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Global IC Packaging Substrate Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-32U9827
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Global IC Packaging Substrate Market Research Report 2022
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Global IC Packaging Substrate Market Research Report 2025

Code: QYRE-Auto-32U9827
Report
March 2025
Pages:109
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

IC Packaging Substrate Market Size

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

IC Packaging Substrate Market

IC Packaging Substrate Market

The global market for IC Packaging Substrate was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
IC packaging substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.
Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report aims to provide a comprehensive presentation of the global market for IC Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Substrate.
The IC Packaging Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global IC Packaging Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of IC Packaging Substrate Market Report

Report Metric Details
Report Name IC Packaging Substrate Market
Accounted market size in year US$ 579 billion
Forecasted market size in 2029 US$ 790 billion
CAGR 6%
Base Year year
Forecasted years 2025 - 2029
by Type
  • WB CSP
  • FC BGA
  • FC CSP
  • PBGA
  • SiP
  • BOC
  • Other
by Application
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera, LG Innotek, AT&S, ASE, Daeduck, Shennan Circuit, Zhen Ding Technology, KCC (Korea Circuit Company), ACCESS, Shenzhen Fastprint Circuit Tech, AKM Meadville, Toppan Printing
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of IC Packaging Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of IC Packaging Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of IC Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is IC Packaging Substrate Market growing?

Ans: The IC Packaging Substrate Market witnessing a CAGR of 6% during the forecast period 2025-2029.

What is the IC Packaging Substrate Market size in 2029?

Ans: The IC Packaging Substrate Market size in 2029 will be US$ 790 billion.

Who are the main players in the IC Packaging Substrate Market report?

Ans: The main players in the IC Packaging Substrate Market are Ibiden, Kinsus Interconnect Technology, Unimicron, Shinko Electric Industries, Semco, Simmtech, Nanya, Kyocera, LG Innotek, AT&S, ASE, Daeduck, Shennan Circuit, Zhen Ding Technology, KCC (Korea Circuit Company), ACCESS, Shenzhen Fastprint Circuit Tech, AKM Meadville, Toppan Printing

What are the Application segmentation covered in the IC Packaging Substrate Market report?

Ans: The Applications covered in the IC Packaging Substrate Market report are Smart Phones, PC (Tablet, Laptop), Wearable Devices, Others

What are the Type segmentation covered in the IC Packaging Substrate Market report?

Ans: The Types covered in the IC Packaging Substrate Market report are WB CSP, FC BGA, FC CSP, PBGA, SiP, BOC, Other

Recommended Reports

IC Packaging Markets

Substrate Technologies

Semiconductor Applications

1 IC Packaging Substrate Market Overview
1.1 Product Definition
1.2 IC Packaging Substrate by Type
1.2.1 Global IC Packaging Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 WB CSP
1.2.3 FC BGA
1.2.4 FC CSP
1.2.5 PBGA
1.2.6 SiP
1.2.7 BOC
1.2.8 Other
1.3 IC Packaging Substrate by Application
1.3.1 Global IC Packaging Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global IC Packaging Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global IC Packaging Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global IC Packaging Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global IC Packaging Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of IC Packaging Substrate, Industry Ranking, 2023 VS 2024
2.4 Global IC Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global IC Packaging Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of IC Packaging Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging Substrate, Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging Substrate, Date of Enter into This Industry
2.9 IC Packaging Substrate Market Competitive Situation and Trends
2.9.1 IC Packaging Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging Substrate Production by Region
3.1 Global IC Packaging Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global IC Packaging Substrate Production Value by Region (2020-2031)
3.2.1 Global IC Packaging Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of IC Packaging Substrate by Region (2026-2031)
3.3 Global IC Packaging Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global IC Packaging Substrate Production Volume by Region (2020-2031)
3.4.1 Global IC Packaging Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of IC Packaging Substrate by Region (2026-2031)
3.5 Global IC Packaging Substrate Market Price Analysis by Region (2020-2025)
3.6 Global IC Packaging Substrate Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea IC Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
4 IC Packaging Substrate Consumption by Region
4.1 Global IC Packaging Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global IC Packaging Substrate Consumption by Region (2020-2031)
4.2.1 Global IC Packaging Substrate Consumption by Region (2020-2025)
4.2.2 Global IC Packaging Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America IC Packaging Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe IC Packaging Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific IC Packaging Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa IC Packaging Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global IC Packaging Substrate Production by Type (2020-2031)
5.1.1 Global IC Packaging Substrate Production by Type (2020-2025)
5.1.2 Global IC Packaging Substrate Production by Type (2026-2031)
5.1.3 Global IC Packaging Substrate Production Market Share by Type (2020-2031)
5.2 Global IC Packaging Substrate Production Value by Type (2020-2031)
5.2.1 Global IC Packaging Substrate Production Value by Type (2020-2025)
5.2.2 Global IC Packaging Substrate Production Value by Type (2026-2031)
5.2.3 Global IC Packaging Substrate Production Value Market Share by Type (2020-2031)
5.3 Global IC Packaging Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global IC Packaging Substrate Production by Application (2020-2031)
6.1.1 Global IC Packaging Substrate Production by Application (2020-2025)
6.1.2 Global IC Packaging Substrate Production by Application (2026-2031)
6.1.3 Global IC Packaging Substrate Production Market Share by Application (2020-2031)
6.2 Global IC Packaging Substrate Production Value by Application (2020-2031)
6.2.1 Global IC Packaging Substrate Production Value by Application (2020-2025)
6.2.2 Global IC Packaging Substrate Production Value by Application (2026-2031)
6.2.3 Global IC Packaging Substrate Production Value Market Share by Application (2020-2031)
6.3 Global IC Packaging Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Ibiden
7.1.1 Ibiden IC Packaging Substrate Company Information
7.1.2 Ibiden IC Packaging Substrate Product Portfolio
7.1.3 Ibiden IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Ibiden Main Business and Markets Served
7.1.5 Ibiden Recent Developments/Updates
7.2 Kinsus Interconnect Technology
7.2.1 Kinsus Interconnect Technology IC Packaging Substrate Company Information
7.2.2 Kinsus Interconnect Technology IC Packaging Substrate Product Portfolio
7.2.3 Kinsus Interconnect Technology IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Kinsus Interconnect Technology Main Business and Markets Served
7.2.5 Kinsus Interconnect Technology Recent Developments/Updates
7.3 Unimicron
7.3.1 Unimicron IC Packaging Substrate Company Information
7.3.2 Unimicron IC Packaging Substrate Product Portfolio
7.3.3 Unimicron IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Unimicron Main Business and Markets Served
7.3.5 Unimicron Recent Developments/Updates
7.4 Shinko Electric Industries
7.4.1 Shinko Electric Industries IC Packaging Substrate Company Information
7.4.2 Shinko Electric Industries IC Packaging Substrate Product Portfolio
7.4.3 Shinko Electric Industries IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Shinko Electric Industries Main Business and Markets Served
7.4.5 Shinko Electric Industries Recent Developments/Updates
7.5 Semco
7.5.1 Semco IC Packaging Substrate Company Information
7.5.2 Semco IC Packaging Substrate Product Portfolio
7.5.3 Semco IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Semco Main Business and Markets Served
7.5.5 Semco Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech IC Packaging Substrate Company Information
7.6.2 Simmtech IC Packaging Substrate Product Portfolio
7.6.3 Simmtech IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Nanya
7.7.1 Nanya IC Packaging Substrate Company Information
7.7.2 Nanya IC Packaging Substrate Product Portfolio
7.7.3 Nanya IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Nanya Main Business and Markets Served
7.7.5 Nanya Recent Developments/Updates
7.8 Kyocera
7.8.1 Kyocera IC Packaging Substrate Company Information
7.8.2 Kyocera IC Packaging Substrate Product Portfolio
7.8.3 Kyocera IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Kyocera Main Business and Markets Served
7.8.5 Kyocera Recent Developments/Updates
7.9 LG Innotek
7.9.1 LG Innotek IC Packaging Substrate Company Information
7.9.2 LG Innotek IC Packaging Substrate Product Portfolio
7.9.3 LG Innotek IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 LG Innotek Main Business and Markets Served
7.9.5 LG Innotek Recent Developments/Updates
7.10 AT&S
7.10.1 AT&S IC Packaging Substrate Company Information
7.10.2 AT&S IC Packaging Substrate Product Portfolio
7.10.3 AT&S IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 AT&S Main Business and Markets Served
7.10.5 AT&S Recent Developments/Updates
7.11 ASE
7.11.1 ASE IC Packaging Substrate Company Information
7.11.2 ASE IC Packaging Substrate Product Portfolio
7.11.3 ASE IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 ASE Main Business and Markets Served
7.11.5 ASE Recent Developments/Updates
7.12 Daeduck
7.12.1 Daeduck IC Packaging Substrate Company Information
7.12.2 Daeduck IC Packaging Substrate Product Portfolio
7.12.3 Daeduck IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Daeduck Main Business and Markets Served
7.12.5 Daeduck Recent Developments/Updates
7.13 Shennan Circuit
7.13.1 Shennan Circuit IC Packaging Substrate Company Information
7.13.2 Shennan Circuit IC Packaging Substrate Product Portfolio
7.13.3 Shennan Circuit IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Shennan Circuit Main Business and Markets Served
7.13.5 Shennan Circuit Recent Developments/Updates
7.14 Zhen Ding Technology
7.14.1 Zhen Ding Technology IC Packaging Substrate Company Information
7.14.2 Zhen Ding Technology IC Packaging Substrate Product Portfolio
7.14.3 Zhen Ding Technology IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Zhen Ding Technology Main Business and Markets Served
7.14.5 Zhen Ding Technology Recent Developments/Updates
7.15 KCC (Korea Circuit Company)
7.15.1 KCC (Korea Circuit Company) IC Packaging Substrate Company Information
7.15.2 KCC (Korea Circuit Company) IC Packaging Substrate Product Portfolio
7.15.3 KCC (Korea Circuit Company) IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.15.4 KCC (Korea Circuit Company) Main Business and Markets Served
7.15.5 KCC (Korea Circuit Company) Recent Developments/Updates
7.16 ACCESS
7.16.1 ACCESS IC Packaging Substrate Company Information
7.16.2 ACCESS IC Packaging Substrate Product Portfolio
7.16.3 ACCESS IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.16.4 ACCESS Main Business and Markets Served
7.16.5 ACCESS Recent Developments/Updates
7.17 Shenzhen Fastprint Circuit Tech
7.17.1 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Company Information
7.17.2 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Product Portfolio
7.17.3 Shenzhen Fastprint Circuit Tech IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.17.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
7.17.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
7.18 AKM Meadville
7.18.1 AKM Meadville IC Packaging Substrate Company Information
7.18.2 AKM Meadville IC Packaging Substrate Product Portfolio
7.18.3 AKM Meadville IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.18.4 AKM Meadville Main Business and Markets Served
7.18.5 AKM Meadville Recent Developments/Updates
7.19 Toppan Printing
7.19.1 Toppan Printing IC Packaging Substrate Company Information
7.19.2 Toppan Printing IC Packaging Substrate Product Portfolio
7.19.3 Toppan Printing IC Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Toppan Printing Main Business and Markets Served
7.19.5 Toppan Printing Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging Substrate Industry Chain Analysis
8.2 IC Packaging Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging Substrate Production Mode & Process Analysis
8.4 IC Packaging Substrate Sales and Marketing
8.4.1 IC Packaging Substrate Sales Channels
8.4.2 IC Packaging Substrate Distributors
8.5 IC Packaging Substrate Customer Analysis
9 IC Packaging Substrate Market Dynamics
9.1 IC Packaging Substrate Industry Trends
9.2 IC Packaging Substrate Market Drivers
9.3 IC Packaging Substrate Market Challenges
9.4 IC Packaging Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global IC Packaging Substrate Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global IC Packaging Substrate Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global IC Packaging Substrate Production Capacity (K Sqm) by Manufacturers in 2024
 Table 4. Global IC Packaging Substrate Production by Manufacturers (2020-2025) & (K Sqm)
 Table 5. Global IC Packaging Substrate Production Market Share by Manufacturers (2020-2025)
 Table 6. Global IC Packaging Substrate Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global IC Packaging Substrate Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of IC Packaging Substrate, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in IC Packaging Substrate as of 2024)
 Table 10. Global Market IC Packaging Substrate Average Price by Manufacturers (US$/Sqm) & (2020-2025)
 Table 11. Global Key Manufacturers of IC Packaging Substrate, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of IC Packaging Substrate, Product Offered and Application
 Table 13. Global Key Manufacturers of IC Packaging Substrate, Date of Enter into This Industry
 Table 14. Global IC Packaging Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global IC Packaging Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global IC Packaging Substrate Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global IC Packaging Substrate Production Value Market Share by Region (2020-2025)
 Table 19. Global IC Packaging Substrate Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global IC Packaging Substrate Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global IC Packaging Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Table 22. Global IC Packaging Substrate Production (K Sqm) by Region (2020-2025)
 Table 23. Global IC Packaging Substrate Production Market Share by Region (2020-2025)
 Table 24. Global IC Packaging Substrate Production (K Sqm) Forecast by Region (2026-2031)
 Table 25. Global IC Packaging Substrate Production Market Share Forecast by Region (2026-2031)
 Table 26. Global IC Packaging Substrate Market Average Price (US$/Sqm) by Region (2020-2025)
 Table 27. Global IC Packaging Substrate Market Average Price (US$/Sqm) by Region (2026-2031)
 Table 28. Global IC Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Table 29. Global IC Packaging Substrate Consumption by Region (2020-2025) & (K Sqm)
 Table 30. Global IC Packaging Substrate Consumption Market Share by Region (2020-2025)
 Table 31. Global IC Packaging Substrate Forecasted Consumption by Region (2026-2031) & (K Sqm)
 Table 32. Global IC Packaging Substrate Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
 Table 34. North America IC Packaging Substrate Consumption by Country (2020-2025) & (K Sqm)
 Table 35. North America IC Packaging Substrate Consumption by Country (2026-2031) & (K Sqm)
 Table 36. Europe IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
 Table 37. Europe IC Packaging Substrate Consumption by Country (2020-2025) & (K Sqm)
 Table 38. Europe IC Packaging Substrate Consumption by Country (2026-2031) & (K Sqm)
 Table 39. Asia Pacific IC Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Table 40. Asia Pacific IC Packaging Substrate Consumption by Region (2020-2025) & (K Sqm)
 Table 41. Asia Pacific IC Packaging Substrate Consumption by Region (2026-2031) & (K Sqm)
 Table 42. Latin America, Middle East & Africa IC Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
 Table 43. Latin America, Middle East & Africa IC Packaging Substrate Consumption by Country (2020-2025) & (K Sqm)
 Table 44. Latin America, Middle East & Africa IC Packaging Substrate Consumption by Country (2026-2031) & (K Sqm)
 Table 45. Global IC Packaging Substrate Production (K Sqm) by Type (2020-2025)
 Table 46. Global IC Packaging Substrate Production (K Sqm) by Type (2026-2031)
 Table 47. Global IC Packaging Substrate Production Market Share by Type (2020-2025)
 Table 48. Global IC Packaging Substrate Production Market Share by Type (2026-2031)
 Table 49. Global IC Packaging Substrate Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global IC Packaging Substrate Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global IC Packaging Substrate Production Value Market Share by Type (2020-2025)
 Table 52. Global IC Packaging Substrate Production Value Market Share by Type (2026-2031)
 Table 53. Global IC Packaging Substrate Price (US$/Sqm) by Type (2020-2025)
 Table 54. Global IC Packaging Substrate Price (US$/Sqm) by Type (2026-2031)
 Table 55. Global IC Packaging Substrate Production (K Sqm) by Application (2020-2025)
 Table 56. Global IC Packaging Substrate Production (K Sqm) by Application (2026-2031)
 Table 57. Global IC Packaging Substrate Production Market Share by Application (2020-2025)
 Table 58. Global IC Packaging Substrate Production Market Share by Application (2026-2031)
 Table 59. Global IC Packaging Substrate Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global IC Packaging Substrate Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global IC Packaging Substrate Production Value Market Share by Application (2020-2025)
 Table 62. Global IC Packaging Substrate Production Value Market Share by Application (2026-2031)
 Table 63. Global IC Packaging Substrate Price (US$/Sqm) by Application (2020-2025)
 Table 64. Global IC Packaging Substrate Price (US$/Sqm) by Application (2026-2031)
 Table 65. Ibiden IC Packaging Substrate Company Information
 Table 66. Ibiden IC Packaging Substrate Specification and Application
 Table 67. Ibiden IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 68. Ibiden Main Business and Markets Served
 Table 69. Ibiden Recent Developments/Updates
 Table 70. Kinsus Interconnect Technology IC Packaging Substrate Company Information
 Table 71. Kinsus Interconnect Technology IC Packaging Substrate Specification and Application
 Table 72. Kinsus Interconnect Technology IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 73. Kinsus Interconnect Technology Main Business and Markets Served
 Table 74. Kinsus Interconnect Technology Recent Developments/Updates
 Table 75. Unimicron IC Packaging Substrate Company Information
 Table 76. Unimicron IC Packaging Substrate Specification and Application
 Table 77. Unimicron IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 78. Unimicron Main Business and Markets Served
 Table 79. Unimicron Recent Developments/Updates
 Table 80. Shinko Electric Industries IC Packaging Substrate Company Information
 Table 81. Shinko Electric Industries IC Packaging Substrate Specification and Application
 Table 82. Shinko Electric Industries IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 83. Shinko Electric Industries Main Business and Markets Served
 Table 84. Shinko Electric Industries Recent Developments/Updates
 Table 85. Semco IC Packaging Substrate Company Information
 Table 86. Semco IC Packaging Substrate Specification and Application
 Table 87. Semco IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 88. Semco Main Business and Markets Served
 Table 89. Semco Recent Developments/Updates
 Table 90. Simmtech IC Packaging Substrate Company Information
 Table 91. Simmtech IC Packaging Substrate Specification and Application
 Table 92. Simmtech IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 93. Simmtech Main Business and Markets Served
 Table 94. Simmtech Recent Developments/Updates
 Table 95. Nanya IC Packaging Substrate Company Information
 Table 96. Nanya IC Packaging Substrate Specification and Application
 Table 97. Nanya IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 98. Nanya Main Business and Markets Served
 Table 99. Nanya Recent Developments/Updates
 Table 100. Kyocera IC Packaging Substrate Company Information
 Table 101. Kyocera IC Packaging Substrate Specification and Application
 Table 102. Kyocera IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 103. Kyocera Main Business and Markets Served
 Table 104. Kyocera Recent Developments/Updates
 Table 105. LG Innotek IC Packaging Substrate Company Information
 Table 106. LG Innotek IC Packaging Substrate Specification and Application
 Table 107. LG Innotek IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 108. LG Innotek Main Business and Markets Served
 Table 109. LG Innotek Recent Developments/Updates
 Table 110. AT&S IC Packaging Substrate Company Information
 Table 111. AT&S IC Packaging Substrate Specification and Application
 Table 112. AT&S IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 113. AT&S Main Business and Markets Served
 Table 114. AT&S Recent Developments/Updates
 Table 115. ASE IC Packaging Substrate Company Information
 Table 116. ASE IC Packaging Substrate Specification and Application
 Table 117. ASE IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 118. ASE Main Business and Markets Served
 Table 119. ASE Recent Developments/Updates
 Table 120. Daeduck IC Packaging Substrate Company Information
 Table 121. Daeduck IC Packaging Substrate Specification and Application
 Table 122. Daeduck IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 123. Daeduck Main Business and Markets Served
 Table 124. Daeduck Recent Developments/Updates
 Table 125. Shennan Circuit IC Packaging Substrate Company Information
 Table 126. Shennan Circuit IC Packaging Substrate Specification and Application
 Table 127. Shennan Circuit IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 128. Shennan Circuit Main Business and Markets Served
 Table 129. Shennan Circuit Recent Developments/Updates
 Table 130. Zhen Ding Technology IC Packaging Substrate Company Information
 Table 131. Zhen Ding Technology IC Packaging Substrate Specification and Application
 Table 132. Zhen Ding Technology IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 133. Zhen Ding Technology Main Business and Markets Served
 Table 134. Zhen Ding Technology Recent Developments/Updates
 Table 135. KCC (Korea Circuit Company) IC Packaging Substrate Company Information
 Table 136. KCC (Korea Circuit Company) IC Packaging Substrate Specification and Application
 Table 137. KCC (Korea Circuit Company) IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 138. KCC (Korea Circuit Company) Main Business and Markets Served
 Table 139. KCC (Korea Circuit Company) Recent Developments/Updates
 Table 140. ACCESS IC Packaging Substrate Company Information
 Table 141. ACCESS IC Packaging Substrate Specification and Application
 Table 142. ACCESS IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 143. ACCESS Main Business and Markets Served
 Table 144. ACCESS Recent Developments/Updates
 Table 145. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Company Information
 Table 146. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Specification and Application
 Table 147. Shenzhen Fastprint Circuit Tech IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 148. Shenzhen Fastprint Circuit Tech Main Business and Markets Served
 Table 149. Shenzhen Fastprint Circuit Tech Recent Developments/Updates
 Table 150. AKM Meadville IC Packaging Substrate Company Information
 Table 151. AKM Meadville IC Packaging Substrate Specification and Application
 Table 152. AKM Meadville IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 153. AKM Meadville Main Business and Markets Served
 Table 154. AKM Meadville Recent Developments/Updates
 Table 155. Toppan Printing IC Packaging Substrate Company Information
 Table 156. Toppan Printing IC Packaging Substrate Specification and Application
 Table 157. Toppan Printing IC Packaging Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 158. Toppan Printing Main Business and Markets Served
 Table 159. Toppan Printing Recent Developments/Updates
 Table 160. Key Raw Materials Lists
 Table 161. Raw Materials Key Suppliers Lists
 Table 162. IC Packaging Substrate Distributors List
 Table 163. IC Packaging Substrate Customers List
 Table 164. IC Packaging Substrate Market Trends
 Table 165. IC Packaging Substrate Market Drivers
 Table 166. IC Packaging Substrate Market Challenges
 Table 167. IC Packaging Substrate Market Restraints
 Table 168. Research Programs/Design for This Report
 Table 169. Key Data Information from Secondary Sources
 Table 170. Key Data Information from Primary Sources
 Table 171. Authors List of This Report


List of Figures
 Figure 1. Product Picture of IC Packaging Substrate
 Figure 2. Global IC Packaging Substrate Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global IC Packaging Substrate Market Share by Type: 2024 VS 2031
 Figure 4. WB CSP Product Picture
 Figure 5. FC BGA Product Picture
 Figure 6. FC CSP Product Picture
 Figure 7. PBGA Product Picture
 Figure 8. SiP Product Picture
 Figure 9. BOC Product Picture
 Figure 10. Other Product Picture
 Figure 11. Global IC Packaging Substrate Market Value by Application, (US$ Million) & (2020-2031)
 Figure 12. Global IC Packaging Substrate Market Share by Application: 2024 VS 2031
 Figure 13. Smart Phones
 Figure 14. PC (Tablet, Laptop)
 Figure 15. Wearable Devices
 Figure 16. Others
 Figure 17. Global IC Packaging Substrate Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 18. Global IC Packaging Substrate Production Value (US$ Million) & (2020-2031)
 Figure 19. Global IC Packaging Substrate Production Capacity (K Sqm) & (2020-2031)
 Figure 20. Global IC Packaging Substrate Production (K Sqm) & (2020-2031)
 Figure 21. Global IC Packaging Substrate Average Price (US$/Sqm) & (2020-2031)
 Figure 22. IC Packaging Substrate Report Years Considered
 Figure 23. IC Packaging Substrate Production Share by Manufacturers in 2024
 Figure 24. Global IC Packaging Substrate Production Value Share by Manufacturers (2024)
 Figure 25. IC Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 26. The Global 5 and 10 Largest Players: Market Share by IC Packaging Substrate Revenue in 2024
 Figure 27. Global IC Packaging Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 28. Global IC Packaging Substrate Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 29. Global IC Packaging Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Figure 30. Global IC Packaging Substrate Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 31. North America IC Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Europe IC Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. China IC Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 34. Japan IC Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 35. South Korea IC Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 36. Global IC Packaging Substrate Consumption by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Figure 37. Global IC Packaging Substrate Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 38. North America IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 39. North America IC Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 40. U.S. IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 41. Canada IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 42. Europe IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 43. Europe IC Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 44. Germany IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 45. France IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 46. U.K. IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 47. Italy IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 48. Netherlands IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 49. Asia Pacific IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 50. Asia Pacific IC Packaging Substrate Consumption Market Share by Region (2020-2031)
 Figure 51. China IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 52. Japan IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 53. South Korea IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 54. China Taiwan IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 55. Southeast Asia IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 56. India IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 57. Latin America, Middle East & Africa IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 58. Latin America, Middle East & Africa IC Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 59. Mexico IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 60. Brazil IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 61. Israel IC Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 62. Global Production Market Share of IC Packaging Substrate by Type (2020-2031)
 Figure 63. Global Production Value Market Share of IC Packaging Substrate by Type (2020-2031)
 Figure 64. Global IC Packaging Substrate Price (US$/Sqm) by Type (2020-2031)
 Figure 65. Global Production Market Share of IC Packaging Substrate by Application (2020-2031)
 Figure 66. Global Production Value Market Share of IC Packaging Substrate by Application (2020-2031)
 Figure 67. Global IC Packaging Substrate Price (US$/Sqm) by Application (2020-2031)
 Figure 68. IC Packaging Substrate Value Chain
 Figure 69. Channels of Distribution (Direct Vs Distribution)
 Figure 70. Bottom-up and Top-down Approaches for This Report
 Figure 71. Data Triangulation
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