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Global 3D-IC Packaging Market Research Report 2025

Published Date: January 2025

Report Code: QYRE-Auto-9U13613

Global 3D IC Packaging Market Research Report 2023

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Global 3D-IC Packaging Market Research Report 2025

Code: QYRE-Auto-9U13613

Report

January 2025

Pages:90

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Cadence

XMC

United MicroElectronics Corp

TSMC

STMicroelectronics

ASE Group

Amkor Technology

Intel Corporation

GlobalFoundries

Invensas

Toshiba Corporation

Micron Technology

Xilinx

SPIL

Synopsys

3D-IC Packaging Market Size

The global market for 3D-IC Packaging was valued at US$ 18470 million in the year 2024 and is projected to reach a revised size of US$ 29850 million by 2031, growing at a CAGR of 7.2% during the forecast period.

3D-IC Packaging Market

3D-IC (Three-Dimensional Integrated Circuit) packaging is an advanced packaging technology used in the semiconductor industry to vertically stack multiple integrated circuit (IC) dies or chips. It involves stacking and interconnecting multiple IC chips within a single package, allowing for increased integration, improved performance, and reduced form factor of electronic devices.

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

This report aims to provide a comprehensive presentation of the global market for 3D-IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D-IC Packaging.

The 3D-IC Packaging market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global 3D-IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the 3D-IC Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of 3D-IC Packaging Market Report

Report Metric	Details
Report Name	3D-IC Packaging Market
Accounted market size in year	US$ 18470 million
Forecasted market size in 2031	US$ 29850 million
CAGR	7.2%
Base Year	year
Forecasted years	2025 - 2031
Segment by Type	TSV TGV Silicon Interposer
Segment by Application	Consumer Electronics Medical Devices Automotive Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Synopsys, Cadence, XMC, United Microelectronics Corp, TSMC, SPIL, STMicroelectronics, ASE Group, Amkor Technology, Intel Corporation, GlobalFoundries, Invensas, Toshiba Corporation, Micron Technology, Xilinx
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D-IC Packaging company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is 3D-IC Packaging Market growing?

Ans: The 3D-IC Packaging Market witnessing a CAGR of 7.2% during the forecast period 2025-2031.

What is the 3D-IC Packaging Market size in 2031?

Ans: The 3D-IC Packaging Market size in 2031 will be US$ 29850 million.

Who are the main players in the 3D-IC Packaging Market report?

Ans: The main players in the 3D-IC Packaging Market are Synopsys, Cadence, XMC, United Microelectronics Corp, TSMC, SPIL, STMicroelectronics, ASE Group, Amkor Technology, Intel Corporation, GlobalFoundries, Invensas, Toshiba Corporation, Micron Technology, Xilinx

What are the Application segmentation covered in the 3D-IC Packaging Market report?

Ans: The Applications covered in the 3D-IC Packaging Market report are Consumer Electronics, Medical Devices, Automotive, Others

What are the Type segmentation covered in the 3D-IC Packaging Market report?

Ans: The Types covered in the 3D-IC Packaging Market report are TSV, TGV, Silicon Interposer

Recommended Reports

Semiconductor Packaging

3D Chips & ICs

Advanced IC Materials

Market trends :

Topic	Trends
Global	the 3d-ic packaging market is experiencing robust growth driven by rising demand for compact, high-performance electronics and increased adoption in consumer, automotive, and medical device sectors.
Type	TSV - through-silicon via (tsv) technology is gaining traction due to its ability to enable higher integration density and improved device performance in advanced packaging applications. TGV - through-glass via (tgv) is emerging as a promising solution for high-frequency and rf applications, supporting miniaturization and enhanced signal integrity. Silicon Interposer - silicon interposer technology is increasingly adopted for heterogeneous integration, enabling efficient connectivity between multiple dies in high-end consumer and automotive electronics.
Application	Consumer Electronics - demand for 3d-ic packaging in consumer electronics is surging due to the proliferation of iot devices and the need for smaller, more powerful gadgets. Medical Devices - medical device manufacturers are leveraging 3d-ic packaging to achieve miniaturization and enhanced functionality in next-generation diagnostic and monitoring equipment. Automotive - automotive applications are driving 3d-ic packaging adoption for advanced driver-assistance systems and in-vehicle infotainment, requiring high reliability and performance.
Region	North America - north america is witnessing steady growth in 3d-ic packaging adoption, fueled by innovation in consumer electronics and automotive sectors. EMEA - emea is seeing increased investment in semiconductor manufacturing and r&d, supporting the expansion of 3d-ic packaging technologies. APAC - apac remains the largest and fastest-growing market for 3d-ic packaging, driven by strong demand from electronics manufacturing hubs in china, japan, and south korea.

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global 3D-IC Packaging Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 TSV

1.2.3 TGV

1.2.4 Silicon Interposer

1.3 Market by Application

1.3.1 Global 3D-IC Packaging Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 Consumer Electronics

1.3.3 Medical Devices

1.3.4 Automotive

1.3.5 Others

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global 3D-IC Packaging Market Perspective (2020-2031)

2.2 Global 3D-IC Packaging Growth Trends by Region

2.2.1 Global 3D-IC Packaging Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 3D-IC Packaging Historic Market Size by Region (2020-2025)

2.2.3 3D-IC Packaging Forecasted Market Size by Region (2026-2031)

2.3 3D-IC Packaging Market Dynamics

2.3.1 3D-IC Packaging Industry Trends

2.3.2 3D-IC Packaging Market Drivers

2.3.3 3D-IC Packaging Market Challenges

2.3.4 3D-IC Packaging Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top 3D-IC Packaging Players by Revenue

3.1.1 Global Top 3D-IC Packaging Players by Revenue (2020-2025)

3.1.2 Global 3D-IC Packaging Revenue Market Share by Players (2020-2025)

3.2 Global 3D-IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by 3D-IC Packaging Revenue

3.4 Global 3D-IC Packaging Market Concentration Ratio

3.4.1 Global 3D-IC Packaging Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by 3D-IC Packaging Revenue in 2024

3.5 Global Key Players of 3D-IC Packaging Head office and Area Served

3.6 Global Key Players of 3D-IC Packaging, Product and Application

3.7 Global Key Players of 3D-IC Packaging, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 3D-IC Packaging Breakdown Data by Type

4.1 Global 3D-IC Packaging Historic Market Size by Type (2020-2025)

4.2 Global 3D-IC Packaging Forecasted Market Size by Type (2026-2031)

5 3D-IC Packaging Breakdown Data by Application

5.1 Global 3D-IC Packaging Historic Market Size by Application (2020-2025)

5.2 Global 3D-IC Packaging Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America 3D-IC Packaging Market Size (2020-2031)

6.2 North America 3D-IC Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America 3D-IC Packaging Market Size by Country (2020-2025)

6.4 North America 3D-IC Packaging Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe 3D-IC Packaging Market Size (2020-2031)

7.2 Europe 3D-IC Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe 3D-IC Packaging Market Size by Country (2020-2025)

7.4 Europe 3D-IC Packaging Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific 3D-IC Packaging Market Size (2020-2031)

8.2 Asia-Pacific 3D-IC Packaging Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific 3D-IC Packaging Market Size by Region (2020-2025)

8.4 Asia-Pacific 3D-IC Packaging Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America 3D-IC Packaging Market Size (2020-2031)

9.2 Latin America 3D-IC Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America 3D-IC Packaging Market Size by Country (2020-2025)

9.4 Latin America 3D-IC Packaging Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa 3D-IC Packaging Market Size (2020-2031)

10.2 Middle East & Africa 3D-IC Packaging Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa 3D-IC Packaging Market Size by Country (2020-2025)

10.4 Middle East & Africa 3D-IC Packaging Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Synopsys

11.1.1 Synopsys Company Details

11.1.2 Synopsys Business Overview

11.1.3 Synopsys 3D-IC Packaging Introduction

11.1.4 Synopsys Revenue in 3D-IC Packaging Business (2020-2025)

11.1.5 Synopsys Recent Development

11.2 Cadence

11.2.1 Cadence Company Details

11.2.2 Cadence Business Overview

11.2.3 Cadence 3D-IC Packaging Introduction

11.2.4 Cadence Revenue in 3D-IC Packaging Business (2020-2025)

11.2.5 Cadence Recent Development

11.3 XMC

11.3.1 XMC Company Details

11.3.2 XMC Business Overview

11.3.3 XMC 3D-IC Packaging Introduction

11.3.4 XMC Revenue in 3D-IC Packaging Business (2020-2025)

11.3.5 XMC Recent Development

11.4 United Microelectronics Corp

11.4.1 United Microelectronics Corp Company Details

11.4.2 United Microelectronics Corp Business Overview

11.4.3 United Microelectronics Corp 3D-IC Packaging Introduction

11.4.4 United Microelectronics Corp Revenue in 3D-IC Packaging Business (2020-2025)

11.4.5 United Microelectronics Corp Recent Development

11.5 TSMC

11.5.1 TSMC Company Details

11.5.2 TSMC Business Overview

11.5.3 TSMC 3D-IC Packaging Introduction

11.5.4 TSMC Revenue in 3D-IC Packaging Business (2020-2025)

11.5.5 TSMC Recent Development

11.6 SPIL

11.6.1 SPIL Company Details

11.6.2 SPIL Business Overview

11.6.3 SPIL 3D-IC Packaging Introduction

11.6.4 SPIL Revenue in 3D-IC Packaging Business (2020-2025)

11.6.5 SPIL Recent Development

11.7 STMicroelectronics

11.7.1 STMicroelectronics Company Details

11.7.2 STMicroelectronics Business Overview

11.7.3 STMicroelectronics 3D-IC Packaging Introduction

11.7.4 STMicroelectronics Revenue in 3D-IC Packaging Business (2020-2025)

11.7.5 STMicroelectronics Recent Development

11.8 ASE Group

11.8.1 ASE Group Company Details

11.8.2 ASE Group Business Overview

11.8.3 ASE Group 3D-IC Packaging Introduction

11.8.4 ASE Group Revenue in 3D-IC Packaging Business (2020-2025)

11.8.5 ASE Group Recent Development

11.9 Amkor Technology

11.9.1 Amkor Technology Company Details

11.9.2 Amkor Technology Business Overview

11.9.3 Amkor Technology 3D-IC Packaging Introduction

11.9.4 Amkor Technology Revenue in 3D-IC Packaging Business (2020-2025)

11.9.5 Amkor Technology Recent Development

11.10 Intel Corporation

11.10.1 Intel Corporation Company Details

11.10.2 Intel Corporation Business Overview

11.10.3 Intel Corporation 3D-IC Packaging Introduction

11.10.4 Intel Corporation Revenue in 3D-IC Packaging Business (2020-2025)

11.10.5 Intel Corporation Recent Development

11.11 GlobalFoundries

11.11.1 GlobalFoundries Company Details

11.11.2 GlobalFoundries Business Overview

11.11.3 GlobalFoundries 3D-IC Packaging Introduction

11.11.4 GlobalFoundries Revenue in 3D-IC Packaging Business (2020-2025)

11.11.5 GlobalFoundries Recent Development

11.12 Invensas

11.12.1 Invensas Company Details

11.12.2 Invensas Business Overview

11.12.3 Invensas 3D-IC Packaging Introduction

11.12.4 Invensas Revenue in 3D-IC Packaging Business (2020-2025)

11.12.5 Invensas Recent Development

11.13 Toshiba Corporation

11.13.1 Toshiba Corporation Company Details

11.13.2 Toshiba Corporation Business Overview

11.13.3 Toshiba Corporation 3D-IC Packaging Introduction

11.13.4 Toshiba Corporation Revenue in 3D-IC Packaging Business (2020-2025)

11.13.5 Toshiba Corporation Recent Development

11.14 Micron Technology

11.14.1 Micron Technology Company Details

11.14.2 Micron Technology Business Overview

11.14.3 Micron Technology 3D-IC Packaging Introduction

11.14.4 Micron Technology Revenue in 3D-IC Packaging Business (2020-2025)

11.14.5 Micron Technology Recent Development

11.15 Xilinx

11.15.1 Xilinx Company Details

11.15.2 Xilinx Business Overview

11.15.3 Xilinx 3D-IC Packaging Introduction

11.15.4 Xilinx Revenue in 3D-IC Packaging Business (2020-2025)

11.15.5 Xilinx Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

Cadence

XMC

United MicroElectronics Corp

TSMC

STMicroelectronics

ASE Group

Amkor Technology

Intel Corporation

GlobalFoundries

Invensas

Toshiba Corporation

Micron Technology

Xilinx

SPIL

Synopsys

List of Tables

Table 1. Global 3D-IC Packaging Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of TSV

Table 3. Key Players of TGV

Table 4. Key Players of Silicon Interposer

Table 5. Global 3D-IC Packaging Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 6. Global 3D-IC Packaging Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 7. Global 3D-IC Packaging Market Size by Region (2020-2025) & (US$ Million)

Table 8. Global 3D-IC Packaging Market Share by Region (2020-2025)

Table 9. Global 3D-IC Packaging Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 10. Global 3D-IC Packaging Market Share by Region (2026-2031)

Table 11. 3D-IC Packaging Market Trends

Table 12. 3D-IC Packaging Market Drivers

Table 13. 3D-IC Packaging Market Challenges

Table 14. 3D-IC Packaging Market Restraints

Table 15. Global 3D-IC Packaging Revenue by Players (2020-2025) & (US$ Million)

Table 16. Global 3D-IC Packaging Market Share by Players (2020-2025)

Table 17. Global Top 3D-IC Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D-IC Packaging as of 2024)

Table 18. Ranking of Global Top 3D-IC Packaging Companies by Revenue (US$ Million) in 2024

Table 19. Global 5 Largest Players Market Share by 3D-IC Packaging Revenue (CR5 and HHI) & (2020-2025)

Table 20. Global Key Players of 3D-IC Packaging, Headquarters and Area Served

Table 21. Global Key Players of 3D-IC Packaging, Product and Application

Table 22. Global Key Players of 3D-IC Packaging, Date of Enter into This Industry

Table 23. Mergers & Acquisitions, Expansion Plans

Table 24. Global 3D-IC Packaging Market Size by Type (2020-2025) & (US$ Million)

Table 25. Global 3D-IC Packaging Revenue Market Share by Type (2020-2025)

Table 26. Global 3D-IC Packaging Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 27. Global 3D-IC Packaging Revenue Market Share by Type (2026-2031)

Table 28. Global 3D-IC Packaging Market Size by Application (2020-2025) & (US$ Million)

Table 29. Global 3D-IC Packaging Revenue Market Share by Application (2020-2025)

Table 30. Global 3D-IC Packaging Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 31. Global 3D-IC Packaging Revenue Market Share by Application (2026-2031)

Table 32. North America 3D-IC Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 33. North America 3D-IC Packaging Market Size by Country (2020-2025) & (US$ Million)

Table 34. North America 3D-IC Packaging Market Size by Country (2026-2031) & (US$ Million)

Table 35. Europe 3D-IC Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 36. Europe 3D-IC Packaging Market Size by Country (2020-2025) & (US$ Million)

Table 37. Europe 3D-IC Packaging Market Size by Country (2026-2031) & (US$ Million)

Table 38. Asia-Pacific 3D-IC Packaging Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 39. Asia-Pacific 3D-IC Packaging Market Size by Region (2020-2025) & (US$ Million)

Table 40. Asia-Pacific 3D-IC Packaging Market Size by Region (2026-2031) & (US$ Million)

Table 41. Latin America 3D-IC Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 42. Latin America 3D-IC Packaging Market Size by Country (2020-2025) & (US$ Million)

Table 43. Latin America 3D-IC Packaging Market Size by Country (2026-2031) & (US$ Million)

Table 44. Middle East & Africa 3D-IC Packaging Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 45. Middle East & Africa 3D-IC Packaging Market Size by Country (2020-2025) & (US$ Million)

Table 46. Middle East & Africa 3D-IC Packaging Market Size by Country (2026-2031) & (US$ Million)

Table 47. Synopsys Company Details

Table 48. Synopsys Business Overview

Table 49. Synopsys 3D-IC Packaging Product

Table 50. Synopsys Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 51. Synopsys Recent Development

Table 52. Cadence Company Details

Table 53. Cadence Business Overview

Table 54. Cadence 3D-IC Packaging Product

Table 55. Cadence Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 56. Cadence Recent Development

Table 57. XMC Company Details

Table 58. XMC Business Overview

Table 59. XMC 3D-IC Packaging Product

Table 60. XMC Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 61. XMC Recent Development

Table 62. United Microelectronics Corp Company Details

Table 63. United Microelectronics Corp Business Overview

Table 64. United Microelectronics Corp 3D-IC Packaging Product

Table 65. United Microelectronics Corp Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 66. United Microelectronics Corp Recent Development

Table 67. TSMC Company Details

Table 68. TSMC Business Overview

Table 69. TSMC 3D-IC Packaging Product

Table 70. TSMC Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 71. TSMC Recent Development

Table 72. SPIL Company Details

Table 73. SPIL Business Overview

Table 74. SPIL 3D-IC Packaging Product

Table 75. SPIL Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 76. SPIL Recent Development

Table 77. STMicroelectronics Company Details

Table 78. STMicroelectronics Business Overview

Table 79. STMicroelectronics 3D-IC Packaging Product

Table 80. STMicroelectronics Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 81. STMicroelectronics Recent Development

Table 82. ASE Group Company Details

Table 83. ASE Group Business Overview

Table 84. ASE Group 3D-IC Packaging Product

Table 85. ASE Group Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 86. ASE Group Recent Development

Table 87. Amkor Technology Company Details

Table 88. Amkor Technology Business Overview

Table 89. Amkor Technology 3D-IC Packaging Product

Table 90. Amkor Technology Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 91. Amkor Technology Recent Development

Table 92. Intel Corporation Company Details

Table 93. Intel Corporation Business Overview

Table 94. Intel Corporation 3D-IC Packaging Product

Table 95. Intel Corporation Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 96. Intel Corporation Recent Development

Table 97. GlobalFoundries Company Details

Table 98. GlobalFoundries Business Overview

Table 99. GlobalFoundries 3D-IC Packaging Product

Table 100. GlobalFoundries Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 101. GlobalFoundries Recent Development

Table 102. Invensas Company Details

Table 103. Invensas Business Overview

Table 104. Invensas 3D-IC Packaging Product

Table 105. Invensas Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 106. Invensas Recent Development

Table 107. Toshiba Corporation Company Details

Table 108. Toshiba Corporation Business Overview

Table 109. Toshiba Corporation 3D-IC Packaging Product

Table 110. Toshiba Corporation Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 111. Toshiba Corporation Recent Development

Table 112. Micron Technology Company Details

Table 113. Micron Technology Business Overview

Table 114. Micron Technology 3D-IC Packaging Product

Table 115. Micron Technology Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 116. Micron Technology Recent Development

Table 117. Xilinx Company Details

Table 118. Xilinx Business Overview

Table 119. Xilinx 3D-IC Packaging Product

Table 120. Xilinx Revenue in 3D-IC Packaging Business (2020-2025) & (US$ Million)

Table 121. Xilinx Recent Development

Table 122. Research Programs/Design for This Report

Table 123. Key Data Information from Secondary Sources

Table 124. Key Data Information from Primary Sources

Table 125. Authors List of This Report

List of Figures

Figure 1. 3D-IC Packaging Picture

Figure 2. Global 3D-IC Packaging Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global 3D-IC Packaging Market Share by Type: 2024 VS 2031

Figure 4. TSV Features

Figure 5. TGV Features

Figure 6. Silicon Interposer Features

Figure 7. Global 3D-IC Packaging Market Size by Application (2020-2031) & (US$ Million)

Figure 8. Global 3D-IC Packaging Market Share by Application: 2024 VS 2031

Figure 9. Consumer Electronics Case Studies

Figure 10. Medical Devices Case Studies

Figure 11. Automotive Case Studies

Figure 12. Others Case Studies

Figure 13. 3D-IC Packaging Report Years Considered

Figure 14. Global 3D-IC Packaging Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 15. Global 3D-IC Packaging Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 16. Global 3D-IC Packaging Market Share by Region: 2024 VS 2031

Figure 17. Global 3D-IC Packaging Market Share by Players in 2024

Figure 18. Global Top 3D-IC Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D-IC Packaging as of 2024)

Figure 19. The Top 10 and 5 Players Market Share by 3D-IC Packaging Revenue in 2024

Figure 20. North America 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 21. North America 3D-IC Packaging Market Share by Country (2020-2031)

Figure 22. United States 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 23. Canada 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 24. Europe 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 25. Europe 3D-IC Packaging Market Share by Country (2020-2031)

Figure 26. Germany 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. France 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 28. U.K. 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. Italy 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. Russia 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Nordic Countries 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 32. Asia-Pacific 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 33. Asia-Pacific 3D-IC Packaging Market Share by Region (2020-2031)

Figure 34. China 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. Japan 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 36. South Korea 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. Southeast Asia 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. India 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Australia 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 40. Latin America 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 41. Latin America 3D-IC Packaging Market Share by Country (2020-2031)

Figure 42. Mexico 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Brazil 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 44. Middle East & Africa 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 45. Middle East & Africa 3D-IC Packaging Market Share by Country (2020-2031)

Figure 46. Turkey 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. Saudi Arabia 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 48. UAE 3D-IC Packaging Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 49. Synopsys Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 50. Cadence Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 51. XMC Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 52. United Microelectronics Corp Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 53. TSMC Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 54. SPIL Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 55. STMicroelectronics Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 56. ASE Group Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 57. Amkor Technology Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 58. Intel Corporation Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 59. GlobalFoundries Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 60. Invensas Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 61. Toshiba Corporation Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 62. Micron Technology Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 63. Xilinx Revenue Growth Rate in 3D-IC Packaging Business (2020-2025)

Figure 64. Bottom-up and Top-down Approaches for This Report

Figure 65. Data Triangulation

Figure 66. Key Executives Interviewed

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