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Global Semiconductor Packaging and Assembly Equipment Market Research Report 2025
Published Date: July 2025
|
Report Code: QYRE-Auto-18K7204
Home | Market Reports | Computers & Electronics| Electronics & Electrical| Electronic Components
Global Semiconductor Packaging and Assembly Equipment Market Insights and Forecast to 2028
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Global Semiconductor Packaging and Assembly Equipment Market Research Report 2025

Code: QYRE-Auto-18K7204
Report
July 2025
Pages:102
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Applied Materials
ASMPT
DISCO Corporation
EV Group
Kulicke and Soffa Industries
TEL
Tokyo Seimitsu
Rudolph Technologies
SEMES
Suss Microtec
Veeco/CNT
ULVAC Technologies

Semiconductor Packaging and Assembly Equipment Market Size

The global market for Semiconductor Packaging and Assembly Equipment was valued at US$ 6741 million in the year 2024 and is projected to reach a revised size of US$ 8954 million by 2031, growing at a CAGR of 4.2% during the forecast period.

Semiconductor Packaging and Assembly Equipment Market

Semiconductor Packaging and Assembly Equipment Market

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Semiconductor Packaging and Assembly Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Packaging and Assembly Equipment.
The Semiconductor Packaging and Assembly Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Semiconductor Packaging and Assembly Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Semiconductor Packaging and Assembly Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Semiconductor Packaging and Assembly Equipment Market Report

Report Metric Details
Report Name Semiconductor Packaging and Assembly Equipment Market
Accounted market size in year US$ 6741 million
Forecasted market size in 2031 US$ 8954 million
CAGR 4.2%
Base Year year
Forecasted years 2025 - 2031
by Type
  • Die- Level Packaging and Assembly Equipment
  • Wafer-Level Packaging and Assembly Equipment
by Application
  • IDM (Integrated Device Manufacturers)
  • OSAT (Outsourced Semiconductor Assembly and Test Companies)
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Applied Materials, ASMPT, DISCO Corporation, EV Group, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu, Rudolph Technologies, SEMES, Suss Microtec, Veeco/CNT, Ulvac Technologies
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Semiconductor Packaging and Assembly Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Semiconductor Packaging and Assembly Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Semiconductor Packaging and Assembly Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Semiconductor Packaging and Assembly Equipment Market growing?

Ans: The Semiconductor Packaging and Assembly Equipment Market witnessing a CAGR of 4.2% during the forecast period 2025-2031.

What is the Semiconductor Packaging and Assembly Equipment Market size in 2031?

Ans: The Semiconductor Packaging and Assembly Equipment Market size in 2031 will be US$ 8954 million.

What is the Semiconductor Packaging and Assembly Equipment Market share by region?

Ans: North America, Europe and Japan, have a combined market share of 23%.

Who are the main players in the Semiconductor Packaging and Assembly Equipment Market report?

Ans: The main players in the Semiconductor Packaging and Assembly Equipment Market are Applied Materials, ASMPT, DISCO Corporation, EV Group, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu, Rudolph Technologies, SEMES, Suss Microtec, Veeco/CNT, Ulvac Technologies

What are the Application segmentation covered in the Semiconductor Packaging and Assembly Equipment Market report?

Ans: The Applications covered in the Semiconductor Packaging and Assembly Equipment Market report are IDM (Integrated Device Manufacturers), OSAT (Outsourced Semiconductor Assembly and Test Companies)

What are the Type segmentation covered in the Semiconductor Packaging and Assembly Equipment Market report?

Ans: The Types covered in the Semiconductor Packaging and Assembly Equipment Market report are Die- Level Packaging and Assembly Equipment, Wafer-Level Packaging and Assembly Equipment

1 Semiconductor Packaging and Assembly Equipment Market Overview
1.1 Product Definition
1.2 Semiconductor Packaging and Assembly Equipment by Type
1.2.1 Global Semiconductor Packaging and Assembly Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Die- Level Packaging and Assembly Equipment
1.2.3 Wafer-Level Packaging and Assembly Equipment
1.3 Semiconductor Packaging and Assembly Equipment by Application
1.3.1 Global Semiconductor Packaging and Assembly Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 IDM (Integrated Device Manufacturers)
1.3.3 OSAT (Outsourced Semiconductor Assembly and Test Companies)
1.4 Global Market Growth Prospects
1.4.1 Global Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Semiconductor Packaging and Assembly Equipment Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Semiconductor Packaging and Assembly Equipment Production Estimates and Forecasts (2020-2031)
1.4.4 Global Semiconductor Packaging and Assembly Equipment Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Semiconductor Packaging and Assembly Equipment Production Market Share by Manufacturers (2020-2025)
2.2 Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Semiconductor Packaging and Assembly Equipment, Industry Ranking, 2023 VS 2024
2.4 Global Semiconductor Packaging and Assembly Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Semiconductor Packaging and Assembly Equipment Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Product Offered and Application
2.8 Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Date of Enter into This Industry
2.9 Semiconductor Packaging and Assembly Equipment Market Competitive Situation and Trends
2.9.1 Semiconductor Packaging and Assembly Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest Semiconductor Packaging and Assembly Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Semiconductor Packaging and Assembly Equipment Production by Region
3.1 Global Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Region (2020-2031)
3.2.1 Global Semiconductor Packaging and Assembly Equipment Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Semiconductor Packaging and Assembly Equipment by Region (2026-2031)
3.3 Global Semiconductor Packaging and Assembly Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Semiconductor Packaging and Assembly Equipment Production Volume by Region (2020-2031)
3.4.1 Global Semiconductor Packaging and Assembly Equipment Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Semiconductor Packaging and Assembly Equipment by Region (2026-2031)
3.5 Global Semiconductor Packaging and Assembly Equipment Market Price Analysis by Region (2020-2025)
3.6 Global Semiconductor Packaging and Assembly Equipment Production and Value, Year-over-Year Growth
3.6.1 North America Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Semiconductor Packaging and Assembly Equipment Production Value Estimates and Forecasts (2020-2031)
4 Semiconductor Packaging and Assembly Equipment Consumption by Region
4.1 Global Semiconductor Packaging and Assembly Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Semiconductor Packaging and Assembly Equipment Consumption by Region (2020-2031)
4.2.1 Global Semiconductor Packaging and Assembly Equipment Consumption by Region (2020-2025)
4.2.2 Global Semiconductor Packaging and Assembly Equipment Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Semiconductor Packaging and Assembly Equipment Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Semiconductor Packaging and Assembly Equipment Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Semiconductor Packaging and Assembly Equipment Production by Type (2020-2031)
5.1.1 Global Semiconductor Packaging and Assembly Equipment Production by Type (2020-2025)
5.1.2 Global Semiconductor Packaging and Assembly Equipment Production by Type (2026-2031)
5.1.3 Global Semiconductor Packaging and Assembly Equipment Production Market Share by Type (2020-2031)
5.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Type (2020-2031)
5.2.1 Global Semiconductor Packaging and Assembly Equipment Production Value by Type (2020-2025)
5.2.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Type (2026-2031)
5.2.3 Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Type (2020-2031)
5.3 Global Semiconductor Packaging and Assembly Equipment Price by Type (2020-2031)
6 Segment by Application
6.1 Global Semiconductor Packaging and Assembly Equipment Production by Application (2020-2031)
6.1.1 Global Semiconductor Packaging and Assembly Equipment Production by Application (2020-2025)
6.1.2 Global Semiconductor Packaging and Assembly Equipment Production by Application (2026-2031)
6.1.3 Global Semiconductor Packaging and Assembly Equipment Production Market Share by Application (2020-2031)
6.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Application (2020-2031)
6.2.1 Global Semiconductor Packaging and Assembly Equipment Production Value by Application (2020-2025)
6.2.2 Global Semiconductor Packaging and Assembly Equipment Production Value by Application (2026-2031)
6.2.3 Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Application (2020-2031)
6.3 Global Semiconductor Packaging and Assembly Equipment Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Applied Materials
7.1.1 Applied Materials Semiconductor Packaging and Assembly Equipment Company Information
7.1.2 Applied Materials Semiconductor Packaging and Assembly Equipment Product Portfolio
7.1.3 Applied Materials Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Applied Materials Main Business and Markets Served
7.1.5 Applied Materials Recent Developments/Updates
7.2 ASMPT
7.2.1 ASMPT Semiconductor Packaging and Assembly Equipment Company Information
7.2.2 ASMPT Semiconductor Packaging and Assembly Equipment Product Portfolio
7.2.3 ASMPT Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.2.4 ASMPT Main Business and Markets Served
7.2.5 ASMPT Recent Developments/Updates
7.3 DISCO Corporation
7.3.1 DISCO Corporation Semiconductor Packaging and Assembly Equipment Company Information
7.3.2 DISCO Corporation Semiconductor Packaging and Assembly Equipment Product Portfolio
7.3.3 DISCO Corporation Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.3.4 DISCO Corporation Main Business and Markets Served
7.3.5 DISCO Corporation Recent Developments/Updates
7.4 EV Group
7.4.1 EV Group Semiconductor Packaging and Assembly Equipment Company Information
7.4.2 EV Group Semiconductor Packaging and Assembly Equipment Product Portfolio
7.4.3 EV Group Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.4.4 EV Group Main Business and Markets Served
7.4.5 EV Group Recent Developments/Updates
7.5 Kulicke and Soffa Industries
7.5.1 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Company Information
7.5.2 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Product Portfolio
7.5.3 Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Kulicke and Soffa Industries Main Business and Markets Served
7.5.5 Kulicke and Soffa Industries Recent Developments/Updates
7.6 TEL
7.6.1 TEL Semiconductor Packaging and Assembly Equipment Company Information
7.6.2 TEL Semiconductor Packaging and Assembly Equipment Product Portfolio
7.6.3 TEL Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.6.4 TEL Main Business and Markets Served
7.6.5 TEL Recent Developments/Updates
7.7 Tokyo Seimitsu
7.7.1 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Company Information
7.7.2 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Product Portfolio
7.7.3 Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Tokyo Seimitsu Main Business and Markets Served
7.7.5 Tokyo Seimitsu Recent Developments/Updates
7.8 Rudolph Technologies
7.8.1 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Company Information
7.8.2 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Product Portfolio
7.8.3 Rudolph Technologies Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Rudolph Technologies Main Business and Markets Served
7.8.5 Rudolph Technologies Recent Developments/Updates
7.9 SEMES
7.9.1 SEMES Semiconductor Packaging and Assembly Equipment Company Information
7.9.2 SEMES Semiconductor Packaging and Assembly Equipment Product Portfolio
7.9.3 SEMES Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.9.4 SEMES Main Business and Markets Served
7.9.5 SEMES Recent Developments/Updates
7.10 Suss Microtec
7.10.1 Suss Microtec Semiconductor Packaging and Assembly Equipment Company Information
7.10.2 Suss Microtec Semiconductor Packaging and Assembly Equipment Product Portfolio
7.10.3 Suss Microtec Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Suss Microtec Main Business and Markets Served
7.10.5 Suss Microtec Recent Developments/Updates
7.11 Veeco/CNT
7.11.1 Veeco/CNT Semiconductor Packaging and Assembly Equipment Company Information
7.11.2 Veeco/CNT Semiconductor Packaging and Assembly Equipment Product Portfolio
7.11.3 Veeco/CNT Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Veeco/CNT Main Business and Markets Served
7.11.5 Veeco/CNT Recent Developments/Updates
7.12 Ulvac Technologies
7.12.1 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Company Information
7.12.2 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Product Portfolio
7.12.3 Ulvac Technologies Semiconductor Packaging and Assembly Equipment Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Ulvac Technologies Main Business and Markets Served
7.12.5 Ulvac Technologies Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Semiconductor Packaging and Assembly Equipment Industry Chain Analysis
8.2 Semiconductor Packaging and Assembly Equipment Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Semiconductor Packaging and Assembly Equipment Production Mode & Process Analysis
8.4 Semiconductor Packaging and Assembly Equipment Sales and Marketing
8.4.1 Semiconductor Packaging and Assembly Equipment Sales Channels
8.4.2 Semiconductor Packaging and Assembly Equipment Distributors
8.5 Semiconductor Packaging and Assembly Equipment Customer Analysis
9 Semiconductor Packaging and Assembly Equipment Market Dynamics
9.1 Semiconductor Packaging and Assembly Equipment Industry Trends
9.2 Semiconductor Packaging and Assembly Equipment Market Drivers
9.3 Semiconductor Packaging and Assembly Equipment Market Challenges
9.4 Semiconductor Packaging and Assembly Equipment Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
Applied Materials
ASMPT
DISCO Corporation
EV Group
Kulicke and Soffa Industries
TEL
Tokyo Seimitsu
Rudolph Technologies
SEMES
Suss Microtec
Veeco/CNT
ULVAC Technologies
List of Tables
 Table 1. Global Semiconductor Packaging and Assembly Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Semiconductor Packaging and Assembly Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Semiconductor Packaging and Assembly Equipment Production Capacity (Units) by Manufacturers in 2024
 Table 4. Global Semiconductor Packaging and Assembly Equipment Production by Manufacturers (2020-2025) & (Units)
 Table 5. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Semiconductor Packaging and Assembly Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Semiconductor Packaging and Assembly Equipment Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Semiconductor Packaging and Assembly Equipment, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Semiconductor Packaging and Assembly Equipment as of 2024)
 Table 10. Global Market Semiconductor Packaging and Assembly Equipment Average Price by Manufacturers (K USD/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Product Offered and Application
 Table 13. Global Key Manufacturers of Semiconductor Packaging and Assembly Equipment, Date of Enter into This Industry
 Table 14. Global Semiconductor Packaging and Assembly Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Semiconductor Packaging and Assembly Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Region (2020-2025)
 Table 19. Global Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Semiconductor Packaging and Assembly Equipment Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Semiconductor Packaging and Assembly Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)
 Table 22. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Region (2020-2025)
 Table 23. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Region (2020-2025)
 Table 24. Global Semiconductor Packaging and Assembly Equipment Production (Units) Forecast by Region (2026-2031)
 Table 25. Global Semiconductor Packaging and Assembly Equipment Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Semiconductor Packaging and Assembly Equipment Market Average Price (K USD/Unit) by Region (2020-2025)
 Table 27. Global Semiconductor Packaging and Assembly Equipment Market Average Price (K USD/Unit) by Region (2026-2031)
 Table 28. Global Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)
 Table 29. Global Semiconductor Packaging and Assembly Equipment Consumption by Region (2020-2025) & (Units)
 Table 30. Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Region (2020-2025)
 Table 31. Global Semiconductor Packaging and Assembly Equipment Forecasted Consumption by Region (2026-2031) & (Units)
 Table 32. Global Semiconductor Packaging and Assembly Equipment Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 34. North America Semiconductor Packaging and Assembly Equipment Consumption by Country (2020-2025) & (Units)
 Table 35. North America Semiconductor Packaging and Assembly Equipment Consumption by Country (2026-2031) & (Units)
 Table 36. Europe Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 37. Europe Semiconductor Packaging and Assembly Equipment Consumption by Country (2020-2025) & (Units)
 Table 38. Europe Semiconductor Packaging and Assembly Equipment Consumption by Country (2026-2031) & (Units)
 Table 39. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)
 Table 40. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption by Region (2020-2025) & (Units)
 Table 41. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption by Region (2026-2031) & (Units)
 Table 42. Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 43. Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption by Country (2020-2025) & (Units)
 Table 44. Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption by Country (2026-2031) & (Units)
 Table 45. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Type (2020-2025)
 Table 46. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Type (2026-2031)
 Table 47. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Type (2020-2025)
 Table 48. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Type (2026-2031)
 Table 49. Global Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Type (2020-2025)
 Table 52. Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Type (2026-2031)
 Table 53. Global Semiconductor Packaging and Assembly Equipment Price (K USD/Unit) by Type (2020-2025)
 Table 54. Global Semiconductor Packaging and Assembly Equipment Price (K USD/Unit) by Type (2026-2031)
 Table 55. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Application (2020-2025)
 Table 56. Global Semiconductor Packaging and Assembly Equipment Production (Units) by Application (2026-2031)
 Table 57. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Application (2020-2025)
 Table 58. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Application (2026-2031)
 Table 59. Global Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Application (2020-2025)
 Table 62. Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Application (2026-2031)
 Table 63. Global Semiconductor Packaging and Assembly Equipment Price (K USD/Unit) by Application (2020-2025)
 Table 64. Global Semiconductor Packaging and Assembly Equipment Price (K USD/Unit) by Application (2026-2031)
 Table 65. Applied Materials Semiconductor Packaging and Assembly Equipment Company Information
 Table 66. Applied Materials Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 67. Applied Materials Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 68. Applied Materials Main Business and Markets Served
 Table 69. Applied Materials Recent Developments/Updates
 Table 70. ASMPT Semiconductor Packaging and Assembly Equipment Company Information
 Table 71. ASMPT Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 72. ASMPT Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 73. ASMPT Main Business and Markets Served
 Table 74. ASMPT Recent Developments/Updates
 Table 75. DISCO Corporation Semiconductor Packaging and Assembly Equipment Company Information
 Table 76. DISCO Corporation Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 77. DISCO Corporation Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 78. DISCO Corporation Main Business and Markets Served
 Table 79. DISCO Corporation Recent Developments/Updates
 Table 80. EV Group Semiconductor Packaging and Assembly Equipment Company Information
 Table 81. EV Group Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 82. EV Group Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 83. EV Group Main Business and Markets Served
 Table 84. EV Group Recent Developments/Updates
 Table 85. Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Company Information
 Table 86. Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 87. Kulicke and Soffa Industries Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 88. Kulicke and Soffa Industries Main Business and Markets Served
 Table 89. Kulicke and Soffa Industries Recent Developments/Updates
 Table 90. TEL Semiconductor Packaging and Assembly Equipment Company Information
 Table 91. TEL Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 92. TEL Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 93. TEL Main Business and Markets Served
 Table 94. TEL Recent Developments/Updates
 Table 95. Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Company Information
 Table 96. Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 97. Tokyo Seimitsu Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 98. Tokyo Seimitsu Main Business and Markets Served
 Table 99. Tokyo Seimitsu Recent Developments/Updates
 Table 100. Rudolph Technologies Semiconductor Packaging and Assembly Equipment Company Information
 Table 101. Rudolph Technologies Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 102. Rudolph Technologies Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 103. Rudolph Technologies Main Business and Markets Served
 Table 104. Rudolph Technologies Recent Developments/Updates
 Table 105. SEMES Semiconductor Packaging and Assembly Equipment Company Information
 Table 106. SEMES Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 107. SEMES Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 108. SEMES Main Business and Markets Served
 Table 109. SEMES Recent Developments/Updates
 Table 110. Suss Microtec Semiconductor Packaging and Assembly Equipment Company Information
 Table 111. Suss Microtec Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 112. Suss Microtec Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 113. Suss Microtec Main Business and Markets Served
 Table 114. Suss Microtec Recent Developments/Updates
 Table 115. Veeco/CNT Semiconductor Packaging and Assembly Equipment Company Information
 Table 116. Veeco/CNT Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 117. Veeco/CNT Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 118. Veeco/CNT Main Business and Markets Served
 Table 119. Veeco/CNT Recent Developments/Updates
 Table 120. Ulvac Technologies Semiconductor Packaging and Assembly Equipment Company Information
 Table 121. Ulvac Technologies Semiconductor Packaging and Assembly Equipment Specification and Application
 Table 122. Ulvac Technologies Semiconductor Packaging and Assembly Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)
 Table 123. Ulvac Technologies Main Business and Markets Served
 Table 124. Ulvac Technologies Recent Developments/Updates
 Table 125. Key Raw Materials Lists
 Table 126. Raw Materials Key Suppliers Lists
 Table 127. Semiconductor Packaging and Assembly Equipment Distributors List
 Table 128. Semiconductor Packaging and Assembly Equipment Customers List
 Table 129. Semiconductor Packaging and Assembly Equipment Market Trends
 Table 130. Semiconductor Packaging and Assembly Equipment Market Drivers
 Table 131. Semiconductor Packaging and Assembly Equipment Market Challenges
 Table 132. Semiconductor Packaging and Assembly Equipment Market Restraints
 Table 133. Research Programs/Design for This Report
 Table 134. Key Data Information from Secondary Sources
 Table 135. Key Data Information from Primary Sources
 Table 136. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Semiconductor Packaging and Assembly Equipment
 Figure 2. Global Semiconductor Packaging and Assembly Equipment Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Semiconductor Packaging and Assembly Equipment Market Share by Type: 2024 VS 2031
 Figure 4. Die- Level Packaging and Assembly Equipment Product Picture
 Figure 5. Wafer-Level Packaging and Assembly Equipment Product Picture
 Figure 6. Global Semiconductor Packaging and Assembly Equipment Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global Semiconductor Packaging and Assembly Equipment Market Share by Application: 2024 VS 2031
 Figure 8. IDM (Integrated Device Manufacturers)
 Figure 9. OSAT (Outsourced Semiconductor Assembly and Test Companies)
 Figure 10. Global Semiconductor Packaging and Assembly Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 11. Global Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) & (2020-2031)
 Figure 12. Global Semiconductor Packaging and Assembly Equipment Production Capacity (Units) & (2020-2031)
 Figure 13. Global Semiconductor Packaging and Assembly Equipment Production (Units) & (2020-2031)
 Figure 14. Global Semiconductor Packaging and Assembly Equipment Average Price (K USD/Unit) & (2020-2031)
 Figure 15. Semiconductor Packaging and Assembly Equipment Report Years Considered
 Figure 16. Semiconductor Packaging and Assembly Equipment Production Share by Manufacturers in 2024
 Figure 17. Global Semiconductor Packaging and Assembly Equipment Production Value Share by Manufacturers (2024)
 Figure 18. Semiconductor Packaging and Assembly Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 19. The Global 5 and 10 Largest Players: Market Share by Semiconductor Packaging and Assembly Equipment Revenue in 2024
 Figure 20. Global Semiconductor Packaging and Assembly Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 21. Global Semiconductor Packaging and Assembly Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 22. Global Semiconductor Packaging and Assembly Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)
 Figure 23. Global Semiconductor Packaging and Assembly Equipment Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 24. North America Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 25. Europe Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 26. China Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. Japan Semiconductor Packaging and Assembly Equipment Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Global Semiconductor Packaging and Assembly Equipment Consumption by Region: 2020 VS 2024 VS 2031 (Units)
 Figure 29. Global Semiconductor Packaging and Assembly Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 30. North America Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 31. North America Semiconductor Packaging and Assembly Equipment Consumption Market Share by Country (2020-2031)
 Figure 32. U.S. Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 33. Canada Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 34. Europe Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 35. Europe Semiconductor Packaging and Assembly Equipment Consumption Market Share by Country (2020-2031)
 Figure 36. Germany Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 37. France Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 38. U.K. Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 39. Italy Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 40. Netherlands Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 41. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 42. Asia Pacific Semiconductor Packaging and Assembly Equipment Consumption Market Share by Region (2020-2031)
 Figure 43. China Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 44. Japan Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 45. South Korea Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 46. China Taiwan Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 47. Southeast Asia Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 48. India Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 49. Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 50. Latin America, Middle East & Africa Semiconductor Packaging and Assembly Equipment Consumption Market Share by Country (2020-2031)
 Figure 51. Mexico Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 52. Brazil Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 53. Israel Semiconductor Packaging and Assembly Equipment Consumption and Growth Rate (2020-2031) & (Units)
 Figure 54. Global Production Market Share of Semiconductor Packaging and Assembly Equipment by Type (2020-2031)
 Figure 55. Global Production Value Market Share of Semiconductor Packaging and Assembly Equipment by Type (2020-2031)
 Figure 56. Global Semiconductor Packaging and Assembly Equipment Price (K USD/Unit) by Type (2020-2031)
 Figure 57. Global Production Market Share of Semiconductor Packaging and Assembly Equipment by Application (2020-2031)
 Figure 58. Global Production Value Market Share of Semiconductor Packaging and Assembly Equipment by Application (2020-2031)
 Figure 59. Global Semiconductor Packaging and Assembly Equipment Price (K USD/Unit) by Application (2020-2031)
 Figure 60. Semiconductor Packaging and Assembly Equipment Value Chain
 Figure 61. Channels of Distribution (Direct Vs Distribution)
 Figure 62. Bottom-up and Top-down Approaches for This Report
 Figure 63. Data Triangulation
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