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Global Molded Interconnect Substrate (MIS) Market Research Report 2024
Published Date: November 2024
|
Report Code: QYRE-Auto-10E16927
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Global Molded Interconnect Substrate MIS Market Research Report 2024
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Global Molded Interconnect Substrate (MIS) Market Research Report 2024

Code: QYRE-Auto-10E16927
Report
November 2024
Pages:88
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Molded Interconnect Substrate (MIS) Market Size

The global Molded Interconnect Substrate (MIS) market was valued at US$ 536 million in 2023 and is anticipated to reach US$ 1244 million by 2030, witnessing a CAGR of 12.8% during the forecast period 2024-2030.

Molded Interconnect Substrate (MIS) Market

Molded Interconnect Substrate (MIS) Market

Molded Interconnect Substrate Technology (MIS) is a novel substrate solution that is ideal for mobile industry. It encompasses a wide range of solutions for the complex needs of IC package for mobile applications. With its embedded copper trace technology, it enable a finer line and space that is needed for high I/O count with smaller form factor. It also provides a robust Flip Chip assembly process. Another important feature of MIS substrate is copper filled-via and filled-pad technologies, which is significantly important for high frequency requirements, and improve thermal dissipation.
MIS (Molded Interconnect Substrate) substrates, as a new packaging technology, have been gaining momentum in the market in recent years.
At present, there are many suppliers in the MIS substrate market, including ASE, Carsem, JCET, Unisem, etc. These companies are actively developing IC packaging technology based on MIS substrates and are competing fiercely in the market.
Market development trend
Technology continues to improve: With the further improvement of integrated circuit product performance and the demand for ultra-thin products, MIS substrate technology is also constantly improving. For example, by optimizing wiring design, increasing wiring density, and adopting more advanced electroplating copper pillar technology, MIS substrates have shown significant advantages in electrical, thermal performance and reliability.
Continuous expansion of application areas: In addition to traditional analog chips, power ICs and digital currency fields, MIS substrates have also been widely used in the packaging of RF and power management devices in electronic products such as mobile phones, industrial control, and IOT. In the future, as electronic products continue to develop in the direction of high performance, multi-function, and high-frequency transmission, the application areas of MIS substrates will be further expanded.
Accelerated domestic substitution: In the field of mid- and low-end packaging, traditional lead frame packaging is gradually replaced by IC substrates. As a type of IC substrate, MIS substrates are expected to play an important role in the process of domestic substitution with their superior performance and cost-effectiveness.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Substrate (MIS), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Substrate (MIS).
The Molded Interconnect Substrate (MIS) market size, estimations, and forecasts are provided in terms of output/shipments (K Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Molded Interconnect Substrate (MIS) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Molded Interconnect Substrate (MIS) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Molded Interconnect Substrate (MIS) Market Report

Report Metric Details
Report Name Molded Interconnect Substrate (MIS) Market
Accounted market size in 2023 US$ 536 million
Forecasted market size in 2030 US$ 1244 million
CAGR 12.8%
Base Year 2023
Forecasted years 2024 - 2030
by Type
  • Single Layer
  • Multilayer
by Application
  • Analog Chip
  • Power IC
  • Digital Currency
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
  • Taiwan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company ASM Advanced Packaging Materials, Unisem, Phoenix Pioneer Technology, ASE Material, Carsem, JCET Group, MISpak, Advanpack
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Molded Interconnect Substrate (MIS) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Molded Interconnect Substrate (MIS) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Molded Interconnect Substrate (MIS) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Molded Interconnect Substrate (MIS) Market growing?

Ans: The Molded Interconnect Substrate (MIS) Market witnessing a CAGR of 12.8% during the forecast period 2024-2030.

What is the Molded Interconnect Substrate (MIS) Market size in 2030?

Ans: The Molded Interconnect Substrate (MIS) Market size in 2030 will be US$ 1244 million.

Who are the main players in the Molded Interconnect Substrate (MIS) Market report?

Ans: The main players in the Molded Interconnect Substrate (MIS) Market are ASM Advanced Packaging Materials, Unisem, Phoenix Pioneer Technology, ASE Material, Carsem, JCET Group, MISpak, Advanpack

What are the Application segmentation covered in the Molded Interconnect Substrate (MIS) Market report?

Ans: The Applications covered in the Molded Interconnect Substrate (MIS) Market report are Analog Chip, Power IC, Digital Currency, Others

What are the Type segmentation covered in the Molded Interconnect Substrate (MIS) Market report?

Ans: The Types covered in the Molded Interconnect Substrate (MIS) Market report are Single Layer, Multilayer

1 Molded Interconnect Substrate (MIS) Market Overview
1.1 Product Definition
1.2 Molded Interconnect Substrate (MIS) by Type
1.2.1 Global Molded Interconnect Substrate (MIS) Market Value Growth Rate Analysis by Type: 2023 VS 2030
1.2.2 Single Layer
1.2.3 Multilayer
1.3 Molded Interconnect Substrate (MIS) by Application
1.3.1 Global Molded Interconnect Substrate (MIS) Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Analog Chip
1.3.3 Power IC
1.3.4 Digital Currency
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Molded Interconnect Substrate (MIS) Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Molded Interconnect Substrate (MIS) Production Estimates and Forecasts (2019-2030)
1.4.4 Global Molded Interconnect Substrate (MIS) Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Molded Interconnect Substrate (MIS) Production Market Share by Manufacturers (2019-2024)
2.2 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Molded Interconnect Substrate (MIS), Industry Ranking, 2022 VS 2023
2.4 Global Molded Interconnect Substrate (MIS) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Molded Interconnect Substrate (MIS) Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Manufacturing Sites & Headquarters
2.7 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Product Type & Application
2.8 Global Key Manufacturers of Molded Interconnect Substrate (MIS), Date of Enter into This Industry
2.9 Global Molded Interconnect Substrate (MIS) Market Competitive Situation and Trends
2.9.1 Global Molded Interconnect Substrate (MIS) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Molded Interconnect Substrate (MIS) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Molded Interconnect Substrate (MIS) Production by Region
3.1 Global Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Molded Interconnect Substrate (MIS) Production Value by Region (2019-2030)
3.2.1 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Molded Interconnect Substrate (MIS) by Region (2025-2030)
3.3 Global Molded Interconnect Substrate (MIS) Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Molded Interconnect Substrate (MIS) Production by Region (2019-2030)
3.4.1 Global Molded Interconnect Substrate (MIS) Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Molded Interconnect Substrate (MIS) by Region (2025-2030)
3.5 Global Molded Interconnect Substrate (MIS) Market Price Analysis by Region (2019-2024)
3.6 Global Molded Interconnect Substrate (MIS) Production and Value, Year-over-Year Growth
3.6.1 North America Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan Molded Interconnect Substrate (MIS) Production Value Estimates and Forecasts (2019-2030)
4 Molded Interconnect Substrate (MIS) Consumption by Region
4.1 Global Molded Interconnect Substrate (MIS) Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Molded Interconnect Substrate (MIS) Consumption by Region (2019-2030)
4.2.1 Global Molded Interconnect Substrate (MIS) Consumption by Region (2019-2030)
4.2.2 Global Molded Interconnect Substrate (MIS) Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Molded Interconnect Substrate (MIS) Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Molded Interconnect Substrate (MIS) Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Molded Interconnect Substrate (MIS) Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Molded Interconnect Substrate (MIS) Production by Type (2019-2030)
5.1.1 Global Molded Interconnect Substrate (MIS) Production by Type (2019-2024)
5.1.2 Global Molded Interconnect Substrate (MIS) Production by Type (2025-2030)
5.1.3 Global Molded Interconnect Substrate (MIS) Production Market Share by Type (2019-2030)
5.2 Global Molded Interconnect Substrate (MIS) Production Value by Type (2019-2030)
5.2.1 Global Molded Interconnect Substrate (MIS) Production Value by Type (2019-2024)
5.2.2 Global Molded Interconnect Substrate (MIS) Production Value by Type (2025-2030)
5.2.3 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Type (2019-2030)
5.3 Global Molded Interconnect Substrate (MIS) Price by Type (2019-2030)
6 Segment by Application
6.1 Global Molded Interconnect Substrate (MIS) Production by Application (2019-2030)
6.1.1 Global Molded Interconnect Substrate (MIS) Production by Application (2019-2024)
6.1.2 Global Molded Interconnect Substrate (MIS) Production by Application (2025-2030)
6.1.3 Global Molded Interconnect Substrate (MIS) Production Market Share by Application (2019-2030)
6.2 Global Molded Interconnect Substrate (MIS) Production Value by Application (2019-2030)
6.2.1 Global Molded Interconnect Substrate (MIS) Production Value by Application (2019-2024)
6.2.2 Global Molded Interconnect Substrate (MIS) Production Value by Application (2025-2030)
6.2.3 Global Molded Interconnect Substrate (MIS) Production Value Market Share by Application (2019-2030)
6.3 Global Molded Interconnect Substrate (MIS) Price by Application (2019-2030)
7 Key Companies Profiled
7.1 ASM Advanced Packaging Materials
7.1.1 ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Company Information
7.1.2 ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Product Portfolio
7.1.3 ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.1.4 ASM Advanced Packaging Materials Main Business and Markets Served
7.1.5 ASM Advanced Packaging Materials Recent Developments/Updates
7.2 Unisem
7.2.1 Unisem Molded Interconnect Substrate (MIS) Company Information
7.2.2 Unisem Molded Interconnect Substrate (MIS) Product Portfolio
7.2.3 Unisem Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Unisem Main Business and Markets Served
7.2.5 Unisem Recent Developments/Updates
7.3 Phoenix Pioneer Technology
7.3.1 Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Company Information
7.3.2 Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Product Portfolio
7.3.3 Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Phoenix Pioneer Technology Main Business and Markets Served
7.3.5 Phoenix Pioneer Technology Recent Developments/Updates
7.4 ASE Material
7.4.1 ASE Material Molded Interconnect Substrate (MIS) Company Information
7.4.2 ASE Material Molded Interconnect Substrate (MIS) Product Portfolio
7.4.3 ASE Material Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.4.4 ASE Material Main Business and Markets Served
7.4.5 ASE Material Recent Developments/Updates
7.5 Carsem
7.5.1 Carsem Molded Interconnect Substrate (MIS) Company Information
7.5.2 Carsem Molded Interconnect Substrate (MIS) Product Portfolio
7.5.3 Carsem Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Carsem Main Business and Markets Served
7.5.5 Carsem Recent Developments/Updates
7.6 JCET Group
7.6.1 JCET Group Molded Interconnect Substrate (MIS) Company Information
7.6.2 JCET Group Molded Interconnect Substrate (MIS) Product Portfolio
7.6.3 JCET Group Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.6.4 JCET Group Main Business and Markets Served
7.6.5 JCET Group Recent Developments/Updates
7.7 MISpak
7.7.1 MISpak Molded Interconnect Substrate (MIS) Company Information
7.7.2 MISpak Molded Interconnect Substrate (MIS) Product Portfolio
7.7.3 MISpak Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.7.4 MISpak Main Business and Markets Served
7.7.5 MISpak Recent Developments/Updates
7.8 Advanpack
7.8.1 Advanpack Molded Interconnect Substrate (MIS) Company Information
7.8.2 Advanpack Molded Interconnect Substrate (MIS) Product Portfolio
7.8.3 Advanpack Molded Interconnect Substrate (MIS) Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Advanpack Main Business and Markets Served
7.8.5 Advanpack Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Molded Interconnect Substrate (MIS) Industry Chain Analysis
8.2 Molded Interconnect Substrate (MIS) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Molded Interconnect Substrate (MIS) Production Mode & Process
8.4 Molded Interconnect Substrate (MIS) Sales and Marketing
8.4.1 Molded Interconnect Substrate (MIS) Sales Channels
8.4.2 Molded Interconnect Substrate (MIS) Distributors
8.5 Molded Interconnect Substrate (MIS) Customers
9 Molded Interconnect Substrate (MIS) Market Dynamics
9.1 Molded Interconnect Substrate (MIS) Industry Trends
9.2 Molded Interconnect Substrate (MIS) Market Drivers
9.3 Molded Interconnect Substrate (MIS) Market Challenges
9.4 Molded Interconnect Substrate (MIS) Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Molded Interconnect Substrate (MIS) Market Value by Type, (US$ Million) & (2023 VS 2030)
 Table 2. Global Molded Interconnect Substrate (MIS) Market Value by Application, (US$ Million) & (2023 VS 2030)
 Table 3. Global Molded Interconnect Substrate (MIS) Production by Manufacturers (2019-2024) & (K Pcs)
 Table 4. Global Molded Interconnect Substrate (MIS) Production Market Share by Manufacturers (2019-2024)
 Table 5. Global Molded Interconnect Substrate (MIS) Production Value by Manufacturers (2019-2024) & (US$ Million)
 Table 6. Global Molded Interconnect Substrate (MIS) Production Value Share by Manufacturers (2019-2024)
 Table 7. Global Key Players of Molded Interconnect Substrate (MIS), Industry Ranking, 2022 VS 2023
 Table 8. Global Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Molded Interconnect Substrate (MIS) as of 2023)
 Table 9. Global Market Molded Interconnect Substrate (MIS) Average Price by Manufacturers (US$/Pcs) & (2019-2024)
 Table 10. Global Key Manufacturers of Molded Interconnect Substrate (MIS), Manufacturing Sites & Headquarters
 Table 11. Global Key Manufacturers of Molded Interconnect Substrate (MIS), Product Type & Application
 Table 12. Global Key Manufacturers of Molded Interconnect Substrate (MIS), Date of Enter into This Industry
 Table 13. Global Molded Interconnect Substrate (MIS) Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 14. Mergers & Acquisitions, Expansion Plans
 Table 15. Global Molded Interconnect Substrate (MIS) Production Value Growth Rate by Region: 2019 VS 2023 VS 2030 (US$ Million)
 Table 16. Global Molded Interconnect Substrate (MIS) Production Value (US$ Million) by Region (2019-2024)
 Table 17. Global Molded Interconnect Substrate (MIS) Production Value Market Share by Region (2019-2024)
 Table 18. Global Molded Interconnect Substrate (MIS) Production Value (US$ Million) Forecast by Region (2025-2030)
 Table 19. Global Molded Interconnect Substrate (MIS) Production Value Market Share Forecast by Region (2025-2030)
 Table 20. Global Molded Interconnect Substrate (MIS) Production Comparison by Region: 2019 VS 2023 VS 2030 (K Pcs)
 Table 21. Global Molded Interconnect Substrate (MIS) Production (K Pcs) by Region (2019-2024)
 Table 22. Global Molded Interconnect Substrate (MIS) Production Market Share by Region (2019-2024)
 Table 23. Global Molded Interconnect Substrate (MIS) Production (K Pcs) Forecast by Region (2025-2030)
 Table 24. Global Molded Interconnect Substrate (MIS) Production Market Share Forecast by Region (2025-2030)
 Table 25. Global Molded Interconnect Substrate (MIS) Market Average Price (US$/Pcs) by Region (2019-2024)
 Table 26. Global Molded Interconnect Substrate (MIS) Market Average Price (US$/Pcs) by Region (2025-2030)
 Table 27. Global Molded Interconnect Substrate (MIS) Consumption Growth Rate by Region: 2019 VS 2023 VS 2030 (K Pcs)
 Table 28. Global Molded Interconnect Substrate (MIS) Consumption by Region (2019-2024) & (K Pcs)
 Table 29. Global Molded Interconnect Substrate (MIS) Consumption Market Share by Region (2019-2024)
 Table 30. Global Molded Interconnect Substrate (MIS) Forecasted Consumption by Region (2025-2030) & (K Pcs)
 Table 31. Global Molded Interconnect Substrate (MIS) Forecasted Consumption Market Share by Region (2019-2024)
 Table 32. North America Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Pcs)
 Table 33. North America Molded Interconnect Substrate (MIS) Consumption by Country (2019-2024) & (K Pcs)
 Table 34. North America Molded Interconnect Substrate (MIS) Consumption by Country (2025-2030) & (K Pcs)
 Table 35. Europe Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Pcs)
 Table 36. Europe Molded Interconnect Substrate (MIS) Consumption by Country (2019-2024) & (K Pcs)
 Table 37. Europe Molded Interconnect Substrate (MIS) Consumption by Country (2025-2030) & (K Pcs)
 Table 38. Asia Pacific Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Pcs)
 Table 39. Asia Pacific Molded Interconnect Substrate (MIS) Consumption by Region (2019-2024) & (K Pcs)
 Table 40. Asia Pacific Molded Interconnect Substrate (MIS) Consumption by Region (2025-2030) & (K Pcs)
 Table 41. Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption Growth Rate by Country: 2019 VS 2023 VS 2030 (K Pcs)
 Table 42. Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption by Country (2019-2024) & (K Pcs)
 Table 43. Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption by Country (2025-2030) & (K Pcs)
 Table 44. Global Molded Interconnect Substrate (MIS) Production (K Pcs) by Type (2019-2024)
 Table 45. Global Molded Interconnect Substrate (MIS) Production (K Pcs) by Type (2025-2030)
 Table 46. Global Molded Interconnect Substrate (MIS) Production Market Share by Type (2019-2024)
 Table 47. Global Molded Interconnect Substrate (MIS) Production Market Share by Type (2025-2030)
 Table 48. Global Molded Interconnect Substrate (MIS) Production Value (US$ Million) by Type (2019-2024)
 Table 49. Global Molded Interconnect Substrate (MIS) Production Value (US$ Million) by Type (2025-2030)
 Table 50. Global Molded Interconnect Substrate (MIS) Production Value Market Share by Type (2019-2024)
 Table 51. Global Molded Interconnect Substrate (MIS) Production Value Market Share by Type (2025-2030)
 Table 52. Global Molded Interconnect Substrate (MIS) Price (US$/Pcs) by Type (2019-2024)
 Table 53. Global Molded Interconnect Substrate (MIS) Price (US$/Pcs) by Type (2025-2030)
 Table 54. Global Molded Interconnect Substrate (MIS) Production (K Pcs) by Application (2019-2024)
 Table 55. Global Molded Interconnect Substrate (MIS) Production (K Pcs) by Application (2025-2030)
 Table 56. Global Molded Interconnect Substrate (MIS) Production Market Share by Application (2019-2024)
 Table 57. Global Molded Interconnect Substrate (MIS) Production Market Share by Application (2025-2030)
 Table 58. Global Molded Interconnect Substrate (MIS) Production Value (US$ Million) by Application (2019-2024)
 Table 59. Global Molded Interconnect Substrate (MIS) Production Value (US$ Million) by Application (2025-2030)
 Table 60. Global Molded Interconnect Substrate (MIS) Production Value Market Share by Application (2019-2024)
 Table 61. Global Molded Interconnect Substrate (MIS) Production Value Market Share by Application (2025-2030)
 Table 62. Global Molded Interconnect Substrate (MIS) Price (US$/Pcs) by Application (2019-2024)
 Table 63. Global Molded Interconnect Substrate (MIS) Price (US$/Pcs) by Application (2025-2030)
 Table 64. ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Company Information
 Table 65. ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Specification and Application
 Table 66. ASM Advanced Packaging Materials Molded Interconnect Substrate (MIS) Production (K Pcs), Value (US$ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 67. ASM Advanced Packaging Materials Main Business and Markets Served
 Table 68. ASM Advanced Packaging Materials Recent Developments/Updates
 Table 69. Unisem Molded Interconnect Substrate (MIS) Company Information
 Table 70. Unisem Molded Interconnect Substrate (MIS) Specification and Application
 Table 71. Unisem Molded Interconnect Substrate (MIS) Production (K Pcs), Value (US$ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 72. Unisem Main Business and Markets Served
 Table 73. Unisem Recent Developments/Updates
 Table 74. Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Company Information
 Table 75. Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Specification and Application
 Table 76. Phoenix Pioneer Technology Molded Interconnect Substrate (MIS) Production (K Pcs), Value (US$ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 77. Phoenix Pioneer Technology Main Business and Markets Served
 Table 78. Phoenix Pioneer Technology Recent Developments/Updates
 Table 79. ASE Material Molded Interconnect Substrate (MIS) Company Information
 Table 80. ASE Material Molded Interconnect Substrate (MIS) Specification and Application
 Table 81. ASE Material Molded Interconnect Substrate (MIS) Production (K Pcs), Value (US$ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 82. ASE Material Main Business and Markets Served
 Table 83. ASE Material Recent Developments/Updates
 Table 84. Carsem Molded Interconnect Substrate (MIS) Company Information
 Table 85. Carsem Molded Interconnect Substrate (MIS) Specification and Application
 Table 86. Carsem Molded Interconnect Substrate (MIS) Production (K Pcs), Value (US$ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 87. Carsem Main Business and Markets Served
 Table 88. Carsem Recent Developments/Updates
 Table 89. JCET Group Molded Interconnect Substrate (MIS) Company Information
 Table 90. JCET Group Molded Interconnect Substrate (MIS) Specification and Application
 Table 91. JCET Group Molded Interconnect Substrate (MIS) Production (K Pcs), Value (US$ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 92. JCET Group Main Business and Markets Served
 Table 93. JCET Group Recent Developments/Updates
 Table 94. MISpak Molded Interconnect Substrate (MIS) Company Information
 Table 95. MISpak Molded Interconnect Substrate (MIS) Specification and Application
 Table 96. MISpak Molded Interconnect Substrate (MIS) Production (K Pcs), Value (US$ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 97. MISpak Main Business and Markets Served
 Table 98. MISpak Recent Developments/Updates
 Table 99. Advanpack Molded Interconnect Substrate (MIS) Company Information
 Table 100. Advanpack Molded Interconnect Substrate (MIS) Specification and Application
 Table 101. Advanpack Molded Interconnect Substrate (MIS) Production (K Pcs), Value (US$ Million), Price (US$/Pcs) and Gross Margin (2019-2024)
 Table 102. Advanpack Main Business and Markets Served
 Table 103. Advanpack Recent Developments/Updates
 Table 104. Key Raw Materials Lists
 Table 105. Raw Materials Key Suppliers Lists
 Table 106. Molded Interconnect Substrate (MIS) Distributors List
 Table 107. Molded Interconnect Substrate (MIS) Customers List
 Table 108. Molded Interconnect Substrate (MIS) Market Trends
 Table 109. Molded Interconnect Substrate (MIS) Market Drivers
 Table 110. Molded Interconnect Substrate (MIS) Market Challenges
 Table 111. Molded Interconnect Substrate (MIS) Market Restraints
 Table 112. Research Programs/Design for This Report
 Table 113. Key Data Information from Secondary Sources
 Table 114. Key Data Information from Primary Sources
 Table 115. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Molded Interconnect Substrate (MIS)
 Figure 2. Global Molded Interconnect Substrate (MIS) Market Value by Type, (US$ Million) & (2023 VS 2030)
 Figure 3. Global Molded Interconnect Substrate (MIS) Market Share by Type: 2023 VS 2030
 Figure 4. Single Layer Product Picture
 Figure 5. Multilayer Product Picture
 Figure 6. Global Molded Interconnect Substrate (MIS) Market Value by Application, (US$ Million) & (2023 VS 2030)
 Figure 7. Global Molded Interconnect Substrate (MIS) Market Share by Application: 2023 VS 2030
 Figure 8. Analog Chip
 Figure 9. Power IC
 Figure 10. Digital Currency
 Figure 11. Others
 Figure 12. Global Molded Interconnect Substrate (MIS) Production Value (US$ Million), 2019 VS 2023 VS 2030
 Figure 13. Global Molded Interconnect Substrate (MIS) Production Value (US$ Million) & (2019-2030)
 Figure 14. Global Molded Interconnect Substrate (MIS) Production Capacity (K Pcs) & (2019-2030)
 Figure 15. Global Molded Interconnect Substrate (MIS) Production (K Pcs) & (2019-2030)
 Figure 16. Global Molded Interconnect Substrate (MIS) Average Price (US$/Pcs) & (2019-2030)
 Figure 17. Molded Interconnect Substrate (MIS) Report Years Considered
 Figure 18. Molded Interconnect Substrate (MIS) Production Share by Manufacturers in 2023
 Figure 19. Global Molded Interconnect Substrate (MIS) Production Value Share by Manufacturers (2023)
 Figure 20. Molded Interconnect Substrate (MIS) Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
 Figure 21. The Global 5 and 10 Largest Players: Market Share by Molded Interconnect Substrate (MIS) Revenue in 2023
 Figure 22. Global Molded Interconnect Substrate (MIS) Production Value Comparison by Region: 2019 VS 2023 VS 2030 (US$ Million)
 Figure 23. Global Molded Interconnect Substrate (MIS) Production Value Market Share by Region: 2019 VS 2023 VS 2030
 Figure 24. Global Molded Interconnect Substrate (MIS) Production Comparison by Region: 2019 VS 2023 VS 2030 (K Pcs)
 Figure 25. Global Molded Interconnect Substrate (MIS) Production Market Share by Region: 2019 VS 2023 VS 2030
 Figure 26. North America Molded Interconnect Substrate (MIS) Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 27. Europe Molded Interconnect Substrate (MIS) Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 28. China Molded Interconnect Substrate (MIS) Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 29. Japan Molded Interconnect Substrate (MIS) Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 30. South Korea Molded Interconnect Substrate (MIS) Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 31. Taiwan Molded Interconnect Substrate (MIS) Production Value (US$ Million) Growth Rate (2019-2030)
 Figure 32. Global Molded Interconnect Substrate (MIS) Consumption by Region: 2019 VS 2023 VS 2030 (K Pcs)
 Figure 33. Global Molded Interconnect Substrate (MIS) Consumption Market Share by Region: 2019 VS 2023 VS 2030
 Figure 34. North America Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 35. North America Molded Interconnect Substrate (MIS) Consumption Market Share by Country (2019-2030)
 Figure 36. U.S. Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 37. Canada Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 38. Europe Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 39. Europe Molded Interconnect Substrate (MIS) Consumption Market Share by Country (2019-2030)
 Figure 40. Germany Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 41. France Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 42. U.K. Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 43. Italy Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 44. Netherlands Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 45. Asia Pacific Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 46. Asia Pacific Molded Interconnect Substrate (MIS) Consumption Market Share by Region (2025-2030)
 Figure 47. China Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 48. Japan Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 49. South Korea Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 50. China Taiwan Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 51. Southeast Asia Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 52. India Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 53. Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 54. Latin America, Middle East & Africa Molded Interconnect Substrate (MIS) Consumption Market Share by Country (2019-2030)
 Figure 55. Mexico Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 56. Brazil Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 57. Israel Molded Interconnect Substrate (MIS) Consumption and Growth Rate (2019-2030) & (K Pcs)
 Figure 58. Global Production Market Share of Molded Interconnect Substrate (MIS) by Type (2019-2030)
 Figure 59. Global Production Value Market Share of Molded Interconnect Substrate (MIS) by Type (2019-2030)
 Figure 60. Global Molded Interconnect Substrate (MIS) Price (US$/Pcs) by Type (2019-2030)
 Figure 61. Global Production Market Share of Molded Interconnect Substrate (MIS) by Application (2019-2030)
 Figure 62. Global Production Value Market Share of Molded Interconnect Substrate (MIS) by Application (2019-2030)
 Figure 63. Global Molded Interconnect Substrate (MIS) Price (US$/Pcs) by Application (2019-2030)
 Figure 64. Molded Interconnect Substrate (MIS) Value Chain
 Figure 65. Molded Interconnect Substrate (MIS) Production Process
 Figure 66. Channels of Distribution (Direct Vs Distribution)
 Figure 67. Bottom-up and Top-down Approaches for This Report
 Figure 68. Data Triangulation
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