The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

IC Packaging Substrate - Market

IC packaging substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.

The global market for IC Packaging Substrate was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.

Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report aims to provide a comprehensive presentation of the global market for IC Packaging Substrate, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of IC Packaging Substrate by region & country, by Type, and by Application.

The IC Packaging Substrate market size, estimations, and forecasts are provided in terms of sales volume (K Sqm) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Substrate.

Market Segmentation

Scope of IC Packaging Substrate - Market Report

Report Metric	Details
Report Name	IC Packaging Substrate - Market
Accounted market size in year	US$ 579 billion
Forecasted market size in 2029	US$ 790 billion
CAGR	6%
Base Year	year
Forecasted years	2024 - 2029
Segment by Type:	WB CSP FC BGA FC CSP PBGA SiP BOC Other
Segment by Application	Smart Phones PC (Tablet, Laptop) Wearable Devices Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera, LG Innotek, AT&S, ASE, Daeduck, Shennan Circuit, Zhen Ding Technology, KCC (Korea Circuit Company), ACCESS, Shenzhen Fastprint Circuit Tech, AKM Meadville, Toppan Printing
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of IC Packaging Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of IC Packaging Substrate in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of IC Packaging Substrate in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

FAQ for this report

How fast is IC Packaging Substrate - Market growing?

Ans: The IC Packaging Substrate - Market witnessing a CAGR of 6% during the forecast period 2024-2029.

What is the IC Packaging Substrate - Market size in 2029?

Ans: The IC Packaging Substrate - Market size in 2029 will be US$ 790 billion.

Who are the main players in the IC Packaging Substrate - Market report?

Ans: The main players in the IC Packaging Substrate - Market are Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera, LG Innotek, AT&S, ASE, Daeduck, Shennan Circuit, Zhen Ding Technology, KCC (Korea Circuit Company), ACCESS, Shenzhen Fastprint Circuit Tech, AKM Meadville, Toppan Printing

What are the Application segmentation covered in the IC Packaging Substrate - Market report?

Ans: The Applications covered in the IC Packaging Substrate - Market report are Smart Phones, PC (Tablet, Laptop), Wearable Devices, Others

What are the Type segmentation covered in the IC Packaging Substrate - Market report?

Ans: The Types covered in the IC Packaging Substrate - Market report are WB CSP, FC BGA, FC CSP, PBGA, SiP, BOC, Other

1 Market Overview

1.1 IC Packaging Substrate Product Introduction

1.2 Global IC Packaging Substrate Market Size Forecast

1.2.1 Global IC Packaging Substrate Sales Value (2019-2030)

1.2.2 Global IC Packaging Substrate Sales Volume (2019-2030)

1.2.3 Global IC Packaging Substrate Sales Price (2019-2030)

1.3 IC Packaging Substrate Market Trends & Drivers

1.3.1 IC Packaging Substrate Industry Trends

1.3.2 IC Packaging Substrate Market Drivers & Opportunity

1.3.3 IC Packaging Substrate Market Challenges

1.3.4 IC Packaging Substrate Market Restraints

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Competitive Analysis by Company

2.1 Global IC Packaging Substrate Players Revenue Ranking (2023)

2.2 Global IC Packaging Substrate Revenue by Company (2019-2024)

2.3 Global IC Packaging Substrate Players Sales Volume Ranking (2023)

2.4 Global IC Packaging Substrate Sales Volume by Company Players (2019-2024)

2.5 Global IC Packaging Substrate Average Price by Company (2019-2024)

2.6 Key Manufacturers IC Packaging Substrate Manufacturing Base Distribution and Headquarters

2.7 Key Manufacturers IC Packaging Substrate Product Offered

2.8 Key Manufacturers Time to Begin Mass Production of IC Packaging Substrate

2.9 IC Packaging Substrate Market Competitive Analysis

2.9.1 IC Packaging Substrate Market Concentration Rate (2019-2024)

2.9.2 Global 5 and 10 Largest Manufacturers by IC Packaging Substrate Revenue in 2023

2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Packaging Substrate as of 2023)

2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

3.1 Introduction by Type

3.1.1 WB CSP

3.1.2 FC BGA

3.1.3 FC CSP

3.1.4 PBGA

3.1.5 SiP

3.1.6 BOC

3.1.7 Other

3.2 Global IC Packaging Substrate Sales Value by Type

3.2.1 Global IC Packaging Substrate Sales Value by Type (2019 VS 2023 VS 2030)

3.2.2 Global IC Packaging Substrate Sales Value, by Type (2019-2030)

3.2.3 Global IC Packaging Substrate Sales Value, by Type (%) (2019-2030)

3.3 Global IC Packaging Substrate Sales Volume by Type

3.3.1 Global IC Packaging Substrate Sales Volume by Type (2019 VS 2023 VS 2030)

3.3.2 Global IC Packaging Substrate Sales Volume, by Type (2019-2030)

3.3.3 Global IC Packaging Substrate Sales Volume, by Type (%) (2019-2030)

3.4 Global IC Packaging Substrate Average Price by Type (2019-2030)

4 Segmentation by Application

4.1 Introduction by Application

4.1.1 Smart Phones

4.1.2 PC (Tablet, Laptop)

4.1.3 Wearable Devices

4.1.4 Others

4.2 Global IC Packaging Substrate Sales Value by Application

4.2.1 Global IC Packaging Substrate Sales Value by Application (2019 VS 2023 VS 2030)

4.2.2 Global IC Packaging Substrate Sales Value, by Application (2019-2030)

4.2.3 Global IC Packaging Substrate Sales Value, by Application (%) (2019-2030)

4.3 Global IC Packaging Substrate Sales Volume by Application

4.3.1 Global IC Packaging Substrate Sales Volume by Application (2019 VS 2023 VS 2030)

4.3.2 Global IC Packaging Substrate Sales Volume, by Application (2019-2030)

4.3.3 Global IC Packaging Substrate Sales Volume, by Application (%) (2019-2030)

4.4 Global IC Packaging Substrate Average Price by Application (2019-2030)

5 Segmentation by Region

5.1 Global IC Packaging Substrate Sales Value by Region

5.1.1 Global IC Packaging Substrate Sales Value by Region: 2019 VS 2023 VS 2030

5.1.2 Global IC Packaging Substrate Sales Value by Region (2019-2024)

5.1.3 Global IC Packaging Substrate Sales Value by Region (2025-2030)

5.1.4 Global IC Packaging Substrate Sales Value by Region (%), (2019-2030)

5.2 Global IC Packaging Substrate Sales Volume by Region

5.2.1 Global IC Packaging Substrate Sales Volume by Region: 2019 VS 2023 VS 2030

5.2.2 Global IC Packaging Substrate Sales Volume by Region (2019-2024)

5.2.3 Global IC Packaging Substrate Sales Volume by Region (2025-2030)

5.2.4 Global IC Packaging Substrate Sales Volume by Region (%), (2019-2030)

5.3 Global IC Packaging Substrate Average Price by Region (2019-2030)

5.4 North America

5.4.1 North America IC Packaging Substrate Sales Value, 2019-2030

5.4.2 North America IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

5.5 Europe

5.5.1 Europe IC Packaging Substrate Sales Value, 2019-2030

5.5.2 Europe IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

5.6 Asia Pacific

5.6.1 Asia Pacific IC Packaging Substrate Sales Value, 2019-2030

5.6.2 Asia Pacific IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

5.7 South America

5.7.1 South America IC Packaging Substrate Sales Value, 2019-2030

5.7.2 South America IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

5.8 Middle East & Africa

5.8.1 Middle East & Africa IC Packaging Substrate Sales Value, 2019-2030

5.8.2 Middle East & Africa IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

6 Segmentation by Key Countries/Regions

6.1 Key Countries/Regions IC Packaging Substrate Sales Value Growth Trends, 2019 VS 2023 VS 2030

6.2 Key Countries/Regions IC Packaging Substrate Sales Value

6.2.1 Key Countries/Regions IC Packaging Substrate Sales Value, 2019-2030

6.2.2 Key Countries/Regions IC Packaging Substrate Sales Volume, 2019-2030

6.3 United States

6.3.1 United States IC Packaging Substrate Sales Value, 2019-2030

6.3.2 United States IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

6.3.3 United States IC Packaging Substrate Sales Value by Application, 2023 VS 2030

6.4 Europe

6.4.1 Europe IC Packaging Substrate Sales Value, 2019-2030

6.4.2 Europe IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

6.4.3 Europe IC Packaging Substrate Sales Value by Application, 2023 VS 2030

6.5 China

6.5.1 China IC Packaging Substrate Sales Value, 2019-2030

6.5.2 China IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

6.5.3 China IC Packaging Substrate Sales Value by Application, 2023 VS 2030

6.6 Japan

6.6.1 Japan IC Packaging Substrate Sales Value, 2019-2030

6.6.2 Japan IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

6.6.3 Japan IC Packaging Substrate Sales Value by Application, 2023 VS 2030

6.7 South Korea

6.7.1 South Korea IC Packaging Substrate Sales Value, 2019-2030

6.7.2 South Korea IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

6.7.3 South Korea IC Packaging Substrate Sales Value by Application, 2023 VS 2030

6.8 Southeast Asia

6.8.1 Southeast Asia IC Packaging Substrate Sales Value, 2019-2030

6.8.2 Southeast Asia IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

6.8.3 Southeast Asia IC Packaging Substrate Sales Value by Application, 2023 VS 2030

6.9 India

6.9.1 India IC Packaging Substrate Sales Value, 2019-2030

6.9.2 India IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

6.9.3 India IC Packaging Substrate Sales Value by Application, 2023 VS 2030

7 Company Profiles

7.1 Ibiden

7.1.1 Ibiden Company Information

7.1.2 Ibiden Introduction and Business Overview

7.1.3 Ibiden IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.1.4 Ibiden IC Packaging Substrate Product Offerings

7.1.5 Ibiden Recent Development

7.2 Kinsus Interconnect Technology

7.2.1 Kinsus Interconnect Technology Company Information

7.2.2 Kinsus Interconnect Technology Introduction and Business Overview

7.2.3 Kinsus Interconnect Technology IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.2.4 Kinsus Interconnect Technology IC Packaging Substrate Product Offerings

7.2.5 Kinsus Interconnect Technology Recent Development

7.3 Unimicron

7.3.1 Unimicron Company Information

7.3.2 Unimicron Introduction and Business Overview

7.3.3 Unimicron IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.3.4 Unimicron IC Packaging Substrate Product Offerings

7.3.5 Unimicron Recent Development

7.4 Shinko Electric Industries

7.4.1 Shinko Electric Industries Company Information

7.4.2 Shinko Electric Industries Introduction and Business Overview

7.4.3 Shinko Electric Industries IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.4.4 Shinko Electric Industries IC Packaging Substrate Product Offerings

7.4.5 Shinko Electric Industries Recent Development

7.5 Semco

7.5.1 Semco Company Information

7.5.2 Semco Introduction and Business Overview

7.5.3 Semco IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.5.4 Semco IC Packaging Substrate Product Offerings

7.5.5 Semco Recent Development

7.6 Simmtech

7.6.1 Simmtech Company Information

7.6.2 Simmtech Introduction and Business Overview

7.6.3 Simmtech IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.6.4 Simmtech IC Packaging Substrate Product Offerings

7.6.5 Simmtech Recent Development

7.7 Nanya

7.7.1 Nanya Company Information

7.7.2 Nanya Introduction and Business Overview

7.7.3 Nanya IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.7.4 Nanya IC Packaging Substrate Product Offerings

7.7.5 Nanya Recent Development

7.8 Kyocera

7.8.1 Kyocera Company Information

7.8.2 Kyocera Introduction and Business Overview

7.8.3 Kyocera IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.8.4 Kyocera IC Packaging Substrate Product Offerings

7.8.5 Kyocera Recent Development

7.9 LG Innotek

7.9.1 LG Innotek Company Information

7.9.2 LG Innotek Introduction and Business Overview

7.9.3 LG Innotek IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.9.4 LG Innotek IC Packaging Substrate Product Offerings

7.9.5 LG Innotek Recent Development

7.10 AT&S

7.10.1 AT&S Company Information

7.10.2 AT&S Introduction and Business Overview

7.10.3 AT&S IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.10.4 AT&S IC Packaging Substrate Product Offerings

7.10.5 AT&S Recent Development

7.11 ASE

7.11.1 ASE Company Information

7.11.2 ASE Introduction and Business Overview

7.11.3 ASE IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.11.4 ASE IC Packaging Substrate Product Offerings

7.11.5 ASE Recent Development

7.12 Daeduck

7.12.1 Daeduck Company Information

7.12.2 Daeduck Introduction and Business Overview

7.12.3 Daeduck IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.12.4 Daeduck IC Packaging Substrate Product Offerings

7.12.5 Daeduck Recent Development

7.13 Shennan Circuit

7.13.1 Shennan Circuit Company Information

7.13.2 Shennan Circuit Introduction and Business Overview

7.13.3 Shennan Circuit IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.13.4 Shennan Circuit IC Packaging Substrate Product Offerings

7.13.5 Shennan Circuit Recent Development

7.14 Zhen Ding Technology

7.14.1 Zhen Ding Technology Company Information

7.14.2 Zhen Ding Technology Introduction and Business Overview

7.14.3 Zhen Ding Technology IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.14.4 Zhen Ding Technology IC Packaging Substrate Product Offerings

7.14.5 Zhen Ding Technology Recent Development

7.15 KCC (Korea Circuit Company)

7.15.1 KCC (Korea Circuit Company) Company Information

7.15.2 KCC (Korea Circuit Company) Introduction and Business Overview

7.15.3 KCC (Korea Circuit Company) IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.15.4 KCC (Korea Circuit Company) IC Packaging Substrate Product Offerings

7.15.5 KCC (Korea Circuit Company) Recent Development

7.16 ACCESS

7.16.1 ACCESS Company Information

7.16.2 ACCESS Introduction and Business Overview

7.16.3 ACCESS IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.16.4 ACCESS IC Packaging Substrate Product Offerings

7.16.5 ACCESS Recent Development

7.17 Shenzhen Fastprint Circuit Tech

7.17.1 Shenzhen Fastprint Circuit Tech Company Information

7.17.2 Shenzhen Fastprint Circuit Tech Introduction and Business Overview

7.17.3 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.17.4 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product Offerings

7.17.5 Shenzhen Fastprint Circuit Tech Recent Development

7.18 AKM Meadville

7.18.1 AKM Meadville Company Information

7.18.2 AKM Meadville Introduction and Business Overview

7.18.3 AKM Meadville IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.18.4 AKM Meadville IC Packaging Substrate Product Offerings

7.18.5 AKM Meadville Recent Development

7.19 Toppan Printing

7.19.1 Toppan Printing Company Information

7.19.2 Toppan Printing Introduction and Business Overview

7.19.3 Toppan Printing IC Packaging Substrate Sales, Revenue and Gross Margin (2019-2024)

7.19.4 Toppan Printing IC Packaging Substrate Product Offerings

7.19.5 Toppan Printing Recent Development

8 Industry Chain Analysis

8.1 IC Packaging Substrate Industrial Chain

8.2 IC Packaging Substrate Upstream Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.2.3 Manufacturing Cost Structure

8.3 Midstream Analysis

8.4 Downstream Analysis (Customers Analysis)

8.5 Sales Model and Sales Channels

8.5.1 IC Packaging Substrate Sales Model

8.5.2 Sales Channel

8.5.3 IC Packaging Substrate Distributors

9 Research Findings and Conclusion

10 Appendix

10.1 Research Methodology

10.1.1 Methodology/Research Approach

10.1.2 Data Source

10.2 Author Details

10.3 Disclaimer

FEATURED COMPANIES

IBIDEN

Kinsus Interconnect Technology

Unimicron

Shinko Electric Industries

KCC（Korea Circuit Company）

ACCESS

Shenzhen Fastprint Circuit Tech

AKM Meadville

Toppan Printing

List of Tables

Table 1. IC Packaging Substrate Market Trends

Table 2. IC Packaging Substrate Market Drivers & Opportunity

Table 3. IC Packaging Substrate Market Challenges

Table 4. IC Packaging Substrate Market Restraints

Table 5. Global IC Packaging Substrate Revenue by Company (2019-2024) & (US$ Million)

Table 6. Global IC Packaging Substrate Revenue Market Share by Company (2019-2024)

Table 7. Global IC Packaging Substrate Sales Volume by Company (2019-2024) & (K Sqm)

Table 8. Global IC Packaging Substrate Sales Volume Market Share by Company (2019-2024)

Table 9. Global Market IC Packaging Substrate Price by Company (2019-2024) & (US$/Sqm)

Table 10. Key Manufacturers IC Packaging Substrate Manufacturing Base Distribution and Headquarters

Table 11. Key Manufacturers IC Packaging Substrate Product Type

Table 12. Key Manufacturers Time to Begin Mass Production of IC Packaging Substrate

Table 13. Global IC Packaging Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 14. Global Top Manufacturers Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Packaging Substrate as of 2023)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global IC Packaging Substrate Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)

Table 17. Global IC Packaging Substrate Sales Value by Type (2019-2024) & (US$ Million)

Table 18. Global IC Packaging Substrate Sales Value by Type (2025-2030) & (US$ Million)

Table 19. Global IC Packaging Substrate Sales Market Share in Value by Type (2019-2024) & (%)

Table 20. Global IC Packaging Substrate Sales Market Share in Value by Type (2025-2030) & (%)

Table 21. Global IC Packaging Substrate Sales Volume by Type: 2019 VS 2023 VS 2030 (K Sqm)

Table 22. Global IC Packaging Substrate Sales Volume by Type (2019-2024) & (K Sqm)

Table 23. Global IC Packaging Substrate Sales Volume by Type (2025-2030) & (K Sqm)

Table 24. Global IC Packaging Substrate Sales Market Share in Volume by Type (2019-2024) & (%)

Table 25. Global IC Packaging Substrate Sales Market Share in Volume by Type (2025-2030) & (%)

Table 26. Global IC Packaging Substrate Price by Type (2019-2024) & (US$/Sqm)

Table 27. Global IC Packaging Substrate Price by Type (2025-2030) & (US$/Sqm)

Table 28. Global IC Packaging Substrate Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)

Table 29. Global IC Packaging Substrate Sales Value by Application (2019-2024) & (US$ Million)

Table 30. Global IC Packaging Substrate Sales Value by Application (2025-2030) & (US$ Million)

Table 31. Global IC Packaging Substrate Sales Market Share in Value by Application (2019-2024) & (%)

Table 32. Global IC Packaging Substrate Sales Market Share in Value by Application (2025-2030) & (%)

Table 33. Global IC Packaging Substrate Sales Volume by Application: 2019 VS 2023 VS 2030 (K Sqm)

Table 34. Global IC Packaging Substrate Sales Volume by Application (2019-2024) & (K Sqm)

Table 35. Global IC Packaging Substrate Sales Volume by Application (2025-2030) & (K Sqm)

Table 36. Global IC Packaging Substrate Sales Market Share in Volume by Application (2019-2024) & (%)

Table 37. Global IC Packaging Substrate Sales Market Share in Volume by Application (2025-2030) & (%)

Table 38. Global IC Packaging Substrate Price by Application (2019-2024) & (US$/Sqm)

Table 39. Global IC Packaging Substrate Price by Application (2025-2030) & (US$/Sqm)

Table 40. Global IC Packaging Substrate Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)

Table 41. Global IC Packaging Substrate Sales Value by Region (2019-2024) & (US$ Million)

Table 42. Global IC Packaging Substrate Sales Value by Region (2025-2030) & (US$ Million)

Table 43. Global IC Packaging Substrate Sales Value by Region (2019-2024) & (%)

Table 44. Global IC Packaging Substrate Sales Value by Region (2025-2030) & (%)

Table 45. Global IC Packaging Substrate Sales Volume by Region (K Sqm): 2019 VS 2023 VS 2030

Table 46. Global IC Packaging Substrate Sales Volume by Region (2019-2024) & (K Sqm)

Table 47. Global IC Packaging Substrate Sales Volume by Region (2025-2030) & (K Sqm)

Table 48. Global IC Packaging Substrate Sales Volume by Region (2019-2024) & (%)

Table 49. Global IC Packaging Substrate Sales Volume by Region (2025-2030) & (%)

Table 50. Global IC Packaging Substrate Average Price by Region (2019-2024) & (US$/Sqm)

Table 51. Global IC Packaging Substrate Average Price by Region (2025-2030) & (US$/Sqm)

Table 52. Key Countries/Regions IC Packaging Substrate Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030

Table 53. Key Countries/Regions IC Packaging Substrate Sales Value, (2019-2024) & (US$ Million)

Table 54. Key Countries/Regions IC Packaging Substrate Sales Value, (2025-2030) & (US$ Million)

Table 55. Key Countries/Regions IC Packaging Substrate Sales Volume, (2019-2024) & (K Sqm)

Table 56. Key Countries/Regions IC Packaging Substrate Sales Volume, (2025-2030) & (K Sqm)

Table 57. Ibiden Company Information

Table 58. Ibiden Introduction and Business Overview

Table 59. Ibiden IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 60. Ibiden IC Packaging Substrate Product Offerings

Table 61. Ibiden Recent Development

Table 62. Kinsus Interconnect Technology Company Information

Table 63. Kinsus Interconnect Technology Introduction and Business Overview

Table 64. Kinsus Interconnect Technology IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 65. Kinsus Interconnect Technology IC Packaging Substrate Product Offerings

Table 66. Kinsus Interconnect Technology Recent Development

Table 67. Unimicron Company Information

Table 68. Unimicron Introduction and Business Overview

Table 69. Unimicron IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 70. Unimicron IC Packaging Substrate Product Offerings

Table 71. Unimicron Recent Development

Table 72. Shinko Electric Industries Company Information

Table 73. Shinko Electric Industries Introduction and Business Overview

Table 74. Shinko Electric Industries IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 75. Shinko Electric Industries IC Packaging Substrate Product Offerings

Table 76. Shinko Electric Industries Recent Development

Table 77. Semco Company Information

Table 78. Semco Introduction and Business Overview

Table 79. Semco IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 80. Semco IC Packaging Substrate Product Offerings

Table 81. Semco Recent Development

Table 82. Simmtech Company Information

Table 83. Simmtech Introduction and Business Overview

Table 84. Simmtech IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 85. Simmtech IC Packaging Substrate Product Offerings

Table 86. Simmtech Recent Development

Table 87. Nanya Company Information

Table 88. Nanya Introduction and Business Overview

Table 89. Nanya IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 90. Nanya IC Packaging Substrate Product Offerings

Table 91. Nanya Recent Development

Table 92. Kyocera Company Information

Table 93. Kyocera Introduction and Business Overview

Table 94. Kyocera IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 95. Kyocera IC Packaging Substrate Product Offerings

Table 96. Kyocera Recent Development

Table 97. LG Innotek Company Information

Table 98. LG Innotek Introduction and Business Overview

Table 99. LG Innotek IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 100. LG Innotek IC Packaging Substrate Product Offerings

Table 101. LG Innotek Recent Development

Table 102. AT&S Company Information

Table 103. AT&S Introduction and Business Overview

Table 104. AT&S IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 105. AT&S IC Packaging Substrate Product Offerings

Table 106. AT&S Recent Development

Table 107. ASE Company Information

Table 108. ASE Introduction and Business Overview

Table 109. ASE IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 110. ASE IC Packaging Substrate Product Offerings

Table 111. ASE Recent Development

Table 112. Daeduck Company Information

Table 113. Daeduck Introduction and Business Overview

Table 114. Daeduck IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 115. Daeduck IC Packaging Substrate Product Offerings

Table 116. Daeduck Recent Development

Table 117. Shennan Circuit Company Information

Table 118. Shennan Circuit Introduction and Business Overview

Table 119. Shennan Circuit IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 120. Shennan Circuit IC Packaging Substrate Product Offerings

Table 121. Shennan Circuit Recent Development

Table 122. Zhen Ding Technology Company Information

Table 123. Zhen Ding Technology Introduction and Business Overview

Table 124. Zhen Ding Technology IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 125. Zhen Ding Technology IC Packaging Substrate Product Offerings

Table 126. Zhen Ding Technology Recent Development

Table 127. KCC (Korea Circuit Company) Company Information

Table 128. KCC (Korea Circuit Company) Introduction and Business Overview

Table 129. KCC (Korea Circuit Company) IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 130. KCC (Korea Circuit Company) IC Packaging Substrate Product Offerings

Table 131. KCC (Korea Circuit Company) Recent Development

Table 132. ACCESS Company Information

Table 133. ACCESS Introduction and Business Overview

Table 134. ACCESS IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 135. ACCESS IC Packaging Substrate Product Offerings

Table 136. ACCESS Recent Development

Table 137. Shenzhen Fastprint Circuit Tech Company Information

Table 138. Shenzhen Fastprint Circuit Tech Introduction and Business Overview

Table 139. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 140. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product Offerings

Table 141. Shenzhen Fastprint Circuit Tech Recent Development

Table 142. AKM Meadville Company Information

Table 143. AKM Meadville Introduction and Business Overview

Table 144. AKM Meadville IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 145. AKM Meadville IC Packaging Substrate Product Offerings

Table 146. AKM Meadville Recent Development

Table 147. Toppan Printing Company Information

Table 148. Toppan Printing Introduction and Business Overview

Table 149. Toppan Printing IC Packaging Substrate Sales (K Sqm), Revenue (US$ Million), Price (US$/Sqm) and Gross Margin (2019-2024)

Table 150. Toppan Printing IC Packaging Substrate Product Offerings

Table 151. Toppan Printing Recent Development

Table 152. Key Raw Materials Lists

Table 153. Raw Materials Key Suppliers Lists

Table 154. IC Packaging Substrate Downstream Customers

Table 155. IC Packaging Substrate Distributors List

Table 156. Research Programs/Design for This Report

Table 157. Key Data Information from Secondary Sources

Table 158. Key Data Information from Primary Sources

List of Figures

Figure 1. IC Packaging Substrate Product Picture

Figure 2. Global IC Packaging Substrate Sales Value, 2019 VS 2023 VS 2030 (US$ Million)

Figure 3. Global IC Packaging Substrate Sales Value (2019-2030) & (US$ Million)

Figure 4. Global IC Packaging Substrate Sales Volume (2019-2030) & (K Sqm)

Figure 5. Global IC Packaging Substrate Sales Price (2019-2030) & (US$/Sqm)

Figure 6. IC Packaging Substrate Report Years Considered

Figure 7. Global IC Packaging Substrate Players Revenue Ranking (2023) & (US$ Million)

Figure 8. Global IC Packaging Substrate Players Sales Volume Ranking (2023) & (K Sqm)

Figure 9. The 5 and 10 Largest Manufacturers in the World: Market Share by IC Packaging Substrate Revenue in 2023

Figure 10. IC Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023

Figure 11. WB CSP Picture

Figure 12. FC BGA Picture

Figure 13. FC CSP Picture

Figure 14. PBGA Picture

Figure 15. SiP Picture

Figure 16. BOC Picture

Figure 17. Other Picture

Figure 18. Global IC Packaging Substrate Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)

Figure 19. Global IC Packaging Substrate Sales Value Market Share by Type, 2023 & 2030

Figure 20. Global IC Packaging Substrate Sales Volume by Type (2019 VS 2023 VS 2030) & (K Sqm)

Figure 21. Global IC Packaging Substrate Sales Volume Market Share by Type, 2023 & 2030

Figure 22. Global IC Packaging Substrate Price by Type (2019-2030) & (US$/Sqm)

Figure 23. Product Picture of Smart Phones

Figure 24. Product Picture of PC (Tablet, Laptop)

Figure 25. Product Picture of Wearable Devices

Figure 26. Product Picture of Others

Figure 27. Global IC Packaging Substrate Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)

Figure 28. Global IC Packaging Substrate Sales Value Market Share by Application, 2023 & 2030

Figure 29. Global IC Packaging Substrate Sales Volume by Application (2019 VS 2023 VS 2030) & (K Sqm)

Figure 30. Global IC Packaging Substrate Sales Volume Market Share by Application, 2023 & 2030

Figure 31. Global IC Packaging Substrate Price by Application (2019-2030) & (US$/Sqm)

Figure 32. North America IC Packaging Substrate Sales Value (2019-2030) & (US$ Million)

Figure 33. North America IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

Figure 34. Europe IC Packaging Substrate Sales Value (2019-2030) & (US$ Million)

Figure 35. Europe IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

Figure 36. Asia Pacific IC Packaging Substrate Sales Value (2019-2030) & (US$ Million)

Figure 37. Asia Pacific IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

Figure 38. South America IC Packaging Substrate Sales Value (2019-2030) & (US$ Million)

Figure 39. South America IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

Figure 40. Middle East & Africa IC Packaging Substrate Sales Value (2019-2030) & (US$ Million)

Figure 41. Middle East & Africa IC Packaging Substrate Sales Value by Country (%), 2023 VS 2030

Figure 42. Key Countries/Regions IC Packaging Substrate Sales Value (%), (2019-2030)

Figure 43. Key Countries/Regions IC Packaging Substrate Sales Volume (%), (2019-2030)

Figure 44. United States IC Packaging Substrate Sales Value, (2019-2030) & (US$ Million)

Figure 45. United States IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

Figure 46. United States IC Packaging Substrate Sales Value by Application (%), 2023 VS 2030

Figure 47. Europe IC Packaging Substrate Sales Value, (2019-2030) & (US$ Million)

Figure 48. Europe IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

Figure 49. Europe IC Packaging Substrate Sales Value by Application (%), 2023 VS 2030

Figure 50. China IC Packaging Substrate Sales Value, (2019-2030) & (US$ Million)

Figure 51. China IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

Figure 52. China IC Packaging Substrate Sales Value by Application (%), 2023 VS 2030

Figure 53. Japan IC Packaging Substrate Sales Value, (2019-2030) & (US$ Million)

Figure 54. Japan IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

Figure 55. Japan IC Packaging Substrate Sales Value by Application (%), 2023 VS 2030

Figure 56. South Korea IC Packaging Substrate Sales Value, (2019-2030) & (US$ Million)

Figure 57. South Korea IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

Figure 58. South Korea IC Packaging Substrate Sales Value by Application (%), 2023 VS 2030

Figure 59. Southeast Asia IC Packaging Substrate Sales Value, (2019-2030) & (US$ Million)

Figure 60. Southeast Asia IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

Figure 61. Southeast Asia IC Packaging Substrate Sales Value by Application (%), 2023 VS 2030

Figure 62. India IC Packaging Substrate Sales Value, (2019-2030) & (US$ Million)

Figure 63. India IC Packaging Substrate Sales Value by Type (%), 2023 VS 2030

Figure 64. India IC Packaging Substrate Sales Value by Application (%), 2023 VS 2030

Figure 65. IC Packaging Substrate Industrial Chain

Figure 66. IC Packaging Substrate Manufacturing Cost Structure

Figure 67. Channels of Distribution (Direct Sales, and Distribution)

Figure 68. Bottom-up and Top-down Approaches for This Report

Figure 69. Data Triangulation

Figure 70. Key Executives Interviewed

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IC Packaging Substrate - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Published Date: June 2024

Report Code: QYRE-Auto-32U9827

IC Packaging Substrate - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

FEATURED COMPANIES

IC Packaging Substrate - Market Size

IC Packaging Substrate - Market

Report Scope

Scope of IC Packaging Substrate - Market Report

Chapter Outline

FAQ for this report

How fast is IC Packaging Substrate - Market growing?

What is the IC Packaging Substrate - Market size in 2029?

Who are the main players in the IC Packaging Substrate - Market report?

What are the Application segmentation covered in the IC Packaging Substrate - Market report?

What are the Type segmentation covered in the IC Packaging Substrate - Market report?

FEATURED COMPANIES

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