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Global Flip Chip CSP (FCCSP) Package Market Research Report 2025

Published Date: January 2025

Report Code: QYRE-Auto-20X11550

Global Flip Chip CSP FCCSP Package Market Research Report 2022

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Global Flip Chip CSP (FCCSP) Package Market Research Report 2025

Code: QYRE-Auto-20X11550

Report

January 2025

Pages:96

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Amkor

Taiwan Semiconductor Manufacturing

ASE Group

Intel Corporation

Samsung Group

SPIL

Powertech Technology

Tongfu Microelectronics Co., Ltd.

Tianshui Huatian Technology Co., Ltd

United Microelectronics

SFA Semicon

JCET Group Co.,Ltd

Flip Chip CSP (FCCSP) Package Market Size

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

Flip Chip CSP (FCCSP) Package Market

The global market for Flip Chip CSP (FCCSP) Package was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better solder joint reliability compared with direct chip attach (DCA) or chip on board (COB). FCCSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FCCSP features thin and small profile, and lightweight packages.

Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Flip Chip CSP (FCCSP) Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip CSP (FCCSP) Package.

The Flip Chip CSP (FCCSP) Package market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Flip Chip CSP (FCCSP) Package market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Flip Chip CSP (FCCSP) Package manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Flip Chip CSP (FCCSP) Package Market Report

Report Metric	Details
Report Name	Flip Chip CSP (FCCSP) Package Market
Accounted market size in year	US$ 579 billion
Forecasted market size in 2029	US$ 790 billion
CAGR	6%
Base Year	year
Forecasted years	2025 - 2029
by Type	Bare Die Type Molded (CUF, MUF) Type SiP Type Hybrid (fcSCSP) Type Others
by Application	Auto and Transportation Consumer Electronics Communication Others
Production by Region	North America Europe China Japan South Korea
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Amkor, Taiwan Semiconductor Manufacturing, ASE Group, Intel Corporation, JCET Group Co.,Ltd, Samsung Group, SPIL, Powertech Technology, Tongfu Microelectronics Co., Ltd, Tianshui Huatian Technology Co., Ltd, United Microelectronics, SFA Semicon
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Flip Chip CSP (FCCSP) Package manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Flip Chip CSP (FCCSP) Package by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Flip Chip CSP (FCCSP) Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Flip Chip CSP (FCCSP) Package Market growing?

Ans: The Flip Chip CSP (FCCSP) Package Market witnessing a CAGR of 6% during the forecast period 2025-2029.

What is the Flip Chip CSP (FCCSP) Package Market size in 2029?

Ans: The Flip Chip CSP (FCCSP) Package Market size in 2029 will be US$ 790 billion.

Who are the main players in the Flip Chip CSP (FCCSP) Package Market report?

Ans: The main players in the Flip Chip CSP (FCCSP) Package Market are Amkor, Taiwan Semiconductor Manufacturing, ASE Group, Intel Corporation, JCET Group Co.,Ltd, Samsung Group, SPIL, Powertech Technology, Tongfu Microelectronics Co., Ltd, Tianshui Huatian Technology Co., Ltd, United Microelectronics, SFA Semicon

What are the Application segmentation covered in the Flip Chip CSP (FCCSP) Package Market report?

Ans: The Applications covered in the Flip Chip CSP (FCCSP) Package Market report are Auto and Transportation, Consumer Electronics, Communication, Others

What are the Type segmentation covered in the Flip Chip CSP (FCCSP) Package Market report?

Ans: The Types covered in the Flip Chip CSP (FCCSP) Package Market report are Bare Die Type, Molded (CUF, MUF) Type, SiP Type, Hybrid (fcSCSP) Type, Others

Recommended Reports

Semiconductor Packaging

Semiconductor Chips

Package Substrates

1 Flip Chip CSP (FCCSP) Package Market Overview

1.1 Product Definition

1.2 Flip Chip CSP (FCCSP) Package by Type

1.2.1 Global Flip Chip CSP (FCCSP) Package Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Bare Die Type

1.2.3 Molded (CUF, MUF) Type

1.2.4 SiP Type

1.2.5 Hybrid (fcSCSP) Type

1.2.6 Others

1.3 Flip Chip CSP (FCCSP) Package by Application

1.3.1 Global Flip Chip CSP (FCCSP) Package Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Auto and Transportation

1.3.3 Consumer Electronics

1.3.4 Communication

1.3.5 Others

1.4 Global Market Growth Prospects

1.4.1 Global Flip Chip CSP (FCCSP) Package Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Flip Chip CSP (FCCSP) Package Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Flip Chip CSP (FCCSP) Package Production Estimates and Forecasts (2020-2031)

1.4.4 Global Flip Chip CSP (FCCSP) Package Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Flip Chip CSP (FCCSP) Package Production Market Share by Manufacturers (2020-2025)

2.2 Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Flip Chip CSP (FCCSP) Package, Industry Ranking, 2023 VS 2024

2.4 Global Flip Chip CSP (FCCSP) Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Flip Chip CSP (FCCSP) Package Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Product Offered and Application

2.8 Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Date of Enter into This Industry

2.9 Flip Chip CSP (FCCSP) Package Market Competitive Situation and Trends

2.9.1 Flip Chip CSP (FCCSP) Package Market Concentration Rate

2.9.2 Global 5 and 10 Largest Flip Chip CSP (FCCSP) Package Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Flip Chip CSP (FCCSP) Package Production by Region

3.1 Global Flip Chip CSP (FCCSP) Package Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Flip Chip CSP (FCCSP) Package Production Value by Region (2020-2031)

3.2.1 Global Flip Chip CSP (FCCSP) Package Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Flip Chip CSP (FCCSP) Package by Region (2026-2031)

3.3 Global Flip Chip CSP (FCCSP) Package Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Flip Chip CSP (FCCSP) Package Production Volume by Region (2020-2031)

3.4.1 Global Flip Chip CSP (FCCSP) Package Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Flip Chip CSP (FCCSP) Package by Region (2026-2031)

3.5 Global Flip Chip CSP (FCCSP) Package Market Price Analysis by Region (2020-2025)

3.6 Global Flip Chip CSP (FCCSP) Package Production and Value, Year-over-Year Growth

3.6.1 North America Flip Chip CSP (FCCSP) Package Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Flip Chip CSP (FCCSP) Package Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Flip Chip CSP (FCCSP) Package Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Flip Chip CSP (FCCSP) Package Production Value Estimates and Forecasts (2020-2031)

3.6.5 South Korea Flip Chip CSP (FCCSP) Package Production Value Estimates and Forecasts (2020-2031)

4 Flip Chip CSP (FCCSP) Package Consumption by Region

4.1 Global Flip Chip CSP (FCCSP) Package Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Flip Chip CSP (FCCSP) Package Consumption by Region (2020-2031)

4.2.1 Global Flip Chip CSP (FCCSP) Package Consumption by Region (2020-2025)

4.2.2 Global Flip Chip CSP (FCCSP) Package Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Flip Chip CSP (FCCSP) Package Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Flip Chip CSP (FCCSP) Package Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Flip Chip CSP (FCCSP) Package Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Flip Chip CSP (FCCSP) Package Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Israel

5 Segment by Type

5.1 Global Flip Chip CSP (FCCSP) Package Production by Type (2020-2031)

5.1.1 Global Flip Chip CSP (FCCSP) Package Production by Type (2020-2025)

5.1.2 Global Flip Chip CSP (FCCSP) Package Production by Type (2026-2031)

5.1.3 Global Flip Chip CSP (FCCSP) Package Production Market Share by Type (2020-2031)

5.2 Global Flip Chip CSP (FCCSP) Package Production Value by Type (2020-2031)

5.2.1 Global Flip Chip CSP (FCCSP) Package Production Value by Type (2020-2025)

5.2.2 Global Flip Chip CSP (FCCSP) Package Production Value by Type (2026-2031)

5.2.3 Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Type (2020-2031)

5.3 Global Flip Chip CSP (FCCSP) Package Price by Type (2020-2031)

6 Segment by Application

6.1 Global Flip Chip CSP (FCCSP) Package Production by Application (2020-2031)

6.1.1 Global Flip Chip CSP (FCCSP) Package Production by Application (2020-2025)

6.1.2 Global Flip Chip CSP (FCCSP) Package Production by Application (2026-2031)

6.1.3 Global Flip Chip CSP (FCCSP) Package Production Market Share by Application (2020-2031)

6.2 Global Flip Chip CSP (FCCSP) Package Production Value by Application (2020-2031)

6.2.1 Global Flip Chip CSP (FCCSP) Package Production Value by Application (2020-2025)

6.2.2 Global Flip Chip CSP (FCCSP) Package Production Value by Application (2026-2031)

6.2.3 Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Application (2020-2031)

6.3 Global Flip Chip CSP (FCCSP) Package Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Amkor

7.1.1 Amkor Flip Chip CSP (FCCSP) Package Company Information

7.1.2 Amkor Flip Chip CSP (FCCSP) Package Product Portfolio

7.1.3 Amkor Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Amkor Main Business and Markets Served

7.1.5 Amkor Recent Developments/Updates

7.2 Taiwan Semiconductor Manufacturing

7.2.1 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Company Information

7.2.2 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Product Portfolio

7.2.3 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Taiwan Semiconductor Manufacturing Main Business and Markets Served

7.2.5 Taiwan Semiconductor Manufacturing Recent Developments/Updates

7.3 ASE Group

7.3.1 ASE Group Flip Chip CSP (FCCSP) Package Company Information

7.3.2 ASE Group Flip Chip CSP (FCCSP) Package Product Portfolio

7.3.3 ASE Group Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.3.4 ASE Group Main Business and Markets Served

7.3.5 ASE Group Recent Developments/Updates

7.4 Intel Corporation

7.4.1 Intel Corporation Flip Chip CSP (FCCSP) Package Company Information

7.4.2 Intel Corporation Flip Chip CSP (FCCSP) Package Product Portfolio

7.4.3 Intel Corporation Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Intel Corporation Main Business and Markets Served

7.4.5 Intel Corporation Recent Developments/Updates

7.5 JCET Group Co.,Ltd

7.5.1 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Company Information

7.5.2 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Product Portfolio

7.5.3 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.5.4 JCET Group Co.,Ltd Main Business and Markets Served

7.5.5 JCET Group Co.,Ltd Recent Developments/Updates

7.6 Samsung Group

7.6.1 Samsung Group Flip Chip CSP (FCCSP) Package Company Information

7.6.2 Samsung Group Flip Chip CSP (FCCSP) Package Product Portfolio

7.6.3 Samsung Group Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Samsung Group Main Business and Markets Served

7.6.5 Samsung Group Recent Developments/Updates

7.7 SPIL

7.7.1 SPIL Flip Chip CSP (FCCSP) Package Company Information

7.7.2 SPIL Flip Chip CSP (FCCSP) Package Product Portfolio

7.7.3 SPIL Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.7.4 SPIL Main Business and Markets Served

7.7.5 SPIL Recent Developments/Updates

7.8 Powertech Technology

7.8.1 Powertech Technology Flip Chip CSP (FCCSP) Package Company Information

7.8.2 Powertech Technology Flip Chip CSP (FCCSP) Package Product Portfolio

7.8.3 Powertech Technology Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Powertech Technology Main Business and Markets Served

7.8.5 Powertech Technology Recent Developments/Updates

7.9 Tongfu Microelectronics Co., Ltd

7.9.1 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Company Information

7.9.2 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Product Portfolio

7.9.3 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Tongfu Microelectronics Co., Ltd Main Business and Markets Served

7.9.5 Tongfu Microelectronics Co., Ltd Recent Developments/Updates

7.10 Tianshui Huatian Technology Co., Ltd

7.10.1 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Company Information

7.10.2 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Product Portfolio

7.10.3 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.10.4 Tianshui Huatian Technology Co., Ltd Main Business and Markets Served

7.10.5 Tianshui Huatian Technology Co., Ltd Recent Developments/Updates

7.11 United Microelectronics

7.11.1 United Microelectronics Flip Chip CSP (FCCSP) Package Company Information

7.11.2 United Microelectronics Flip Chip CSP (FCCSP) Package Product Portfolio

7.11.3 United Microelectronics Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.11.4 United Microelectronics Main Business and Markets Served

7.11.5 United Microelectronics Recent Developments/Updates

7.12 SFA Semicon

7.12.1 SFA Semicon Flip Chip CSP (FCCSP) Package Company Information

7.12.2 SFA Semicon Flip Chip CSP (FCCSP) Package Product Portfolio

7.12.3 SFA Semicon Flip Chip CSP (FCCSP) Package Production, Value, Price and Gross Margin (2020-2025)

7.12.4 SFA Semicon Main Business and Markets Served

7.12.5 SFA Semicon Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Flip Chip CSP (FCCSP) Package Industry Chain Analysis

8.2 Flip Chip CSP (FCCSP) Package Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Flip Chip CSP (FCCSP) Package Production Mode & Process Analysis

8.4 Flip Chip CSP (FCCSP) Package Sales and Marketing

8.4.1 Flip Chip CSP (FCCSP) Package Sales Channels

8.4.2 Flip Chip CSP (FCCSP) Package Distributors

8.5 Flip Chip CSP (FCCSP) Package Customer Analysis

9 Flip Chip CSP (FCCSP) Package Market Dynamics

9.1 Flip Chip CSP (FCCSP) Package Industry Trends

9.2 Flip Chip CSP (FCCSP) Package Market Drivers

9.3 Flip Chip CSP (FCCSP) Package Market Challenges

9.4 Flip Chip CSP (FCCSP) Package Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

Amkor

Taiwan Semiconductor Manufacturing

ASE Group

Intel Corporation

Samsung Group

SPIL

Powertech Technology

Tongfu Microelectronics Co., Ltd.

Tianshui Huatian Technology Co., Ltd

United Microelectronics

SFA Semicon

JCET Group Co.,Ltd

List of Tables

Table 1. Global Flip Chip CSP (FCCSP) Package Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Flip Chip CSP (FCCSP) Package Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Flip Chip CSP (FCCSP) Package Production Capacity (K Units) by Manufacturers in 2024

Table 4. Global Flip Chip CSP (FCCSP) Package Production by Manufacturers (2020-2025) & (K Units)

Table 5. Global Flip Chip CSP (FCCSP) Package Production Market Share by Manufacturers (2020-2025)

Table 6. Global Flip Chip CSP (FCCSP) Package Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Flip Chip CSP (FCCSP) Package Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Flip Chip CSP (FCCSP) Package, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Flip Chip CSP (FCCSP) Package as of 2024)

Table 10. Global Market Flip Chip CSP (FCCSP) Package Average Price by Manufacturers (US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Product Offered and Application

Table 13. Global Key Manufacturers of Flip Chip CSP (FCCSP) Package, Date of Enter into This Industry

Table 14. Global Flip Chip CSP (FCCSP) Package Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Flip Chip CSP (FCCSP) Package Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Flip Chip CSP (FCCSP) Package Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Region (2020-2025)

Table 19. Global Flip Chip CSP (FCCSP) Package Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Flip Chip CSP (FCCSP) Package Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Flip Chip CSP (FCCSP) Package Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)

Table 22. Global Flip Chip CSP (FCCSP) Package Production (K Units) by Region (2020-2025)

Table 23. Global Flip Chip CSP (FCCSP) Package Production Market Share by Region (2020-2025)

Table 24. Global Flip Chip CSP (FCCSP) Package Production (K Units) Forecast by Region (2026-2031)

Table 25. Global Flip Chip CSP (FCCSP) Package Production Market Share Forecast by Region (2026-2031)

Table 26. Global Flip Chip CSP (FCCSP) Package Market Average Price (US$/Unit) by Region (2020-2025)

Table 27. Global Flip Chip CSP (FCCSP) Package Market Average Price (US$/Unit) by Region (2026-2031)

Table 28. Global Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)

Table 29. Global Flip Chip CSP (FCCSP) Package Consumption by Region (2020-2025) & (K Units)

Table 30. Global Flip Chip CSP (FCCSP) Package Consumption Market Share by Region (2020-2025)

Table 31. Global Flip Chip CSP (FCCSP) Package Forecasted Consumption by Region (2026-2031) & (K Units)

Table 32. Global Flip Chip CSP (FCCSP) Package Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 34. North America Flip Chip CSP (FCCSP) Package Consumption by Country (2020-2025) & (K Units)

Table 35. North America Flip Chip CSP (FCCSP) Package Consumption by Country (2026-2031) & (K Units)

Table 36. Europe Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 37. Europe Flip Chip CSP (FCCSP) Package Consumption by Country (2020-2025) & (K Units)

Table 38. Europe Flip Chip CSP (FCCSP) Package Consumption by Country (2026-2031) & (K Units)

Table 39. Asia Pacific Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)

Table 40. Asia Pacific Flip Chip CSP (FCCSP) Package Consumption by Region (2020-2025) & (K Units)

Table 41. Asia Pacific Flip Chip CSP (FCCSP) Package Consumption by Region (2026-2031) & (K Units)

Table 42. Latin America, Middle East & Africa Flip Chip CSP (FCCSP) Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)

Table 43. Latin America, Middle East & Africa Flip Chip CSP (FCCSP) Package Consumption by Country (2020-2025) & (K Units)

Table 44. Latin America, Middle East & Africa Flip Chip CSP (FCCSP) Package Consumption by Country (2026-2031) & (K Units)

Table 45. Global Flip Chip CSP (FCCSP) Package Production (K Units) by Type (2020-2025)

Table 46. Global Flip Chip CSP (FCCSP) Package Production (K Units) by Type (2026-2031)

Table 47. Global Flip Chip CSP (FCCSP) Package Production Market Share by Type (2020-2025)

Table 48. Global Flip Chip CSP (FCCSP) Package Production Market Share by Type (2026-2031)

Table 49. Global Flip Chip CSP (FCCSP) Package Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Flip Chip CSP (FCCSP) Package Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Type (2020-2025)

Table 52. Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Type (2026-2031)

Table 53. Global Flip Chip CSP (FCCSP) Package Price (US$/Unit) by Type (2020-2025)

Table 54. Global Flip Chip CSP (FCCSP) Package Price (US$/Unit) by Type (2026-2031)

Table 55. Global Flip Chip CSP (FCCSP) Package Production (K Units) by Application (2020-2025)

Table 56. Global Flip Chip CSP (FCCSP) Package Production (K Units) by Application (2026-2031)

Table 57. Global Flip Chip CSP (FCCSP) Package Production Market Share by Application (2020-2025)

Table 58. Global Flip Chip CSP (FCCSP) Package Production Market Share by Application (2026-2031)

Table 59. Global Flip Chip CSP (FCCSP) Package Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Flip Chip CSP (FCCSP) Package Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Application (2020-2025)

Table 62. Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Application (2026-2031)

Table 63. Global Flip Chip CSP (FCCSP) Package Price (US$/Unit) by Application (2020-2025)

Table 64. Global Flip Chip CSP (FCCSP) Package Price (US$/Unit) by Application (2026-2031)

Table 65. Amkor Flip Chip CSP (FCCSP) Package Company Information

Table 66. Amkor Flip Chip CSP (FCCSP) Package Specification and Application

Table 67. Amkor Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 68. Amkor Main Business and Markets Served

Table 69. Amkor Recent Developments/Updates

Table 70. Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Company Information

Table 71. Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Specification and Application

Table 72. Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 73. Taiwan Semiconductor Manufacturing Main Business and Markets Served

Table 74. Taiwan Semiconductor Manufacturing Recent Developments/Updates

Table 75. ASE Group Flip Chip CSP (FCCSP) Package Company Information

Table 76. ASE Group Flip Chip CSP (FCCSP) Package Specification and Application

Table 77. ASE Group Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 78. ASE Group Main Business and Markets Served

Table 79. ASE Group Recent Developments/Updates

Table 80. Intel Corporation Flip Chip CSP (FCCSP) Package Company Information

Table 81. Intel Corporation Flip Chip CSP (FCCSP) Package Specification and Application

Table 82. Intel Corporation Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 83. Intel Corporation Main Business and Markets Served

Table 84. Intel Corporation Recent Developments/Updates

Table 85. JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Company Information

Table 86. JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Specification and Application

Table 87. JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 88. JCET Group Co.,Ltd Main Business and Markets Served

Table 89. JCET Group Co.,Ltd Recent Developments/Updates

Table 90. Samsung Group Flip Chip CSP (FCCSP) Package Company Information

Table 91. Samsung Group Flip Chip CSP (FCCSP) Package Specification and Application

Table 92. Samsung Group Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 93. Samsung Group Main Business and Markets Served

Table 94. Samsung Group Recent Developments/Updates

Table 95. SPIL Flip Chip CSP (FCCSP) Package Company Information

Table 96. SPIL Flip Chip CSP (FCCSP) Package Specification and Application

Table 97. SPIL Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 98. SPIL Main Business and Markets Served

Table 99. SPIL Recent Developments/Updates

Table 100. Powertech Technology Flip Chip CSP (FCCSP) Package Company Information

Table 101. Powertech Technology Flip Chip CSP (FCCSP) Package Specification and Application

Table 102. Powertech Technology Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 103. Powertech Technology Main Business and Markets Served

Table 104. Powertech Technology Recent Developments/Updates

Table 105. Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Company Information

Table 106. Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Specification and Application

Table 107. Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 108. Tongfu Microelectronics Co., Ltd Main Business and Markets Served

Table 109. Tongfu Microelectronics Co., Ltd Recent Developments/Updates

Table 110. Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Company Information

Table 111. Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Specification and Application

Table 112. Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 113. Tianshui Huatian Technology Co., Ltd Main Business and Markets Served

Table 114. Tianshui Huatian Technology Co., Ltd Recent Developments/Updates

Table 115. United Microelectronics Flip Chip CSP (FCCSP) Package Company Information

Table 116. United Microelectronics Flip Chip CSP (FCCSP) Package Specification and Application

Table 117. United Microelectronics Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 118. United Microelectronics Main Business and Markets Served

Table 119. United Microelectronics Recent Developments/Updates

Table 120. SFA Semicon Flip Chip CSP (FCCSP) Package Company Information

Table 121. SFA Semicon Flip Chip CSP (FCCSP) Package Specification and Application

Table 122. SFA Semicon Flip Chip CSP (FCCSP) Package Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 123. SFA Semicon Main Business and Markets Served

Table 124. SFA Semicon Recent Developments/Updates

Table 125. Key Raw Materials Lists

Table 126. Raw Materials Key Suppliers Lists

Table 127. Flip Chip CSP (FCCSP) Package Distributors List

Table 128. Flip Chip CSP (FCCSP) Package Customers List

Table 129. Flip Chip CSP (FCCSP) Package Market Trends

Table 130. Flip Chip CSP (FCCSP) Package Market Drivers

Table 131. Flip Chip CSP (FCCSP) Package Market Challenges

Table 132. Flip Chip CSP (FCCSP) Package Market Restraints

Table 133. Research Programs/Design for This Report

Table 134. Key Data Information from Secondary Sources

Table 135. Key Data Information from Primary Sources

Table 136. Authors List of This Report

List of Figures

Figure 1. Product Picture of Flip Chip CSP (FCCSP) Package

Figure 2. Global Flip Chip CSP (FCCSP) Package Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Flip Chip CSP (FCCSP) Package Market Share by Type: 2024 VS 2031

Figure 4. Bare Die Type Product Picture

Figure 5. Molded (CUF, MUF) Type Product Picture

Figure 6. SiP Type Product Picture

Figure 7. Hybrid (fcSCSP) Type Product Picture

Figure 8. Others Product Picture

Figure 9. Global Flip Chip CSP (FCCSP) Package Market Value by Application, (US$ Million) & (2020-2031)

Figure 10. Global Flip Chip CSP (FCCSP) Package Market Share by Application: 2024 VS 2031

Figure 11. Auto and Transportation

Figure 12. Consumer Electronics

Figure 13. Communication

Figure 14. Others

Figure 15. Global Flip Chip CSP (FCCSP) Package Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 16. Global Flip Chip CSP (FCCSP) Package Production Value (US$ Million) & (2020-2031)

Figure 17. Global Flip Chip CSP (FCCSP) Package Production Capacity (K Units) & (2020-2031)

Figure 18. Global Flip Chip CSP (FCCSP) Package Production (K Units) & (2020-2031)

Figure 19. Global Flip Chip CSP (FCCSP) Package Average Price (US$/Unit) & (2020-2031)

Figure 20. Flip Chip CSP (FCCSP) Package Report Years Considered

Figure 21. Flip Chip CSP (FCCSP) Package Production Share by Manufacturers in 2024

Figure 22. Global Flip Chip CSP (FCCSP) Package Production Value Share by Manufacturers (2024)

Figure 23. Flip Chip CSP (FCCSP) Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 24. The Global 5 and 10 Largest Players: Market Share by Flip Chip CSP (FCCSP) Package Revenue in 2024

Figure 25. Global Flip Chip CSP (FCCSP) Package Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 26. Global Flip Chip CSP (FCCSP) Package Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 27. Global Flip Chip CSP (FCCSP) Package Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)

Figure 28. Global Flip Chip CSP (FCCSP) Package Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 29. North America Flip Chip CSP (FCCSP) Package Production Value (US$ Million) Growth Rate (2020-2031)

Figure 30. Europe Flip Chip CSP (FCCSP) Package Production Value (US$ Million) Growth Rate (2020-2031)

Figure 31. China Flip Chip CSP (FCCSP) Package Production Value (US$ Million) Growth Rate (2020-2031)

Figure 32. Japan Flip Chip CSP (FCCSP) Package Production Value (US$ Million) Growth Rate (2020-2031)

Figure 33. South Korea Flip Chip CSP (FCCSP) Package Production Value (US$ Million) Growth Rate (2020-2031)

Figure 34. Global Flip Chip CSP (FCCSP) Package Consumption by Region: 2020 VS 2024 VS 2031 (K Units)

Figure 35. Global Flip Chip CSP (FCCSP) Package Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 36. North America Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 37. North America Flip Chip CSP (FCCSP) Package Consumption Market Share by Country (2020-2031)

Figure 38. U.S. Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 39. Canada Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 40. Europe Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 41. Europe Flip Chip CSP (FCCSP) Package Consumption Market Share by Country (2020-2031)

Figure 42. Germany Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 43. France Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 44. U.K. Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 45. Italy Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 46. Netherlands Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 47. Asia Pacific Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 48. Asia Pacific Flip Chip CSP (FCCSP) Package Consumption Market Share by Region (2020-2031)

Figure 49. China Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 50. Japan Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 51. South Korea Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 52. China Taiwan Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 53. Southeast Asia Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 54. India Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 55. Latin America, Middle East & Africa Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 56. Latin America, Middle East & Africa Flip Chip CSP (FCCSP) Package Consumption Market Share by Country (2020-2031)

Figure 57. Mexico Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 58. Brazil Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 59. Israel Flip Chip CSP (FCCSP) Package Consumption and Growth Rate (2020-2031) & (K Units)

Figure 60. Global Production Market Share of Flip Chip CSP (FCCSP) Package by Type (2020-2031)

Figure 61. Global Production Value Market Share of Flip Chip CSP (FCCSP) Package by Type (2020-2031)

Figure 62. Global Flip Chip CSP (FCCSP) Package Price (US$/Unit) by Type (2020-2031)

Figure 63. Global Production Market Share of Flip Chip CSP (FCCSP) Package by Application (2020-2031)

Figure 64. Global Production Value Market Share of Flip Chip CSP (FCCSP) Package by Application (2020-2031)

Figure 65. Global Flip Chip CSP (FCCSP) Package Price (US$/Unit) by Application (2020-2031)

Figure 66. Flip Chip CSP (FCCSP) Package Value Chain

Figure 67. Channels of Distribution (Direct Vs Distribution)

Figure 68. Bottom-up and Top-down Approaches for This Report

Figure 69. Data Triangulation

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