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Global IC Package Substrates Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-38Z7894
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Global IC Package Substrates Market Research Report 2022
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Global IC Package Substrates Market Research Report 2025

Code: QYRE-Auto-38Z7894
Report
March 2025
Pages:120
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

IC Package Substrates Market

The global market for IC Package Substrates was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.

Report Scope

This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates.
The IC Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global IC Package Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of IC Package Substrates Market Report

Report Metric Details
Report Name IC Package Substrates Market
by Type
  • FC-BGA
  • FC-CSP
  • WB BGA
  • WB CSP
  • RF Module
  • Others
by Application
  • Smart Phone
  • PC (tablet and Laptop)
  • Wearable Device
  • Others
Production by Region
  • Japan
  • South Korea
  • China Taiwan
  • China
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, Daeduck Electronics, ASE Material, LG InnoTek, Simmtech, Shennan Circuit, Shenzhen Fastprint Circuit Tech, ACCESS, Suntak Technology, National Center for Advanced Packaging (NCAP China), Huizhou China Eagle Electronic Technology, DSBJ, Shenzhen Kinwong Electronic, AKM Meadville, Victory Giant Technology
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of IC Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of IC Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of IC Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

What is the market share of major companies in IC Package Substrates Market?

Ans: The top three manufacturers account for more than 50% of the market share.

What is the IC Package Substrates Market share by type?

Ans: Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively.

Who are the main players in the IC Package Substrates Market report?

Ans: The main players in the IC Package Substrates Market are Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, Daeduck Electronics, ASE Material, LG InnoTek, Simmtech, Shennan Circuit, Shenzhen Fastprint Circuit Tech, ACCESS, Suntak Technology, National Center for Advanced Packaging (NCAP China), Huizhou China Eagle Electronic Technology, DSBJ, Shenzhen Kinwong Electronic, AKM Meadville, Victory Giant Technology

What are the Application segmentation covered in the IC Package Substrates Market report?

Ans: The Applications covered in the IC Package Substrates Market report are Smart Phone, PC (tablet and Laptop), Wearable Device, Others

What are the Type segmentation covered in the IC Package Substrates Market report?

Ans: The Types covered in the IC Package Substrates Market report are FC-BGA, FC-CSP, WB BGA, WB CSP, RF Module, Others

1 IC Package Substrates Market Overview
1.1 Product Definition
1.2 IC Package Substrates by Type
1.2.1 Global IC Package Substrates Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 FC-BGA
1.2.3 FC-CSP
1.2.4 WB BGA
1.2.5 WB CSP
1.2.6 RF Module
1.2.7 Others
1.3 IC Package Substrates by Application
1.3.1 Global IC Package Substrates Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phone
1.3.3 PC (tablet and Laptop)
1.3.4 Wearable Device
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global IC Package Substrates Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global IC Package Substrates Production Estimates and Forecasts (2020-2031)
1.4.4 Global IC Package Substrates Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Package Substrates Production Market Share by Manufacturers (2020-2025)
2.2 Global IC Package Substrates Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of IC Package Substrates, Industry Ranking, 2023 VS 2024
2.4 Global IC Package Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global IC Package Substrates Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of IC Package Substrates, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Package Substrates, Product Offered and Application
2.8 Global Key Manufacturers of IC Package Substrates, Date of Enter into This Industry
2.9 IC Package Substrates Market Competitive Situation and Trends
2.9.1 IC Package Substrates Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Package Substrates Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Package Substrates Production by Region
3.1 Global IC Package Substrates Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global IC Package Substrates Production Value by Region (2020-2031)
3.2.1 Global IC Package Substrates Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of IC Package Substrates by Region (2026-2031)
3.3 Global IC Package Substrates Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global IC Package Substrates Production Volume by Region (2020-2031)
3.4.1 Global IC Package Substrates Production by Region (2020-2025)
3.4.2 Global Forecasted Production of IC Package Substrates by Region (2026-2031)
3.5 Global IC Package Substrates Market Price Analysis by Region (2020-2025)
3.6 Global IC Package Substrates Production and Value, Year-over-Year Growth
3.6.1 Japan IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.2 South Korea IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Taiwan IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.4 China IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
4 IC Package Substrates Consumption by Region
4.1 Global IC Package Substrates Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global IC Package Substrates Consumption by Region (2020-2031)
4.2.1 Global IC Package Substrates Consumption by Region (2020-2025)
4.2.2 Global IC Package Substrates Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America IC Package Substrates Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe IC Package Substrates Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific IC Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific IC Package Substrates Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global IC Package Substrates Production by Type (2020-2031)
5.1.1 Global IC Package Substrates Production by Type (2020-2025)
5.1.2 Global IC Package Substrates Production by Type (2026-2031)
5.1.3 Global IC Package Substrates Production Market Share by Type (2020-2031)
5.2 Global IC Package Substrates Production Value by Type (2020-2031)
5.2.1 Global IC Package Substrates Production Value by Type (2020-2025)
5.2.2 Global IC Package Substrates Production Value by Type (2026-2031)
5.2.3 Global IC Package Substrates Production Value Market Share by Type (2020-2031)
5.3 Global IC Package Substrates Price by Type (2020-2031)
6 Segment by Application
6.1 Global IC Package Substrates Production by Application (2020-2031)
6.1.1 Global IC Package Substrates Production by Application (2020-2025)
6.1.2 Global IC Package Substrates Production by Application (2026-2031)
6.1.3 Global IC Package Substrates Production Market Share by Application (2020-2031)
6.2 Global IC Package Substrates Production Value by Application (2020-2031)
6.2.1 Global IC Package Substrates Production Value by Application (2020-2025)
6.2.2 Global IC Package Substrates Production Value by Application (2026-2031)
6.2.3 Global IC Package Substrates Production Value Market Share by Application (2020-2031)
6.3 Global IC Package Substrates Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron IC Package Substrates Company Information
7.1.2 Unimicron IC Package Substrates Product Portfolio
7.1.3 Unimicron IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 Ibiden
7.2.1 Ibiden IC Package Substrates Company Information
7.2.2 Ibiden IC Package Substrates Product Portfolio
7.2.3 Ibiden IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Ibiden Main Business and Markets Served
7.2.5 Ibiden Recent Developments/Updates
7.3 Nan Ya PCB
7.3.1 Nan Ya PCB IC Package Substrates Company Information
7.3.2 Nan Ya PCB IC Package Substrates Product Portfolio
7.3.3 Nan Ya PCB IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Nan Ya PCB Main Business and Markets Served
7.3.5 Nan Ya PCB Recent Developments/Updates
7.4 Shinko Electric Industries
7.4.1 Shinko Electric Industries IC Package Substrates Company Information
7.4.2 Shinko Electric Industries IC Package Substrates Product Portfolio
7.4.3 Shinko Electric Industries IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Shinko Electric Industries Main Business and Markets Served
7.4.5 Shinko Electric Industries Recent Developments/Updates
7.5 Kinsus Interconnect Technology
7.5.1 Kinsus Interconnect Technology IC Package Substrates Company Information
7.5.2 Kinsus Interconnect Technology IC Package Substrates Product Portfolio
7.5.3 Kinsus Interconnect Technology IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Kinsus Interconnect Technology Main Business and Markets Served
7.5.5 Kinsus Interconnect Technology Recent Developments/Updates
7.6 AT&S
7.6.1 AT&S IC Package Substrates Company Information
7.6.2 AT&S IC Package Substrates Product Portfolio
7.6.3 AT&S IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.6.4 AT&S Main Business and Markets Served
7.6.5 AT&S Recent Developments/Updates
7.7 Semco
7.7.1 Semco IC Package Substrates Company Information
7.7.2 Semco IC Package Substrates Product Portfolio
7.7.3 Semco IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Semco Main Business and Markets Served
7.7.5 Semco Recent Developments/Updates
7.8 Kyocera
7.8.1 Kyocera IC Package Substrates Company Information
7.8.2 Kyocera IC Package Substrates Product Portfolio
7.8.3 Kyocera IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Kyocera Main Business and Markets Served
7.8.5 Kyocera Recent Developments/Updates
7.9 TOPPAN
7.9.1 TOPPAN IC Package Substrates Company Information
7.9.2 TOPPAN IC Package Substrates Product Portfolio
7.9.3 TOPPAN IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.9.4 TOPPAN Main Business and Markets Served
7.9.5 TOPPAN Recent Developments/Updates
7.10 Zhen Ding Technology
7.10.1 Zhen Ding Technology IC Package Substrates Company Information
7.10.2 Zhen Ding Technology IC Package Substrates Product Portfolio
7.10.3 Zhen Ding Technology IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Zhen Ding Technology Main Business and Markets Served
7.10.5 Zhen Ding Technology Recent Developments/Updates
7.11 Daeduck Electronics
7.11.1 Daeduck Electronics IC Package Substrates Company Information
7.11.2 Daeduck Electronics IC Package Substrates Product Portfolio
7.11.3 Daeduck Electronics IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Daeduck Electronics Main Business and Markets Served
7.11.5 Daeduck Electronics Recent Developments/Updates
7.12 ASE Material
7.12.1 ASE Material IC Package Substrates Company Information
7.12.2 ASE Material IC Package Substrates Product Portfolio
7.12.3 ASE Material IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.12.4 ASE Material Main Business and Markets Served
7.12.5 ASE Material Recent Developments/Updates
7.13 LG InnoTek
7.13.1 LG InnoTek IC Package Substrates Company Information
7.13.2 LG InnoTek IC Package Substrates Product Portfolio
7.13.3 LG InnoTek IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.13.4 LG InnoTek Main Business and Markets Served
7.13.5 LG InnoTek Recent Developments/Updates
7.14 Simmtech
7.14.1 Simmtech IC Package Substrates Company Information
7.14.2 Simmtech IC Package Substrates Product Portfolio
7.14.3 Simmtech IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Simmtech Main Business and Markets Served
7.14.5 Simmtech Recent Developments/Updates
7.15 Shennan Circuit
7.15.1 Shennan Circuit IC Package Substrates Company Information
7.15.2 Shennan Circuit IC Package Substrates Product Portfolio
7.15.3 Shennan Circuit IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Shennan Circuit Main Business and Markets Served
7.15.5 Shennan Circuit Recent Developments/Updates
7.16 Shenzhen Fastprint Circuit Tech
7.16.1 Shenzhen Fastprint Circuit Tech IC Package Substrates Company Information
7.16.2 Shenzhen Fastprint Circuit Tech IC Package Substrates Product Portfolio
7.16.3 Shenzhen Fastprint Circuit Tech IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
7.16.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
7.17 ACCESS
7.17.1 ACCESS IC Package Substrates Company Information
7.17.2 ACCESS IC Package Substrates Product Portfolio
7.17.3 ACCESS IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.17.4 ACCESS Main Business and Markets Served
7.17.5 ACCESS Recent Developments/Updates
7.18 Suntak Technology
7.18.1 Suntak Technology IC Package Substrates Company Information
7.18.2 Suntak Technology IC Package Substrates Product Portfolio
7.18.3 Suntak Technology IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Suntak Technology Main Business and Markets Served
7.18.5 Suntak Technology Recent Developments/Updates
7.19 National Center for Advanced Packaging (NCAP China)
7.19.1 National Center for Advanced Packaging (NCAP China) IC Package Substrates Company Information
7.19.2 National Center for Advanced Packaging (NCAP China) IC Package Substrates Product Portfolio
7.19.3 National Center for Advanced Packaging (NCAP China) IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.19.4 National Center for Advanced Packaging (NCAP China) Main Business and Markets Served
7.19.5 National Center for Advanced Packaging (NCAP China) Recent Developments/Updates
7.20 Huizhou China Eagle Electronic Technology
7.20.1 Huizhou China Eagle Electronic Technology IC Package Substrates Company Information
7.20.2 Huizhou China Eagle Electronic Technology IC Package Substrates Product Portfolio
7.20.3 Huizhou China Eagle Electronic Technology IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.20.4 Huizhou China Eagle Electronic Technology Main Business and Markets Served
7.20.5 Huizhou China Eagle Electronic Technology Recent Developments/Updates
7.21 DSBJ
7.21.1 DSBJ IC Package Substrates Company Information
7.21.2 DSBJ IC Package Substrates Product Portfolio
7.21.3 DSBJ IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.21.4 DSBJ Main Business and Markets Served
7.21.5 DSBJ Recent Developments/Updates
7.22 Shenzhen Kinwong Electronic
7.22.1 Shenzhen Kinwong Electronic IC Package Substrates Company Information
7.22.2 Shenzhen Kinwong Electronic IC Package Substrates Product Portfolio
7.22.3 Shenzhen Kinwong Electronic IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.22.4 Shenzhen Kinwong Electronic Main Business and Markets Served
7.22.5 Shenzhen Kinwong Electronic Recent Developments/Updates
7.23 AKM Meadville
7.23.1 AKM Meadville IC Package Substrates Company Information
7.23.2 AKM Meadville IC Package Substrates Product Portfolio
7.23.3 AKM Meadville IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.23.4 AKM Meadville Main Business and Markets Served
7.23.5 AKM Meadville Recent Developments/Updates
7.24 Victory Giant Technology
7.24.1 Victory Giant Technology IC Package Substrates Company Information
7.24.2 Victory Giant Technology IC Package Substrates Product Portfolio
7.24.3 Victory Giant Technology IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.24.4 Victory Giant Technology Main Business and Markets Served
7.24.5 Victory Giant Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Package Substrates Industry Chain Analysis
8.2 IC Package Substrates Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Package Substrates Production Mode & Process Analysis
8.4 IC Package Substrates Sales and Marketing
8.4.1 IC Package Substrates Sales Channels
8.4.2 IC Package Substrates Distributors
8.5 IC Package Substrates Customer Analysis
9 IC Package Substrates Market Dynamics
9.1 IC Package Substrates Industry Trends
9.2 IC Package Substrates Market Drivers
9.3 IC Package Substrates Market Challenges
9.4 IC Package Substrates Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global IC Package Substrates Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global IC Package Substrates Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global IC Package Substrates Production Capacity (K Sqm) by Manufacturers in 2024
 Table 4. Global IC Package Substrates Production by Manufacturers (2020-2025) & (K Sqm)
 Table 5. Global IC Package Substrates Production Market Share by Manufacturers (2020-2025)
 Table 6. Global IC Package Substrates Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global IC Package Substrates Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of IC Package Substrates, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in IC Package Substrates as of 2024)
 Table 10. Global Market IC Package Substrates Average Price by Manufacturers (US$/Sqm) & (2020-2025)
 Table 11. Global Key Manufacturers of IC Package Substrates, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of IC Package Substrates, Product Offered and Application
 Table 13. Global Key Manufacturers of IC Package Substrates, Date of Enter into This Industry
 Table 14. Global IC Package Substrates Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global IC Package Substrates Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global IC Package Substrates Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global IC Package Substrates Production Value Market Share by Region (2020-2025)
 Table 19. Global IC Package Substrates Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global IC Package Substrates Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global IC Package Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Table 22. Global IC Package Substrates Production (K Sqm) by Region (2020-2025)
 Table 23. Global IC Package Substrates Production Market Share by Region (2020-2025)
 Table 24. Global IC Package Substrates Production (K Sqm) Forecast by Region (2026-2031)
 Table 25. Global IC Package Substrates Production Market Share Forecast by Region (2026-2031)
 Table 26. Global IC Package Substrates Market Average Price (US$/Sqm) by Region (2020-2025)
 Table 27. Global IC Package Substrates Market Average Price (US$/Sqm) by Region (2026-2031)
 Table 28. Global IC Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Table 29. Global IC Package Substrates Consumption by Region (2020-2025) & (K Sqm)
 Table 30. Global IC Package Substrates Consumption Market Share by Region (2020-2025)
 Table 31. Global IC Package Substrates Forecasted Consumption by Region (2026-2031) & (K Sqm)
 Table 32. Global IC Package Substrates Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
 Table 34. North America IC Package Substrates Consumption by Country (2020-2025) & (K Sqm)
 Table 35. North America IC Package Substrates Consumption by Country (2026-2031) & (K Sqm)
 Table 36. Europe IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
 Table 37. Europe IC Package Substrates Consumption by Country (2020-2025) & (K Sqm)
 Table 38. Europe IC Package Substrates Consumption by Country (2026-2031) & (K Sqm)
 Table 39. Asia Pacific IC Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Table 40. Asia Pacific IC Package Substrates Consumption by Region (2020-2025) & (K Sqm)
 Table 41. Asia Pacific IC Package Substrates Consumption by Region (2026-2031) & (K Sqm)
 Table 42. Latin America, Middle East & Africa IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
 Table 43. Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2020-2025) & (K Sqm)
 Table 44. Latin America, Middle East & Africa IC Package Substrates Consumption by Country (2026-2031) & (K Sqm)
 Table 45. Global IC Package Substrates Production (K Sqm) by Type (2020-2025)
 Table 46. Global IC Package Substrates Production (K Sqm) by Type (2026-2031)
 Table 47. Global IC Package Substrates Production Market Share by Type (2020-2025)
 Table 48. Global IC Package Substrates Production Market Share by Type (2026-2031)
 Table 49. Global IC Package Substrates Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global IC Package Substrates Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global IC Package Substrates Production Value Market Share by Type (2020-2025)
 Table 52. Global IC Package Substrates Production Value Market Share by Type (2026-2031)
 Table 53. Global IC Package Substrates Price (US$/Sqm) by Type (2020-2025)
 Table 54. Global IC Package Substrates Price (US$/Sqm) by Type (2026-2031)
 Table 55. Global IC Package Substrates Production (K Sqm) by Application (2020-2025)
 Table 56. Global IC Package Substrates Production (K Sqm) by Application (2026-2031)
 Table 57. Global IC Package Substrates Production Market Share by Application (2020-2025)
 Table 58. Global IC Package Substrates Production Market Share by Application (2026-2031)
 Table 59. Global IC Package Substrates Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global IC Package Substrates Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global IC Package Substrates Production Value Market Share by Application (2020-2025)
 Table 62. Global IC Package Substrates Production Value Market Share by Application (2026-2031)
 Table 63. Global IC Package Substrates Price (US$/Sqm) by Application (2020-2025)
 Table 64. Global IC Package Substrates Price (US$/Sqm) by Application (2026-2031)
 Table 65. Unimicron IC Package Substrates Company Information
 Table 66. Unimicron IC Package Substrates Specification and Application
 Table 67. Unimicron IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 68. Unimicron Main Business and Markets Served
 Table 69. Unimicron Recent Developments/Updates
 Table 70. Ibiden IC Package Substrates Company Information
 Table 71. Ibiden IC Package Substrates Specification and Application
 Table 72. Ibiden IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 73. Ibiden Main Business and Markets Served
 Table 74. Ibiden Recent Developments/Updates
 Table 75. Nan Ya PCB IC Package Substrates Company Information
 Table 76. Nan Ya PCB IC Package Substrates Specification and Application
 Table 77. Nan Ya PCB IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 78. Nan Ya PCB Main Business and Markets Served
 Table 79. Nan Ya PCB Recent Developments/Updates
 Table 80. Shinko Electric Industries IC Package Substrates Company Information
 Table 81. Shinko Electric Industries IC Package Substrates Specification and Application
 Table 82. Shinko Electric Industries IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 83. Shinko Electric Industries Main Business and Markets Served
 Table 84. Shinko Electric Industries Recent Developments/Updates
 Table 85. Kinsus Interconnect Technology IC Package Substrates Company Information
 Table 86. Kinsus Interconnect Technology IC Package Substrates Specification and Application
 Table 87. Kinsus Interconnect Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 88. Kinsus Interconnect Technology Main Business and Markets Served
 Table 89. Kinsus Interconnect Technology Recent Developments/Updates
 Table 90. AT&S IC Package Substrates Company Information
 Table 91. AT&S IC Package Substrates Specification and Application
 Table 92. AT&S IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 93. AT&S Main Business and Markets Served
 Table 94. AT&S Recent Developments/Updates
 Table 95. Semco IC Package Substrates Company Information
 Table 96. Semco IC Package Substrates Specification and Application
 Table 97. Semco IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 98. Semco Main Business and Markets Served
 Table 99. Semco Recent Developments/Updates
 Table 100. Kyocera IC Package Substrates Company Information
 Table 101. Kyocera IC Package Substrates Specification and Application
 Table 102. Kyocera IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 103. Kyocera Main Business and Markets Served
 Table 104. Kyocera Recent Developments/Updates
 Table 105. TOPPAN IC Package Substrates Company Information
 Table 106. TOPPAN IC Package Substrates Specification and Application
 Table 107. TOPPAN IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 108. TOPPAN Main Business and Markets Served
 Table 109. TOPPAN Recent Developments/Updates
 Table 110. Zhen Ding Technology IC Package Substrates Company Information
 Table 111. Zhen Ding Technology IC Package Substrates Specification and Application
 Table 112. Zhen Ding Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 113. Zhen Ding Technology Main Business and Markets Served
 Table 114. Zhen Ding Technology Recent Developments/Updates
 Table 115. Daeduck Electronics IC Package Substrates Company Information
 Table 116. Daeduck Electronics IC Package Substrates Specification and Application
 Table 117. Daeduck Electronics IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 118. Daeduck Electronics Main Business and Markets Served
 Table 119. Daeduck Electronics Recent Developments/Updates
 Table 120. ASE Material IC Package Substrates Company Information
 Table 121. ASE Material IC Package Substrates Specification and Application
 Table 122. ASE Material IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 123. ASE Material Main Business and Markets Served
 Table 124. ASE Material Recent Developments/Updates
 Table 125. LG InnoTek IC Package Substrates Company Information
 Table 126. LG InnoTek IC Package Substrates Specification and Application
 Table 127. LG InnoTek IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 128. LG InnoTek Main Business and Markets Served
 Table 129. LG InnoTek Recent Developments/Updates
 Table 130. Simmtech IC Package Substrates Company Information
 Table 131. Simmtech IC Package Substrates Specification and Application
 Table 132. Simmtech IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 133. Simmtech Main Business and Markets Served
 Table 134. Simmtech Recent Developments/Updates
 Table 135. Shennan Circuit IC Package Substrates Company Information
 Table 136. Shennan Circuit IC Package Substrates Specification and Application
 Table 137. Shennan Circuit IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 138. Shennan Circuit Main Business and Markets Served
 Table 139. Shennan Circuit Recent Developments/Updates
 Table 140. Shenzhen Fastprint Circuit Tech IC Package Substrates Company Information
 Table 141. Shenzhen Fastprint Circuit Tech IC Package Substrates Specification and Application
 Table 142. Shenzhen Fastprint Circuit Tech IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 143. Shenzhen Fastprint Circuit Tech Main Business and Markets Served
 Table 144. Shenzhen Fastprint Circuit Tech Recent Developments/Updates
 Table 145. ACCESS IC Package Substrates Company Information
 Table 146. ACCESS IC Package Substrates Specification and Application
 Table 147. ACCESS IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 148. ACCESS Main Business and Markets Served
 Table 149. ACCESS Recent Developments/Updates
 Table 150. Suntak Technology IC Package Substrates Company Information
 Table 151. Suntak Technology IC Package Substrates Specification and Application
 Table 152. Suntak Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 153. Suntak Technology Main Business and Markets Served
 Table 154. Suntak Technology Recent Developments/Updates
 Table 155. National Center for Advanced Packaging (NCAP China) IC Package Substrates Company Information
 Table 156. National Center for Advanced Packaging (NCAP China) IC Package Substrates Specification and Application
 Table 157. National Center for Advanced Packaging (NCAP China) IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 158. National Center for Advanced Packaging (NCAP China) Main Business and Markets Served
 Table 159. National Center for Advanced Packaging (NCAP China) Recent Developments/Updates
 Table 160. Huizhou China Eagle Electronic Technology IC Package Substrates Company Information
 Table 161. Huizhou China Eagle Electronic Technology IC Package Substrates Specification and Application
 Table 162. Huizhou China Eagle Electronic Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 163. Huizhou China Eagle Electronic Technology Main Business and Markets Served
 Table 164. Huizhou China Eagle Electronic Technology Recent Developments/Updates
 Table 165. DSBJ IC Package Substrates Company Information
 Table 166. DSBJ IC Package Substrates Specification and Application
 Table 167. DSBJ IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 168. DSBJ Main Business and Markets Served
 Table 169. DSBJ Recent Developments/Updates
 Table 170. Shenzhen Kinwong Electronic IC Package Substrates Company Information
 Table 171. Shenzhen Kinwong Electronic IC Package Substrates Specification and Application
 Table 172. Shenzhen Kinwong Electronic IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 173. Shenzhen Kinwong Electronic Main Business and Markets Served
 Table 174. Shenzhen Kinwong Electronic Recent Developments/Updates
 Table 175. AKM Meadville IC Package Substrates Company Information
 Table 176. AKM Meadville IC Package Substrates Specification and Application
 Table 177. AKM Meadville IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 178. AKM Meadville Main Business and Markets Served
 Table 179. AKM Meadville Recent Developments/Updates
 Table 180. Victory Giant Technology IC Package Substrates Company Information
 Table 181. Victory Giant Technology IC Package Substrates Specification and Application
 Table 182. Victory Giant Technology IC Package Substrates Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
 Table 183. Victory Giant Technology Main Business and Markets Served
 Table 184. Victory Giant Technology Recent Developments/Updates
 Table 185. Key Raw Materials Lists
 Table 186. Raw Materials Key Suppliers Lists
 Table 187. IC Package Substrates Distributors List
 Table 188. IC Package Substrates Customers List
 Table 189. IC Package Substrates Market Trends
 Table 190. IC Package Substrates Market Drivers
 Table 191. IC Package Substrates Market Challenges
 Table 192. IC Package Substrates Market Restraints
 Table 193. Research Programs/Design for This Report
 Table 194. Key Data Information from Secondary Sources
 Table 195. Key Data Information from Primary Sources
 Table 196. Authors List of This Report


List of Figures
 Figure 1. Product Picture of IC Package Substrates
 Figure 2. Global IC Package Substrates Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global IC Package Substrates Market Share by Type: 2024 VS 2031
 Figure 4. FC-BGA Product Picture
 Figure 5. FC-CSP Product Picture
 Figure 6. WB BGA Product Picture
 Figure 7. WB CSP Product Picture
 Figure 8. RF Module Product Picture
 Figure 9. Others Product Picture
 Figure 10. Global IC Package Substrates Market Value by Application, (US$ Million) & (2020-2031)
 Figure 11. Global IC Package Substrates Market Share by Application: 2024 VS 2031
 Figure 12. Smart Phone
 Figure 13. PC (tablet and Laptop)
 Figure 14. Wearable Device
 Figure 15. Others
 Figure 16. Global IC Package Substrates Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 17. Global IC Package Substrates Production Value (US$ Million) & (2020-2031)
 Figure 18. Global IC Package Substrates Production Capacity (K Sqm) & (2020-2031)
 Figure 19. Global IC Package Substrates Production (K Sqm) & (2020-2031)
 Figure 20. Global IC Package Substrates Average Price (US$/Sqm) & (2020-2031)
 Figure 21. IC Package Substrates Report Years Considered
 Figure 22. IC Package Substrates Production Share by Manufacturers in 2024
 Figure 23. Global IC Package Substrates Production Value Share by Manufacturers (2024)
 Figure 24. IC Package Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 25. The Global 5 and 10 Largest Players: Market Share by IC Package Substrates Revenue in 2024
 Figure 26. Global IC Package Substrates Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 27. Global IC Package Substrates Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 28. Global IC Package Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Figure 29. Global IC Package Substrates Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 30. Japan IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. South Korea IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. China Taiwan IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. China IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 34. Global IC Package Substrates Consumption by Region: 2020 VS 2024 VS 2031 (K Sqm)
 Figure 35. Global IC Package Substrates Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 36. North America IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 37. North America IC Package Substrates Consumption Market Share by Country (2020-2031)
 Figure 38. U.S. IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 39. Canada IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 40. Europe IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 41. Europe IC Package Substrates Consumption Market Share by Country (2020-2031)
 Figure 42. Germany IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 43. France IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 44. U.K. IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 45. Italy IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 46. Netherlands IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 47. Asia Pacific IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 48. Asia Pacific IC Package Substrates Consumption Market Share by Region (2020-2031)
 Figure 49. China IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 50. Japan IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 51. South Korea IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 52. China Taiwan IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 53. Southeast Asia IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 54. India IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 55. Latin America, Middle East & Africa IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 56. Latin America, Middle East & Africa IC Package Substrates Consumption Market Share by Country (2020-2031)
 Figure 57. Mexico IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 58. Brazil IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 59. Israel IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Sqm)
 Figure 60. Global Production Market Share of IC Package Substrates by Type (2020-2031)
 Figure 61. Global Production Value Market Share of IC Package Substrates by Type (2020-2031)
 Figure 62. Global IC Package Substrates Price (US$/Sqm) by Type (2020-2031)
 Figure 63. Global Production Market Share of IC Package Substrates by Application (2020-2031)
 Figure 64. Global Production Value Market Share of IC Package Substrates by Application (2020-2031)
 Figure 65. Global IC Package Substrates Price (US$/Sqm) by Application (2020-2031)
 Figure 66. IC Package Substrates Value Chain
 Figure 67. Channels of Distribution (Direct Vs Distribution)
 Figure 68. Bottom-up and Top-down Approaches for This Report
 Figure 69. Data Triangulation
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