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Global Wafer Level Package Market Size, Status and Forecast 2021-2027
Published Date: July 2021
|
Report Code: QYRE-Auto-39A1062
Home | Market Reports | Computers & Electronics | Computer Hardware | Computer Components
Global Wafer Level Package Market Size Status and Forecast 2021 2027

Global Wafer Level Package Market Size, Status and Forecast 2021-2027

Code: QYRE-Auto-39A1062
Report
July 2021
106 Pages
QYResearch
Region: Global, North America, China, Europe, Japan,
Description
Table of Content
Tables & Figures
In 2021, the global Wafer Level Package market size will be US$ XX million and it is expected to reach US$ XX million by the end of 2027, with a CAGR of XX% during 2021-2027.
This report focuses on the global Wafer Level Package status, future forecast, growth opportunity, key market, and key players. The study objectives are to present the Wafer Level Package development in North America, Europe, Japan, China, Southeast Asia, India, etc.
Global Wafer Level Package Scope and Market Size
Wafer Level Package market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Level Package market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by Type and by Application in terms of revenue and forecast for the period 2016-2027.

Segment by Type

3D Wire Bonding
3D TSV
Others

Segment by Application

Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others

BY REGION

North America
Europe
Japan
China
Southeast Asia
India

BY COMPANY

lASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Wafer Level Package Market Size Growth Rate by Type (2021-2027)
1.2.2 3D Wire Bonding
1.2.3 3D TSV
1.2.4 Others
1.3 Market by Application
1.3.1 Global Wafer Level Package Market Share by Application (2021-2027)
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Automotive & Transport
1.3.5 IT & Telecommunication
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
2 Executive Summary
2.1 Global Wafer Level Package Market Size
2.2 Wafer Level Package Market Size by Regions
2.2.1 Wafer Level Package Growth Rate by Regions (2021-2027)
2.2.2 Wafer Level Package Market Share by Regions (2021-2027)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Use Cases
3 Key Players
3.1 Wafer Level Package Revenue by Players (2020-2021)
3.2 Wafer Level Package Key Players Headquaters and Area Served
3.3 Key Players Wafer Level Package Product/Solution/Service
3.4 Date of Enter into Wafer Level Package Market
3.5 Mergers & Acquisitions, Expansion Plans
4 Breakdown by Type and by Application
4.1 Global Wafer Level Package Market Size by Type (2021-2027)
4.2 Global Wafer Level Package Market Size by Application (2021-2027)
5 North America
5.1 North America Wafer Level Package Market Forecast (2021-2027)
5.2 Wafer Level Package Key Players in North America
5.3 North America Wafer Level Package Market Size by Type
5.4 North America Wafer Level Package Market Size by Application
6.4.4 Canada
6 Europe
6.1 Europe Wafer Level Package Market Forecast (2021-2027)
6.2 Wafer Level Package Key Players in Europe
6.3 Europe Wafer Level Package Market Size by Type
6.4 Europe Wafer Level Package Market Size by Application
7 Japan
7.1 Japan Wafer Level Package Market Forecast (2021-2027)
7.2 Wafer Level Package Key Players in Europe
7.3 Japan Wafer Level Package Market Size by Type
7.4 Japan Wafer Level Package Market Size by Application
8 Rest of World
8.1 China
8.1.1 China Wafer Level Package Market Analysis
8.1.2 Key Players in China
8.2 Southeast Asia
8.2.1 Southeast Asia Wafer Level Package Market Analysis
8.2.2 Key Players in Southeast Asia
8.3 India
8.3.1 India Wafer Level Package Market Analysis
8.3.2 Key Players in India
9 International Player Profiles
9.1 lASE
9.1.1 lASE Company Details
9.1.2 lASE Description and Business Overview
9.1.3 lASE Wafer Level Package Introduction
9.1.4 lASE Revenue in Wafer Level Package Business (2020-2021)
9.1.5 lASE Recent Development
9.2 Amkor
9.2.1 Amkor Company Details
9.2.2 Amkor Description and Business Overview
9.2.3 Amkor Wafer Level Package Introduction
9.2.4 Amkor Revenue in Wafer Level Package Business (2020-2021)
9.2.5 Amkor Recent Development
9.3 Intel
9.3.1 Intel Company Details
9.3.2 Intel Description and Business Overview
9.3.3 Intel Wafer Level Package Introduction
9.3.4 Intel Revenue in Wafer Level Package Business (2020-2021)
9.3.5 Intel Recent Development
9.4 Samsung
9.4.1 Samsung Company Details
9.4.2 Samsung Description and Business Overview
9.4.3 Samsung Wafer Level Package Introduction
9.4.4 Samsung Revenue in Wafer Level Package Business (2020-2021)
9.4.5 Samsung Recent Development
9.5 AT&S
9.5.1 AT&S Company Details
9.5.2 AT&S Description and Business Overview
9.5.3 AT&S Wafer Level Package Introduction
9.5.4 AT&S Revenue in Wafer Level Package Business (2020-2021)
9.5.5 AT&S Recent Development
9.6 Toshiba
9.6.1 Toshiba Company Details
9.6.2 Toshiba Description and Business Overview
9.6.3 Toshiba Wafer Level Package Introduction
9.6.4 Toshiba Revenue in Wafer Level Package Business (2020-2021)
9.6.5 Toshiba Recent Development
9.7 JCET
9.7.1 JCET Company Details
9.7.2 JCET Description and Business Overview
9.7.3 JCET Wafer Level Package Introduction
9.7.4 JCET Revenue in Wafer Level Package Business (2020-2021)
9.7.5 JCET Recent Development
9.8 Qualcomm
9.8.1 Qualcomm Company Details
9.8.2 Qualcomm Description and Business Overview
9.8.3 Qualcomm Wafer Level Package Introduction
9.8.4 Qualcomm Revenue in Wafer Level Package Business (2020-2021)
9.8.5 Qualcomm Recent Development
9.9 IBM
9.9.1 IBM Company Details
9.9.2 IBM Description and Business Overview
9.9.3 IBM Wafer Level Package Introduction
9.9.4 IBM Revenue in Wafer Level Package Business (2020-2021)
9.9.5 IBM Recent Development
9.10 SK Hynix
9.10.1 SK Hynix Company Details
9.10.2 SK Hynix Description and Business Overview
9.10.3 SK Hynix Wafer Level Package Introduction
9.10.4 SK Hynix Revenue in Wafer Level Package Business (2020-2021)
9.10.5 SK Hynix Recent Development
9.11 UTAC
9.11.1 UTAC Company Details
9.11.2 UTAC Description and Business Overview
9.11.3 UTAC Wafer Level Package Introduction
9.11.4 UTAC Revenue in Wafer Level Package Business (2020-2021)
9.11.5 UTAC Recent Development
9.12 TSMC
9.12.1 TSMC Company Details
9.12.2 TSMC Description and Business Overview
9.12.3 TSMC Wafer Level Package Introduction
9.12.4 TSMC Revenue in Wafer Level Package Business (2020-2021)
9.12.5 TSMC Recent Development
9.13 China Wafer Level CSP
9.13.1 China Wafer Level CSP Company Details
9.13.2 China Wafer Level CSP Description and Business Overview
9.13.3 China Wafer Level CSP Wafer Level Package Introduction
9.13.4 China Wafer Level CSP Revenue in Wafer Level Package Business (2020-2021)
9.13.5 China Wafer Level CSP Recent Development
9.14 Interconnect Systems
9.14.1 Interconnect Systems Company Details
9.14.2 Interconnect Systems Description and Business Overview
9.14.3 Interconnect Systems Wafer Level Package Introduction
9.14.4 Interconnect Systems Revenue in Wafer Level Package Business (2020-2021)
9.14.5 Interconnect Systems Recent Development
10 Market Dynamics
10.1 Industry Trends
10.2 Market Drives
10.3 Market Challenges
10.4 Market Restraints
11 Key Findings in This Report
12 Appendix
12.1 Research Methodology
12.1.1 Methodology/Research Approach
12.1.2 Data Source
12.2 Disclaimer
12.3 Author Details
List of Tables
    Table 1. Global Wafer Level Package Market Size Growth Rate by Type (2021-2027) (US$ Million)
    Table 2. Key Players of 3D Wire Bonding
    Table 3. Key Players of 3D TSV
    Table 4. Key Players of Others
    Table 5. Global Wafer Level Package Market Size Growth by Application (2021-2027) (US$ Million)
    Table 6. Global Wafer Level Package Market Size by Regions (2021-2027) (US$ Million)
    Table 7. Global Wafer Level Package Market Share by Regions (2021-2027)
    Table 8. Market Top Trends
    Table 9. Market Use Cases
    Table 10. Global Wafer Level Package Revenue by Players (2020-2021) (US$ Million)
    Table 11. Global Wafer Level Package Market Share by Players (2020-2021)
    Table 12. Key Players Headquarters and Area Served
    Table 13. Key Players Wafer Level Package Product Solution and Service
    Table 14. Date of Enter into Wafer Level Package Market
    Table 15. Mergers & Acquisitions, Expansion Plans
    Table 16. Global Wafer Level Package Market Size by Type (2021-2027) (US$ Million)
    Table 17. Global Wafer Level Package Market Size Share by Type (2021-2027)
    Table 18. Global Wafer Level Package Market Size by Application (2021-2027) (US$ Million)
    Table 19. Global Wafer Level Package Market Size Share by Application (2021-2027)
    Table 20. North America Key Players Wafer Level Package Revenue (2020-2021) (US$ Million)
    Table 21. North America Key Players Wafer Level Package Market Share (2020-2021)
    Table 22. North America Wafer Level Package Market Size by Type (2021-2027) (US$ Million)
    Table 23. North America Wafer Level Package Market Share by Type (2021-2027)
    Table 24. North America Wafer Level Package Market Size by Application (2021-2027) (US$ Million)
    Table 25. North America Wafer Level Package Market Share by Application (2021-2027)
    Table 26. Europe Key Players Wafer Level Package Revenue (2020-2021) (US$ Million)
    Table 27. Europe Key Players Wafer Level Package Market Share (2020-2021)
    Table 28. Europe Wafer Level Package Market Size by Type (2021-2027) (US$ Million)
    Table 29. Europe Wafer Level Package Market Share by Type (2021-2027)
    Table 30. Europe Wafer Level Package Market Size by Application (2021-2027) (US$ Million)
    Table 31. Europe Wafer Level Package Market Share by Application (2021-2027)
    Table 32. Japan Key Players Wafer Level Package Revenue (2020-2021) (US$ Million)
    Table 33. Japan Key Players Wafer Level Package Market Share (2020-2021)
    Table 34. Japan Wafer Level Package Market Size by Type (2021-2027) (US$ Million)
    Table 35. Japan Wafer Level Package Market Share by Type (2021-2027)
    Table 36. Japan Wafer Level Package Market Size by Application (2021-2027) (US$ Million)
    Table 37. Japan Wafer Level Package Market Share by Application (2021-2027)
    Table 38. Key Players in China
    Table 39. Key Players in Southeast Asia
    Table 40. Key Players in India
    Table 41. lASE Company Details
    Table 42. lASE Description and Business Overview
    Table 43. lASE Wafer Level Package Product
    Table 44. lASE Revenue in Wafer Level Package Business 2020 and 2021
    Table 45. lASE Recent Development
    Table 46. Amkor Company Details
    Table 47. Amkor Description and Business Overview
    Table 48. Amkor Wafer Level Package Product
    Table 49. Amkor Revenue in Wafer Level Package Business 2020 and 2021
    Table 50. Amkor Recent Development
    Table 51. Intel Company Details
    Table 52. Intel Description and Business Overview
    Table 53. Intel Wafer Level Package Product
    Table 54. Intel Revenue in Wafer Level Package Business 2020 and 2021
    Table 55. Intel Recent Development
    Table 56. Samsung Company Details
    Table 57. Samsung Description and Business Overview
    Table 58. Samsung Wafer Level Package Product
    Table 59. Samsung Revenue in Wafer Level Package Business 2020 and 2021
    Table 60. Samsung Recent Development
    Table 61. AT&S Company Details
    Table 62. AT&S Description and Business Overview
    Table 63. AT&S Wafer Level Package Product
    Table 64. AT&S Revenue in Wafer Level Package Business 2020 and 2021
    Table 65. AT&S Recent Development
    Table 66. Toshiba Company Details
    Table 67. Toshiba Description and Business Overview
    Table 68. Toshiba Wafer Level Package Product
    Table 69. Toshiba Revenue in Wafer Level Package Business 2020 and 2021
    Table 70. Toshiba Recent Development
    Table 71. JCET Company Details
    Table 72. JCET Description and Business Overview
    Table 73. JCET Wafer Level Package Product
    Table 74. JCET Revenue in Wafer Level Package Business 2020 and 2021
    Table 75. JCET Recent Development
    Table 76. Qualcomm Company Details
    Table 77. Qualcomm Description and Business Overview
    Table 78. Qualcomm Wafer Level Package Product
    Table 79. Qualcomm Revenue in Wafer Level Package Business 2020 and 2021
    Table 80. Qualcomm Recent Development
    Table 81. IBM Company Details
    Table 82. IBM Description and Business Overview
    Table 83. IBM Wafer Level Package Product
    Table 84. IBM Revenue in Wafer Level Package Business 2020 and 2021
    Table 85. IBM Recent Development
    Table 86. SK Hynix Company Details
    Table 87. SK Hynix Description and Business Overview
    Table 88. SK Hynix Wafer Level Package Product
    Table 89. SK Hynix Revenue in Wafer Level Package Business 2020 and 2021
    Table 90. SK Hynix Recent Development
    Table 91. UTAC Company Details
    Table 92. UTAC Description and Business Overview
    Table 93. UTAC Wafer Level Package Product
    Table 94. UTAC Revenue in Wafer Level Package Business 2020 and 2021
    Table 95. UTAC Recent Development
    Table 96. TSMC Company Details
    Table 97. TSMC Description and Business Overview
    Table 98. TSMC Wafer Level Package Product
    Table 99. TSMC Revenue in Wafer Level Package Business 2020 and 2021
    Table 100. TSMC Recent Development
    Table 101. China Wafer Level CSP Company Details
    Table 102. China Wafer Level CSP Description and Business Overview
    Table 103. China Wafer Level CSP Wafer Level Package Product
    Table 104. China Wafer Level CSP Revenue in Wafer Level Package Business 2020 and 2021
    Table 105. China Wafer Level CSP Recent Development
    Table 106. Interconnect Systems Company Details
    Table 107. Interconnect Systems Description and Business Overview
    Table 108. Interconnect Systems Wafer Level Package Product
    Table 109. Interconnect Systems Revenue in Wafer Level Package Business 2020 and 2021
    Table 110. Interconnect Systems Recent Development
    Table 111. Wafer Level Package Market Trends
    Table 112. Wafer Level Package Market Drivers
    Table 113. Wafer Level Package Market Challenges
    Table 114. Wafer Level Package Market Restraints
    Table 115. Research Programs/Design for This Report
    Table 116. Key Data Information from Secondary Sources
    Table 117. Key Data Information from Primary Sources
List of Figures
    Figure 1. Global Wafer Level Package Market Share by Type in 2021 & 2027
    Figure 2. 3D Wire Bonding Features
    Figure 3. 3D TSV Features
    Figure 4. Others Features
    Figure 5. Global Wafer Level Package Market Share by Application in 2021 & 2027
    Figure 6. Consumer Electronics Case Studies
    Figure 7. Industrial Case Studies
    Figure 8. Automotive & Transport Case Studies
    Figure 9. IT & Telecommunication Case Studies
    Figure 10. Others Case Studies
    Figure 11. Wafer Level Package Report Years Considered
    Figure 12. Global Wafer Level Package Market Size and Growth Rate (2020-2027) (US$ Million)
    Figure 13. Global Wafer Level Package Market Share by Regions (2020-2027)
    Figure 14. Global Wafer Level Package Market Share by Players in 2021
    Figure 15. Global Wafer Level Package Market Size Market Share by Type (2021-2027)
    Figure 16. Global Wafer Level Package Market Size Market Share by Application (2021-2027)
    Figure 17. Global Wafer Level Package Revenue Market Share by Application in 2021
    Figure 18. North America Wafer Level Package Market Size 2021-2027 (US$ Million)
    Figure 19. Europe Wafer Level Package Market Size 2021-2027 (US$ Million)
    Figure 20. Japan Wafer Level Package Market Size 2021-2027 (US$ Million)
    Figure 21. Wafer Level Package Market Size in China (2021-2027) (US$ Million)
    Figure 22. Wafer Level Package Market Size in Southeast Asia (2021-2027) (US$ Million)
    Figure 23. Wafer Level Package Market Size in India (2021-2027) (US$ Million)
    Figure 24. Bottom-up and Top-down Approaches for This Report
    Figure 25. Data Triangulation
    Figure 26. Key Executives Interviewed
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