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Global Semiconductor Wafer Grinding Equipment Market Research Report 2025

Published Date: March 2025

Report Code: QYRE-Auto-25O7042

Global Semiconductor Wafer Grinding Equipment Market Insights and Forecast to 2028

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Global Semiconductor Wafer Grinding Equipment Market Research Report 2025

Code: QYRE-Auto-25O7042

Report

March 2025

Pages:102

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Revasum

Tokyo Seimitsu

Disco

G&N

CETC

Koyo Machinery

WAIDA MFG

Hunan Yujing Machine Industrial

SpeedFam

TSD

Engis Corporation

NTS

Semiconductor Wafer Grinding Equipment Market Size

The global market for Semiconductor Wafer Grinding Equipment was valued at US$ 1200 million in the year 2024 and is projected to reach a revised size of US$ 1945 million by 2031, growing at a CAGR of 7.0% during the forecast period.

Semiconductor Wafer Grinding Equipment Market

A Semiconductor Wafer Grinder is a type of Semiconductor Wafer Grinder specifically designed to offer superior rigidity and stability during the grinding process. This enhanced rigidity helps ensure the high precision and accuracy required for wafer thinning and surface finishing in semiconductor manufacturing. Semiconductor Wafer Grinders are particularly important for processing large-diameter wafers, such as 300mm or larger wafers, where maintaining consistency and reducing the potential for vibrations are critical to avoid surface defects or irregularities. These grinders are equipped with advanced control systems, strong mechanical structures, and high-performance grinding wheels to achieve high throughput and precise wafer thickness uniformity.

The semiconductor wafer grinding equipment market plays a pivotal role in the global semiconductor manufacturing industry. This equipment, which is primarily used to process wafers into highly precise, smooth, and uniformly thin substrates, is critical in the production of semiconductor devices, including integrated circuits and optoelectronic components. The market can be divided into two primary types of equipment: Wafer Edge Grinders and Wafer Surface Grinders. Among these, Wafer Surface Grinders dominate the global market, holding an estimated 87% of the total market share.

The major application areas for wafer grinding equipment include Silicon Wafers and Compound Semiconductors. Silicon Wafers are by far the most prominent application, accounting for over 90% of the global demand. Silicon, being the fundamental material for semiconductor manufacturing, is the backbone of the semiconductor industry, driving much of the market for wafer grinding equipment. Compound semiconductors, used in high-performance applications like LEDs and power electronics, also constitute a growing segment of the market.

Asia-Pacific (APAC) stands as the largest consumer of semiconductor wafer grinding equipment, accounting for approximately 78% of the global market. The region’s dominance is largely attributed to the strong presence of semiconductor manufacturing hubs in countries such as China, Japan, South Korea, and Taiwan. These regions serve as the epicenter of semiconductor production, fueling the demand for high-precision wafer grinding equipment to meet the stringent requirements of advanced semiconductor devices.

In conclusion, the semiconductor wafer grinding equipment market is characterized by its dominance in the Wafer Surface Grinder segment, driven primarily by the demand for Silicon Wafers. The global market’s significant reliance on this equipment highlights its critical importance in ensuring the precision and quality of semiconductor devices. The increasing adoption of semiconductor technology across a wide range of industries, from consumer electronics to automotive, continues to propel the growth of this market.

The market drivers are multifaceted, with the most prominent being the continuous advancement in semiconductor technology. The demand for more powerful, energy-efficient, and miniaturized electronic devices fuels the need for high-precision wafer grinding equipment. Technologies such as 5G, Artificial Intelligence (AI), and the Internet of Things (IoT) are accelerating the need for cutting-edge semiconductor devices, which in turn drives the demand for wafer grinding equipment capable of meeting increasingly stringent manufacturing requirements.

The high demand for Silicon Wafers is another major driving force in the market. Silicon remains the material of choice for the vast majority of semiconductor applications, particularly in the production of integrated circuits (ICs), sensors, and photovoltaic cells. As the demand for these devices continues to rise, the requirement for efficient and precise wafer grinding equipment remains strong.

Asia-Pacific continues to be the largest market for wafer grinding equipment, accounting for a significant portion of global demand. The region’s dominance is expected to continue, driven by the continued growth of semiconductor manufacturing and the increasing demand for advanced semiconductor devices. With major semiconductor hubs in countries like China, Taiwan, and South Korea, the APAC region continues to lead global semiconductor production, making it a key consumer of wafer grinding equipment.

Despite the promising growth prospects, several challenges could potentially hinder the market’s progress. One of the major challenges is the high cost of wafer grinding equipment. Advanced machines, particularly those that offer the highest precision and automation, can be prohibitively expensive. For smaller semiconductor manufacturers, the cost of acquiring and maintaining such equipment could be a significant barrier to entry.

Another challenge is the intense market competition. The wafer grinding equipment market is highly competitive, with numerous manufacturers vying for market share. This competition can drive prices down, which may squeeze profit margins for manufacturers. Additionally, technological advancements in wafer grinding equipment require constant investment in research and development, which can be costly and time-consuming.

The need for skilled labor also presents a challenge. Operating and maintaining wafer grinding equipment requires specialized knowledge and expertise. However, the semiconductor industry, in general, is facing a shortage of skilled workers, which could impact the efficiency and productivity of wafer grinding operations. Additionally, the complexity of modern wafer grinding equipment requires ongoing training and development for operators, adding further strain on human resources.

Supply chain disruptions are another potential hindrance to the growth of the wafer grinding equipment market. The semiconductor industry is heavily reliant on a complex and global supply chain, and any disruptions—whether due to geopolitical tensions, trade restrictions, or natural disasters—could delay the production and delivery of essential components required for wafer grinding machines. These disruptions could lead to increased costs and delays, ultimately affecting the production capacity of semiconductor manufacturers.

Looking to the future, the wafer grinding equipment market is poised for continued growth. The increasing demand for advanced semiconductor devices, particularly those used in emerging technologies such as 5G, AI, and IoT, will continue to drive the need for high-precision wafer grinding equipment. Additionally, as semiconductor devices become more advanced and complex, the requirement for increasingly precise and efficient wafer grinding equipment will only grow.

In conclusion, the semiconductor wafer grinding equipment market is in a favorable position to grow over the coming years, driven by the increasing demand for advanced semiconductor devices and the continued development of cutting-edge semiconductor manufacturing technologies. However, to fully capitalize on this growth, manufacturers must address challenges such as high equipment costs, intense market competition, and labor shortages. By investing in technological innovation, improving operational efficiency, and enhancing the skill sets of the workforce, wafer grinding equipment manufacturers can position themselves for success in this rapidly evolving market.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Semiconductor Wafer Grinding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Wafer Grinding Equipment.

The Semiconductor Wafer Grinding Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Semiconductor Wafer Grinding Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Semiconductor Wafer Grinding Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Semiconductor Wafer Grinding Equipment Market Report

Report Metric	Details
Report Name	Semiconductor Wafer Grinding Equipment Market
Accounted market size in year	US$ 1200 million
Forecasted market size in 2031	US$ 1945 million
CAGR	7.0%
Base Year	year
Forecasted years	2025 - 2031
by Type	Wafer Edge Grinder Wafer Surface Grinder
by Application	Silicon Wafer Compound Semiconductors
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation, NTS
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semiconductor Wafer Grinding Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semiconductor Wafer Grinding Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semiconductor Wafer Grinding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Semiconductor Wafer Grinding Equipment Market growing?

Ans: The Semiconductor Wafer Grinding Equipment Market witnessing a CAGR of 7.0% during the forecast period 2025-2031.

What is the Semiconductor Wafer Grinding Equipment Market size in 2031?

Ans: The Semiconductor Wafer Grinding Equipment Market size in 2031 will be US$ 1945 million.

Who are the main players in the Semiconductor Wafer Grinding Equipment Market report?

Ans: The main players in the Semiconductor Wafer Grinding Equipment Market are Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation, NTS

What are the Application segmentation covered in the Semiconductor Wafer Grinding Equipment Market report?

Ans: The Applications covered in the Semiconductor Wafer Grinding Equipment Market report are Silicon Wafer, Compound Semiconductors

What are the Type segmentation covered in the Semiconductor Wafer Grinding Equipment Market report?

Ans: The Types covered in the Semiconductor Wafer Grinding Equipment Market report are Wafer Edge Grinder, Wafer Surface Grinder

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Market trends :

Topic	Trends
Global	the semiconductor wafer grinding equipment market is experiencing robust growth driven by rising demand for advanced semiconductor devices, especially in 5g, ai, and iot applications, with asia-pacific leading global consumption.
Type	Wafer Surface Grinder - wafer surface grinders dominate the market, accounting for approximately 87% of global share due to their critical role in achieving high-precision wafer thickness and surface uniformity.
Application	Silicon Wafer - silicon wafers remain the primary application, representing over 90% of demand as the backbone material for integrated circuits and semiconductor devices. Compound Semiconductors - compound semiconductors are a growing application segment, driven by increased use in high-performance electronics such as leds and power devices.
Region	APAC - asia-pacific accounts for approximately 78% of global demand, fueled by major semiconductor manufacturing hubs in china, japan, south korea, and taiwan.

1 Semiconductor Wafer Grinding Equipment Market Overview

1.1 Product Definition

1.2 Semiconductor Wafer Grinding Equipment by Type

1.2.1 Global Semiconductor Wafer Grinding Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Wafer Edge Grinder

1.2.3 Wafer Surface Grinder

1.3 Semiconductor Wafer Grinding Equipment by Application

1.3.1 Global Semiconductor Wafer Grinding Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Silicon Wafer

1.3.3 Compound Semiconductors

1.4 Global Market Growth Prospects

1.4.1 Global Semiconductor Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Semiconductor Wafer Grinding Equipment Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Semiconductor Wafer Grinding Equipment Production Estimates and Forecasts (2020-2031)

1.4.4 Global Semiconductor Wafer Grinding Equipment Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Semiconductor Wafer Grinding Equipment Production Market Share by Manufacturers (2020-2025)

2.2 Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Semiconductor Wafer Grinding Equipment, Industry Ranking, 2023 VS 2024

2.4 Global Semiconductor Wafer Grinding Equipment Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Semiconductor Wafer Grinding Equipment Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Semiconductor Wafer Grinding Equipment, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Semiconductor Wafer Grinding Equipment, Product Offered and Application

2.8 Global Key Manufacturers of Semiconductor Wafer Grinding Equipment, Date of Enter into This Industry

2.9 Semiconductor Wafer Grinding Equipment Market Competitive Situation and Trends

2.9.1 Semiconductor Wafer Grinding Equipment Market Concentration Rate

2.9.2 Global 5 and 10 Largest Semiconductor Wafer Grinding Equipment Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Semiconductor Wafer Grinding Equipment Production by Region

3.1 Global Semiconductor Wafer Grinding Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Semiconductor Wafer Grinding Equipment Production Value by Region (2020-2031)

3.2.1 Global Semiconductor Wafer Grinding Equipment Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Semiconductor Wafer Grinding Equipment by Region (2026-2031)

3.3 Global Semiconductor Wafer Grinding Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Semiconductor Wafer Grinding Equipment Production Volume by Region (2020-2031)

3.4.1 Global Semiconductor Wafer Grinding Equipment Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Semiconductor Wafer Grinding Equipment by Region (2026-2031)

3.5 Global Semiconductor Wafer Grinding Equipment Market Price Analysis by Region (2020-2025)

3.6 Global Semiconductor Wafer Grinding Equipment Production and Value, Year-over-Year Growth

3.6.1 North America Semiconductor Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Semiconductor Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Semiconductor Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Semiconductor Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

4 Semiconductor Wafer Grinding Equipment Consumption by Region

4.1 Global Semiconductor Wafer Grinding Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Semiconductor Wafer Grinding Equipment Consumption by Region (2020-2031)

4.2.1 Global Semiconductor Wafer Grinding Equipment Consumption by Region (2020-2025)

4.2.2 Global Semiconductor Wafer Grinding Equipment Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Semiconductor Wafer Grinding Equipment Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Semiconductor Wafer Grinding Equipment Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Semiconductor Wafer Grinding Equipment Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Semiconductor Wafer Grinding Equipment Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Israel

5 Segment by Type

5.1 Global Semiconductor Wafer Grinding Equipment Production by Type (2020-2031)

5.1.1 Global Semiconductor Wafer Grinding Equipment Production by Type (2020-2025)

5.1.2 Global Semiconductor Wafer Grinding Equipment Production by Type (2026-2031)

5.1.3 Global Semiconductor Wafer Grinding Equipment Production Market Share by Type (2020-2031)

5.2 Global Semiconductor Wafer Grinding Equipment Production Value by Type (2020-2031)

5.2.1 Global Semiconductor Wafer Grinding Equipment Production Value by Type (2020-2025)

5.2.2 Global Semiconductor Wafer Grinding Equipment Production Value by Type (2026-2031)

5.2.3 Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Type (2020-2031)

5.3 Global Semiconductor Wafer Grinding Equipment Price by Type (2020-2031)

6 Segment by Application

6.1 Global Semiconductor Wafer Grinding Equipment Production by Application (2020-2031)

6.1.1 Global Semiconductor Wafer Grinding Equipment Production by Application (2020-2025)

6.1.2 Global Semiconductor Wafer Grinding Equipment Production by Application (2026-2031)

6.1.3 Global Semiconductor Wafer Grinding Equipment Production Market Share by Application (2020-2031)

6.2 Global Semiconductor Wafer Grinding Equipment Production Value by Application (2020-2031)

6.2.1 Global Semiconductor Wafer Grinding Equipment Production Value by Application (2020-2025)

6.2.2 Global Semiconductor Wafer Grinding Equipment Production Value by Application (2026-2031)

6.2.3 Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Application (2020-2031)

6.3 Global Semiconductor Wafer Grinding Equipment Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Disco

7.1.1 Disco Semiconductor Wafer Grinding Equipment Company Information

7.1.2 Disco Semiconductor Wafer Grinding Equipment Product Portfolio

7.1.3 Disco Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Disco Main Business and Markets Served

7.1.5 Disco Recent Developments/Updates

7.2 TOKYO SEIMITSU

7.2.1 TOKYO SEIMITSU Semiconductor Wafer Grinding Equipment Company Information

7.2.2 TOKYO SEIMITSU Semiconductor Wafer Grinding Equipment Product Portfolio

7.2.3 TOKYO SEIMITSU Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.2.4 TOKYO SEIMITSU Main Business and Markets Served

7.2.5 TOKYO SEIMITSU Recent Developments/Updates

7.3 G&N

7.3.1 G&N Semiconductor Wafer Grinding Equipment Company Information

7.3.2 G&N Semiconductor Wafer Grinding Equipment Product Portfolio

7.3.3 G&N Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.3.4 G&N Main Business and Markets Served

7.3.5 G&N Recent Developments/Updates

7.4 Okamoto Semiconductor Equipment Division

7.4.1 Okamoto Semiconductor Equipment Division Semiconductor Wafer Grinding Equipment Company Information

7.4.2 Okamoto Semiconductor Equipment Division Semiconductor Wafer Grinding Equipment Product Portfolio

7.4.3 Okamoto Semiconductor Equipment Division Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Okamoto Semiconductor Equipment Division Main Business and Markets Served

7.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates

7.5 CETC

7.5.1 CETC Semiconductor Wafer Grinding Equipment Company Information

7.5.2 CETC Semiconductor Wafer Grinding Equipment Product Portfolio

7.5.3 CETC Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.5.4 CETC Main Business and Markets Served

7.5.5 CETC Recent Developments/Updates

7.6 Koyo Machinery

7.6.1 Koyo Machinery Semiconductor Wafer Grinding Equipment Company Information

7.6.2 Koyo Machinery Semiconductor Wafer Grinding Equipment Product Portfolio

7.6.3 Koyo Machinery Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Koyo Machinery Main Business and Markets Served

7.6.5 Koyo Machinery Recent Developments/Updates

7.7 Revasum

7.7.1 Revasum Semiconductor Wafer Grinding Equipment Company Information

7.7.2 Revasum Semiconductor Wafer Grinding Equipment Product Portfolio

7.7.3 Revasum Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Revasum Main Business and Markets Served

7.7.5 Revasum Recent Developments/Updates

7.8 WAIDA MFG

7.8.1 WAIDA MFG Semiconductor Wafer Grinding Equipment Company Information

7.8.2 WAIDA MFG Semiconductor Wafer Grinding Equipment Product Portfolio

7.8.3 WAIDA MFG Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.8.4 WAIDA MFG Main Business and Markets Served

7.8.5 WAIDA MFG Recent Developments/Updates

7.9 Hunan Yujing Machine Industrial

7.9.1 Hunan Yujing Machine Industrial Semiconductor Wafer Grinding Equipment Company Information

7.9.2 Hunan Yujing Machine Industrial Semiconductor Wafer Grinding Equipment Product Portfolio

7.9.3 Hunan Yujing Machine Industrial Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Hunan Yujing Machine Industrial Main Business and Markets Served

7.9.5 Hunan Yujing Machine Industrial Recent Developments/Updates

7.10 SpeedFam

7.10.1 SpeedFam Semiconductor Wafer Grinding Equipment Company Information

7.10.2 SpeedFam Semiconductor Wafer Grinding Equipment Product Portfolio

7.10.3 SpeedFam Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.10.4 SpeedFam Main Business and Markets Served

7.10.5 SpeedFam Recent Developments/Updates

7.11 TSD

7.11.1 TSD Semiconductor Wafer Grinding Equipment Company Information

7.11.2 TSD Semiconductor Wafer Grinding Equipment Product Portfolio

7.11.3 TSD Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.11.4 TSD Main Business and Markets Served

7.11.5 TSD Recent Developments/Updates

7.12 Engis Corporation

7.12.1 Engis Corporation Semiconductor Wafer Grinding Equipment Company Information

7.12.2 Engis Corporation Semiconductor Wafer Grinding Equipment Product Portfolio

7.12.3 Engis Corporation Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.12.4 Engis Corporation Main Business and Markets Served

7.12.5 Engis Corporation Recent Developments/Updates

7.13 NTS

7.13.1 NTS Semiconductor Wafer Grinding Equipment Company Information

7.13.2 NTS Semiconductor Wafer Grinding Equipment Product Portfolio

7.13.3 NTS Semiconductor Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.13.4 NTS Main Business and Markets Served

7.13.5 NTS Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Semiconductor Wafer Grinding Equipment Industry Chain Analysis

8.2 Semiconductor Wafer Grinding Equipment Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Semiconductor Wafer Grinding Equipment Production Mode & Process Analysis

8.4 Semiconductor Wafer Grinding Equipment Sales and Marketing

8.4.1 Semiconductor Wafer Grinding Equipment Sales Channels

8.4.2 Semiconductor Wafer Grinding Equipment Distributors

8.5 Semiconductor Wafer Grinding Equipment Customer Analysis

9 Semiconductor Wafer Grinding Equipment Market Dynamics

9.1 Semiconductor Wafer Grinding Equipment Industry Trends

9.2 Semiconductor Wafer Grinding Equipment Market Drivers

9.3 Semiconductor Wafer Grinding Equipment Market Challenges

9.4 Semiconductor Wafer Grinding Equipment Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

Revasum

Tokyo Seimitsu

Disco

G&N

CETC

Koyo Machinery

WAIDA MFG

Hunan Yujing Machine Industrial

SpeedFam

TSD

Engis Corporation

NTS

List of Tables

Table 1. Global Semiconductor Wafer Grinding Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Semiconductor Wafer Grinding Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Semiconductor Wafer Grinding Equipment Production Capacity (Units) by Manufacturers in 2024

Table 4. Global Semiconductor Wafer Grinding Equipment Production by Manufacturers (2020-2025) & (Units)

Table 5. Global Semiconductor Wafer Grinding Equipment Production Market Share by Manufacturers (2020-2025)

Table 6. Global Semiconductor Wafer Grinding Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Semiconductor Wafer Grinding Equipment Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Semiconductor Wafer Grinding Equipment, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Semiconductor Wafer Grinding Equipment as of 2024)

Table 10. Global Market Semiconductor Wafer Grinding Equipment Average Price by Manufacturers (K US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Semiconductor Wafer Grinding Equipment, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Semiconductor Wafer Grinding Equipment, Product Offered and Application

Table 13. Global Key Manufacturers of Semiconductor Wafer Grinding Equipment, Date of Enter into This Industry

Table 14. Global Semiconductor Wafer Grinding Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Semiconductor Wafer Grinding Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Semiconductor Wafer Grinding Equipment Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Region (2020-2025)

Table 19. Global Semiconductor Wafer Grinding Equipment Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Semiconductor Wafer Grinding Equipment Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Semiconductor Wafer Grinding Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global Semiconductor Wafer Grinding Equipment Production (Units) by Region (2020-2025)

Table 23. Global Semiconductor Wafer Grinding Equipment Production Market Share by Region (2020-2025)

Table 24. Global Semiconductor Wafer Grinding Equipment Production (Units) Forecast by Region (2026-2031)

Table 25. Global Semiconductor Wafer Grinding Equipment Production Market Share Forecast by Region (2026-2031)

Table 26. Global Semiconductor Wafer Grinding Equipment Market Average Price (K US$/Unit) by Region (2020-2025)

Table 27. Global Semiconductor Wafer Grinding Equipment Market Average Price (K US$/Unit) by Region (2026-2031)

Table 28. Global Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global Semiconductor Wafer Grinding Equipment Consumption by Region (2020-2025) & (Units)

Table 30. Global Semiconductor Wafer Grinding Equipment Consumption Market Share by Region (2020-2025)

Table 31. Global Semiconductor Wafer Grinding Equipment Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global Semiconductor Wafer Grinding Equipment Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America Semiconductor Wafer Grinding Equipment Consumption by Country (2020-2025) & (Units)

Table 35. North America Semiconductor Wafer Grinding Equipment Consumption by Country (2026-2031) & (Units)

Table 36. Europe Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe Semiconductor Wafer Grinding Equipment Consumption by Country (2020-2025) & (Units)

Table 38. Europe Semiconductor Wafer Grinding Equipment Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific Semiconductor Wafer Grinding Equipment Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific Semiconductor Wafer Grinding Equipment Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa Semiconductor Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa Semiconductor Wafer Grinding Equipment Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa Semiconductor Wafer Grinding Equipment Consumption by Country (2026-2031) & (Units)

Table 45. Global Semiconductor Wafer Grinding Equipment Production (Units) by Type (2020-2025)

Table 46. Global Semiconductor Wafer Grinding Equipment Production (Units) by Type (2026-2031)

Table 47. Global Semiconductor Wafer Grinding Equipment Production Market Share by Type (2020-2025)

Table 48. Global Semiconductor Wafer Grinding Equipment Production Market Share by Type (2026-2031)

Table 49. Global Semiconductor Wafer Grinding Equipment Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Semiconductor Wafer Grinding Equipment Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Type (2020-2025)

Table 52. Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Type (2026-2031)

Table 53. Global Semiconductor Wafer Grinding Equipment Price (K US$/Unit) by Type (2020-2025)

Table 54. Global Semiconductor Wafer Grinding Equipment Price (K US$/Unit) by Type (2026-2031)

Table 55. Global Semiconductor Wafer Grinding Equipment Production (Units) by Application (2020-2025)

Table 56. Global Semiconductor Wafer Grinding Equipment Production (Units) by Application (2026-2031)

Table 57. Global Semiconductor Wafer Grinding Equipment Production Market Share by Application (2020-2025)

Table 58. Global Semiconductor Wafer Grinding Equipment Production Market Share by Application (2026-2031)

Table 59. Global Semiconductor Wafer Grinding Equipment Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Semiconductor Wafer Grinding Equipment Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Application (2020-2025)

Table 62. Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Application (2026-2031)

Table 63. Global Semiconductor Wafer Grinding Equipment Price (K US$/Unit) by Application (2020-2025)

Table 64. Global Semiconductor Wafer Grinding Equipment Price (K US$/Unit) by Application (2026-2031)

Table 65. Disco Semiconductor Wafer Grinding Equipment Company Information

Table 66. Disco Semiconductor Wafer Grinding Equipment Specification and Application

Table 67. Disco Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 68. Disco Main Business and Markets Served

Table 69. Disco Recent Developments/Updates

Table 70. TOKYO SEIMITSU Semiconductor Wafer Grinding Equipment Company Information

Table 71. TOKYO SEIMITSU Semiconductor Wafer Grinding Equipment Specification and Application

Table 72. TOKYO SEIMITSU Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 73. TOKYO SEIMITSU Main Business and Markets Served

Table 74. TOKYO SEIMITSU Recent Developments/Updates

Table 75. G&N Semiconductor Wafer Grinding Equipment Company Information

Table 76. G&N Semiconductor Wafer Grinding Equipment Specification and Application

Table 77. G&N Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 78. G&N Main Business and Markets Served

Table 79. G&N Recent Developments/Updates

Table 80. Okamoto Semiconductor Equipment Division Semiconductor Wafer Grinding Equipment Company Information

Table 81. Okamoto Semiconductor Equipment Division Semiconductor Wafer Grinding Equipment Specification and Application

Table 82. Okamoto Semiconductor Equipment Division Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 83. Okamoto Semiconductor Equipment Division Main Business and Markets Served

Table 84. Okamoto Semiconductor Equipment Division Recent Developments/Updates

Table 85. CETC Semiconductor Wafer Grinding Equipment Company Information

Table 86. CETC Semiconductor Wafer Grinding Equipment Specification and Application

Table 87. CETC Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 88. CETC Main Business and Markets Served

Table 89. CETC Recent Developments/Updates

Table 90. Koyo Machinery Semiconductor Wafer Grinding Equipment Company Information

Table 91. Koyo Machinery Semiconductor Wafer Grinding Equipment Specification and Application

Table 92. Koyo Machinery Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 93. Koyo Machinery Main Business and Markets Served

Table 94. Koyo Machinery Recent Developments/Updates

Table 95. Revasum Semiconductor Wafer Grinding Equipment Company Information

Table 96. Revasum Semiconductor Wafer Grinding Equipment Specification and Application

Table 97. Revasum Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 98. Revasum Main Business and Markets Served

Table 99. Revasum Recent Developments/Updates

Table 100. WAIDA MFG Semiconductor Wafer Grinding Equipment Company Information

Table 101. WAIDA MFG Semiconductor Wafer Grinding Equipment Specification and Application

Table 102. WAIDA MFG Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 103. WAIDA MFG Main Business and Markets Served

Table 104. WAIDA MFG Recent Developments/Updates

Table 105. Hunan Yujing Machine Industrial Semiconductor Wafer Grinding Equipment Company Information

Table 106. Hunan Yujing Machine Industrial Semiconductor Wafer Grinding Equipment Specification and Application

Table 107. Hunan Yujing Machine Industrial Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 108. Hunan Yujing Machine Industrial Main Business and Markets Served

Table 109. Hunan Yujing Machine Industrial Recent Developments/Updates

Table 110. SpeedFam Semiconductor Wafer Grinding Equipment Company Information

Table 111. SpeedFam Semiconductor Wafer Grinding Equipment Specification and Application

Table 112. SpeedFam Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 113. SpeedFam Main Business and Markets Served

Table 114. SpeedFam Recent Developments/Updates

Table 115. TSD Semiconductor Wafer Grinding Equipment Company Information

Table 116. TSD Semiconductor Wafer Grinding Equipment Specification and Application

Table 117. TSD Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 118. TSD Main Business and Markets Served

Table 119. TSD Recent Developments/Updates

Table 120. Engis Corporation Semiconductor Wafer Grinding Equipment Company Information

Table 121. Engis Corporation Semiconductor Wafer Grinding Equipment Specification and Application

Table 122. Engis Corporation Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 123. Engis Corporation Main Business and Markets Served

Table 124. Engis Corporation Recent Developments/Updates

Table 125. NTS Semiconductor Wafer Grinding Equipment Company Information

Table 126. NTS Semiconductor Wafer Grinding Equipment Specification and Application

Table 127. NTS Semiconductor Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 128. NTS Main Business and Markets Served

Table 129. NTS Recent Developments/Updates

Table 130. Key Raw Materials Lists

Table 131. Raw Materials Key Suppliers Lists

Table 132. Semiconductor Wafer Grinding Equipment Distributors List

Table 133. Semiconductor Wafer Grinding Equipment Customers List

Table 134. Semiconductor Wafer Grinding Equipment Market Trends

Table 135. Semiconductor Wafer Grinding Equipment Market Drivers

Table 136. Semiconductor Wafer Grinding Equipment Market Challenges

Table 137. Semiconductor Wafer Grinding Equipment Market Restraints

Table 138. Research Programs/Design for This Report

Table 139. Key Data Information from Secondary Sources

Table 140. Key Data Information from Primary Sources

Table 141. Authors List of This Report

List of Figures

Figure 1. Product Picture of Semiconductor Wafer Grinding Equipment

Figure 2. Global Semiconductor Wafer Grinding Equipment Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Semiconductor Wafer Grinding Equipment Market Share by Type: 2024 VS 2031

Figure 4. Wafer Edge Grinder Product Picture

Figure 5. Wafer Surface Grinder Product Picture

Figure 6. Global Semiconductor Wafer Grinding Equipment Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global Semiconductor Wafer Grinding Equipment Market Share by Application: 2024 VS 2031

Figure 8. Silicon Wafer

Figure 9. Compound Semiconductors

Figure 10. Global Semiconductor Wafer Grinding Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 11. Global Semiconductor Wafer Grinding Equipment Production Value (US$ Million) & (2020-2031)

Figure 12. Global Semiconductor Wafer Grinding Equipment Production Capacity (Units) & (2020-2031)

Figure 13. Global Semiconductor Wafer Grinding Equipment Production (Units) & (2020-2031)

Figure 14. Global Semiconductor Wafer Grinding Equipment Average Price (K US$/Unit) & (2020-2031)

Figure 15. Semiconductor Wafer Grinding Equipment Report Years Considered

Figure 16. Semiconductor Wafer Grinding Equipment Production Share by Manufacturers in 2024

Figure 17. Global Semiconductor Wafer Grinding Equipment Production Value Share by Manufacturers (2024)

Figure 18. Semiconductor Wafer Grinding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 19. The Global 5 and 10 Largest Players: Market Share by Semiconductor Wafer Grinding Equipment Revenue in 2024

Figure 20. Global Semiconductor Wafer Grinding Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 21. Global Semiconductor Wafer Grinding Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 22. Global Semiconductor Wafer Grinding Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 23. Global Semiconductor Wafer Grinding Equipment Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 24. North America Semiconductor Wafer Grinding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 25. Europe Semiconductor Wafer Grinding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. China Semiconductor Wafer Grinding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. Japan Semiconductor Wafer Grinding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Global Semiconductor Wafer Grinding Equipment Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 29. Global Semiconductor Wafer Grinding Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 30. North America Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 31. North America Semiconductor Wafer Grinding Equipment Consumption Market Share by Country (2020-2031)

Figure 32. U.S. Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 33. Canada Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 34. Europe Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 35. Europe Semiconductor Wafer Grinding Equipment Consumption Market Share by Country (2020-2031)

Figure 36. Germany Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 37. France Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 38. U.K. Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 39. Italy Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. Netherlands Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. Asia Pacific Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 42. Asia Pacific Semiconductor Wafer Grinding Equipment Consumption Market Share by Region (2020-2031)

Figure 43. China Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 44. Japan Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 45. South Korea Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 46. China Taiwan Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. Southeast Asia Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. India Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. Latin America, Middle East & Africa Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 50. Latin America, Middle East & Africa Semiconductor Wafer Grinding Equipment Consumption Market Share by Country (2020-2031)

Figure 51. Mexico Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 52. Brazil Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 53. Israel Semiconductor Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 54. Global Production Market Share of Semiconductor Wafer Grinding Equipment by Type (2020-2031)

Figure 55. Global Production Value Market Share of Semiconductor Wafer Grinding Equipment by Type (2020-2031)

Figure 56. Global Semiconductor Wafer Grinding Equipment Price (K US$/Unit) by Type (2020-2031)

Figure 57. Global Production Market Share of Semiconductor Wafer Grinding Equipment by Application (2020-2031)

Figure 58. Global Production Value Market Share of Semiconductor Wafer Grinding Equipment by Application (2020-2031)

Figure 59. Global Semiconductor Wafer Grinding Equipment Price (K US$/Unit) by Application (2020-2031)

Figure 60. Semiconductor Wafer Grinding Equipment Value Chain

Figure 61. Channels of Distribution (Direct Vs Distribution)

Figure 62. Bottom-up and Top-down Approaches for This Report

Figure 63. Data Triangulation

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