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Global 2.5D and 3D IC Packaging Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-0L14379
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Global 2 5D and 3D IC Packaging Market Research Report 2023
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Global 2.5D and 3D IC Packaging Market Research Report 2025

Code: QYRE-Auto-0L14379
Report
March 2025
Pages:93
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology

2.5D and 3D IC Packaging Market

The global market for 2.5D and 3D IC Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.
North American market for 2.5D and 3D IC Packaging is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for 2.5D and 3D IC Packaging is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The global market for 2.5D and 3D IC Packaging in Consumer Electronics is estimated to increase from $ million in 2024 to $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global companies of 2.5D and 3D IC Packaging include ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC, SK Hynix, Amkor Technology, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for 2.5D and 3D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 2.5D and 3D IC Packaging.
The 2.5D and 3D IC Packaging market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global 2.5D and 3D IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 2.5D and 3D IC Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of 2.5D and 3D IC Packaging Market Report

Report Metric Details
Report Name 2.5D and 3D IC Packaging Market
Segment by Type
  • 2.5D
  • 3D TSV
  • 3D Wafer-level Chip-scale Packaging
Segment by Application
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC, SK Hynix, Amkor Technology, GlobalFoundries, SanDisk (Western Digital), Synopsys, Invensas, Siliconware Precision Industries, Jiangsu Changjiang Electronics, Powertech Technology
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of 2.5D and 3D IC Packaging company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the 2.5D and 3D IC Packaging Market report?

Ans: The main players in the 2.5D and 3D IC Packaging Market are ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC, SK Hynix, Amkor Technology, GlobalFoundries, SanDisk (Western Digital), Synopsys, Invensas, Siliconware Precision Industries, Jiangsu Changjiang Electronics, Powertech Technology

What are the Application segmentation covered in the 2.5D and 3D IC Packaging Market report?

Ans: The Applications covered in the 2.5D and 3D IC Packaging Market report are Consumer Electronics, Medical Devices, Communications and Telecom, Automotive, Other

What are the Type segmentation covered in the 2.5D and 3D IC Packaging Market report?

Ans: The Types covered in the 2.5D and 3D IC Packaging Market report are 2.5D, 3D TSV, 3D Wafer-level Chip-scale Packaging

Recommended Reports

IC Packaging Advances

3D & TSV Technology

Semiconductor Substrates

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 2.5D and 3D IC Packaging Market Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 2.5D
1.2.3 3D TSV
1.2.4 3D Wafer-level Chip-scale Packaging
1.3 Market by Application
1.3.1 Global 2.5D and 3D IC Packaging Market Growth by Application: 2020 VS 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Medical Devices
1.3.4 Communications and Telecom
1.3.5 Automotive
1.3.6 Other
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global 2.5D and 3D IC Packaging Market Perspective (2020-2031)
2.2 Global 2.5D and 3D IC Packaging Growth Trends by Region
2.2.1 Global 2.5D and 3D IC Packaging Market Size by Region: 2020 VS 2024 VS 2031
2.2.2 2.5D and 3D IC Packaging Historic Market Size by Region (2020-2025)
2.2.3 2.5D and 3D IC Packaging Forecasted Market Size by Region (2026-2031)
2.3 2.5D and 3D IC Packaging Market Dynamics
2.3.1 2.5D and 3D IC Packaging Industry Trends
2.3.2 2.5D and 3D IC Packaging Market Drivers
2.3.3 2.5D and 3D IC Packaging Market Challenges
2.3.4 2.5D and 3D IC Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top 2.5D and 3D IC Packaging Players by Revenue
3.1.1 Global Top 2.5D and 3D IC Packaging Players by Revenue (2020-2025)
3.1.2 Global 2.5D and 3D IC Packaging Revenue Market Share by Players (2020-2025)
3.2 Global 2.5D and 3D IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by 2.5D and 3D IC Packaging Revenue
3.4 Global 2.5D and 3D IC Packaging Market Concentration Ratio
3.4.1 Global 2.5D and 3D IC Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 2.5D and 3D IC Packaging Revenue in 2024
3.5 Global Key Players of 2.5D and 3D IC Packaging Head office and Area Served
3.6 Global Key Players of 2.5D and 3D IC Packaging, Product and Application
3.7 Global Key Players of 2.5D and 3D IC Packaging, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 2.5D and 3D IC Packaging Breakdown Data by Type
4.1 Global 2.5D and 3D IC Packaging Historic Market Size by Type (2020-2025)
4.2 Global 2.5D and 3D IC Packaging Forecasted Market Size by Type (2026-2031)
5 2.5D and 3D IC Packaging Breakdown Data by Application
5.1 Global 2.5D and 3D IC Packaging Historic Market Size by Application (2020-2025)
5.2 Global 2.5D and 3D IC Packaging Forecasted Market Size by Application (2026-2031)
6 North America
6.1 North America 2.5D and 3D IC Packaging Market Size (2020-2031)
6.2 North America 2.5D and 3D IC Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America 2.5D and 3D IC Packaging Market Size by Country (2020-2025)
6.4 North America 2.5D and 3D IC Packaging Market Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 2.5D and 3D IC Packaging Market Size (2020-2031)
7.2 Europe 2.5D and 3D IC Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe 2.5D and 3D IC Packaging Market Size by Country (2020-2025)
7.4 Europe 2.5D and 3D IC Packaging Market Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 2.5D and 3D IC Packaging Market Size (2020-2031)
8.2 Asia-Pacific 2.5D and 3D IC Packaging Market Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific 2.5D and 3D IC Packaging Market Size by Region (2020-2025)
8.4 Asia-Pacific 2.5D and 3D IC Packaging Market Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 2.5D and 3D IC Packaging Market Size (2020-2031)
9.2 Latin America 2.5D and 3D IC Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America 2.5D and 3D IC Packaging Market Size by Country (2020-2025)
9.4 Latin America 2.5D and 3D IC Packaging Market Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 2.5D and 3D IC Packaging Market Size (2020-2031)
10.2 Middle East & Africa 2.5D and 3D IC Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa 2.5D and 3D IC Packaging Market Size by Country (2020-2025)
10.4 Middle East & Africa 2.5D and 3D IC Packaging Market Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Technology
11.1.1 ASE Technology Company Details
11.1.2 ASE Technology Business Overview
11.1.3 ASE Technology 2.5D and 3D IC Packaging Introduction
11.1.4 ASE Technology Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.1.5 ASE Technology Recent Development
11.2 Samsung Electronics
11.2.1 Samsung Electronics Company Details
11.2.2 Samsung Electronics Business Overview
11.2.3 Samsung Electronics 2.5D and 3D IC Packaging Introduction
11.2.4 Samsung Electronics Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.2.5 Samsung Electronics Recent Development
11.3 Toshiba
11.3.1 Toshiba Company Details
11.3.2 Toshiba Business Overview
11.3.3 Toshiba 2.5D and 3D IC Packaging Introduction
11.3.4 Toshiba Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.3.5 Toshiba Recent Development
11.4 STMicroelectronics
11.4.1 STMicroelectronics Company Details
11.4.2 STMicroelectronics Business Overview
11.4.3 STMicroelectronics 2.5D and 3D IC Packaging Introduction
11.4.4 STMicroelectronics Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.4.5 STMicroelectronics Recent Development
11.5 Xilinx
11.5.1 Xilinx Company Details
11.5.2 Xilinx Business Overview
11.5.3 Xilinx 2.5D and 3D IC Packaging Introduction
11.5.4 Xilinx Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.5.5 Xilinx Recent Development
11.6 Intel
11.6.1 Intel Company Details
11.6.2 Intel Business Overview
11.6.3 Intel 2.5D and 3D IC Packaging Introduction
11.6.4 Intel Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.6.5 Intel Recent Development
11.7 Micron Technology
11.7.1 Micron Technology Company Details
11.7.2 Micron Technology Business Overview
11.7.3 Micron Technology 2.5D and 3D IC Packaging Introduction
11.7.4 Micron Technology Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.7.5 Micron Technology Recent Development
11.8 TSMC
11.8.1 TSMC Company Details
11.8.2 TSMC Business Overview
11.8.3 TSMC 2.5D and 3D IC Packaging Introduction
11.8.4 TSMC Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.8.5 TSMC Recent Development
11.9 SK Hynix
11.9.1 SK Hynix Company Details
11.9.2 SK Hynix Business Overview
11.9.3 SK Hynix 2.5D and 3D IC Packaging Introduction
11.9.4 SK Hynix Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.9.5 SK Hynix Recent Development
11.10 Amkor Technology
11.10.1 Amkor Technology Company Details
11.10.2 Amkor Technology Business Overview
11.10.3 Amkor Technology 2.5D and 3D IC Packaging Introduction
11.10.4 Amkor Technology Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.10.5 Amkor Technology Recent Development
11.11 GlobalFoundries
11.11.1 GlobalFoundries Company Details
11.11.2 GlobalFoundries Business Overview
11.11.3 GlobalFoundries 2.5D and 3D IC Packaging Introduction
11.11.4 GlobalFoundries Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.11.5 GlobalFoundries Recent Development
11.12 SanDisk (Western Digital)
11.12.1 SanDisk (Western Digital) Company Details
11.12.2 SanDisk (Western Digital) Business Overview
11.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Introduction
11.12.4 SanDisk (Western Digital) Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.12.5 SanDisk (Western Digital) Recent Development
11.13 Synopsys
11.13.1 Synopsys Company Details
11.13.2 Synopsys Business Overview
11.13.3 Synopsys 2.5D and 3D IC Packaging Introduction
11.13.4 Synopsys Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.13.5 Synopsys Recent Development
11.14 Invensas
11.14.1 Invensas Company Details
11.14.2 Invensas Business Overview
11.14.3 Invensas 2.5D and 3D IC Packaging Introduction
11.14.4 Invensas Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.14.5 Invensas Recent Development
11.15 Siliconware Precision Industries
11.15.1 Siliconware Precision Industries Company Details
11.15.2 Siliconware Precision Industries Business Overview
11.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Introduction
11.15.4 Siliconware Precision Industries Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.15.5 Siliconware Precision Industries Recent Development
11.16 Jiangsu Changjiang Electronics
11.16.1 Jiangsu Changjiang Electronics Company Details
11.16.2 Jiangsu Changjiang Electronics Business Overview
11.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Introduction
11.16.4 Jiangsu Changjiang Electronics Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.16.5 Jiangsu Changjiang Electronics Recent Development
11.17 Powertech Technology
11.17.1 Powertech Technology Company Details
11.17.2 Powertech Technology Business Overview
11.17.3 Powertech Technology 2.5D and 3D IC Packaging Introduction
11.17.4 Powertech Technology Revenue in 2.5D and 3D IC Packaging Business (2020-2025)
11.17.5 Powertech Technology Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
FEATURED COMPANIES
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology
List of Tables
 Table 1. Global 2.5D and 3D IC Packaging Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031
 Table 2. Key Players of 2.5D
 Table 3. Key Players of 3D TSV
 Table 4. Key Players of 3D Wafer-level Chip-scale Packaging
 Table 5. Global 2.5D and 3D IC Packaging Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031
 Table 6. Global 2.5D and 3D IC Packaging Market Size by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 7. Global 2.5D and 3D IC Packaging Market Size by Region (2020-2025) & (US$ Million)
 Table 8. Global 2.5D and 3D IC Packaging Market Share by Region (2020-2025)
 Table 9. Global 2.5D and 3D IC Packaging Forecasted Market Size by Region (2026-2031) & (US$ Million)
 Table 10. Global 2.5D and 3D IC Packaging Market Share by Region (2026-2031)
 Table 11. 2.5D and 3D IC Packaging Market Trends
 Table 12. 2.5D and 3D IC Packaging Market Drivers
 Table 13. 2.5D and 3D IC Packaging Market Challenges
 Table 14. 2.5D and 3D IC Packaging Market Restraints
 Table 15. Global 2.5D and 3D IC Packaging Revenue by Players (2020-2025) & (US$ Million)
 Table 16. Global 2.5D and 3D IC Packaging Market Share by Players (2020-2025)
 Table 17. Global Top 2.5D and 3D IC Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 2.5D and 3D IC Packaging as of 2024)
 Table 18. Ranking of Global Top 2.5D and 3D IC Packaging Companies by Revenue (US$ Million) in 2024
 Table 19. Global 5 Largest Players Market Share by 2.5D and 3D IC Packaging Revenue (CR5 and HHI) & (2020-2025)
 Table 20. Global Key Players of 2.5D and 3D IC Packaging, Headquarters and Area Served
 Table 21. Global Key Players of 2.5D and 3D IC Packaging, Product and Application
 Table 22. Global Key Players of 2.5D and 3D IC Packaging, Date of Enter into This Industry
 Table 23. Mergers & Acquisitions, Expansion Plans
 Table 24. Global 2.5D and 3D IC Packaging Market Size by Type (2020-2025) & (US$ Million)
 Table 25. Global 2.5D and 3D IC Packaging Revenue Market Share by Type (2020-2025)
 Table 26. Global 2.5D and 3D IC Packaging Forecasted Market Size by Type (2026-2031) & (US$ Million)
 Table 27. Global 2.5D and 3D IC Packaging Revenue Market Share by Type (2026-2031)
 Table 28. Global 2.5D and 3D IC Packaging Market Size by Application (2020-2025) & (US$ Million)
 Table 29. Global 2.5D and 3D IC Packaging Revenue Market Share by Application (2020-2025)
 Table 30. Global 2.5D and 3D IC Packaging Forecasted Market Size by Application (2026-2031) & (US$ Million)
 Table 31. Global 2.5D and 3D IC Packaging Revenue Market Share by Application (2026-2031)
 Table 32. North America 2.5D and 3D IC Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 33. North America 2.5D and 3D IC Packaging Market Size by Country (2020-2025) & (US$ Million)
 Table 34. North America 2.5D and 3D IC Packaging Market Size by Country (2026-2031) & (US$ Million)
 Table 35. Europe 2.5D and 3D IC Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 36. Europe 2.5D and 3D IC Packaging Market Size by Country (2020-2025) & (US$ Million)
 Table 37. Europe 2.5D and 3D IC Packaging Market Size by Country (2026-2031) & (US$ Million)
 Table 38. Asia-Pacific 2.5D and 3D IC Packaging Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 39. Asia-Pacific 2.5D and 3D IC Packaging Market Size by Region (2020-2025) & (US$ Million)
 Table 40. Asia-Pacific 2.5D and 3D IC Packaging Market Size by Region (2026-2031) & (US$ Million)
 Table 41. Latin America 2.5D and 3D IC Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 42. Latin America 2.5D and 3D IC Packaging Market Size by Country (2020-2025) & (US$ Million)
 Table 43. Latin America 2.5D and 3D IC Packaging Market Size by Country (2026-2031) & (US$ Million)
 Table 44. Middle East & Africa 2.5D and 3D IC Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 45. Middle East & Africa 2.5D and 3D IC Packaging Market Size by Country (2020-2025) & (US$ Million)
 Table 46. Middle East & Africa 2.5D and 3D IC Packaging Market Size by Country (2026-2031) & (US$ Million)
 Table 47. ASE Technology Company Details
 Table 48. ASE Technology Business Overview
 Table 49. ASE Technology 2.5D and 3D IC Packaging Product
 Table 50. ASE Technology Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 51. ASE Technology Recent Development
 Table 52. Samsung Electronics Company Details
 Table 53. Samsung Electronics Business Overview
 Table 54. Samsung Electronics 2.5D and 3D IC Packaging Product
 Table 55. Samsung Electronics Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 56. Samsung Electronics Recent Development
 Table 57. Toshiba Company Details
 Table 58. Toshiba Business Overview
 Table 59. Toshiba 2.5D and 3D IC Packaging Product
 Table 60. Toshiba Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 61. Toshiba Recent Development
 Table 62. STMicroelectronics Company Details
 Table 63. STMicroelectronics Business Overview
 Table 64. STMicroelectronics 2.5D and 3D IC Packaging Product
 Table 65. STMicroelectronics Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 66. STMicroelectronics Recent Development
 Table 67. Xilinx Company Details
 Table 68. Xilinx Business Overview
 Table 69. Xilinx 2.5D and 3D IC Packaging Product
 Table 70. Xilinx Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 71. Xilinx Recent Development
 Table 72. Intel Company Details
 Table 73. Intel Business Overview
 Table 74. Intel 2.5D and 3D IC Packaging Product
 Table 75. Intel Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 76. Intel Recent Development
 Table 77. Micron Technology Company Details
 Table 78. Micron Technology Business Overview
 Table 79. Micron Technology 2.5D and 3D IC Packaging Product
 Table 80. Micron Technology Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 81. Micron Technology Recent Development
 Table 82. TSMC Company Details
 Table 83. TSMC Business Overview
 Table 84. TSMC 2.5D and 3D IC Packaging Product
 Table 85. TSMC Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 86. TSMC Recent Development
 Table 87. SK Hynix Company Details
 Table 88. SK Hynix Business Overview
 Table 89. SK Hynix 2.5D and 3D IC Packaging Product
 Table 90. SK Hynix Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 91. SK Hynix Recent Development
 Table 92. Amkor Technology Company Details
 Table 93. Amkor Technology Business Overview
 Table 94. Amkor Technology 2.5D and 3D IC Packaging Product
 Table 95. Amkor Technology Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 96. Amkor Technology Recent Development
 Table 97. GlobalFoundries Company Details
 Table 98. GlobalFoundries Business Overview
 Table 99. GlobalFoundries 2.5D and 3D IC Packaging Product
 Table 100. GlobalFoundries Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 101. GlobalFoundries Recent Development
 Table 102. SanDisk (Western Digital) Company Details
 Table 103. SanDisk (Western Digital) Business Overview
 Table 104. SanDisk (Western Digital) 2.5D and 3D IC Packaging Product
 Table 105. SanDisk (Western Digital) Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 106. SanDisk (Western Digital) Recent Development
 Table 107. Synopsys Company Details
 Table 108. Synopsys Business Overview
 Table 109. Synopsys 2.5D and 3D IC Packaging Product
 Table 110. Synopsys Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 111. Synopsys Recent Development
 Table 112. Invensas Company Details
 Table 113. Invensas Business Overview
 Table 114. Invensas 2.5D and 3D IC Packaging Product
 Table 115. Invensas Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 116. Invensas Recent Development
 Table 117. Siliconware Precision Industries Company Details
 Table 118. Siliconware Precision Industries Business Overview
 Table 119. Siliconware Precision Industries 2.5D and 3D IC Packaging Product
 Table 120. Siliconware Precision Industries Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 121. Siliconware Precision Industries Recent Development
 Table 122. Jiangsu Changjiang Electronics Company Details
 Table 123. Jiangsu Changjiang Electronics Business Overview
 Table 124. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Product
 Table 125. Jiangsu Changjiang Electronics Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 126. Jiangsu Changjiang Electronics Recent Development
 Table 127. Powertech Technology Company Details
 Table 128. Powertech Technology Business Overview
 Table 129. Powertech Technology 2.5D and 3D IC Packaging Product
 Table 130. Powertech Technology Revenue in 2.5D and 3D IC Packaging Business (2020-2025) & (US$ Million)
 Table 131. Powertech Technology Recent Development
 Table 132. Research Programs/Design for This Report
 Table 133. Key Data Information from Secondary Sources
 Table 134. Key Data Information from Primary Sources
 Table 135. Authors List of This Report


List of Figures
 Figure 1. 2.5D and 3D IC Packaging Picture
 Figure 2. Global 2.5D and 3D IC Packaging Market Size Comparison by Type (2020-2031) & (US$ Million)
 Figure 3. Global 2.5D and 3D IC Packaging Market Share by Type: 2024 VS 2031
 Figure 4. 2.5D Features
 Figure 5. 3D TSV Features
 Figure 6. 3D Wafer-level Chip-scale Packaging Features
 Figure 7. Global 2.5D and 3D IC Packaging Market Size by Application (2020-2031) & (US$ Million)
 Figure 8. Global 2.5D and 3D IC Packaging Market Share by Application: 2024 VS 2031
 Figure 9. Consumer Electronics Case Studies
 Figure 10. Medical Devices Case Studies
 Figure 11. Communications and Telecom Case Studies
 Figure 12. Automotive Case Studies
 Figure 13. Other Case Studies
 Figure 14. 2.5D and 3D IC Packaging Report Years Considered
 Figure 15. Global 2.5D and 3D IC Packaging Market Size (US$ Million), Year-over-Year: 2020-2031
 Figure 16. Global 2.5D and 3D IC Packaging Market Size, (US$ Million), 2020 VS 2024 VS 2031
 Figure 17. Global 2.5D and 3D IC Packaging Market Share by Region: 2024 VS 2031
 Figure 18. Global 2.5D and 3D IC Packaging Market Share by Players in 2024
 Figure 19. Global Top 2.5D and 3D IC Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 2.5D and 3D IC Packaging as of 2024)
 Figure 20. The Top 10 and 5 Players Market Share by 2.5D and 3D IC Packaging Revenue in 2024
 Figure 21. North America 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 22. North America 2.5D and 3D IC Packaging Market Share by Country (2020-2031)
 Figure 23. United States 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 24. Canada 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 25. Europe 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 26. Europe 2.5D and 3D IC Packaging Market Share by Country (2020-2031)
 Figure 27. Germany 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 28. France 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 29. U.K. 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 30. Italy 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 31. Russia 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 32. Nordic Countries 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 33. Asia-Pacific 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 34. Asia-Pacific 2.5D and 3D IC Packaging Market Share by Region (2020-2031)
 Figure 35. China 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 36. Japan 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 37. South Korea 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 38. Southeast Asia 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 39. India 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 40. Australia 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 41. Latin America 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 42. Latin America 2.5D and 3D IC Packaging Market Share by Country (2020-2031)
 Figure 43. Mexico 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 44. Brazil 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 45. Middle East & Africa 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 46. Middle East & Africa 2.5D and 3D IC Packaging Market Share by Country (2020-2031)
 Figure 47. Turkey 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 48. Saudi Arabia 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 49. UAE 2.5D and 3D IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 50. ASE Technology Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 51. Samsung Electronics Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 52. Toshiba Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 53. STMicroelectronics Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 54. Xilinx Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 55. Intel Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 56. Micron Technology Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 57. TSMC Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 58. SK Hynix Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 59. Amkor Technology Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 60. GlobalFoundries Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 61. SanDisk (Western Digital) Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 62. Synopsys Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 63. Invensas Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 64. Siliconware Precision Industries Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 65. Jiangsu Changjiang Electronics Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 66. Powertech Technology Revenue Growth Rate in 2.5D and 3D IC Packaging Business (2020-2025)
 Figure 67. Bottom-up and Top-down Approaches for This Report
 Figure 68. Data Triangulation
 Figure 69. Key Executives Interviewed
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