ABOUT US
CONTACT US
FAQ
PRIVACY POLICY
REFUND AND CANCELLATION
BLOGS
COMPANIES
REPORTS
0
U.S. (TOLL FREE)
+1 (315) 215-3225
Automative
0
U.S. (TOLL FREE)
+1 (315) 215-3225
Global Wafer Grinding & Thinning Market Research Report 2025
Published Date: June 2025
|
Report Code: QYRE-Auto-1H18142
Home | Market Reports | Computers & Electronics
Global Wafer Grinding Thinning Market Research Report 2024
BUY CHAPTERS

Global Wafer Grinding & Thinning Market Research Report 2025

Code: QYRE-Auto-1H18142
Report
June 2025
Pages:91
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Syagrus Systems
Optim Wafer Services
Silicon Valley Microelectronics, Inc.
SIEGERT WAFER GmbH
NICHIWA KOGYO CO.,LTD.
Integra Technologies
Valley Design
Axus Technology
Helia Photonics
DISCO Corporation
Aptek Industries
UniversityWafer, Inc.
Micross
Power Master Semiconductor Co., Ltd.
Enzan Factory Co., Ltd.
Phoenix Silicon International
Prosperity Power Technology Inc.
Huahong Group
MacMic
Winstek

Wafer Grinding & Thinning Market

The global market for Wafer Grinding & Thinning was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
North American market for Wafer Grinding & Thinning is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Wafer Grinding & Thinning is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The global market for Wafer Grinding & Thinning in Consumer Electronics is estimated to increase from $ million in 2024 to $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global companies of Wafer Grinding & Thinning include Syagrus Systems, Optim Wafer Services, Silicon Valley Microelectronics, Inc., SIEGERT WAFER GmbH, NICHIWA KOGYO CO.,LTD., Integra Technologies, Valley Design, AXUS TECHNOLOGY, Helia Photonics, DISCO Corporation, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Wafer Grinding & Thinning, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinding & Thinning.
The Wafer Grinding & Thinning market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Grinding & Thinning market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Grinding & Thinning companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Wafer Grinding & Thinning Market Report

Report Metric Details
Report Name Wafer Grinding & Thinning Market
Segment by Type
Segment by Application
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company Syagrus Systems, Optim Wafer Services, Silicon Valley Microelectronics, Inc., SIEGERT WAFER GmbH, NICHIWA KOGYO CO.,LTD., Integra Technologies, Valley Design, AXUS TECHNOLOGY, Helia Photonics, DISCO Corporation, Aptek Industries, UniversityWafer, Inc., Micross, Power Master Semiconductor Co., Ltd., Enzan Factory Co., Ltd., Phoenix Silicon International, Prosperity Power Technology Inc., Huahong Group, MACMIC, Winstek
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of Wafer Grinding & Thinning company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Wafer Grinding & Thinning Market report?

Ans: The main players in the Wafer Grinding & Thinning Market are Syagrus Systems, Optim Wafer Services, Silicon Valley Microelectronics, Inc., SIEGERT WAFER GmbH, NICHIWA KOGYO CO.,LTD., Integra Technologies, Valley Design, AXUS TECHNOLOGY, Helia Photonics, DISCO Corporation, Aptek Industries, UniversityWafer, Inc., Micross, Power Master Semiconductor Co., Ltd., Enzan Factory Co., Ltd., Phoenix Silicon International, Prosperity Power Technology Inc., Huahong Group, MACMIC, Winstek

What are the Application segmentation covered in the Wafer Grinding & Thinning Market report?

Ans: The Applications covered in the Wafer Grinding & Thinning Market report are Consumer Electronics, Automotive Electronics, Computer and Data Center, Others

What are the Type segmentation covered in the Wafer Grinding & Thinning Market report?

Ans: The Types covered in the Wafer Grinding & Thinning Market report are Ordinary Wafers, Ultra-Thin Wafers

Recommended Reports

Wafer Processing Equipment

Wafer Grinding Technology

Wafer Materials & Chemicals

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Wafer Grinding & Thinning Market Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 Ordinary Wafers
1.2.3 Ultra-Thin Wafers
1.3 Market by Application
1.3.1 Global Wafer Grinding & Thinning Market Growth by Application: 2020 VS 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Automotive Electronics
1.3.4 Computer and Data Center
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Wafer Grinding & Thinning Market Perspective (2020-2031)
2.2 Global Wafer Grinding & Thinning Growth Trends by Region
2.2.1 Global Wafer Grinding & Thinning Market Size by Region: 2020 VS 2024 VS 2031
2.2.2 Wafer Grinding & Thinning Historic Market Size by Region (2020-2025)
2.2.3 Wafer Grinding & Thinning Forecasted Market Size by Region (2026-2031)
2.3 Wafer Grinding & Thinning Market Dynamics
2.3.1 Wafer Grinding & Thinning Industry Trends
2.3.2 Wafer Grinding & Thinning Market Drivers
2.3.3 Wafer Grinding & Thinning Market Challenges
2.3.4 Wafer Grinding & Thinning Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Wafer Grinding & Thinning Players by Revenue
3.1.1 Global Top Wafer Grinding & Thinning Players by Revenue (2020-2025)
3.1.2 Global Wafer Grinding & Thinning Revenue Market Share by Players (2020-2025)
3.2 Global Wafer Grinding & Thinning Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Wafer Grinding & Thinning Revenue
3.4 Global Wafer Grinding & Thinning Market Concentration Ratio
3.4.1 Global Wafer Grinding & Thinning Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Wafer Grinding & Thinning Revenue in 2024
3.5 Global Key Players of Wafer Grinding & Thinning Head office and Area Served
3.6 Global Key Players of Wafer Grinding & Thinning, Product and Application
3.7 Global Key Players of Wafer Grinding & Thinning, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Wafer Grinding & Thinning Breakdown Data by Type
4.1 Global Wafer Grinding & Thinning Historic Market Size by Type (2020-2025)
4.2 Global Wafer Grinding & Thinning Forecasted Market Size by Type (2026-2031)
5 Wafer Grinding & Thinning Breakdown Data by Application
5.1 Global Wafer Grinding & Thinning Historic Market Size by Application (2020-2025)
5.2 Global Wafer Grinding & Thinning Forecasted Market Size by Application (2026-2031)
6 North America
6.1 North America Wafer Grinding & Thinning Market Size (2020-2031)
6.2 North America Wafer Grinding & Thinning Market Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America Wafer Grinding & Thinning Market Size by Country (2020-2025)
6.4 North America Wafer Grinding & Thinning Market Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Wafer Grinding & Thinning Market Size (2020-2031)
7.2 Europe Wafer Grinding & Thinning Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe Wafer Grinding & Thinning Market Size by Country (2020-2025)
7.4 Europe Wafer Grinding & Thinning Market Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Wafer Grinding & Thinning Market Size (2020-2031)
8.2 Asia-Pacific Wafer Grinding & Thinning Market Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific Wafer Grinding & Thinning Market Size by Region (2020-2025)
8.4 Asia-Pacific Wafer Grinding & Thinning Market Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Wafer Grinding & Thinning Market Size (2020-2031)
9.2 Latin America Wafer Grinding & Thinning Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America Wafer Grinding & Thinning Market Size by Country (2020-2025)
9.4 Latin America Wafer Grinding & Thinning Market Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Wafer Grinding & Thinning Market Size (2020-2031)
10.2 Middle East & Africa Wafer Grinding & Thinning Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa Wafer Grinding & Thinning Market Size by Country (2020-2025)
10.4 Middle East & Africa Wafer Grinding & Thinning Market Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Syagrus Systems
11.1.1 Syagrus Systems Company Details
11.1.2 Syagrus Systems Business Overview
11.1.3 Syagrus Systems Wafer Grinding & Thinning Introduction
11.1.4 Syagrus Systems Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.1.5 Syagrus Systems Recent Development
11.2 Optim Wafer Services
11.2.1 Optim Wafer Services Company Details
11.2.2 Optim Wafer Services Business Overview
11.2.3 Optim Wafer Services Wafer Grinding & Thinning Introduction
11.2.4 Optim Wafer Services Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.2.5 Optim Wafer Services Recent Development
11.3 Silicon Valley Microelectronics, Inc.
11.3.1 Silicon Valley Microelectronics, Inc. Company Details
11.3.2 Silicon Valley Microelectronics, Inc. Business Overview
11.3.3 Silicon Valley Microelectronics, Inc. Wafer Grinding & Thinning Introduction
11.3.4 Silicon Valley Microelectronics, Inc. Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.3.5 Silicon Valley Microelectronics, Inc. Recent Development
11.4 SIEGERT WAFER GmbH
11.4.1 SIEGERT WAFER GmbH Company Details
11.4.2 SIEGERT WAFER GmbH Business Overview
11.4.3 SIEGERT WAFER GmbH Wafer Grinding & Thinning Introduction
11.4.4 SIEGERT WAFER GmbH Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.4.5 SIEGERT WAFER GmbH Recent Development
11.5 NICHIWA KOGYO CO.,LTD.
11.5.1 NICHIWA KOGYO CO.,LTD. Company Details
11.5.2 NICHIWA KOGYO CO.,LTD. Business Overview
11.5.3 NICHIWA KOGYO CO.,LTD. Wafer Grinding & Thinning Introduction
11.5.4 NICHIWA KOGYO CO.,LTD. Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.5.5 NICHIWA KOGYO CO.,LTD. Recent Development
11.6 Integra Technologies
11.6.1 Integra Technologies Company Details
11.6.2 Integra Technologies Business Overview
11.6.3 Integra Technologies Wafer Grinding & Thinning Introduction
11.6.4 Integra Technologies Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.6.5 Integra Technologies Recent Development
11.7 Valley Design
11.7.1 Valley Design Company Details
11.7.2 Valley Design Business Overview
11.7.3 Valley Design Wafer Grinding & Thinning Introduction
11.7.4 Valley Design Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.7.5 Valley Design Recent Development
11.8 AXUS TECHNOLOGY
11.8.1 AXUS TECHNOLOGY Company Details
11.8.2 AXUS TECHNOLOGY Business Overview
11.8.3 AXUS TECHNOLOGY Wafer Grinding & Thinning Introduction
11.8.4 AXUS TECHNOLOGY Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.8.5 AXUS TECHNOLOGY Recent Development
11.9 Helia Photonics
11.9.1 Helia Photonics Company Details
11.9.2 Helia Photonics Business Overview
11.9.3 Helia Photonics Wafer Grinding & Thinning Introduction
11.9.4 Helia Photonics Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.9.5 Helia Photonics Recent Development
11.10 DISCO Corporation
11.10.1 DISCO Corporation Company Details
11.10.2 DISCO Corporation Business Overview
11.10.3 DISCO Corporation Wafer Grinding & Thinning Introduction
11.10.4 DISCO Corporation Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.10.5 DISCO Corporation Recent Development
11.11 Aptek Industries
11.11.1 Aptek Industries Company Details
11.11.2 Aptek Industries Business Overview
11.11.3 Aptek Industries Wafer Grinding & Thinning Introduction
11.11.4 Aptek Industries Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.11.5 Aptek Industries Recent Development
11.12 UniversityWafer, Inc.
11.12.1 UniversityWafer, Inc. Company Details
11.12.2 UniversityWafer, Inc. Business Overview
11.12.3 UniversityWafer, Inc. Wafer Grinding & Thinning Introduction
11.12.4 UniversityWafer, Inc. Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.12.5 UniversityWafer, Inc. Recent Development
11.13 Micross
11.13.1 Micross Company Details
11.13.2 Micross Business Overview
11.13.3 Micross Wafer Grinding & Thinning Introduction
11.13.4 Micross Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.13.5 Micross Recent Development
11.14 Power Master Semiconductor Co., Ltd.
11.14.1 Power Master Semiconductor Co., Ltd. Company Details
11.14.2 Power Master Semiconductor Co., Ltd. Business Overview
11.14.3 Power Master Semiconductor Co., Ltd. Wafer Grinding & Thinning Introduction
11.14.4 Power Master Semiconductor Co., Ltd. Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.14.5 Power Master Semiconductor Co., Ltd. Recent Development
11.15 Enzan Factory Co., Ltd.
11.15.1 Enzan Factory Co., Ltd. Company Details
11.15.2 Enzan Factory Co., Ltd. Business Overview
11.15.3 Enzan Factory Co., Ltd. Wafer Grinding & Thinning Introduction
11.15.4 Enzan Factory Co., Ltd. Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.15.5 Enzan Factory Co., Ltd. Recent Development
11.16 Phoenix Silicon International
11.16.1 Phoenix Silicon International Company Details
11.16.2 Phoenix Silicon International Business Overview
11.16.3 Phoenix Silicon International Wafer Grinding & Thinning Introduction
11.16.4 Phoenix Silicon International Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.16.5 Phoenix Silicon International Recent Development
11.17 Prosperity Power Technology Inc.
11.17.1 Prosperity Power Technology Inc. Company Details
11.17.2 Prosperity Power Technology Inc. Business Overview
11.17.3 Prosperity Power Technology Inc. Wafer Grinding & Thinning Introduction
11.17.4 Prosperity Power Technology Inc. Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.17.5 Prosperity Power Technology Inc. Recent Development
11.18 Huahong Group
11.18.1 Huahong Group Company Details
11.18.2 Huahong Group Business Overview
11.18.3 Huahong Group Wafer Grinding & Thinning Introduction
11.18.4 Huahong Group Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.18.5 Huahong Group Recent Development
11.19 MACMIC
11.19.1 MACMIC Company Details
11.19.2 MACMIC Business Overview
11.19.3 MACMIC Wafer Grinding & Thinning Introduction
11.19.4 MACMIC Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.19.5 MACMIC Recent Development
11.20 Winstek
11.20.1 Winstek Company Details
11.20.2 Winstek Business Overview
11.20.3 Winstek Wafer Grinding & Thinning Introduction
11.20.4 Winstek Revenue in Wafer Grinding & Thinning Business (2020-2025)
11.20.5 Winstek Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
FEATURED COMPANIES
Syagrus Systems
Optim Wafer Services
Silicon Valley Microelectronics, Inc.
SIEGERT WAFER GmbH
NICHIWA KOGYO CO.,LTD.
Integra Technologies
Valley Design
Axus Technology
Helia Photonics
DISCO Corporation
Aptek Industries
UniversityWafer, Inc.
Micross
Power Master Semiconductor Co., Ltd.
Enzan Factory Co., Ltd.
Phoenix Silicon International
Prosperity Power Technology Inc.
Huahong Group
MacMic
Winstek
List of Tables
 Table 1. Global Wafer Grinding & Thinning Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031
 Table 2. Key Players of Ordinary Wafers
 Table 3. Key Players of Ultra-Thin Wafers
 Table 4. Global Wafer Grinding & Thinning Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031
 Table 5. Global Wafer Grinding & Thinning Market Size by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 6. Global Wafer Grinding & Thinning Market Size by Region (2020-2025) & (US$ Million)
 Table 7. Global Wafer Grinding & Thinning Market Share by Region (2020-2025)
 Table 8. Global Wafer Grinding & Thinning Forecasted Market Size by Region (2026-2031) & (US$ Million)
 Table 9. Global Wafer Grinding & Thinning Market Share by Region (2026-2031)
 Table 10. Wafer Grinding & Thinning Market Trends
 Table 11. Wafer Grinding & Thinning Market Drivers
 Table 12. Wafer Grinding & Thinning Market Challenges
 Table 13. Wafer Grinding & Thinning Market Restraints
 Table 14. Global Wafer Grinding & Thinning Revenue by Players (2020-2025) & (US$ Million)
 Table 15. Global Wafer Grinding & Thinning Market Share by Players (2020-2025)
 Table 16. Global Top Wafer Grinding & Thinning Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Grinding & Thinning as of 2024)
 Table 17. Ranking of Global Top Wafer Grinding & Thinning Companies by Revenue (US$ Million) in 2024
 Table 18. Global 5 Largest Players Market Share by Wafer Grinding & Thinning Revenue (CR5 and HHI) & (2020-2025)
 Table 19. Global Key Players of Wafer Grinding & Thinning, Headquarters and Area Served
 Table 20. Global Key Players of Wafer Grinding & Thinning, Product and Application
 Table 21. Global Key Players of Wafer Grinding & Thinning, Date of Enter into This Industry
 Table 22. Mergers & Acquisitions, Expansion Plans
 Table 23. Global Wafer Grinding & Thinning Market Size by Type (2020-2025) & (US$ Million)
 Table 24. Global Wafer Grinding & Thinning Revenue Market Share by Type (2020-2025)
 Table 25. Global Wafer Grinding & Thinning Forecasted Market Size by Type (2026-2031) & (US$ Million)
 Table 26. Global Wafer Grinding & Thinning Revenue Market Share by Type (2026-2031)
 Table 27. Global Wafer Grinding & Thinning Market Size by Application (2020-2025) & (US$ Million)
 Table 28. Global Wafer Grinding & Thinning Revenue Market Share by Application (2020-2025)
 Table 29. Global Wafer Grinding & Thinning Forecasted Market Size by Application (2026-2031) & (US$ Million)
 Table 30. Global Wafer Grinding & Thinning Revenue Market Share by Application (2026-2031)
 Table 31. North America Wafer Grinding & Thinning Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 32. North America Wafer Grinding & Thinning Market Size by Country (2020-2025) & (US$ Million)
 Table 33. North America Wafer Grinding & Thinning Market Size by Country (2026-2031) & (US$ Million)
 Table 34. Europe Wafer Grinding & Thinning Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 35. Europe Wafer Grinding & Thinning Market Size by Country (2020-2025) & (US$ Million)
 Table 36. Europe Wafer Grinding & Thinning Market Size by Country (2026-2031) & (US$ Million)
 Table 37. Asia-Pacific Wafer Grinding & Thinning Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 38. Asia-Pacific Wafer Grinding & Thinning Market Size by Region (2020-2025) & (US$ Million)
 Table 39. Asia-Pacific Wafer Grinding & Thinning Market Size by Region (2026-2031) & (US$ Million)
 Table 40. Latin America Wafer Grinding & Thinning Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 41. Latin America Wafer Grinding & Thinning Market Size by Country (2020-2025) & (US$ Million)
 Table 42. Latin America Wafer Grinding & Thinning Market Size by Country (2026-2031) & (US$ Million)
 Table 43. Middle East & Africa Wafer Grinding & Thinning Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 44. Middle East & Africa Wafer Grinding & Thinning Market Size by Country (2020-2025) & (US$ Million)
 Table 45. Middle East & Africa Wafer Grinding & Thinning Market Size by Country (2026-2031) & (US$ Million)
 Table 46. Syagrus Systems Company Details
 Table 47. Syagrus Systems Business Overview
 Table 48. Syagrus Systems Wafer Grinding & Thinning Product
 Table 49. Syagrus Systems Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 50. Syagrus Systems Recent Development
 Table 51. Optim Wafer Services Company Details
 Table 52. Optim Wafer Services Business Overview
 Table 53. Optim Wafer Services Wafer Grinding & Thinning Product
 Table 54. Optim Wafer Services Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 55. Optim Wafer Services Recent Development
 Table 56. Silicon Valley Microelectronics, Inc. Company Details
 Table 57. Silicon Valley Microelectronics, Inc. Business Overview
 Table 58. Silicon Valley Microelectronics, Inc. Wafer Grinding & Thinning Product
 Table 59. Silicon Valley Microelectronics, Inc. Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 60. Silicon Valley Microelectronics, Inc. Recent Development
 Table 61. SIEGERT WAFER GmbH Company Details
 Table 62. SIEGERT WAFER GmbH Business Overview
 Table 63. SIEGERT WAFER GmbH Wafer Grinding & Thinning Product
 Table 64. SIEGERT WAFER GmbH Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 65. SIEGERT WAFER GmbH Recent Development
 Table 66. NICHIWA KOGYO CO.,LTD. Company Details
 Table 67. NICHIWA KOGYO CO.,LTD. Business Overview
 Table 68. NICHIWA KOGYO CO.,LTD. Wafer Grinding & Thinning Product
 Table 69. NICHIWA KOGYO CO.,LTD. Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 70. NICHIWA KOGYO CO.,LTD. Recent Development
 Table 71. Integra Technologies Company Details
 Table 72. Integra Technologies Business Overview
 Table 73. Integra Technologies Wafer Grinding & Thinning Product
 Table 74. Integra Technologies Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 75. Integra Technologies Recent Development
 Table 76. Valley Design Company Details
 Table 77. Valley Design Business Overview
 Table 78. Valley Design Wafer Grinding & Thinning Product
 Table 79. Valley Design Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 80. Valley Design Recent Development
 Table 81. AXUS TECHNOLOGY Company Details
 Table 82. AXUS TECHNOLOGY Business Overview
 Table 83. AXUS TECHNOLOGY Wafer Grinding & Thinning Product
 Table 84. AXUS TECHNOLOGY Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 85. AXUS TECHNOLOGY Recent Development
 Table 86. Helia Photonics Company Details
 Table 87. Helia Photonics Business Overview
 Table 88. Helia Photonics Wafer Grinding & Thinning Product
 Table 89. Helia Photonics Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 90. Helia Photonics Recent Development
 Table 91. DISCO Corporation Company Details
 Table 92. DISCO Corporation Business Overview
 Table 93. DISCO Corporation Wafer Grinding & Thinning Product
 Table 94. DISCO Corporation Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 95. DISCO Corporation Recent Development
 Table 96. Aptek Industries Company Details
 Table 97. Aptek Industries Business Overview
 Table 98. Aptek Industries Wafer Grinding & Thinning Product
 Table 99. Aptek Industries Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 100. Aptek Industries Recent Development
 Table 101. UniversityWafer, Inc. Company Details
 Table 102. UniversityWafer, Inc. Business Overview
 Table 103. UniversityWafer, Inc. Wafer Grinding & Thinning Product
 Table 104. UniversityWafer, Inc. Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 105. UniversityWafer, Inc. Recent Development
 Table 106. Micross Company Details
 Table 107. Micross Business Overview
 Table 108. Micross Wafer Grinding & Thinning Product
 Table 109. Micross Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 110. Micross Recent Development
 Table 111. Power Master Semiconductor Co., Ltd. Company Details
 Table 112. Power Master Semiconductor Co., Ltd. Business Overview
 Table 113. Power Master Semiconductor Co., Ltd. Wafer Grinding & Thinning Product
 Table 114. Power Master Semiconductor Co., Ltd. Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 115. Power Master Semiconductor Co., Ltd. Recent Development
 Table 116. Enzan Factory Co., Ltd. Company Details
 Table 117. Enzan Factory Co., Ltd. Business Overview
 Table 118. Enzan Factory Co., Ltd. Wafer Grinding & Thinning Product
 Table 119. Enzan Factory Co., Ltd. Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 120. Enzan Factory Co., Ltd. Recent Development
 Table 121. Phoenix Silicon International Company Details
 Table 122. Phoenix Silicon International Business Overview
 Table 123. Phoenix Silicon International Wafer Grinding & Thinning Product
 Table 124. Phoenix Silicon International Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 125. Phoenix Silicon International Recent Development
 Table 126. Prosperity Power Technology Inc. Company Details
 Table 127. Prosperity Power Technology Inc. Business Overview
 Table 128. Prosperity Power Technology Inc. Wafer Grinding & Thinning Product
 Table 129. Prosperity Power Technology Inc. Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 130. Prosperity Power Technology Inc. Recent Development
 Table 131. Huahong Group Company Details
 Table 132. Huahong Group Business Overview
 Table 133. Huahong Group Wafer Grinding & Thinning Product
 Table 134. Huahong Group Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 135. Huahong Group Recent Development
 Table 136. MACMIC Company Details
 Table 137. MACMIC Business Overview
 Table 138. MACMIC Wafer Grinding & Thinning Product
 Table 139. MACMIC Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 140. MACMIC Recent Development
 Table 141. Winstek Company Details
 Table 142. Winstek Business Overview
 Table 143. Winstek Wafer Grinding & Thinning Product
 Table 144. Winstek Revenue in Wafer Grinding & Thinning Business (2020-2025) & (US$ Million)
 Table 145. Winstek Recent Development
 Table 146. Research Programs/Design for This Report
 Table 147. Key Data Information from Secondary Sources
 Table 148. Key Data Information from Primary Sources
 Table 149. Authors List of This Report


List of Figures
 Figure 1. Wafer Grinding & Thinning Picture
 Figure 2. Global Wafer Grinding & Thinning Market Size Comparison by Type (2020-2031) & (US$ Million)
 Figure 3. Global Wafer Grinding & Thinning Market Share by Type: 2024 VS 2031
 Figure 4. Ordinary Wafers Features
 Figure 5. Ultra-Thin Wafers Features
 Figure 6. Global Wafer Grinding & Thinning Market Size by Application (2020-2031) & (US$ Million)
 Figure 7. Global Wafer Grinding & Thinning Market Share by Application: 2024 VS 2031
 Figure 8. Consumer Electronics Case Studies
 Figure 9. Automotive Electronics Case Studies
 Figure 10. Computer and Data Center Case Studies
 Figure 11. Others Case Studies
 Figure 12. Wafer Grinding & Thinning Report Years Considered
 Figure 13. Global Wafer Grinding & Thinning Market Size (US$ Million), Year-over-Year: 2020-2031
 Figure 14. Global Wafer Grinding & Thinning Market Size, (US$ Million), 2020 VS 2024 VS 2031
 Figure 15. Global Wafer Grinding & Thinning Market Share by Region: 2024 VS 2031
 Figure 16. Global Wafer Grinding & Thinning Market Share by Players in 2024
 Figure 17. Global Top Wafer Grinding & Thinning Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Grinding & Thinning as of 2024)
 Figure 18. The Top 10 and 5 Players Market Share by Wafer Grinding & Thinning Revenue in 2024
 Figure 19. North America Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 20. North America Wafer Grinding & Thinning Market Share by Country (2020-2031)
 Figure 21. United States Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 22. Canada Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 23. Europe Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 24. Europe Wafer Grinding & Thinning Market Share by Country (2020-2031)
 Figure 25. Germany Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 26. France Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 27. U.K. Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 28. Italy Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 29. Russia Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 30. Nordic Countries Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 31. Asia-Pacific Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 32. Asia-Pacific Wafer Grinding & Thinning Market Share by Region (2020-2031)
 Figure 33. China Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 34. Japan Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 35. South Korea Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 36. Southeast Asia Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 37. India Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 38. Australia Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 39. Latin America Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 40. Latin America Wafer Grinding & Thinning Market Share by Country (2020-2031)
 Figure 41. Mexico Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 42. Brazil Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 43. Middle East & Africa Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 44. Middle East & Africa Wafer Grinding & Thinning Market Share by Country (2020-2031)
 Figure 45. Turkey Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 46. Saudi Arabia Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 47. UAE Wafer Grinding & Thinning Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 48. Syagrus Systems Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 49. Optim Wafer Services Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 50. Silicon Valley Microelectronics, Inc. Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 51. SIEGERT WAFER GmbH Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 52. NICHIWA KOGYO CO.,LTD. Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 53. Integra Technologies Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 54. Valley Design Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 55. AXUS TECHNOLOGY Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 56. Helia Photonics Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 57. DISCO Corporation Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 58. Aptek Industries Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 59. UniversityWafer, Inc. Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 60. Micross Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 61. Power Master Semiconductor Co., Ltd. Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 62. Enzan Factory Co., Ltd. Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 63. Phoenix Silicon International Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 64. Prosperity Power Technology Inc. Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 65. Huahong Group Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 66. MACMIC Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 67. Winstek Revenue Growth Rate in Wafer Grinding & Thinning Business (2020-2025)
 Figure 68. Bottom-up and Top-down Approaches for This Report
 Figure 69. Data Triangulation
 Figure 70. Key Executives Interviewed
SELECT A FORMAT
Added to Cart
Electronic (PDF)

$2900

This license allows only one user to access the PDF.
Electronic (PDF)

$4350

This license allows 1 - 5 user to access the PDF, license is suitable for small groups of 5 users working together
Electronic (PDF)

$5800

This license allows users/teams in a same Enterprise to use this report, various departments within an enterpise can use this report
Add to Cart
Buy Now (15% Discount)
INQUIRE FOR DISCOUNT

HAVE A QUERY?

INQUIRE ABOUT REPORT EMAIL US

OUR CUSTOMER

Accenture

SIMILAR REPORTS

Global Wafer Grinding Services Market Research Report 2024
Global Wafer Backside Thinning Services Market Research Report 2024
Global Wafer Polish Grinders Market Research Report 2025
Global Silicon Wafer Thinning Wheel Market Research Report 2024
Global Automatic Wafer Grinders Market Research Report 2025
Global Wafer Back Grinding Machine Market Research Report 2025
Global Automatic Semiconductor Wafer Grinders Market Research Report 2025
Global Wafer Dicing Equipment Market Research Report 2025
Global Wafer Market Research Report 2024
Global Wafer Polishing Machines Market Research Report 2025
Global Wafer Back Grinding Tapes Market Research Report 2024
Global Automatic Silicon Wafer Grinders Market Research Report 2025
Global Etching Wafer Market Research Report 2025
Global Wafer Dicing And Cleaning Solution Market Research Report 2025
Global Wafer Dicing Knife Market Research Report 2025
Global Wafer Grinding Machine Market Research Report 2025
Global Wafer Thickness Measuring System Market Research Report 2024
Global Compound Semiconductor Wafer Grinders Market Research Report 2024
Global Wafer Thinning Grinding Wheel Market Research Report 2025
Global Wafer Dicing Machine For IC Market Research Report 2025

RELATED REPORTS

Global Big Data Spending in Healthcare Market Research Report 2025

120 Pages
Type: Report
Code: QYRE-Auto-5E6179
Fri Sep 12 00:00:00 UTC 2025

Add to Cart

Global BYOD Market Research Report 2025

120 Pages
Type: Report
Code: QYRE-Auto-11T6229
Fri Sep 12 00:00:00 UTC 2025

Add to Cart

Global Translation Management Software Market Research Report 2025

120 Pages
Type: Report
Code: QYRE-Auto-36Z5964
Fri Sep 12 00:00:00 UTC 2025

Add to Cart

Global Archiving Software Market Research Report 2025

120 Pages
Type: Report
Code: QYRE-Auto-11S6221
Fri Sep 12 00:00:00 UTC 2025

Add to Cart

Call
Buy Now
REQUEST FREE SAMPLE REPORT
Support Contacts
U.S. (TOLL FREE)
+1 (425) 388-2538
THE COMPANY
OUR PRODUCTS
CUSTOMER SUPPORT
POLICES
THE COMPANY
CUSTOMER SUPPORT
OUR PRODUCTS
POLICES
Copyright © 2018 Valuates.com. All Rights Reserved.
Sitemap - Privacy Policy - Terms & Conditions