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Global Automotive Packaging Market Research Report 2024
Published Date: August 2024
|
Report Code: QYRE-Auto-29G1562
Home | Market Reports | Business & Industrial| Transportation & Logistics| Packaging
Global Automotive Packaging Market Insights Forecast to 2028
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Global Automotive Packaging Market Research Report 2024

Code: QYRE-Auto-29G1562
Report
August 2024
Pages:108
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
Onsemi
Mitsubishi Electric
Rapidus
ROHM CO LTD
ADI
Microchip (Microsemi)
Amkor
ASE(SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co. Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)

Automotive Packaging Market Size

The global Automotive Packaging market was valued at US$ 8430 million in 2023 and is anticipated to reach US$ 14990 million by 2030, witnessing a CAGR of 8.7% during the forecast period 2024-2030.

Automotive Packaging Market

Automotive Packaging Market

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. This report studies the Automotive Semiconductor Packaging.
Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.
This report aims to provide a comprehensive presentation of the global market for Automotive Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Automotive Packaging.

Report Scope

The Automotive Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Automotive Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Automotive Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Automotive Packaging Market Report

Report Metric Details
Report Name Automotive Packaging Market
Accounted market size in 2023 US$ 8430 million
Forecasted market size in 2030 US$ 14990 million
CAGR 8.7%
Base Year 2023
Forecasted years 2024 - 2030
Segment by Type
  • Advanced Packaging for Automotive
  • Traditional Packaging for Automotive
Segment by Application
  • Automotive OSAT
  • Automotive IDM
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company NXP, Infineon (Cypress), Renesas, Texas Instrument, STMicroelectronics, Bosch, onsemi, Mitsubishi Electric, Rapidus, Rohm, ADI, Microchip (Microsemi), Amkor, ASE (SPIL), UTAC, JCET (STATS ChipPAC), Carsem, King Yuan Electronics Corp. (KYEC), KINGPAK Technology Inc, Powertech Technology Inc. (PTI), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, KESM Industries Berhad, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., HT-tech, China Wafer Level CSP Co., Ltd, Ningbo ChipEx Semiconductor Co., Ltd, Guangdong Leadyo IC Testing, Unimos Microelectronics (Shanghai), Sino Technology, Taiji Semiconductor (Suzhou)
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of Automotive Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Automotive Packaging Market growing?

Ans: The Automotive Packaging Market witnessing a CAGR of 8.7% during the forecast period 2024-2030.

What is the Automotive Packaging Market size in 2030?

Ans: The Automotive Packaging Market size in 2030 will be US$ 14990 million.

Who are the main players in the Automotive Packaging Market report?

Ans: The main players in the Automotive Packaging Market are NXP, Infineon (Cypress), Renesas, Texas Instrument, STMicroelectronics, Bosch, onsemi, Mitsubishi Electric, Rapidus, Rohm, ADI, Microchip (Microsemi), Amkor, ASE (SPIL), UTAC, JCET (STATS ChipPAC), Carsem, King Yuan Electronics Corp. (KYEC), KINGPAK Technology Inc, Powertech Technology Inc. (PTI), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, KESM Industries Berhad, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., HT-tech, China Wafer Level CSP Co., Ltd, Ningbo ChipEx Semiconductor Co., Ltd, Guangdong Leadyo IC Testing, Unimos Microelectronics (Shanghai), Sino Technology, Taiji Semiconductor (Suzhou)

What are the Application segmentation covered in the Automotive Packaging Market report?

Ans: The Applications covered in the Automotive Packaging Market report are Automotive OSAT, Automotive IDM

What are the Type segmentation covered in the Automotive Packaging Market report?

Ans: The Types covered in the Automotive Packaging Market report are Advanced Packaging for Automotive, Traditional Packaging for Automotive

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Automotive Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Advanced Packaging for Automotive
1.2.3 Traditional Packaging for Automotive
1.3 Market by Application
1.3.1 Global Automotive Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive OSAT
1.3.3 Automotive IDM
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Automotive Packaging Market Perspective (2019-2030)
2.2 Automotive Packaging Growth Trends by Region
2.2.1 Global Automotive Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Automotive Packaging Historic Market Size by Region (2019-2024)
2.2.3 Automotive Packaging Forecasted Market Size by Region (2025-2030)
2.3 Automotive Packaging Market Dynamics
2.3.1 Automotive Packaging Industry Trends
2.3.2 Automotive Packaging Market Drivers
2.3.3 Automotive Packaging Market Challenges
2.3.4 Automotive Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Automotive Packaging Players by Revenue
3.1.1 Global Top Automotive Packaging Players by Revenue (2019-2024)
3.1.2 Global Automotive Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Automotive Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Automotive Packaging Revenue
3.4 Global Automotive Packaging Market Concentration Ratio
3.4.1 Global Automotive Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Automotive Packaging Revenue in 2023
3.5 Automotive Packaging Key Players Head office and Area Served
3.6 Key Players Automotive Packaging Product Solution and Service
3.7 Date of Enter into Automotive Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Automotive Packaging Breakdown Data by Type
4.1 Global Automotive Packaging Historic Market Size by Type (2019-2024)
4.2 Global Automotive Packaging Forecasted Market Size by Type (2025-2030)
5 Automotive Packaging Breakdown Data by Application
5.1 Global Automotive Packaging Historic Market Size by Application (2019-2024)
5.2 Global Automotive Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Automotive Packaging Market Size (2019-2030)
6.2 North America Automotive Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Automotive Packaging Market Size by Country (2019-2024)
6.4 North America Automotive Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Automotive Packaging Market Size (2019-2030)
7.2 Europe Automotive Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Automotive Packaging Market Size by Country (2019-2024)
7.4 Europe Automotive Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Automotive Packaging Market Size (2019-2030)
8.2 Asia-Pacific Automotive Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Automotive Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific Automotive Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Automotive Packaging Market Size (2019-2030)
9.2 Latin America Automotive Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Automotive Packaging Market Size by Country (2019-2024)
9.4 Latin America Automotive Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Automotive Packaging Market Size (2019-2030)
10.2 Middle East & Africa Automotive Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Automotive Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa Automotive Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 NXP
11.1.1 NXP Company Detail
11.1.2 NXP Business Overview
11.1.3 NXP Automotive Packaging Introduction
11.1.4 NXP Revenue in Automotive Packaging Business (2019-2024)
11.1.5 NXP Recent Development
11.2 Infineon (Cypress)
11.2.1 Infineon (Cypress) Company Detail
11.2.2 Infineon (Cypress) Business Overview
11.2.3 Infineon (Cypress) Automotive Packaging Introduction
11.2.4 Infineon (Cypress) Revenue in Automotive Packaging Business (2019-2024)
11.2.5 Infineon (Cypress) Recent Development
11.3 Renesas
11.3.1 Renesas Company Detail
11.3.2 Renesas Business Overview
11.3.3 Renesas Automotive Packaging Introduction
11.3.4 Renesas Revenue in Automotive Packaging Business (2019-2024)
11.3.5 Renesas Recent Development
11.4 Texas Instrument
11.4.1 Texas Instrument Company Detail
11.4.2 Texas Instrument Business Overview
11.4.3 Texas Instrument Automotive Packaging Introduction
11.4.4 Texas Instrument Revenue in Automotive Packaging Business (2019-2024)
11.4.5 Texas Instrument Recent Development
11.5 STMicroelectronics
11.5.1 STMicroelectronics Company Detail
11.5.2 STMicroelectronics Business Overview
11.5.3 STMicroelectronics Automotive Packaging Introduction
11.5.4 STMicroelectronics Revenue in Automotive Packaging Business (2019-2024)
11.5.5 STMicroelectronics Recent Development
11.6 Bosch
11.6.1 Bosch Company Detail
11.6.2 Bosch Business Overview
11.6.3 Bosch Automotive Packaging Introduction
11.6.4 Bosch Revenue in Automotive Packaging Business (2019-2024)
11.6.5 Bosch Recent Development
11.7 onsemi
11.7.1 onsemi Company Detail
11.7.2 onsemi Business Overview
11.7.3 onsemi Automotive Packaging Introduction
11.7.4 onsemi Revenue in Automotive Packaging Business (2019-2024)
11.7.5 onsemi Recent Development
11.8 Mitsubishi Electric
11.8.1 Mitsubishi Electric Company Detail
11.8.2 Mitsubishi Electric Business Overview
11.8.3 Mitsubishi Electric Automotive Packaging Introduction
11.8.4 Mitsubishi Electric Revenue in Automotive Packaging Business (2019-2024)
11.8.5 Mitsubishi Electric Recent Development
11.9 Rapidus
11.9.1 Rapidus Company Detail
11.9.2 Rapidus Business Overview
11.9.3 Rapidus Automotive Packaging Introduction
11.9.4 Rapidus Revenue in Automotive Packaging Business (2019-2024)
11.9.5 Rapidus Recent Development
11.10 Rohm
11.10.1 Rohm Company Detail
11.10.2 Rohm Business Overview
11.10.3 Rohm Automotive Packaging Introduction
11.10.4 Rohm Revenue in Automotive Packaging Business (2019-2024)
11.10.5 Rohm Recent Development
11.11 ADI
11.11.1 ADI Company Detail
11.11.2 ADI Business Overview
11.11.3 ADI Automotive Packaging Introduction
11.11.4 ADI Revenue in Automotive Packaging Business (2019-2024)
11.11.5 ADI Recent Development
11.12 Microchip (Microsemi)
11.12.1 Microchip (Microsemi) Company Detail
11.12.2 Microchip (Microsemi) Business Overview
11.12.3 Microchip (Microsemi) Automotive Packaging Introduction
11.12.4 Microchip (Microsemi) Revenue in Automotive Packaging Business (2019-2024)
11.12.5 Microchip (Microsemi) Recent Development
11.13 Amkor
11.13.1 Amkor Company Detail
11.13.2 Amkor Business Overview
11.13.3 Amkor Automotive Packaging Introduction
11.13.4 Amkor Revenue in Automotive Packaging Business (2019-2024)
11.13.5 Amkor Recent Development
11.14 ASE (SPIL)
11.14.1 ASE (SPIL) Company Detail
11.14.2 ASE (SPIL) Business Overview
11.14.3 ASE (SPIL) Automotive Packaging Introduction
11.14.4 ASE (SPIL) Revenue in Automotive Packaging Business (2019-2024)
11.14.5 ASE (SPIL) Recent Development
11.15 UTAC
11.15.1 UTAC Company Detail
11.15.2 UTAC Business Overview
11.15.3 UTAC Automotive Packaging Introduction
11.15.4 UTAC Revenue in Automotive Packaging Business (2019-2024)
11.15.5 UTAC Recent Development
11.16 JCET (STATS ChipPAC)
11.16.1 JCET (STATS ChipPAC) Company Detail
11.16.2 JCET (STATS ChipPAC) Business Overview
11.16.3 JCET (STATS ChipPAC) Automotive Packaging Introduction
11.16.4 JCET (STATS ChipPAC) Revenue in Automotive Packaging Business (2019-2024)
11.16.5 JCET (STATS ChipPAC) Recent Development
11.17 Carsem
11.17.1 Carsem Company Detail
11.17.2 Carsem Business Overview
11.17.3 Carsem Automotive Packaging Introduction
11.17.4 Carsem Revenue in Automotive Packaging Business (2019-2024)
11.17.5 Carsem Recent Development
11.18 King Yuan Electronics Corp. (KYEC)
11.18.1 King Yuan Electronics Corp. (KYEC) Company Detail
11.18.2 King Yuan Electronics Corp. (KYEC) Business Overview
11.18.3 King Yuan Electronics Corp. (KYEC) Automotive Packaging Introduction
11.18.4 King Yuan Electronics Corp. (KYEC) Revenue in Automotive Packaging Business (2019-2024)
11.18.5 King Yuan Electronics Corp. (KYEC) Recent Development
11.19 KINGPAK Technology Inc
11.19.1 KINGPAK Technology Inc Company Detail
11.19.2 KINGPAK Technology Inc Business Overview
11.19.3 KINGPAK Technology Inc Automotive Packaging Introduction
11.19.4 KINGPAK Technology Inc Revenue in Automotive Packaging Business (2019-2024)
11.19.5 KINGPAK Technology Inc Recent Development
11.20 Powertech Technology Inc. (PTI)
11.20.1 Powertech Technology Inc. (PTI) Company Detail
11.20.2 Powertech Technology Inc. (PTI) Business Overview
11.20.3 Powertech Technology Inc. (PTI) Automotive Packaging Introduction
11.20.4 Powertech Technology Inc. (PTI) Revenue in Automotive Packaging Business (2019-2024)
11.20.5 Powertech Technology Inc. (PTI) Recent Development
11.21 SFA Semicon
11.21.1 SFA Semicon Company Detail
11.21.2 SFA Semicon Business Overview
11.21.3 SFA Semicon Automotive Packaging Introduction
11.21.4 SFA Semicon Revenue in Automotive Packaging Business (2019-2024)
11.21.5 SFA Semicon Recent Development
11.22 Unisem Group
11.22.1 Unisem Group Company Detail
11.22.2 Unisem Group Business Overview
11.22.3 Unisem Group Automotive Packaging Introduction
11.22.4 Unisem Group Revenue in Automotive Packaging Business (2019-2024)
11.22.5 Unisem Group Recent Development
11.23 Chipbond Technology Corporation
11.23.1 Chipbond Technology Corporation Company Detail
11.23.2 Chipbond Technology Corporation Business Overview
11.23.3 Chipbond Technology Corporation Automotive Packaging Introduction
11.23.4 Chipbond Technology Corporation Revenue in Automotive Packaging Business (2019-2024)
11.23.5 Chipbond Technology Corporation Recent Development
11.24 ChipMOS TECHNOLOGIES
11.24.1 ChipMOS TECHNOLOGIES Company Detail
11.24.2 ChipMOS TECHNOLOGIES Business Overview
11.24.3 ChipMOS TECHNOLOGIES Automotive Packaging Introduction
11.24.4 ChipMOS TECHNOLOGIES Revenue in Automotive Packaging Business (2019-2024)
11.24.5 ChipMOS TECHNOLOGIES Recent Development
11.25 OSE CORP.
11.25.1 OSE CORP. Company Detail
11.25.2 OSE CORP. Business Overview
11.25.3 OSE CORP. Automotive Packaging Introduction
11.25.4 OSE CORP. Revenue in Automotive Packaging Business (2019-2024)
11.25.5 OSE CORP. Recent Development
11.26 Sigurd Microelectronics
11.26.1 Sigurd Microelectronics Company Detail
11.26.2 Sigurd Microelectronics Business Overview
11.26.3 Sigurd Microelectronics Automotive Packaging Introduction
11.26.4 Sigurd Microelectronics Revenue in Automotive Packaging Business (2019-2024)
11.26.5 Sigurd Microelectronics Recent Development
11.27 Natronix Semiconductor Technology
11.27.1 Natronix Semiconductor Technology Company Detail
11.27.2 Natronix Semiconductor Technology Business Overview
11.27.3 Natronix Semiconductor Technology Automotive Packaging Introduction
11.27.4 Natronix Semiconductor Technology Revenue in Automotive Packaging Business (2019-2024)
11.27.5 Natronix Semiconductor Technology Recent Development
11.28 Nepes
11.28.1 Nepes Company Detail
11.28.2 Nepes Business Overview
11.28.3 Nepes Automotive Packaging Introduction
11.28.4 Nepes Revenue in Automotive Packaging Business (2019-2024)
11.28.5 Nepes Recent Development
11.29 KESM Industries Berhad
11.29.1 KESM Industries Berhad Company Detail
11.29.2 KESM Industries Berhad Business Overview
11.29.3 KESM Industries Berhad Automotive Packaging Introduction
11.29.4 KESM Industries Berhad Revenue in Automotive Packaging Business (2019-2024)
11.29.5 KESM Industries Berhad Recent Development
11.30 Forehope Electronic (Ningbo) Co.,Ltd.
11.30.1 Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
11.30.2 Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
11.30.3 Forehope Electronic (Ningbo) Co.,Ltd. Automotive Packaging Introduction
11.30.4 Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Automotive Packaging Business (2019-2024)
11.30.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
11.31 Union Semiconductor（Hefei）Co., Ltd.
11.31.1 Union Semiconductor（Hefei）Co., Ltd. Company Detail
11.31.2 Union Semiconductor（Hefei）Co., Ltd. Business Overview
11.31.3 Union Semiconductor（Hefei）Co., Ltd. Automotive Packaging Introduction
11.31.4 Union Semiconductor（Hefei）Co., Ltd. Revenue in Automotive Packaging Business (2019-2024)
11.31.5 Union Semiconductor（Hefei）Co., Ltd. Recent Development
11.32 Tongfu Microelectronics (TFME)
11.32.1 Tongfu Microelectronics (TFME) Company Detail
11.32.2 Tongfu Microelectronics (TFME) Business Overview
11.32.3 Tongfu Microelectronics (TFME) Automotive Packaging Introduction
11.32.4 Tongfu Microelectronics (TFME) Revenue in Automotive Packaging Business (2019-2024)
11.32.5 Tongfu Microelectronics (TFME) Recent Development
11.33 Hefei Chipmore Technology Co.,Ltd.
11.33.1 Hefei Chipmore Technology Co.,Ltd. Company Detail
11.33.2 Hefei Chipmore Technology Co.,Ltd. Business Overview
11.33.3 Hefei Chipmore Technology Co.,Ltd. Automotive Packaging Introduction
11.33.4 Hefei Chipmore Technology Co.,Ltd. Revenue in Automotive Packaging Business (2019-2024)
11.33.5 Hefei Chipmore Technology Co.,Ltd. Recent Development
11.34 HT-tech
11.34.1 HT-tech Company Detail
11.34.2 HT-tech Business Overview
11.34.3 HT-tech Automotive Packaging Introduction
11.34.4 HT-tech Revenue in Automotive Packaging Business (2019-2024)
11.34.5 HT-tech Recent Development
11.35 China Wafer Level CSP Co., Ltd
11.35.1 China Wafer Level CSP Co., Ltd Company Detail
11.35.2 China Wafer Level CSP Co., Ltd Business Overview
11.35.3 China Wafer Level CSP Co., Ltd Automotive Packaging Introduction
11.35.4 China Wafer Level CSP Co., Ltd Revenue in Automotive Packaging Business (2019-2024)
11.35.5 China Wafer Level CSP Co., Ltd Recent Development
11.36 Ningbo ChipEx Semiconductor Co., Ltd
11.36.1 Ningbo ChipEx Semiconductor Co., Ltd Company Detail
11.36.2 Ningbo ChipEx Semiconductor Co., Ltd Business Overview
11.36.3 Ningbo ChipEx Semiconductor Co., Ltd Automotive Packaging Introduction
11.36.4 Ningbo ChipEx Semiconductor Co., Ltd Revenue in Automotive Packaging Business (2019-2024)
11.36.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Development
11.37 Guangdong Leadyo IC Testing
11.37.1 Guangdong Leadyo IC Testing Company Detail
11.37.2 Guangdong Leadyo IC Testing Business Overview
11.37.3 Guangdong Leadyo IC Testing Automotive Packaging Introduction
11.37.4 Guangdong Leadyo IC Testing Revenue in Automotive Packaging Business (2019-2024)
11.37.5 Guangdong Leadyo IC Testing Recent Development
11.38 Unimos Microelectronics (Shanghai)
11.38.1 Unimos Microelectronics (Shanghai) Company Detail
11.38.2 Unimos Microelectronics (Shanghai) Business Overview
11.38.3 Unimos Microelectronics (Shanghai) Automotive Packaging Introduction
11.38.4 Unimos Microelectronics (Shanghai) Revenue in Automotive Packaging Business (2019-2024)
11.38.5 Unimos Microelectronics (Shanghai) Recent Development
11.39 Sino Technology
11.39.1 Sino Technology Company Detail
11.39.2 Sino Technology Business Overview
11.39.3 Sino Technology Automotive Packaging Introduction
11.39.4 Sino Technology Revenue in Automotive Packaging Business (2019-2024)
11.39.5 Sino Technology Recent Development
11.40 Taiji Semiconductor (Suzhou)
11.40.1 Taiji Semiconductor (Suzhou) Company Detail
11.40.2 Taiji Semiconductor (Suzhou) Business Overview
11.40.3 Taiji Semiconductor (Suzhou) Automotive Packaging Introduction
11.40.4 Taiji Semiconductor (Suzhou) Revenue in Automotive Packaging Business (2019-2024)
11.40.5 Taiji Semiconductor (Suzhou) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
FEATURED COMPANIES
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
Onsemi
Mitsubishi Electric
Rapidus
ROHM CO LTD
ADI
Microchip (Microsemi)
Amkor
ASE(SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co. Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
List of Tables
    Table 1. Global Automotive Packaging Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
    Table 2. Key Players of Advanced Packaging for Automotive
    Table 3. Key Players of Traditional Packaging for Automotive
    Table 4. Global Automotive Packaging Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
    Table 5. Global Automotive Packaging Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 6. Global Automotive Packaging Market Size by Region (2019-2024) & (US$ Million)
    Table 7. Global Automotive Packaging Market Share by Region (2019-2024)
    Table 8. Global Automotive Packaging Forecasted Market Size by Region (2025-2030) & (US$ Million)
    Table 9. Global Automotive Packaging Market Share by Region (2025-2030)
    Table 10. Automotive Packaging Market Trends
    Table 11. Automotive Packaging Market Drivers
    Table 12. Automotive Packaging Market Challenges
    Table 13. Automotive Packaging Market Restraints
    Table 14. Global Automotive Packaging Revenue by Players (2019-2024) & (US$ Million)
    Table 15. Global Automotive Packaging Market Share by Players (2019-2024)
    Table 16. Global Top Automotive Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Automotive Packaging as of 2023)
    Table 17. Ranking of Global Top Automotive Packaging Companies by Revenue (US$ Million) in 2023
    Table 18. Global 5 Largest Players Market Share by Automotive Packaging Revenue (CR5 and HHI) & (2019-2024)
    Table 19. Key Players Headquarters and Area Served
    Table 20. Key Players Automotive Packaging Product Solution and Service
    Table 21. Date of Enter into Automotive Packaging Market
    Table 22. Mergers & Acquisitions, Expansion Plans
    Table 23. Global Automotive Packaging Market Size by Type (2019-2024) & (US$ Million)
    Table 24. Global Automotive Packaging Revenue Market Share by Type (2019-2024)
    Table 25. Global Automotive Packaging Forecasted Market Size by Type (2025-2030) & (US$ Million)
    Table 26. Global Automotive Packaging Revenue Market Share by Type (2025-2030)
    Table 27. Global Automotive Packaging Market Size by Application (2019-2024) & (US$ Million)
    Table 28. Global Automotive Packaging Revenue Market Share by Application (2019-2024)
    Table 29. Global Automotive Packaging Forecasted Market Size by Application (2025-2030) & (US$ Million)
    Table 30. Global Automotive Packaging Revenue Market Share by Application (2025-2030)
    Table 31. North America Automotive Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 32. North America Automotive Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 33. North America Automotive Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 34. Europe Automotive Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 35. Europe Automotive Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 36. Europe Automotive Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 37. Asia-Pacific Automotive Packaging Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 38. Asia-Pacific Automotive Packaging Market Size by Region (2019-2024) & (US$ Million)
    Table 39. Asia-Pacific Automotive Packaging Market Size by Region (2025-2030) & (US$ Million)
    Table 40. Latin America Automotive Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 41. Latin America Automotive Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 42. Latin America Automotive Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 43. Middle East & Africa Automotive Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 44. Middle East & Africa Automotive Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 45. Middle East & Africa Automotive Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 46. NXP Company Detail
    Table 47. NXP Business Overview
    Table 48. NXP Automotive Packaging Product
    Table 49. NXP Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 50. NXP Recent Development
    Table 51. Infineon (Cypress) Company Detail
    Table 52. Infineon (Cypress) Business Overview
    Table 53. Infineon (Cypress) Automotive Packaging Product
    Table 54. Infineon (Cypress) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 55. Infineon (Cypress) Recent Development
    Table 56. Renesas Company Detail
    Table 57. Renesas Business Overview
    Table 58. Renesas Automotive Packaging Product
    Table 59. Renesas Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 60. Renesas Recent Development
    Table 61. Texas Instrument Company Detail
    Table 62. Texas Instrument Business Overview
    Table 63. Texas Instrument Automotive Packaging Product
    Table 64. Texas Instrument Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 65. Texas Instrument Recent Development
    Table 66. STMicroelectronics Company Detail
    Table 67. STMicroelectronics Business Overview
    Table 68. STMicroelectronics Automotive Packaging Product
    Table 69. STMicroelectronics Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 70. STMicroelectronics Recent Development
    Table 71. Bosch Company Detail
    Table 72. Bosch Business Overview
    Table 73. Bosch Automotive Packaging Product
    Table 74. Bosch Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 75. Bosch Recent Development
    Table 76. onsemi Company Detail
    Table 77. onsemi Business Overview
    Table 78. onsemi Automotive Packaging Product
    Table 79. onsemi Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 80. onsemi Recent Development
    Table 81. Mitsubishi Electric Company Detail
    Table 82. Mitsubishi Electric Business Overview
    Table 83. Mitsubishi Electric Automotive Packaging Product
    Table 84. Mitsubishi Electric Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 85. Mitsubishi Electric Recent Development
    Table 86. Rapidus Company Detail
    Table 87. Rapidus Business Overview
    Table 88. Rapidus Automotive Packaging Product
    Table 89. Rapidus Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 90. Rapidus Recent Development
    Table 91. Rohm Company Detail
    Table 92. Rohm Business Overview
    Table 93. Rohm Automotive Packaging Product
    Table 94. Rohm Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 95. Rohm Recent Development
    Table 96. ADI Company Detail
    Table 97. ADI Business Overview
    Table 98. ADI Automotive Packaging Product
    Table 99. ADI Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 100. ADI Recent Development
    Table 101. Microchip (Microsemi) Company Detail
    Table 102. Microchip (Microsemi) Business Overview
    Table 103. Microchip (Microsemi) Automotive Packaging Product
    Table 104. Microchip (Microsemi) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 105. Microchip (Microsemi) Recent Development
    Table 106. Amkor Company Detail
    Table 107. Amkor Business Overview
    Table 108. Amkor Automotive Packaging Product
    Table 109. Amkor Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 110. Amkor Recent Development
    Table 111. ASE (SPIL) Company Detail
    Table 112. ASE (SPIL) Business Overview
    Table 113. ASE (SPIL) Automotive Packaging Product
    Table 114. ASE (SPIL) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 115. ASE (SPIL) Recent Development
    Table 116. UTAC Company Detail
    Table 117. UTAC Business Overview
    Table 118. UTAC Automotive Packaging Product
    Table 119. UTAC Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 120. UTAC Recent Development
    Table 121. JCET (STATS ChipPAC) Company Detail
    Table 122. JCET (STATS ChipPAC) Business Overview
    Table 123. JCET (STATS ChipPAC) Automotive Packaging Product
    Table 124. JCET (STATS ChipPAC) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 125. JCET (STATS ChipPAC) Recent Development
    Table 126. Carsem Company Detail
    Table 127. Carsem Business Overview
    Table 128. Carsem Automotive Packaging Product
    Table 129. Carsem Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 130. Carsem Recent Development
    Table 131. King Yuan Electronics Corp. (KYEC) Company Detail
    Table 132. King Yuan Electronics Corp. (KYEC) Business Overview
    Table 133. King Yuan Electronics Corp. (KYEC) Automotive Packaging Product
    Table 134. King Yuan Electronics Corp. (KYEC) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 135. King Yuan Electronics Corp. (KYEC) Recent Development
    Table 136. KINGPAK Technology Inc Company Detail
    Table 137. KINGPAK Technology Inc Business Overview
    Table 138. KINGPAK Technology Inc Automotive Packaging Product
    Table 139. KINGPAK Technology Inc Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 140. KINGPAK Technology Inc Recent Development
    Table 141. Powertech Technology Inc. (PTI) Company Detail
    Table 142. Powertech Technology Inc. (PTI) Business Overview
    Table 143. Powertech Technology Inc. (PTI) Automotive Packaging Product
    Table 144. Powertech Technology Inc. (PTI) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 145. Powertech Technology Inc. (PTI) Recent Development
    Table 146. SFA Semicon Company Detail
    Table 147. SFA Semicon Business Overview
    Table 148. SFA Semicon Automotive Packaging Product
    Table 149. SFA Semicon Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 150. SFA Semicon Recent Development
    Table 151. Unisem Group Company Detail
    Table 152. Unisem Group Business Overview
    Table 153. Unisem Group Automotive Packaging Product
    Table 154. Unisem Group Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 155. Unisem Group Recent Development
    Table 156. Chipbond Technology Corporation Company Detail
    Table 157. Chipbond Technology Corporation Business Overview
    Table 158. Chipbond Technology Corporation Automotive Packaging Product
    Table 159. Chipbond Technology Corporation Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 160. Chipbond Technology Corporation Recent Development
    Table 161. ChipMOS TECHNOLOGIES Company Detail
    Table 162. ChipMOS TECHNOLOGIES Business Overview
    Table 163. ChipMOS TECHNOLOGIES Automotive Packaging Product
    Table 164. ChipMOS TECHNOLOGIES Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 165. ChipMOS TECHNOLOGIES Recent Development
    Table 166. OSE CORP. Company Detail
    Table 167. OSE CORP. Business Overview
    Table 168. OSE CORP. Automotive Packaging Product
    Table 169. OSE CORP. Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 170. OSE CORP. Recent Development
    Table 171. Sigurd Microelectronics Company Detail
    Table 172. Sigurd Microelectronics Business Overview
    Table 173. Sigurd Microelectronics Automotive Packaging Product
    Table 174. Sigurd Microelectronics Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 175. Sigurd Microelectronics Recent Development
    Table 176. Natronix Semiconductor Technology Company Detail
    Table 177. Natronix Semiconductor Technology Business Overview
    Table 178. Natronix Semiconductor Technology Automotive Packaging Product
    Table 179. Natronix Semiconductor Technology Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 180. Natronix Semiconductor Technology Recent Development
    Table 181. Nepes Company Detail
    Table 182. Nepes Business Overview
    Table 183. Nepes Automotive Packaging Product
    Table 184. Nepes Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 185. Nepes Recent Development
    Table 186. KESM Industries Berhad Company Detail
    Table 187. KESM Industries Berhad Business Overview
    Table 188. KESM Industries Berhad Automotive Packaging Product
    Table 189. KESM Industries Berhad Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 190. KESM Industries Berhad Recent Development
    Table 191. Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
    Table 192. Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
    Table 193. Forehope Electronic (Ningbo) Co.,Ltd. Automotive Packaging Product
    Table 194. Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 195. Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
    Table 196. Union Semiconductor（Hefei）Co., Ltd. Company Detail
    Table 197. Union Semiconductor（Hefei）Co., Ltd. Business Overview
    Table 198. Union Semiconductor（Hefei）Co., Ltd. Automotive Packaging Product
    Table 199. Union Semiconductor（Hefei）Co., Ltd. Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 200. Union Semiconductor（Hefei）Co., Ltd. Recent Development
    Table 201. Tongfu Microelectronics (TFME) Company Detail
    Table 202. Tongfu Microelectronics (TFME) Business Overview
    Table 203. Tongfu Microelectronics (TFME) Automotive Packaging Product
    Table 204. Tongfu Microelectronics (TFME) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 205. Tongfu Microelectronics (TFME) Recent Development
    Table 206. Hefei Chipmore Technology Co.,Ltd. Company Detail
    Table 207. Hefei Chipmore Technology Co.,Ltd. Business Overview
    Table 208. Hefei Chipmore Technology Co.,Ltd. Automotive Packaging Product
    Table 209. Hefei Chipmore Technology Co.,Ltd. Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 210. Hefei Chipmore Technology Co.,Ltd. Recent Development
    Table 211. HT-tech Company Detail
    Table 212. HT-tech Business Overview
    Table 213. HT-tech Automotive Packaging Product
    Table 214. HT-tech Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 215. HT-tech Recent Development
    Table 216. China Wafer Level CSP Co., Ltd Company Detail
    Table 217. China Wafer Level CSP Co., Ltd Business Overview
    Table 218. China Wafer Level CSP Co., Ltd Automotive Packaging Product
    Table 219. China Wafer Level CSP Co., Ltd Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 220. China Wafer Level CSP Co., Ltd Recent Development
    Table 221. Ningbo ChipEx Semiconductor Co., Ltd Company Detail
    Table 222. Ningbo ChipEx Semiconductor Co., Ltd Business Overview
    Table 223. Ningbo ChipEx Semiconductor Co., Ltd Automotive Packaging Product
    Table 224. Ningbo ChipEx Semiconductor Co., Ltd Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 225. Ningbo ChipEx Semiconductor Co., Ltd Recent Development
    Table 226. Guangdong Leadyo IC Testing Company Detail
    Table 227. Guangdong Leadyo IC Testing Business Overview
    Table 228. Guangdong Leadyo IC Testing Automotive Packaging Product
    Table 229. Guangdong Leadyo IC Testing Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 230. Guangdong Leadyo IC Testing Recent Development
    Table 231. Unimos Microelectronics (Shanghai) Company Detail
    Table 232. Unimos Microelectronics (Shanghai) Business Overview
    Table 233. Unimos Microelectronics (Shanghai) Automotive Packaging Product
    Table 234. Unimos Microelectronics (Shanghai) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 235. Unimos Microelectronics (Shanghai) Recent Development
    Table 236. Sino Technology Company Detail
    Table 237. Sino Technology Business Overview
    Table 238. Sino Technology Automotive Packaging Product
    Table 239. Sino Technology Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 240. Sino Technology Recent Development
    Table 241. Taiji Semiconductor (Suzhou) Company Detail
    Table 242. Taiji Semiconductor (Suzhou) Business Overview
    Table 243. Taiji Semiconductor (Suzhou) Automotive Packaging Product
    Table 244. Taiji Semiconductor (Suzhou) Revenue in Automotive Packaging Business (2019-2024) & (US$ Million)
    Table 245. Taiji Semiconductor (Suzhou) Recent Development
    Table 246. Research Programs/Design for This Report
    Table 247. Key Data Information from Secondary Sources
    Table 248. Key Data Information from Primary Sources
List of Figures
    Figure 1. Global Automotive Packaging Market Size Comparison by Type (2024-2030) & (US$ Million)
    Figure 2. Global Automotive Packaging Market Share by Type: 2023 VS 2030
    Figure 3. Advanced Packaging for Automotive Features
    Figure 4. Traditional Packaging for Automotive Features
    Figure 5. Global Automotive Packaging Market Size Comparison by Application (2024-2030) & (US$ Million)
    Figure 6. Global Automotive Packaging Market Share by Application: 2023 VS 2030
    Figure 7. Automotive OSAT Case Studies
    Figure 8. Automotive IDM Case Studies
    Figure 9. Automotive Packaging Report Years Considered
    Figure 10. Global Automotive Packaging Market Size (US$ Million), Year-over-Year: 2019-2030
    Figure 11. Global Automotive Packaging Market Size, (US$ Million), 2019 VS 2023 VS 2030
    Figure 12. Global Automotive Packaging Market Share by Region: 2023 VS 2030
    Figure 13. Global Automotive Packaging Market Share by Players in 2023
    Figure 14. Global Top Automotive Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Automotive Packaging as of 2023)
    Figure 15. The Top 10 and 5 Players Market Share by Automotive Packaging Revenue in 2023
    Figure 16. North America Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 17. North America Automotive Packaging Market Share by Country (2019-2030)
    Figure 18. United States Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 19. Canada Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 20. Europe Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 21. Europe Automotive Packaging Market Share by Country (2019-2030)
    Figure 22. Germany Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 23. France Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 24. U.K. Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 25. Italy Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 26. Russia Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 27. Nordic Countries Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 28. Asia-Pacific Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 29. Asia-Pacific Automotive Packaging Market Share by Region (2019-2030)
    Figure 30. China Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 31. Japan Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 32. South Korea Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 33. Southeast Asia Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 34. India Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 35. Australia Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 36. Latin America Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 37. Latin America Automotive Packaging Market Share by Country (2019-2030)
    Figure 38. Mexico Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 39. Brazil Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 40. Middle East & Africa Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 41. Middle East & Africa Automotive Packaging Market Share by Country (2019-2030)
    Figure 42. Turkey Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 43. Saudi Arabia Automotive Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 44. NXP Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 45. Infineon (Cypress) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 46. Renesas Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 47. Texas Instrument Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 48. STMicroelectronics Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 49. Bosch Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 50. onsemi Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 51. Mitsubishi Electric Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 52. Rapidus Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 53. Rohm Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 54. ADI Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 55. Microchip (Microsemi) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 56. Amkor Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 57. ASE (SPIL) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 58. UTAC Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 59. JCET (STATS ChipPAC) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 60. Carsem Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 61. King Yuan Electronics Corp. (KYEC) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 62. KINGPAK Technology Inc Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 63. Powertech Technology Inc. (PTI) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 64. SFA Semicon Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 65. Unisem Group Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 66. Chipbond Technology Corporation Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 67. ChipMOS TECHNOLOGIES Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 68. OSE CORP. Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 69. Sigurd Microelectronics Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 70. Natronix Semiconductor Technology Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 71. Nepes Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 72. KESM Industries Berhad Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 73. Forehope Electronic (Ningbo) Co.,Ltd. Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 74. Union Semiconductor（Hefei）Co., Ltd. Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 75. Tongfu Microelectronics (TFME) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 76. Hefei Chipmore Technology Co.,Ltd. Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 77. HT-tech Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 78. China Wafer Level CSP Co., Ltd Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 79. Ningbo ChipEx Semiconductor Co., Ltd Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 80. Guangdong Leadyo IC Testing Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 81. Unimos Microelectronics (Shanghai) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 82. Sino Technology Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 83. Taiji Semiconductor (Suzhou) Revenue Growth Rate in Automotive Packaging Business (2019-2024)
    Figure 84. Bottom-up and Top-down Approaches for This Report
    Figure 85. Data Triangulation
    Figure 86. Key Executives Interviewed
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