equipment is used for an integrated chip to function, it needs to be connected to the package or directly to the printed circuit. This involves wire bonding, die-bonding, and dicing. Also, it is a back end process of chip formation. Semiconductor chip assembly is also a key component of the semiconductor supply chain.

The global semiconductor assembly and packaging equipment market refers to the market for tools and machinery used in the assembly and packaging processes of semiconductor devices. Semiconductor assembly and packaging equipment are essential in the manufacturing and production of integrated circuits, chips, and other semiconductor components.

Semiconductor assembly and packaging equipment play a crucial role in the final stage of semiconductor device manufacturing. These equipment are responsible for assembling and packaging individual silicon chips into functional units, which are then integrated into electronic devices. The assembly and packaging processes ensure the protection, electrical connection, and reliability of the semiconductor devices.

The market for semiconductor assembly and packaging equipment is driven by several factors, including the increasing demand for smaller and more powerful electronic devices, advancements in semiconductor packaging technology, and the growing need for cost-effective manufacturing solutions. As consumer electronics, automotive, and communication sectors continue to evolve, the demand for advanced packaging technologies and equipment is expected to rise.

The market can be segmented based on the type of equipment, such as die bonders, wire bonders, molding machines, testing equipment, and others. Die bonders and wire bonders are used for attaching the semiconductor chips to the package, while molding machines are used to encapsulate the chips with protective materials. Testing equipment ensures the quality and reliability of the assembled semiconductor devices.

Geographically, Asia-Pacific holds a significant share in the semiconductor assembly and packaging equipment market, primarily driven by the presence of major semiconductor manufacturing hubs in countries like China, Taiwan, South Korea, and Japan. The region is known for high-volume semiconductor production and rapid technological advancements. North America and Europe also contribute to the market due to the presence of established semiconductor companies and semiconductor packaging facilities.

Key players in the global semiconductor assembly and packaging equipment market include industry leaders such as ASM Pacific Technology, Kulicke & Soffa Industries, Tokyo Electron Limited, Applied Materials, and Advantest Corporation. These companies are engaged in the research, development, and manufacturing of advanced equipment to meet the ever-increasing demands of the semiconductor industry.

The market for semiconductor assembly and packaging equipment is expected to witness steady growth in the coming years, driven by factors such as the increasing demand for compact electronic devices, the adoption of advanced packaging technologies like System-in-Package (SiP) and Fan-out Wafer-Level Packaging (FOWLP), and the emergence of new applications such as Internet of Things (IoT) and artificial intelligence (AI). However, factors like high initial costs, the complexity of equipment integration, and the need for skilled workforce may pose challenges to market growth.

This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly and Packaging Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly and Packaging Equipment.

Report Scope

The Semiconductor Assembly and Packaging Equipment market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Assembly and Packaging Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Semiconductor Assembly and Packaging Equipment companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Semiconductor Assembly and Packaging Equipment Market Report

Report Metric	Details
Report Name	Semiconductor Assembly and Packaging Equipment Market
Accounted market size in 2023	US$ 4150 million
Forecasted market size in 2030	US$ 6485.8 million
CAGR	6.6%
Base Year	2023
Forecasted years	2024 - 2030
Segment by Type	Electroplating Equipment Inspection and Cutting Equipment Lead Bonding Equipment Chip Bonding Equipment Others
Segment by Application	Automotive Enterprise Storage Consumer Electronics Healthcare Devices Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Advantest, Accrutech, Shinkawa, KLA-Tencor, Teradyne Inc., Amkor Technology, Tokyo Electron Limited, Lam Research Corporation, ASML Holding N.V, Applied Materials, Toray Engineering, Kulicke & Soffa Industries, Hesse Mechatronics, Palomar Technologies, West Bond, DIAS Automation, Screen Holdings Co. Ltd, Hitachi High-Technologies Corporation, HYBONDASM Pacific Technology
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Semiconductor Assembly and Packaging Equipment companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Semiconductor Assembly and Packaging Equipment Market growing?

Ans: The Semiconductor Assembly and Packaging Equipment Market witnessing a CAGR of 6.6% during the forecast period 2024-2030.

What is the Semiconductor Assembly and Packaging Equipment Market size in 2030?

Ans: The Semiconductor Assembly and Packaging Equipment Market size in 2030 will be US$ 6485.8 million.

Who are the main players in the Semiconductor Assembly and Packaging Equipment Market report?

Ans: The main players in the Semiconductor Assembly and Packaging Equipment Market are Advantest, Accrutech, Shinkawa, KLA-Tencor, Teradyne Inc., Amkor Technology, Tokyo Electron Limited, Lam Research Corporation, ASML Holding N.V, Applied Materials, Toray Engineering, Kulicke & Soffa Industries, Hesse Mechatronics, Palomar Technologies, West Bond, DIAS Automation, Screen Holdings Co. Ltd, Hitachi High-Technologies Corporation, HYBONDASM Pacific Technology

What are the Application segmentation covered in the Semiconductor Assembly and Packaging Equipment Market report?

Ans: The Applications covered in the Semiconductor Assembly and Packaging Equipment Market report are Automotive, Enterprise Storage, Consumer Electronics, Healthcare Devices, Others

What are the Type segmentation covered in the Semiconductor Assembly and Packaging Equipment Market report?

Ans: The Types covered in the Semiconductor Assembly and Packaging Equipment Market report are Electroplating Equipment, Inspection and Cutting Equipment, Lead Bonding Equipment, Chip Bonding Equipment, Others

Recommended Reports

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Wafer Handling Solutions

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Semiconductor Assembly and Packaging Equipment Market Size Growth Rate by Type: 2019 VS 2023 VS 2030

1.2.2 Electroplating Equipment

1.2.3 Inspection and Cutting Equipment

1.2.4 Lead Bonding Equipment

1.2.5 Chip Bonding Equipment

1.2.6 Others

1.3 Market by Application

1.3.1 Global Semiconductor Assembly and Packaging Equipment Market Growth by Application: 2019 VS 2023 VS 2030

1.3.2 Automotive

1.3.3 Enterprise Storage

1.3.4 Consumer Electronics

1.3.5 Healthcare Devices

1.3.6 Others

1.4 Study Objectives

1.5 Years Considered

1.6 Years Considered

2 Global Growth Trends

2.1 Global Semiconductor Assembly and Packaging Equipment Market Perspective (2019-2030)

2.2 Semiconductor Assembly and Packaging Equipment Growth Trends by Region

2.2.1 Global Semiconductor Assembly and Packaging Equipment Market Size by Region: 2019 VS 2023 VS 2030

2.2.2 Semiconductor Assembly and Packaging Equipment Historic Market Size by Region (2019-2024)

2.2.3 Semiconductor Assembly and Packaging Equipment Forecasted Market Size by Region (2025-2030)

2.3 Semiconductor Assembly and Packaging Equipment Market Dynamics

2.3.1 Semiconductor Assembly and Packaging Equipment Industry Trends

2.3.2 Semiconductor Assembly and Packaging Equipment Market Drivers

2.3.3 Semiconductor Assembly and Packaging Equipment Market Challenges

2.3.4 Semiconductor Assembly and Packaging Equipment Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Semiconductor Assembly and Packaging Equipment Players by Revenue

3.1.1 Global Top Semiconductor Assembly and Packaging Equipment Players by Revenue (2019-2024)

3.1.2 Global Semiconductor Assembly and Packaging Equipment Revenue Market Share by Players (2019-2024)

3.2 Global Semiconductor Assembly and Packaging Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Players Covered: Ranking by Semiconductor Assembly and Packaging Equipment Revenue

3.4 Global Semiconductor Assembly and Packaging Equipment Market Concentration Ratio

3.4.1 Global Semiconductor Assembly and Packaging Equipment Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Semiconductor Assembly and Packaging Equipment Revenue in 2023

3.5 Semiconductor Assembly and Packaging Equipment Key Players Head office and Area Served

3.6 Key Players Semiconductor Assembly and Packaging Equipment Product Solution and Service

3.7 Date of Enter into Semiconductor Assembly and Packaging Equipment Market

3.8 Mergers & Acquisitions, Expansion Plans

4 Semiconductor Assembly and Packaging Equipment Breakdown Data by Type

4.1 Global Semiconductor Assembly and Packaging Equipment Historic Market Size by Type (2019-2024)

4.2 Global Semiconductor Assembly and Packaging Equipment Forecasted Market Size by Type (2025-2030)

5 Semiconductor Assembly and Packaging Equipment Breakdown Data by Application

5.1 Global Semiconductor Assembly and Packaging Equipment Historic Market Size by Application (2019-2024)

5.2 Global Semiconductor Assembly and Packaging Equipment Forecasted Market Size by Application (2025-2030)

6 North America

6.1 North America Semiconductor Assembly and Packaging Equipment Market Size (2019-2030)

6.2 North America Semiconductor Assembly and Packaging Equipment Market Growth Rate by Country: 2019 VS 2023 VS 2030

6.3 North America Semiconductor Assembly and Packaging Equipment Market Size by Country (2019-2024)

6.4 North America Semiconductor Assembly and Packaging Equipment Market Size by Country (2025-2030)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Semiconductor Assembly and Packaging Equipment Market Size (2019-2030)

7.2 Europe Semiconductor Assembly and Packaging Equipment Market Growth Rate by Country: 2019 VS 2023 VS 2030

7.3 Europe Semiconductor Assembly and Packaging Equipment Market Size by Country (2019-2024)

7.4 Europe Semiconductor Assembly and Packaging Equipment Market Size by Country (2025-2030)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Size (2019-2030)

8.2 Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Growth Rate by Region: 2019 VS 2023 VS 2030

8.3 Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Size by Region (2019-2024)

8.4 Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Size by Region (2025-2030)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Semiconductor Assembly and Packaging Equipment Market Size (2019-2030)

9.2 Latin America Semiconductor Assembly and Packaging Equipment Market Growth Rate by Country: 2019 VS 2023 VS 2030

9.3 Latin America Semiconductor Assembly and Packaging Equipment Market Size by Country (2019-2024)

9.4 Latin America Semiconductor Assembly and Packaging Equipment Market Size by Country (2025-2030)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Size (2019-2030)

10.2 Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Growth Rate by Country: 2019 VS 2023 VS 2030

10.3 Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Size by Country (2019-2024)

10.4 Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Size by Country (2025-2030)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Advantest

11.1.1 Advantest Company Detail

11.1.2 Advantest Business Overview

11.1.3 Advantest Semiconductor Assembly and Packaging Equipment Introduction

11.1.4 Advantest Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.1.5 Advantest Recent Development

11.2 Accrutech

11.2.1 Accrutech Company Detail

11.2.2 Accrutech Business Overview

11.2.3 Accrutech Semiconductor Assembly and Packaging Equipment Introduction

11.2.4 Accrutech Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.2.5 Accrutech Recent Development

11.3 Shinkawa

11.3.1 Shinkawa Company Detail

11.3.2 Shinkawa Business Overview

11.3.3 Shinkawa Semiconductor Assembly and Packaging Equipment Introduction

11.3.4 Shinkawa Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.3.5 Shinkawa Recent Development

11.4 KLA-Tencor

11.4.1 KLA-Tencor Company Detail

11.4.2 KLA-Tencor Business Overview

11.4.3 KLA-Tencor Semiconductor Assembly and Packaging Equipment Introduction

11.4.4 KLA-Tencor Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.4.5 KLA-Tencor Recent Development

11.5 Teradyne Inc.

11.5.1 Teradyne Inc. Company Detail

11.5.2 Teradyne Inc. Business Overview

11.5.3 Teradyne Inc. Semiconductor Assembly and Packaging Equipment Introduction

11.5.4 Teradyne Inc. Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.5.5 Teradyne Inc. Recent Development

11.6 Amkor Technology

11.6.1 Amkor Technology Company Detail

11.6.2 Amkor Technology Business Overview

11.6.3 Amkor Technology Semiconductor Assembly and Packaging Equipment Introduction

11.6.4 Amkor Technology Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.6.5 Amkor Technology Recent Development

11.7 Tokyo Electron Limited

11.7.1 Tokyo Electron Limited Company Detail

11.7.2 Tokyo Electron Limited Business Overview

11.7.3 Tokyo Electron Limited Semiconductor Assembly and Packaging Equipment Introduction

11.7.4 Tokyo Electron Limited Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.7.5 Tokyo Electron Limited Recent Development

11.8 Lam Research Corporation

11.8.1 Lam Research Corporation Company Detail

11.8.2 Lam Research Corporation Business Overview

11.8.3 Lam Research Corporation Semiconductor Assembly and Packaging Equipment Introduction

11.8.4 Lam Research Corporation Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.8.5 Lam Research Corporation Recent Development

11.9 ASML Holding N.V

11.9.1 ASML Holding N.V Company Detail

11.9.2 ASML Holding N.V Business Overview

11.9.3 ASML Holding N.V Semiconductor Assembly and Packaging Equipment Introduction

11.9.4 ASML Holding N.V Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.9.5 ASML Holding N.V Recent Development

11.10 Applied Materials

11.10.1 Applied Materials Company Detail

11.10.2 Applied Materials Business Overview

11.10.3 Applied Materials Semiconductor Assembly and Packaging Equipment Introduction

11.10.4 Applied Materials Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.10.5 Applied Materials Recent Development

11.11 Toray Engineering

11.11.1 Toray Engineering Company Detail

11.11.2 Toray Engineering Business Overview

11.11.3 Toray Engineering Semiconductor Assembly and Packaging Equipment Introduction

11.11.4 Toray Engineering Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.11.5 Toray Engineering Recent Development

11.12 Kulicke & Soffa Industries

11.12.1 Kulicke & Soffa Industries Company Detail

11.12.2 Kulicke & Soffa Industries Business Overview

11.12.3 Kulicke & Soffa Industries Semiconductor Assembly and Packaging Equipment Introduction

11.12.4 Kulicke & Soffa Industries Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.12.5 Kulicke & Soffa Industries Recent Development

11.13 Hesse Mechatronics

11.13.1 Hesse Mechatronics Company Detail

11.13.2 Hesse Mechatronics Business Overview

11.13.3 Hesse Mechatronics Semiconductor Assembly and Packaging Equipment Introduction

11.13.4 Hesse Mechatronics Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.13.5 Hesse Mechatronics Recent Development

11.14 Palomar Technologies

11.14.1 Palomar Technologies Company Detail

11.14.2 Palomar Technologies Business Overview

11.14.3 Palomar Technologies Semiconductor Assembly and Packaging Equipment Introduction

11.14.4 Palomar Technologies Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.14.5 Palomar Technologies Recent Development

11.15 West Bond

11.15.1 West Bond Company Detail

11.15.2 West Bond Business Overview

11.15.3 West Bond Semiconductor Assembly and Packaging Equipment Introduction

11.15.4 West Bond Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.15.5 West Bond Recent Development

11.16 DIAS Automation

11.16.1 DIAS Automation Company Detail

11.16.2 DIAS Automation Business Overview

11.16.3 DIAS Automation Semiconductor Assembly and Packaging Equipment Introduction

11.16.4 DIAS Automation Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.16.5 DIAS Automation Recent Development

11.17 Screen Holdings Co. Ltd

11.17.1 Screen Holdings Co. Ltd Company Detail

11.17.2 Screen Holdings Co. Ltd Business Overview

11.17.3 Screen Holdings Co. Ltd Semiconductor Assembly and Packaging Equipment Introduction

11.17.4 Screen Holdings Co. Ltd Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.17.5 Screen Holdings Co. Ltd Recent Development

11.18 Hitachi High-Technologies Corporation

11.18.1 Hitachi High-Technologies Corporation Company Detail

11.18.2 Hitachi High-Technologies Corporation Business Overview

11.18.3 Hitachi High-Technologies Corporation Semiconductor Assembly and Packaging Equipment Introduction

11.18.4 Hitachi High-Technologies Corporation Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.18.5 Hitachi High-Technologies Corporation Recent Development

11.19 HYBONDASM Pacific Technology

11.19.1 HYBONDASM Pacific Technology Company Detail

11.19.2 HYBONDASM Pacific Technology Business Overview

11.19.3 HYBONDASM Pacific Technology Semiconductor Assembly and Packaging Equipment Introduction

11.19.4 HYBONDASM Pacific Technology Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

11.19.5 HYBONDASM Pacific Technology Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.2 Data Source

13.2 Disclaimer

13.3 Author Details

FEATURED COMPANIES

Kulicke & Soffa Industries

Accrutech

SHINKAWA

Palomar Technologies

Hesse Mechatronics

Toray Engineering

West-Bond

DIAS Automation

Advantest

KLA-Tencor

Teradyne

Amkor Technology

Tokyo Electron Limited

LAM RESEARCH CORPORATION

ASML Holding N.V.

Applied Materials

SCREEN Holdings Co., Ltd.

Hitachi High Technologies Corporation

HYBONDASM Pacific Technology

List of Tables

Table 1. Global Semiconductor Assembly and Packaging Equipment Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030

Table 2. Key Players of Electroplating Equipment

Table 3. Key Players of Inspection and Cutting Equipment

Table 4. Key Players of Lead Bonding Equipment

Table 5. Key Players of Chip Bonding Equipment

Table 6. Key Players of Others

Table 7. Global Semiconductor Assembly and Packaging Equipment Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030

Table 8. Global Semiconductor Assembly and Packaging Equipment Market Size by Region (US$ Million): 2019 VS 2023 VS 2030

Table 9. Global Semiconductor Assembly and Packaging Equipment Market Size by Region (2019-2024) & (US$ Million)

Table 10. Global Semiconductor Assembly and Packaging Equipment Market Share by Region (2019-2024)

Table 11. Global Semiconductor Assembly and Packaging Equipment Forecasted Market Size by Region (2025-2030) & (US$ Million)

Table 12. Global Semiconductor Assembly and Packaging Equipment Market Share by Region (2025-2030)

Table 13. Semiconductor Assembly and Packaging Equipment Market Trends

Table 14. Semiconductor Assembly and Packaging Equipment Market Drivers

Table 15. Semiconductor Assembly and Packaging Equipment Market Challenges

Table 16. Semiconductor Assembly and Packaging Equipment Market Restraints

Table 17. Global Semiconductor Assembly and Packaging Equipment Revenue by Players (2019-2024) & (US$ Million)

Table 18. Global Semiconductor Assembly and Packaging Equipment Market Share by Players (2019-2024)

Table 19. Global Top Semiconductor Assembly and Packaging Equipment Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Assembly and Packaging Equipment as of 2023)

Table 20. Ranking of Global Top Semiconductor Assembly and Packaging Equipment Companies by Revenue (US$ Million) in 2023

Table 21. Global 5 Largest Players Market Share by Semiconductor Assembly and Packaging Equipment Revenue (CR5 and HHI) & (2019-2024)

Table 22. Key Players Headquarters and Area Served

Table 23. Key Players Semiconductor Assembly and Packaging Equipment Product Solution and Service

Table 24. Date of Enter into Semiconductor Assembly and Packaging Equipment Market

Table 25. Mergers & Acquisitions, Expansion Plans

Table 26. Global Semiconductor Assembly and Packaging Equipment Market Size by Type (2019-2024) & (US$ Million)

Table 27. Global Semiconductor Assembly and Packaging Equipment Revenue Market Share by Type (2019-2024)

Table 28. Global Semiconductor Assembly and Packaging Equipment Forecasted Market Size by Type (2025-2030) & (US$ Million)

Table 29. Global Semiconductor Assembly and Packaging Equipment Revenue Market Share by Type (2025-2030)

Table 30. Global Semiconductor Assembly and Packaging Equipment Market Size by Application (2019-2024) & (US$ Million)

Table 31. Global Semiconductor Assembly and Packaging Equipment Revenue Market Share by Application (2019-2024)

Table 32. Global Semiconductor Assembly and Packaging Equipment Forecasted Market Size by Application (2025-2030) & (US$ Million)

Table 33. Global Semiconductor Assembly and Packaging Equipment Revenue Market Share by Application (2025-2030)

Table 34. North America Semiconductor Assembly and Packaging Equipment Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 35. North America Semiconductor Assembly and Packaging Equipment Market Size by Country (2019-2024) & (US$ Million)

Table 36. North America Semiconductor Assembly and Packaging Equipment Market Size by Country (2025-2030) & (US$ Million)

Table 37. Europe Semiconductor Assembly and Packaging Equipment Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 38. Europe Semiconductor Assembly and Packaging Equipment Market Size by Country (2019-2024) & (US$ Million)

Table 39. Europe Semiconductor Assembly and Packaging Equipment Market Size by Country (2025-2030) & (US$ Million)

Table 40. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030

Table 41. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Size by Region (2019-2024) & (US$ Million)

Table 42. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Size by Region (2025-2030) & (US$ Million)

Table 43. Latin America Semiconductor Assembly and Packaging Equipment Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 44. Latin America Semiconductor Assembly and Packaging Equipment Market Size by Country (2019-2024) & (US$ Million)

Table 45. Latin America Semiconductor Assembly and Packaging Equipment Market Size by Country (2025-2030) & (US$ Million)

Table 46. Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 47. Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Size by Country (2019-2024) & (US$ Million)

Table 48. Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Size by Country (2025-2030) & (US$ Million)

Table 49. Advantest Company Detail

Table 50. Advantest Business Overview

Table 51. Advantest Semiconductor Assembly and Packaging Equipment Product

Table 52. Advantest Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 53. Advantest Recent Development

Table 54. Accrutech Company Detail

Table 55. Accrutech Business Overview

Table 56. Accrutech Semiconductor Assembly and Packaging Equipment Product

Table 57. Accrutech Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 58. Accrutech Recent Development

Table 59. Shinkawa Company Detail

Table 60. Shinkawa Business Overview

Table 61. Shinkawa Semiconductor Assembly and Packaging Equipment Product

Table 62. Shinkawa Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 63. Shinkawa Recent Development

Table 64. KLA-Tencor Company Detail

Table 65. KLA-Tencor Business Overview

Table 66. KLA-Tencor Semiconductor Assembly and Packaging Equipment Product

Table 67. KLA-Tencor Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 68. KLA-Tencor Recent Development

Table 69. Teradyne Inc. Company Detail

Table 70. Teradyne Inc. Business Overview

Table 71. Teradyne Inc. Semiconductor Assembly and Packaging Equipment Product

Table 72. Teradyne Inc. Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 73. Teradyne Inc. Recent Development

Table 74. Amkor Technology Company Detail

Table 75. Amkor Technology Business Overview

Table 76. Amkor Technology Semiconductor Assembly and Packaging Equipment Product

Table 77. Amkor Technology Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 78. Amkor Technology Recent Development

Table 79. Tokyo Electron Limited Company Detail

Table 80. Tokyo Electron Limited Business Overview

Table 81. Tokyo Electron Limited Semiconductor Assembly and Packaging Equipment Product

Table 82. Tokyo Electron Limited Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 83. Tokyo Electron Limited Recent Development

Table 84. Lam Research Corporation Company Detail

Table 85. Lam Research Corporation Business Overview

Table 86. Lam Research Corporation Semiconductor Assembly and Packaging Equipment Product

Table 87. Lam Research Corporation Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 88. Lam Research Corporation Recent Development

Table 89. ASML Holding N.V Company Detail

Table 90. ASML Holding N.V Business Overview

Table 91. ASML Holding N.V Semiconductor Assembly and Packaging Equipment Product

Table 92. ASML Holding N.V Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 93. ASML Holding N.V Recent Development

Table 94. Applied Materials Company Detail

Table 95. Applied Materials Business Overview

Table 96. Applied Materials Semiconductor Assembly and Packaging Equipment Product

Table 97. Applied Materials Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 98. Applied Materials Recent Development

Table 99. Toray Engineering Company Detail

Table 100. Toray Engineering Business Overview

Table 101. Toray Engineering Semiconductor Assembly and Packaging Equipment Product

Table 102. Toray Engineering Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 103. Toray Engineering Recent Development

Table 104. Kulicke & Soffa Industries Company Detail

Table 105. Kulicke & Soffa Industries Business Overview

Table 106. Kulicke & Soffa Industries Semiconductor Assembly and Packaging Equipment Product

Table 107. Kulicke & Soffa Industries Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 108. Kulicke & Soffa Industries Recent Development

Table 109. Hesse Mechatronics Company Detail

Table 110. Hesse Mechatronics Business Overview

Table 111. Hesse Mechatronics Semiconductor Assembly and Packaging Equipment Product

Table 112. Hesse Mechatronics Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 113. Hesse Mechatronics Recent Development

Table 114. Palomar Technologies Company Detail

Table 115. Palomar Technologies Business Overview

Table 116. Palomar Technologies Semiconductor Assembly and Packaging Equipment Product

Table 117. Palomar Technologies Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 118. Palomar Technologies Recent Development

Table 119. West Bond Company Detail

Table 120. West Bond Business Overview

Table 121. West Bond Semiconductor Assembly and Packaging Equipment Product

Table 122. West Bond Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 123. West Bond Recent Development

Table 124. DIAS Automation Company Detail

Table 125. DIAS Automation Business Overview

Table 126. DIAS Automation Semiconductor Assembly and Packaging Equipment Product

Table 127. DIAS Automation Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 128. DIAS Automation Recent Development

Table 129. Screen Holdings Co. Ltd Company Detail

Table 130. Screen Holdings Co. Ltd Business Overview

Table 131. Screen Holdings Co. Ltd Semiconductor Assembly and Packaging Equipment Product

Table 132. Screen Holdings Co. Ltd Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 133. Screen Holdings Co. Ltd Recent Development

Table 134. Hitachi High-Technologies Corporation Company Detail

Table 135. Hitachi High-Technologies Corporation Business Overview

Table 136. Hitachi High-Technologies Corporation Semiconductor Assembly and Packaging Equipment Product

Table 137. Hitachi High-Technologies Corporation Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 138. Hitachi High-Technologies Corporation Recent Development

Table 139. HYBONDASM Pacific Technology Company Detail

Table 140. HYBONDASM Pacific Technology Business Overview

Table 141. HYBONDASM Pacific Technology Semiconductor Assembly and Packaging Equipment Product

Table 142. HYBONDASM Pacific Technology Revenue in Semiconductor Assembly and Packaging Equipment Business (2019-2024) & (US$ Million)

Table 143. HYBONDASM Pacific Technology Recent Development

Table 144. Research Programs/Design for This Report

Table 145. Key Data Information from Secondary Sources

Table 146. Key Data Information from Primary Sources

List of Figures

Figure 1. Global Semiconductor Assembly and Packaging Equipment Market Size Comparison by Type (2024-2030) & (US$ Million)

Figure 2. Global Semiconductor Assembly and Packaging Equipment Market Share by Type: 2023 VS 2030

Figure 3. Electroplating Equipment Features

Figure 4. Inspection and Cutting Equipment Features

Figure 5. Lead Bonding Equipment Features

Figure 6. Chip Bonding Equipment Features

Figure 7. Others Features

Figure 8. Global Semiconductor Assembly and Packaging Equipment Market Size Comparison by Application (2024-2030) & (US$ Million)

Figure 9. Global Semiconductor Assembly and Packaging Equipment Market Share by Application: 2023 VS 2030

Figure 10. Automotive Case Studies

Figure 11. Enterprise Storage Case Studies

Figure 12. Consumer Electronics Case Studies

Figure 13. Healthcare Devices Case Studies

Figure 14. Others Case Studies

Figure 15. Semiconductor Assembly and Packaging Equipment Report Years Considered

Figure 16. Global Semiconductor Assembly and Packaging Equipment Market Size (US$ Million), Year-over-Year: 2019-2030

Figure 17. Global Semiconductor Assembly and Packaging Equipment Market Size, (US$ Million), 2019 VS 2023 VS 2030

Figure 18. Global Semiconductor Assembly and Packaging Equipment Market Share by Region: 2023 VS 2030

Figure 19. Global Semiconductor Assembly and Packaging Equipment Market Share by Players in 2023

Figure 20. Global Top Semiconductor Assembly and Packaging Equipment Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Assembly and Packaging Equipment as of 2023)

Figure 21. The Top 10 and 5 Players Market Share by Semiconductor Assembly and Packaging Equipment Revenue in 2023

Figure 22. North America Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 23. North America Semiconductor Assembly and Packaging Equipment Market Share by Country (2019-2030)

Figure 24. United States Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 25. Canada Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 26. Europe Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 27. Europe Semiconductor Assembly and Packaging Equipment Market Share by Country (2019-2030)

Figure 28. Germany Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 29. France Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 30. U.K. Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 31. Italy Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 32. Russia Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 33. Nordic Countries Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 34. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 35. Asia-Pacific Semiconductor Assembly and Packaging Equipment Market Share by Region (2019-2030)

Figure 36. China Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 37. Japan Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 38. South Korea Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 39. Southeast Asia Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 40. India Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 41. Australia Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 42. Latin America Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 43. Latin America Semiconductor Assembly and Packaging Equipment Market Share by Country (2019-2030)

Figure 44. Mexico Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 45. Brazil Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 46. Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 47. Middle East & Africa Semiconductor Assembly and Packaging Equipment Market Share by Country (2019-2030)

Figure 48. Turkey Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 49. Saudi Arabia Semiconductor Assembly and Packaging Equipment Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 50. Advantest Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 51. Accrutech Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 52. Shinkawa Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 53. KLA-Tencor Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 54. Teradyne Inc. Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 55. Amkor Technology Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 56. Tokyo Electron Limited Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 57. Lam Research Corporation Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 58. ASML Holding N.V Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 59. Applied Materials Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 60. Toray Engineering Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 61. Kulicke & Soffa Industries Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 62. Hesse Mechatronics Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 63. Palomar Technologies Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 64. West Bond Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 65. DIAS Automation Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 66. Screen Holdings Co. Ltd Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 67. Hitachi High-Technologies Corporation Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 68. HYBONDASM Pacific Technology Revenue Growth Rate in Semiconductor Assembly and Packaging Equipment Business (2019-2024)

Figure 69. Bottom-up and Top-down Approaches for This Report

Figure 70. Data Triangulation

Figure 71. Key Executives Interviewed

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