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Global Wafer Grinding Equipment Market Research Report 2025

Published Date: March 2025

Report Code: QYRE-Auto-11L7152

Global Wafer Grinding Equipment Market Insights Forecast to 2028

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Global Wafer Grinding Equipment Market Research Report 2025

Code: QYRE-Auto-11L7152

Report

March 2025

Pages:99

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Disco

Hunan Yujing Machine Industrial

WAIDA MFG

SpeedFam

Koyo Machinery

Tokyo Seimitsu

G&N

CETC

Revasum

TSD

Engis Corporation

Wafer Grinding Equipment Market Size

The global market for Wafer Grinding Equipment was valued at US$ 1224 million in the year 2024 and is projected to reach a revised size of US$ 1988 million by 2031, growing at a CAGR of 7.0% during the forecast period.

Wafer Grinding Equipment Market

Wafer Grinding Equipment refers to machinery used in the semiconductor manufacturing process for grinding and reducing the thickness of semiconductor wafers. This equipment helps to achieve precise thickness control and smooth surface finishing by removing material from the wafer's surface. The grinding process is crucial for wafer thinning, which is necessary for the manufacturing of microelectronic devices, sensors, and integrated circuits. Wafer grinding equipment is often used after the wafer has been processed for front-end fabrication, before it undergoes further packaging or testing. This equipment typically includes a grinding wheel, a slurry system for lubrication, and automated control systems to ensure high precision.

This report covers Wafer Edge Grinder and Wafer Surface Grinder in Semiconductor and Photovoltaic field.

The Wafer Grinding Equipments market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe.

Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.

Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Grinding Equipment and related services. The top five players account for about 90% of the revenue market in 2024.

Market Drivers:

Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Grinding Equipments. Fully automatic Wafer Grinding Equipments, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.

Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Grinding Equipments are the preferred solution, as they offer high precision and productivity.

Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Grinding Equipment market, especially in regions such as APAC, which dominate semiconductor manufacturing.

Growth in 300mm Wafer Demand: The 300mm wafer segment is the most significant application for Wafer Grinding Equipments, accounting for 83% of the global market share. Larger wafers allow for more chips to be processed at once, reducing manufacturing costs per chip. This increase in 300mm wafer production is a significant growth factor for the Wafer Grinding Equipment market, as manufacturers need specialized equipment to handle the larger wafers efficiently.

Shift Towards Fully Automated Solutions: Fully automated Wafer Grinding Equipments are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.

Market Restraints:

Despite the strong growth, several factors may restrain the expansion of the Wafer Grinding Equipment market:

High Initial Investment: Fully automatic Wafer Grinding Equipments come with a high initial cost, which could be prohibitive for smaller semiconductor manufacturers or emerging markets with limited capital. Additionally, the cost of maintaining and upgrading these high-tech machines can be a barrier for smaller players who may prefer less expensive, semi-automatic models.

Technological Complexity: Fully automatic Wafer Grinding Equipments are highly complex systems that require specialized knowledge to operate, program, and maintain. This could limit the adoption of such systems in regions with a shortage of skilled technicians and engineers. The technical complexity can also result in extended downtime during maintenance or troubleshooting, affecting overall production efficiency.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer Grinding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinding Equipment.

The Wafer Grinding Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Grinding Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Wafer Grinding Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Wafer Grinding Equipment Market Report

Report Metric	Details
Report Name	Wafer Grinding Equipment Market
Accounted market size in year	US$ 1224 million
Forecasted market size in 2031	US$ 1988 million
CAGR	7.0%
Base Year	year
Forecasted years	2025 - 2031
by Type	Wafer Edge Grinder Wafer Surface Grinder
by Application	Semiconductor Photovoltaic
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Grinding Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Grinding Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Grinding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Wafer Grinding Equipment Market growing?

Ans: The Wafer Grinding Equipment Market witnessing a CAGR of 7.0% during the forecast period 2025-2031.

What is the Wafer Grinding Equipment Market size in 2031?

Ans: The Wafer Grinding Equipment Market size in 2031 will be US$ 1988 million.

What is the market share of major companies in Wafer Grinding Equipment Market?

Ans: The top five players account for about 90% of the revenue market in 2024.

Who are the main players in the Wafer Grinding Equipment Market report?

Ans: The main players in the Wafer Grinding Equipment Market are Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation

What are the Application segmentation covered in the Wafer Grinding Equipment Market report?

Ans: The Applications covered in the Wafer Grinding Equipment Market report are Semiconductor, Photovoltaic

What are the Type segmentation covered in the Wafer Grinding Equipment Market report?

Ans: The Types covered in the Wafer Grinding Equipment Market report are Wafer Edge Grinder, Wafer Surface Grinder

Recommended Reports

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Wafer Processing Equipment

Etching and Slicing Systems

1 Wafer Grinding Equipment Market Overview

1.1 Product Definition

1.2 Wafer Grinding Equipment by Type

1.2.1 Global Wafer Grinding Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Wafer Edge Grinder

1.2.3 Wafer Surface Grinder

1.3 Wafer Grinding Equipment by Application

1.3.1 Global Wafer Grinding Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Semiconductor

1.3.3 Photovoltaic

1.4 Global Market Growth Prospects

1.4.1 Global Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Wafer Grinding Equipment Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Wafer Grinding Equipment Production Estimates and Forecasts (2020-2031)

1.4.4 Global Wafer Grinding Equipment Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Wafer Grinding Equipment Production Market Share by Manufacturers (2020-2025)

2.2 Global Wafer Grinding Equipment Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Wafer Grinding Equipment, Industry Ranking, 2023 VS 2024

2.4 Global Wafer Grinding Equipment Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Wafer Grinding Equipment Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Wafer Grinding Equipment, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Wafer Grinding Equipment, Product Offered and Application

2.8 Global Key Manufacturers of Wafer Grinding Equipment, Date of Enter into This Industry

2.9 Wafer Grinding Equipment Market Competitive Situation and Trends

2.9.1 Wafer Grinding Equipment Market Concentration Rate

2.9.2 Global 5 and 10 Largest Wafer Grinding Equipment Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Wafer Grinding Equipment Production by Region

3.1 Global Wafer Grinding Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Wafer Grinding Equipment Production Value by Region (2020-2031)

3.2.1 Global Wafer Grinding Equipment Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Wafer Grinding Equipment by Region (2026-2031)

3.3 Global Wafer Grinding Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Wafer Grinding Equipment Production Volume by Region (2020-2031)

3.4.1 Global Wafer Grinding Equipment Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Wafer Grinding Equipment by Region (2026-2031)

3.5 Global Wafer Grinding Equipment Market Price Analysis by Region (2020-2025)

3.6 Global Wafer Grinding Equipment Production and Value, Year-over-Year Growth

3.6.1 North America Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Wafer Grinding Equipment Production Value Estimates and Forecasts (2020-2031)

4 Wafer Grinding Equipment Consumption by Region

4.1 Global Wafer Grinding Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Wafer Grinding Equipment Consumption by Region (2020-2031)

4.2.1 Global Wafer Grinding Equipment Consumption by Region (2020-2025)

4.2.2 Global Wafer Grinding Equipment Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Wafer Grinding Equipment Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Wafer Grinding Equipment Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Wafer Grinding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Wafer Grinding Equipment Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Wafer Grinding Equipment Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global Wafer Grinding Equipment Production by Type (2020-2031)

5.1.1 Global Wafer Grinding Equipment Production by Type (2020-2025)

5.1.2 Global Wafer Grinding Equipment Production by Type (2026-2031)

5.1.3 Global Wafer Grinding Equipment Production Market Share by Type (2020-2031)

5.2 Global Wafer Grinding Equipment Production Value by Type (2020-2031)

5.2.1 Global Wafer Grinding Equipment Production Value by Type (2020-2025)

5.2.2 Global Wafer Grinding Equipment Production Value by Type (2026-2031)

5.2.3 Global Wafer Grinding Equipment Production Value Market Share by Type (2020-2031)

5.3 Global Wafer Grinding Equipment Price by Type (2020-2031)

6 Segment by Application

6.1 Global Wafer Grinding Equipment Production by Application (2020-2031)

6.1.1 Global Wafer Grinding Equipment Production by Application (2020-2025)

6.1.2 Global Wafer Grinding Equipment Production by Application (2026-2031)

6.1.3 Global Wafer Grinding Equipment Production Market Share by Application (2020-2031)

6.2 Global Wafer Grinding Equipment Production Value by Application (2020-2031)

6.2.1 Global Wafer Grinding Equipment Production Value by Application (2020-2025)

6.2.2 Global Wafer Grinding Equipment Production Value by Application (2026-2031)

6.2.3 Global Wafer Grinding Equipment Production Value Market Share by Application (2020-2031)

6.3 Global Wafer Grinding Equipment Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Disco

7.1.1 Disco Wafer Grinding Equipment Company Information

7.1.2 Disco Wafer Grinding Equipment Product Portfolio

7.1.3 Disco Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Disco Main Business and Markets Served

7.1.5 Disco Recent Developments/Updates

7.2 TOKYO SEIMITSU

7.2.1 TOKYO SEIMITSU Wafer Grinding Equipment Company Information

7.2.2 TOKYO SEIMITSU Wafer Grinding Equipment Product Portfolio

7.2.3 TOKYO SEIMITSU Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.2.4 TOKYO SEIMITSU Main Business and Markets Served

7.2.5 TOKYO SEIMITSU Recent Developments/Updates

7.3 G&N

7.3.1 G&N Wafer Grinding Equipment Company Information

7.3.2 G&N Wafer Grinding Equipment Product Portfolio

7.3.3 G&N Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.3.4 G&N Main Business and Markets Served

7.3.5 G&N Recent Developments/Updates

7.4 Okamoto Semiconductor Equipment Division

7.4.1 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Company Information

7.4.2 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Product Portfolio

7.4.3 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Okamoto Semiconductor Equipment Division Main Business and Markets Served

7.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates

7.5 CETC

7.5.1 CETC Wafer Grinding Equipment Company Information

7.5.2 CETC Wafer Grinding Equipment Product Portfolio

7.5.3 CETC Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.5.4 CETC Main Business and Markets Served

7.5.5 CETC Recent Developments/Updates

7.6 Koyo Machinery

7.6.1 Koyo Machinery Wafer Grinding Equipment Company Information

7.6.2 Koyo Machinery Wafer Grinding Equipment Product Portfolio

7.6.3 Koyo Machinery Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Koyo Machinery Main Business and Markets Served

7.6.5 Koyo Machinery Recent Developments/Updates

7.7 Revasum

7.7.1 Revasum Wafer Grinding Equipment Company Information

7.7.2 Revasum Wafer Grinding Equipment Product Portfolio

7.7.3 Revasum Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Revasum Main Business and Markets Served

7.7.5 Revasum Recent Developments/Updates

7.8 WAIDA MFG

7.8.1 WAIDA MFG Wafer Grinding Equipment Company Information

7.8.2 WAIDA MFG Wafer Grinding Equipment Product Portfolio

7.8.3 WAIDA MFG Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.8.4 WAIDA MFG Main Business and Markets Served

7.8.5 WAIDA MFG Recent Developments/Updates

7.9 Hunan Yujing Machine Industrial

7.9.1 Hunan Yujing Machine Industrial Wafer Grinding Equipment Company Information

7.9.2 Hunan Yujing Machine Industrial Wafer Grinding Equipment Product Portfolio

7.9.3 Hunan Yujing Machine Industrial Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Hunan Yujing Machine Industrial Main Business and Markets Served

7.9.5 Hunan Yujing Machine Industrial Recent Developments/Updates

7.10 SpeedFam

7.10.1 SpeedFam Wafer Grinding Equipment Company Information

7.10.2 SpeedFam Wafer Grinding Equipment Product Portfolio

7.10.3 SpeedFam Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.10.4 SpeedFam Main Business and Markets Served

7.10.5 SpeedFam Recent Developments/Updates

7.11 TSD

7.11.1 TSD Wafer Grinding Equipment Company Information

7.11.2 TSD Wafer Grinding Equipment Product Portfolio

7.11.3 TSD Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.11.4 TSD Main Business and Markets Served

7.11.5 TSD Recent Developments/Updates

7.12 Engis Corporation

7.12.1 Engis Corporation Wafer Grinding Equipment Company Information

7.12.2 Engis Corporation Wafer Grinding Equipment Product Portfolio

7.12.3 Engis Corporation Wafer Grinding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.12.4 Engis Corporation Main Business and Markets Served

7.12.5 Engis Corporation Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Wafer Grinding Equipment Industry Chain Analysis

8.2 Wafer Grinding Equipment Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Wafer Grinding Equipment Production Mode & Process Analysis

8.4 Wafer Grinding Equipment Sales and Marketing

8.4.1 Wafer Grinding Equipment Sales Channels

8.4.2 Wafer Grinding Equipment Distributors

8.5 Wafer Grinding Equipment Customer Analysis

9 Wafer Grinding Equipment Market Dynamics

9.1 Wafer Grinding Equipment Industry Trends

9.2 Wafer Grinding Equipment Market Drivers

9.3 Wafer Grinding Equipment Market Challenges

9.4 Wafer Grinding Equipment Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

Disco

Hunan Yujing Machine Industrial

WAIDA MFG

SpeedFam

Koyo Machinery

Tokyo Seimitsu

G&N

CETC

Revasum

TSD

Engis Corporation

List of Tables

Table 1. Global Wafer Grinding Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Wafer Grinding Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Wafer Grinding Equipment Production Capacity (Units) by Manufacturers in 2024

Table 4. Global Wafer Grinding Equipment Production by Manufacturers (2020-2025) & (Units)

Table 5. Global Wafer Grinding Equipment Production Market Share by Manufacturers (2020-2025)

Table 6. Global Wafer Grinding Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Wafer Grinding Equipment Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Wafer Grinding Equipment, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Wafer Grinding Equipment as of 2024)

Table 10. Global Market Wafer Grinding Equipment Average Price by Manufacturers (K USD/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Wafer Grinding Equipment, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Wafer Grinding Equipment, Product Offered and Application

Table 13. Global Key Manufacturers of Wafer Grinding Equipment, Date of Enter into This Industry

Table 14. Global Wafer Grinding Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Wafer Grinding Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Wafer Grinding Equipment Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Wafer Grinding Equipment Production Value Market Share by Region (2020-2025)

Table 19. Global Wafer Grinding Equipment Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Wafer Grinding Equipment Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Wafer Grinding Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global Wafer Grinding Equipment Production (Units) by Region (2020-2025)

Table 23. Global Wafer Grinding Equipment Production Market Share by Region (2020-2025)

Table 24. Global Wafer Grinding Equipment Production (Units) Forecast by Region (2026-2031)

Table 25. Global Wafer Grinding Equipment Production Market Share Forecast by Region (2026-2031)

Table 26. Global Wafer Grinding Equipment Market Average Price (K USD/Unit) by Region (2020-2025)

Table 27. Global Wafer Grinding Equipment Market Average Price (K USD/Unit) by Region (2026-2031)

Table 28. Global Wafer Grinding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global Wafer Grinding Equipment Consumption by Region (2020-2025) & (Units)

Table 30. Global Wafer Grinding Equipment Consumption Market Share by Region (2020-2025)

Table 31. Global Wafer Grinding Equipment Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global Wafer Grinding Equipment Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America Wafer Grinding Equipment Consumption by Country (2020-2025) & (Units)

Table 35. North America Wafer Grinding Equipment Consumption by Country (2026-2031) & (Units)

Table 36. Europe Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe Wafer Grinding Equipment Consumption by Country (2020-2025) & (Units)

Table 38. Europe Wafer Grinding Equipment Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific Wafer Grinding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific Wafer Grinding Equipment Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific Wafer Grinding Equipment Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa Wafer Grinding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa Wafer Grinding Equipment Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa Wafer Grinding Equipment Consumption by Country (2026-2031) & (Units)

Table 45. Global Wafer Grinding Equipment Production (Units) by Type (2020-2025)

Table 46. Global Wafer Grinding Equipment Production (Units) by Type (2026-2031)

Table 47. Global Wafer Grinding Equipment Production Market Share by Type (2020-2025)

Table 48. Global Wafer Grinding Equipment Production Market Share by Type (2026-2031)

Table 49. Global Wafer Grinding Equipment Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Wafer Grinding Equipment Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Wafer Grinding Equipment Production Value Market Share by Type (2020-2025)

Table 52. Global Wafer Grinding Equipment Production Value Market Share by Type (2026-2031)

Table 53. Global Wafer Grinding Equipment Price (K USD/Unit) by Type (2020-2025)

Table 54. Global Wafer Grinding Equipment Price (K USD/Unit) by Type (2026-2031)

Table 55. Global Wafer Grinding Equipment Production (Units) by Application (2020-2025)

Table 56. Global Wafer Grinding Equipment Production (Units) by Application (2026-2031)

Table 57. Global Wafer Grinding Equipment Production Market Share by Application (2020-2025)

Table 58. Global Wafer Grinding Equipment Production Market Share by Application (2026-2031)

Table 59. Global Wafer Grinding Equipment Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Wafer Grinding Equipment Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Wafer Grinding Equipment Production Value Market Share by Application (2020-2025)

Table 62. Global Wafer Grinding Equipment Production Value Market Share by Application (2026-2031)

Table 63. Global Wafer Grinding Equipment Price (K USD/Unit) by Application (2020-2025)

Table 64. Global Wafer Grinding Equipment Price (K USD/Unit) by Application (2026-2031)

Table 65. Disco Wafer Grinding Equipment Company Information

Table 66. Disco Wafer Grinding Equipment Specification and Application

Table 67. Disco Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 68. Disco Main Business and Markets Served

Table 69. Disco Recent Developments/Updates

Table 70. TOKYO SEIMITSU Wafer Grinding Equipment Company Information

Table 71. TOKYO SEIMITSU Wafer Grinding Equipment Specification and Application

Table 72. TOKYO SEIMITSU Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 73. TOKYO SEIMITSU Main Business and Markets Served

Table 74. TOKYO SEIMITSU Recent Developments/Updates

Table 75. G&N Wafer Grinding Equipment Company Information

Table 76. G&N Wafer Grinding Equipment Specification and Application

Table 77. G&N Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 78. G&N Main Business and Markets Served

Table 79. G&N Recent Developments/Updates

Table 80. Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Company Information

Table 81. Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Specification and Application

Table 82. Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 83. Okamoto Semiconductor Equipment Division Main Business and Markets Served

Table 84. Okamoto Semiconductor Equipment Division Recent Developments/Updates

Table 85. CETC Wafer Grinding Equipment Company Information

Table 86. CETC Wafer Grinding Equipment Specification and Application

Table 87. CETC Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 88. CETC Main Business and Markets Served

Table 89. CETC Recent Developments/Updates

Table 90. Koyo Machinery Wafer Grinding Equipment Company Information

Table 91. Koyo Machinery Wafer Grinding Equipment Specification and Application

Table 92. Koyo Machinery Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 93. Koyo Machinery Main Business and Markets Served

Table 94. Koyo Machinery Recent Developments/Updates

Table 95. Revasum Wafer Grinding Equipment Company Information

Table 96. Revasum Wafer Grinding Equipment Specification and Application

Table 97. Revasum Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 98. Revasum Main Business and Markets Served

Table 99. Revasum Recent Developments/Updates

Table 100. WAIDA MFG Wafer Grinding Equipment Company Information

Table 101. WAIDA MFG Wafer Grinding Equipment Specification and Application

Table 102. WAIDA MFG Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 103. WAIDA MFG Main Business and Markets Served

Table 104. WAIDA MFG Recent Developments/Updates

Table 105. Hunan Yujing Machine Industrial Wafer Grinding Equipment Company Information

Table 106. Hunan Yujing Machine Industrial Wafer Grinding Equipment Specification and Application

Table 107. Hunan Yujing Machine Industrial Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 108. Hunan Yujing Machine Industrial Main Business and Markets Served

Table 109. Hunan Yujing Machine Industrial Recent Developments/Updates

Table 110. SpeedFam Wafer Grinding Equipment Company Information

Table 111. SpeedFam Wafer Grinding Equipment Specification and Application

Table 112. SpeedFam Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 113. SpeedFam Main Business and Markets Served

Table 114. SpeedFam Recent Developments/Updates

Table 115. TSD Wafer Grinding Equipment Company Information

Table 116. TSD Wafer Grinding Equipment Specification and Application

Table 117. TSD Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 118. TSD Main Business and Markets Served

Table 119. TSD Recent Developments/Updates

Table 120. Engis Corporation Wafer Grinding Equipment Company Information

Table 121. Engis Corporation Wafer Grinding Equipment Specification and Application

Table 122. Engis Corporation Wafer Grinding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 123. Engis Corporation Main Business and Markets Served

Table 124. Engis Corporation Recent Developments/Updates

Table 125. Key Raw Materials Lists

Table 126. Raw Materials Key Suppliers Lists

Table 127. Wafer Grinding Equipment Distributors List

Table 128. Wafer Grinding Equipment Customers List

Table 129. Wafer Grinding Equipment Market Trends

Table 130. Wafer Grinding Equipment Market Drivers

Table 131. Wafer Grinding Equipment Market Challenges

Table 132. Wafer Grinding Equipment Market Restraints

Table 133. Research Programs/Design for This Report

Table 134. Key Data Information from Secondary Sources

Table 135. Key Data Information from Primary Sources

Table 136. Authors List of This Report

List of Figures

Figure 1. Product Picture of Wafer Grinding Equipment

Figure 2. Global Wafer Grinding Equipment Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Wafer Grinding Equipment Market Share by Type: 2024 VS 2031

Figure 4. Wafer Edge Grinder Product Picture

Figure 5. Wafer Surface Grinder Product Picture

Figure 6. Global Wafer Grinding Equipment Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global Wafer Grinding Equipment Market Share by Application: 2024 VS 2031

Figure 8. Semiconductor

Figure 9. Photovoltaic

Figure 10. Global Wafer Grinding Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 11. Global Wafer Grinding Equipment Production Value (US$ Million) & (2020-2031)

Figure 12. Global Wafer Grinding Equipment Production Capacity (Units) & (2020-2031)

Figure 13. Global Wafer Grinding Equipment Production (Units) & (2020-2031)

Figure 14. Global Wafer Grinding Equipment Average Price (K USD/Unit) & (2020-2031)

Figure 15. Wafer Grinding Equipment Report Years Considered

Figure 16. Wafer Grinding Equipment Production Share by Manufacturers in 2024

Figure 17. Global Wafer Grinding Equipment Production Value Share by Manufacturers (2024)

Figure 18. Wafer Grinding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 19. The Global 5 and 10 Largest Players: Market Share by Wafer Grinding Equipment Revenue in 2024

Figure 20. Global Wafer Grinding Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 21. Global Wafer Grinding Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 22. Global Wafer Grinding Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 23. Global Wafer Grinding Equipment Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 24. North America Wafer Grinding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 25. Europe Wafer Grinding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. China Wafer Grinding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. Japan Wafer Grinding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Global Wafer Grinding Equipment Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 29. Global Wafer Grinding Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 30. North America Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 31. North America Wafer Grinding Equipment Consumption Market Share by Country (2020-2031)

Figure 32. U.S. Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 33. Canada Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 34. Europe Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 35. Europe Wafer Grinding Equipment Consumption Market Share by Country (2020-2031)

Figure 36. Germany Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 37. France Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 38. U.K. Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 39. Italy Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. Netherlands Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. Asia Pacific Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 42. Asia Pacific Wafer Grinding Equipment Consumption Market Share by Region (2020-2031)

Figure 43. China Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 44. Japan Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 45. South Korea Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 46. China Taiwan Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. Southeast Asia Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. India Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. Latin America, Middle East & Africa Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 50. Latin America, Middle East & Africa Wafer Grinding Equipment Consumption Market Share by Country (2020-2031)

Figure 51. Mexico Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 52. Brazil Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 53. Turkey Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 54. GCC Countries Wafer Grinding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 55. Global Production Market Share of Wafer Grinding Equipment by Type (2020-2031)

Figure 56. Global Production Value Market Share of Wafer Grinding Equipment by Type (2020-2031)

Figure 57. Global Wafer Grinding Equipment Price (K USD/Unit) by Type (2020-2031)

Figure 58. Global Production Market Share of Wafer Grinding Equipment by Application (2020-2031)

Figure 59. Global Production Value Market Share of Wafer Grinding Equipment by Application (2020-2031)

Figure 60. Global Wafer Grinding Equipment Price (K USD/Unit) by Application (2020-2031)

Figure 61. Wafer Grinding Equipment Value Chain

Figure 62. Channels of Distribution (Direct Vs Distribution)

Figure 63. Bottom-up and Top-down Approaches for This Report

Figure 64. Data Triangulation

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