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Global Automotive Chip Packaging Market Research Report 2024
Published Date: August 2024
|
Report Code: QYRE-Auto-5H15676
Home | Market Reports | Computers & Electronics
Global Automotive Chip Packaging Market Research Report 2023
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Global Automotive Chip Packaging Market Research Report 2024

Code: QYRE-Auto-5H15676
Report
August 2024
Pages:103
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
Onsemi
Mitsubishi Electric
Rapidus
ROHM CO LTD
ADI
Microchip (Microsemi)
Amkor
ASE(SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co. Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)

Automotive Chip Packaging Market Size

The global Automotive Chip Packaging market was valued at US$ 8430 million in 2023 and is anticipated to reach US$ 14990 million by 2030, witnessing a CAGR of 8.7% during the forecast period 2024-2030.

Automotive Chip Packaging Market

Automotive Chip Packaging Market

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. This report studies the Automotive Chip Packaging.
Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.
This report aims to provide a comprehensive presentation of the global market for Automotive Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Automotive Chip Packaging.

Report Scope

The Automotive Chip Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Automotive Chip Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Automotive Chip Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Automotive Chip Packaging Market Report

Report Metric Details
Report Name Automotive Chip Packaging Market
Accounted market size in 2023 US$ 8430 million
Forecasted market size in 2030 US$ 14990 million
CAGR 8.7%
Base Year 2023
Forecasted years 2024 - 2030
Segment by Type
  • Ceramic Substrate
  • WB BGA
  • Lead Frame
  • FC BGA
  • Power Module
  • Others
Segment by Application
  • Automotive OSAT
  • Automotive IDM
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company NXP, Infineon (Cypress), Renesas, Texas Instrument, STMicroelectronics, Bosch, onsemi, Mitsubishi Electric, Rapidus, Rohm, ADI, Microchip (Microsemi), Amkor, ASE (SPIL), UTAC, JCET (STATS ChipPAC), Carsem, King Yuan Electronics Corp. (KYEC), KINGPAK Technology Inc, Powertech Technology Inc. (PTI), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, KESM Industries Berhad, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., HT-tech, China Wafer Level CSP Co., Ltd, Ningbo ChipEx Semiconductor Co., Ltd, Guangdong Leadyo IC Testing, Unimos Microelectronics (Shanghai), Sino Technology, Taiji Semiconductor (Suzhou)
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of Automotive Chip Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Automotive Chip Packaging Market growing?

Ans: The Automotive Chip Packaging Market witnessing a CAGR of 8.7% during the forecast period 2024-2030.

What is the Automotive Chip Packaging Market size in 2030?

Ans: The Automotive Chip Packaging Market size in 2030 will be US$ 14990 million.

Who are the main players in the Automotive Chip Packaging Market report?

Ans: The main players in the Automotive Chip Packaging Market are NXP, Infineon (Cypress), Renesas, Texas Instrument, STMicroelectronics, Bosch, onsemi, Mitsubishi Electric, Rapidus, Rohm, ADI, Microchip (Microsemi), Amkor, ASE (SPIL), UTAC, JCET (STATS ChipPAC), Carsem, King Yuan Electronics Corp. (KYEC), KINGPAK Technology Inc, Powertech Technology Inc. (PTI), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, KESM Industries Berhad, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., HT-tech, China Wafer Level CSP Co., Ltd, Ningbo ChipEx Semiconductor Co., Ltd, Guangdong Leadyo IC Testing, Unimos Microelectronics (Shanghai), Sino Technology, Taiji Semiconductor (Suzhou)

What are the Application segmentation covered in the Automotive Chip Packaging Market report?

Ans: The Applications covered in the Automotive Chip Packaging Market report are Automotive OSAT, Automotive IDM

What are the Type segmentation covered in the Automotive Chip Packaging Market report?

Ans: The Types covered in the Automotive Chip Packaging Market report are Ceramic Substrate, WB BGA, Lead Frame, FC BGA, Power Module, Others

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Automotive Chip Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Ceramic Substrate
1.2.3 WB BGA
1.2.4 Lead Frame
1.2.5 FC BGA
1.2.6 Power Module
1.2.7 Others
1.3 Market by Application
1.3.1 Global Automotive Chip Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive OSAT
1.3.3 Automotive IDM
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Automotive Chip Packaging Market Perspective (2019-2030)
2.2 Automotive Chip Packaging Growth Trends by Region
2.2.1 Global Automotive Chip Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Automotive Chip Packaging Historic Market Size by Region (2019-2024)
2.2.3 Automotive Chip Packaging Forecasted Market Size by Region (2025-2030)
2.3 Automotive Chip Packaging Market Dynamics
2.3.1 Automotive Chip Packaging Industry Trends
2.3.2 Automotive Chip Packaging Market Drivers
2.3.3 Automotive Chip Packaging Market Challenges
2.3.4 Automotive Chip Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Automotive Chip Packaging Players by Revenue
3.1.1 Global Top Automotive Chip Packaging Players by Revenue (2019-2024)
3.1.2 Global Automotive Chip Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Automotive Chip Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Automotive Chip Packaging Revenue
3.4 Global Automotive Chip Packaging Market Concentration Ratio
3.4.1 Global Automotive Chip Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Automotive Chip Packaging Revenue in 2023
3.5 Automotive Chip Packaging Key Players Head office and Area Served
3.6 Key Players Automotive Chip Packaging Product Solution and Service
3.7 Date of Enter into Automotive Chip Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Automotive Chip Packaging Breakdown Data by Type
4.1 Global Automotive Chip Packaging Historic Market Size by Type (2019-2024)
4.2 Global Automotive Chip Packaging Forecasted Market Size by Type (2025-2030)
5 Automotive Chip Packaging Breakdown Data by Application
5.1 Global Automotive Chip Packaging Historic Market Size by Application (2019-2024)
5.2 Global Automotive Chip Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Automotive Chip Packaging Market Size (2019-2030)
6.2 North America Automotive Chip Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Automotive Chip Packaging Market Size by Country (2019-2024)
6.4 North America Automotive Chip Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Automotive Chip Packaging Market Size (2019-2030)
7.2 Europe Automotive Chip Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Automotive Chip Packaging Market Size by Country (2019-2024)
7.4 Europe Automotive Chip Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Automotive Chip Packaging Market Size (2019-2030)
8.2 Asia-Pacific Automotive Chip Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Automotive Chip Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific Automotive Chip Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Automotive Chip Packaging Market Size (2019-2030)
9.2 Latin America Automotive Chip Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Automotive Chip Packaging Market Size by Country (2019-2024)
9.4 Latin America Automotive Chip Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Automotive Chip Packaging Market Size (2019-2030)
10.2 Middle East & Africa Automotive Chip Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Automotive Chip Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa Automotive Chip Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 NXP
11.1.1 NXP Company Detail
11.1.2 NXP Business Overview
11.1.3 NXP Automotive Chip Packaging Introduction
11.1.4 NXP Revenue in Automotive Chip Packaging Business (2019-2024)
11.1.5 NXP Recent Development
11.2 Infineon (Cypress)
11.2.1 Infineon (Cypress) Company Detail
11.2.2 Infineon (Cypress) Business Overview
11.2.3 Infineon (Cypress) Automotive Chip Packaging Introduction
11.2.4 Infineon (Cypress) Revenue in Automotive Chip Packaging Business (2019-2024)
11.2.5 Infineon (Cypress) Recent Development
11.3 Renesas
11.3.1 Renesas Company Detail
11.3.2 Renesas Business Overview
11.3.3 Renesas Automotive Chip Packaging Introduction
11.3.4 Renesas Revenue in Automotive Chip Packaging Business (2019-2024)
11.3.5 Renesas Recent Development
11.4 Texas Instrument
11.4.1 Texas Instrument Company Detail
11.4.2 Texas Instrument Business Overview
11.4.3 Texas Instrument Automotive Chip Packaging Introduction
11.4.4 Texas Instrument Revenue in Automotive Chip Packaging Business (2019-2024)
11.4.5 Texas Instrument Recent Development
11.5 STMicroelectronics
11.5.1 STMicroelectronics Company Detail
11.5.2 STMicroelectronics Business Overview
11.5.3 STMicroelectronics Automotive Chip Packaging Introduction
11.5.4 STMicroelectronics Revenue in Automotive Chip Packaging Business (2019-2024)
11.5.5 STMicroelectronics Recent Development
11.6 Bosch
11.6.1 Bosch Company Detail
11.6.2 Bosch Business Overview
11.6.3 Bosch Automotive Chip Packaging Introduction
11.6.4 Bosch Revenue in Automotive Chip Packaging Business (2019-2024)
11.6.5 Bosch Recent Development
11.7 onsemi
11.7.1 onsemi Company Detail
11.7.2 onsemi Business Overview
11.7.3 onsemi Automotive Chip Packaging Introduction
11.7.4 onsemi Revenue in Automotive Chip Packaging Business (2019-2024)
11.7.5 onsemi Recent Development
11.8 Mitsubishi Electric
11.8.1 Mitsubishi Electric Company Detail
11.8.2 Mitsubishi Electric Business Overview
11.8.3 Mitsubishi Electric Automotive Chip Packaging Introduction
11.8.4 Mitsubishi Electric Revenue in Automotive Chip Packaging Business (2019-2024)
11.8.5 Mitsubishi Electric Recent Development
11.9 Rapidus
11.9.1 Rapidus Company Detail
11.9.2 Rapidus Business Overview
11.9.3 Rapidus Automotive Chip Packaging Introduction
11.9.4 Rapidus Revenue in Automotive Chip Packaging Business (2019-2024)
11.9.5 Rapidus Recent Development
11.10 Rohm
11.10.1 Rohm Company Detail
11.10.2 Rohm Business Overview
11.10.3 Rohm Automotive Chip Packaging Introduction
11.10.4 Rohm Revenue in Automotive Chip Packaging Business (2019-2024)
11.10.5 Rohm Recent Development
11.11 ADI
11.11.1 ADI Company Detail
11.11.2 ADI Business Overview
11.11.3 ADI Automotive Chip Packaging Introduction
11.11.4 ADI Revenue in Automotive Chip Packaging Business (2019-2024)
11.11.5 ADI Recent Development
11.12 Microchip (Microsemi)
11.12.1 Microchip (Microsemi) Company Detail
11.12.2 Microchip (Microsemi) Business Overview
11.12.3 Microchip (Microsemi) Automotive Chip Packaging Introduction
11.12.4 Microchip (Microsemi) Revenue in Automotive Chip Packaging Business (2019-2024)
11.12.5 Microchip (Microsemi) Recent Development
11.13 Amkor
11.13.1 Amkor Company Detail
11.13.2 Amkor Business Overview
11.13.3 Amkor Automotive Chip Packaging Introduction
11.13.4 Amkor Revenue in Automotive Chip Packaging Business (2019-2024)
11.13.5 Amkor Recent Development
11.14 ASE (SPIL)
11.14.1 ASE (SPIL) Company Detail
11.14.2 ASE (SPIL) Business Overview
11.14.3 ASE (SPIL) Automotive Chip Packaging Introduction
11.14.4 ASE (SPIL) Revenue in Automotive Chip Packaging Business (2019-2024)
11.14.5 ASE (SPIL) Recent Development
11.15 UTAC
11.15.1 UTAC Company Detail
11.15.2 UTAC Business Overview
11.15.3 UTAC Automotive Chip Packaging Introduction
11.15.4 UTAC Revenue in Automotive Chip Packaging Business (2019-2024)
11.15.5 UTAC Recent Development
11.16 JCET (STATS ChipPAC)
11.16.1 JCET (STATS ChipPAC) Company Detail
11.16.2 JCET (STATS ChipPAC) Business Overview
11.16.3 JCET (STATS ChipPAC) Automotive Chip Packaging Introduction
11.16.4 JCET (STATS ChipPAC) Revenue in Automotive Chip Packaging Business (2019-2024)
11.16.5 JCET (STATS ChipPAC) Recent Development
11.17 Carsem
11.17.1 Carsem Company Detail
11.17.2 Carsem Business Overview
11.17.3 Carsem Automotive Chip Packaging Introduction
11.17.4 Carsem Revenue in Automotive Chip Packaging Business (2019-2024)
11.17.5 Carsem Recent Development
11.18 King Yuan Electronics Corp. (KYEC)
11.18.1 King Yuan Electronics Corp. (KYEC) Company Detail
11.18.2 King Yuan Electronics Corp. (KYEC) Business Overview
11.18.3 King Yuan Electronics Corp. (KYEC) Automotive Chip Packaging Introduction
11.18.4 King Yuan Electronics Corp. (KYEC) Revenue in Automotive Chip Packaging Business (2019-2024)
11.18.5 King Yuan Electronics Corp. (KYEC) Recent Development
11.19 KINGPAK Technology Inc
11.19.1 KINGPAK Technology Inc Company Detail
11.19.2 KINGPAK Technology Inc Business Overview
11.19.3 KINGPAK Technology Inc Automotive Chip Packaging Introduction
11.19.4 KINGPAK Technology Inc Revenue in Automotive Chip Packaging Business (2019-2024)
11.19.5 KINGPAK Technology Inc Recent Development
11.20 Powertech Technology Inc. (PTI)
11.20.1 Powertech Technology Inc. (PTI) Company Detail
11.20.2 Powertech Technology Inc. (PTI) Business Overview
11.20.3 Powertech Technology Inc. (PTI) Automotive Chip Packaging Introduction
11.20.4 Powertech Technology Inc. (PTI) Revenue in Automotive Chip Packaging Business (2019-2024)
11.20.5 Powertech Technology Inc. (PTI) Recent Development
11.21 SFA Semicon
11.21.1 SFA Semicon Company Detail
11.21.2 SFA Semicon Business Overview
11.21.3 SFA Semicon Automotive Chip Packaging Introduction
11.21.4 SFA Semicon Revenue in Automotive Chip Packaging Business (2019-2024)
11.21.5 SFA Semicon Recent Development
11.22 Unisem Group
11.22.1 Unisem Group Company Detail
11.22.2 Unisem Group Business Overview
11.22.3 Unisem Group Automotive Chip Packaging Introduction
11.22.4 Unisem Group Revenue in Automotive Chip Packaging Business (2019-2024)
11.22.5 Unisem Group Recent Development
11.23 Chipbond Technology Corporation
11.23.1 Chipbond Technology Corporation Company Detail
11.23.2 Chipbond Technology Corporation Business Overview
11.23.3 Chipbond Technology Corporation Automotive Chip Packaging Introduction
11.23.4 Chipbond Technology Corporation Revenue in Automotive Chip Packaging Business (2019-2024)
11.23.5 Chipbond Technology Corporation Recent Development
11.24 ChipMOS TECHNOLOGIES
11.24.1 ChipMOS TECHNOLOGIES Company Detail
11.24.2 ChipMOS TECHNOLOGIES Business Overview
11.24.3 ChipMOS TECHNOLOGIES Automotive Chip Packaging Introduction
11.24.4 ChipMOS TECHNOLOGIES Revenue in Automotive Chip Packaging Business (2019-2024)
11.24.5 ChipMOS TECHNOLOGIES Recent Development
11.25 OSE CORP.
11.25.1 OSE CORP. Company Detail
11.25.2 OSE CORP. Business Overview
11.25.3 OSE CORP. Automotive Chip Packaging Introduction
11.25.4 OSE CORP. Revenue in Automotive Chip Packaging Business (2019-2024)
11.25.5 OSE CORP. Recent Development
11.26 Sigurd Microelectronics
11.26.1 Sigurd Microelectronics Company Detail
11.26.2 Sigurd Microelectronics Business Overview
11.26.3 Sigurd Microelectronics Automotive Chip Packaging Introduction
11.26.4 Sigurd Microelectronics Revenue in Automotive Chip Packaging Business (2019-2024)
11.26.5 Sigurd Microelectronics Recent Development
11.27 Natronix Semiconductor Technology
11.27.1 Natronix Semiconductor Technology Company Detail
11.27.2 Natronix Semiconductor Technology Business Overview
11.27.3 Natronix Semiconductor Technology Automotive Chip Packaging Introduction
11.27.4 Natronix Semiconductor Technology Revenue in Automotive Chip Packaging Business (2019-2024)
11.27.5 Natronix Semiconductor Technology Recent Development
11.28 Nepes
11.28.1 Nepes Company Detail
11.28.2 Nepes Business Overview
11.28.3 Nepes Automotive Chip Packaging Introduction
11.28.4 Nepes Revenue in Automotive Chip Packaging Business (2019-2024)
11.28.5 Nepes Recent Development
11.29 KESM Industries Berhad
11.29.1 KESM Industries Berhad Company Detail
11.29.2 KESM Industries Berhad Business Overview
11.29.3 KESM Industries Berhad Automotive Chip Packaging Introduction
11.29.4 KESM Industries Berhad Revenue in Automotive Chip Packaging Business (2019-2024)
11.29.5 KESM Industries Berhad Recent Development
11.30 Forehope Electronic (Ningbo) Co.,Ltd.
11.30.1 Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
11.30.2 Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
11.30.3 Forehope Electronic (Ningbo) Co.,Ltd. Automotive Chip Packaging Introduction
11.30.4 Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Automotive Chip Packaging Business (2019-2024)
11.30.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
11.31 Union Semiconductor（Hefei）Co., Ltd.
11.31.1 Union Semiconductor（Hefei）Co., Ltd. Company Detail
11.31.2 Union Semiconductor（Hefei）Co., Ltd. Business Overview
11.31.3 Union Semiconductor（Hefei）Co., Ltd. Automotive Chip Packaging Introduction
11.31.4 Union Semiconductor（Hefei）Co., Ltd. Revenue in Automotive Chip Packaging Business (2019-2024)
11.31.5 Union Semiconductor（Hefei）Co., Ltd. Recent Development
11.32 Tongfu Microelectronics (TFME)
11.32.1 Tongfu Microelectronics (TFME) Company Detail
11.32.2 Tongfu Microelectronics (TFME) Business Overview
11.32.3 Tongfu Microelectronics (TFME) Automotive Chip Packaging Introduction
11.32.4 Tongfu Microelectronics (TFME) Revenue in Automotive Chip Packaging Business (2019-2024)
11.32.5 Tongfu Microelectronics (TFME) Recent Development
11.33 Hefei Chipmore Technology Co.,Ltd.
11.33.1 Hefei Chipmore Technology Co.,Ltd. Company Detail
11.33.2 Hefei Chipmore Technology Co.,Ltd. Business Overview
11.33.3 Hefei Chipmore Technology Co.,Ltd. Automotive Chip Packaging Introduction
11.33.4 Hefei Chipmore Technology Co.,Ltd. Revenue in Automotive Chip Packaging Business (2019-2024)
11.33.5 Hefei Chipmore Technology Co.,Ltd. Recent Development
11.34 HT-tech
11.34.1 HT-tech Company Detail
11.34.2 HT-tech Business Overview
11.34.3 HT-tech Automotive Chip Packaging Introduction
11.34.4 HT-tech Revenue in Automotive Chip Packaging Business (2019-2024)
11.34.5 HT-tech Recent Development
11.35 China Wafer Level CSP Co., Ltd
11.35.1 China Wafer Level CSP Co., Ltd Company Detail
11.35.2 China Wafer Level CSP Co., Ltd Business Overview
11.35.3 China Wafer Level CSP Co., Ltd Automotive Chip Packaging Introduction
11.35.4 China Wafer Level CSP Co., Ltd Revenue in Automotive Chip Packaging Business (2019-2024)
11.35.5 China Wafer Level CSP Co., Ltd Recent Development
11.36 Ningbo ChipEx Semiconductor Co., Ltd
11.36.1 Ningbo ChipEx Semiconductor Co., Ltd Company Detail
11.36.2 Ningbo ChipEx Semiconductor Co., Ltd Business Overview
11.36.3 Ningbo ChipEx Semiconductor Co., Ltd Automotive Chip Packaging Introduction
11.36.4 Ningbo ChipEx Semiconductor Co., Ltd Revenue in Automotive Chip Packaging Business (2019-2024)
11.36.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Development
11.37 Guangdong Leadyo IC Testing
11.37.1 Guangdong Leadyo IC Testing Company Detail
11.37.2 Guangdong Leadyo IC Testing Business Overview
11.37.3 Guangdong Leadyo IC Testing Automotive Chip Packaging Introduction
11.37.4 Guangdong Leadyo IC Testing Revenue in Automotive Chip Packaging Business (2019-2024)
11.37.5 Guangdong Leadyo IC Testing Recent Development
11.38 Unimos Microelectronics (Shanghai)
11.38.1 Unimos Microelectronics (Shanghai) Company Detail
11.38.2 Unimos Microelectronics (Shanghai) Business Overview
11.38.3 Unimos Microelectronics (Shanghai) Automotive Chip Packaging Introduction
11.38.4 Unimos Microelectronics (Shanghai) Revenue in Automotive Chip Packaging Business (2019-2024)
11.38.5 Unimos Microelectronics (Shanghai) Recent Development
11.39 Sino Technology
11.39.1 Sino Technology Company Detail
11.39.2 Sino Technology Business Overview
11.39.3 Sino Technology Automotive Chip Packaging Introduction
11.39.4 Sino Technology Revenue in Automotive Chip Packaging Business (2019-2024)
11.39.5 Sino Technology Recent Development
11.40 Taiji Semiconductor (Suzhou)
11.40.1 Taiji Semiconductor (Suzhou) Company Detail
11.40.2 Taiji Semiconductor (Suzhou) Business Overview
11.40.3 Taiji Semiconductor (Suzhou) Automotive Chip Packaging Introduction
11.40.4 Taiji Semiconductor (Suzhou) Revenue in Automotive Chip Packaging Business (2019-2024)
11.40.5 Taiji Semiconductor (Suzhou) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
FEATURED COMPANIES
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
Onsemi
Mitsubishi Electric
Rapidus
ROHM CO LTD
ADI
Microchip (Microsemi)
Amkor
ASE(SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co. Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
List of Tables
    Table 1. Global Automotive Chip Packaging Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
    Table 2. Key Players of Ceramic Substrate
    Table 3. Key Players of WB BGA
    Table 4. Key Players of Lead Frame
    Table 5. Key Players of FC BGA
    Table 6. Key Players of Power Module
    Table 7. Key Players of Others
    Table 8. Global Automotive Chip Packaging Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
    Table 9. Global Automotive Chip Packaging Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 10. Global Automotive Chip Packaging Market Size by Region (2019-2024) & (US$ Million)
    Table 11. Global Automotive Chip Packaging Market Share by Region (2019-2024)
    Table 12. Global Automotive Chip Packaging Forecasted Market Size by Region (2025-2030) & (US$ Million)
    Table 13. Global Automotive Chip Packaging Market Share by Region (2025-2030)
    Table 14. Automotive Chip Packaging Market Trends
    Table 15. Automotive Chip Packaging Market Drivers
    Table 16. Automotive Chip Packaging Market Challenges
    Table 17. Automotive Chip Packaging Market Restraints
    Table 18. Global Automotive Chip Packaging Revenue by Players (2019-2024) & (US$ Million)
    Table 19. Global Automotive Chip Packaging Market Share by Players (2019-2024)
    Table 20. Global Top Automotive Chip Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Automotive Chip Packaging as of 2023)
    Table 21. Ranking of Global Top Automotive Chip Packaging Companies by Revenue (US$ Million) in 2023
    Table 22. Global 5 Largest Players Market Share by Automotive Chip Packaging Revenue (CR5 and HHI) & (2019-2024)
    Table 23. Key Players Headquarters and Area Served
    Table 24. Key Players Automotive Chip Packaging Product Solution and Service
    Table 25. Date of Enter into Automotive Chip Packaging Market
    Table 26. Mergers & Acquisitions, Expansion Plans
    Table 27. Global Automotive Chip Packaging Market Size by Type (2019-2024) & (US$ Million)
    Table 28. Global Automotive Chip Packaging Revenue Market Share by Type (2019-2024)
    Table 29. Global Automotive Chip Packaging Forecasted Market Size by Type (2025-2030) & (US$ Million)
    Table 30. Global Automotive Chip Packaging Revenue Market Share by Type (2025-2030)
    Table 31. Global Automotive Chip Packaging Market Size by Application (2019-2024) & (US$ Million)
    Table 32. Global Automotive Chip Packaging Revenue Market Share by Application (2019-2024)
    Table 33. Global Automotive Chip Packaging Forecasted Market Size by Application (2025-2030) & (US$ Million)
    Table 34. Global Automotive Chip Packaging Revenue Market Share by Application (2025-2030)
    Table 35. North America Automotive Chip Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 36. North America Automotive Chip Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 37. North America Automotive Chip Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 38. Europe Automotive Chip Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 39. Europe Automotive Chip Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 40. Europe Automotive Chip Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 41. Asia-Pacific Automotive Chip Packaging Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 42. Asia-Pacific Automotive Chip Packaging Market Size by Region (2019-2024) & (US$ Million)
    Table 43. Asia-Pacific Automotive Chip Packaging Market Size by Region (2025-2030) & (US$ Million)
    Table 44. Latin America Automotive Chip Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 45. Latin America Automotive Chip Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 46. Latin America Automotive Chip Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 47. Middle East & Africa Automotive Chip Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 48. Middle East & Africa Automotive Chip Packaging Market Size by Country (2019-2024) & (US$ Million)
    Table 49. Middle East & Africa Automotive Chip Packaging Market Size by Country (2025-2030) & (US$ Million)
    Table 50. NXP Company Detail
    Table 51. NXP Business Overview
    Table 52. NXP Automotive Chip Packaging Product
    Table 53. NXP Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 54. NXP Recent Development
    Table 55. Infineon (Cypress) Company Detail
    Table 56. Infineon (Cypress) Business Overview
    Table 57. Infineon (Cypress) Automotive Chip Packaging Product
    Table 58. Infineon (Cypress) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 59. Infineon (Cypress) Recent Development
    Table 60. Renesas Company Detail
    Table 61. Renesas Business Overview
    Table 62. Renesas Automotive Chip Packaging Product
    Table 63. Renesas Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 64. Renesas Recent Development
    Table 65. Texas Instrument Company Detail
    Table 66. Texas Instrument Business Overview
    Table 67. Texas Instrument Automotive Chip Packaging Product
    Table 68. Texas Instrument Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 69. Texas Instrument Recent Development
    Table 70. STMicroelectronics Company Detail
    Table 71. STMicroelectronics Business Overview
    Table 72. STMicroelectronics Automotive Chip Packaging Product
    Table 73. STMicroelectronics Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 74. STMicroelectronics Recent Development
    Table 75. Bosch Company Detail
    Table 76. Bosch Business Overview
    Table 77. Bosch Automotive Chip Packaging Product
    Table 78. Bosch Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 79. Bosch Recent Development
    Table 80. onsemi Company Detail
    Table 81. onsemi Business Overview
    Table 82. onsemi Automotive Chip Packaging Product
    Table 83. onsemi Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 84. onsemi Recent Development
    Table 85. Mitsubishi Electric Company Detail
    Table 86. Mitsubishi Electric Business Overview
    Table 87. Mitsubishi Electric Automotive Chip Packaging Product
    Table 88. Mitsubishi Electric Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 89. Mitsubishi Electric Recent Development
    Table 90. Rapidus Company Detail
    Table 91. Rapidus Business Overview
    Table 92. Rapidus Automotive Chip Packaging Product
    Table 93. Rapidus Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 94. Rapidus Recent Development
    Table 95. Rohm Company Detail
    Table 96. Rohm Business Overview
    Table 97. Rohm Automotive Chip Packaging Product
    Table 98. Rohm Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 99. Rohm Recent Development
    Table 100. ADI Company Detail
    Table 101. ADI Business Overview
    Table 102. ADI Automotive Chip Packaging Product
    Table 103. ADI Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 104. ADI Recent Development
    Table 105. Microchip (Microsemi) Company Detail
    Table 106. Microchip (Microsemi) Business Overview
    Table 107. Microchip (Microsemi) Automotive Chip Packaging Product
    Table 108. Microchip (Microsemi) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 109. Microchip (Microsemi) Recent Development
    Table 110. Amkor Company Detail
    Table 111. Amkor Business Overview
    Table 112. Amkor Automotive Chip Packaging Product
    Table 113. Amkor Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 114. Amkor Recent Development
    Table 115. ASE (SPIL) Company Detail
    Table 116. ASE (SPIL) Business Overview
    Table 117. ASE (SPIL) Automotive Chip Packaging Product
    Table 118. ASE (SPIL) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 119. ASE (SPIL) Recent Development
    Table 120. UTAC Company Detail
    Table 121. UTAC Business Overview
    Table 122. UTAC Automotive Chip Packaging Product
    Table 123. UTAC Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 124. UTAC Recent Development
    Table 125. JCET (STATS ChipPAC) Company Detail
    Table 126. JCET (STATS ChipPAC) Business Overview
    Table 127. JCET (STATS ChipPAC) Automotive Chip Packaging Product
    Table 128. JCET (STATS ChipPAC) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 129. JCET (STATS ChipPAC) Recent Development
    Table 130. Carsem Company Detail
    Table 131. Carsem Business Overview
    Table 132. Carsem Automotive Chip Packaging Product
    Table 133. Carsem Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 134. Carsem Recent Development
    Table 135. King Yuan Electronics Corp. (KYEC) Company Detail
    Table 136. King Yuan Electronics Corp. (KYEC) Business Overview
    Table 137. King Yuan Electronics Corp. (KYEC) Automotive Chip Packaging Product
    Table 138. King Yuan Electronics Corp. (KYEC) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 139. King Yuan Electronics Corp. (KYEC) Recent Development
    Table 140. KINGPAK Technology Inc Company Detail
    Table 141. KINGPAK Technology Inc Business Overview
    Table 142. KINGPAK Technology Inc Automotive Chip Packaging Product
    Table 143. KINGPAK Technology Inc Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 144. KINGPAK Technology Inc Recent Development
    Table 145. Powertech Technology Inc. (PTI) Company Detail
    Table 146. Powertech Technology Inc. (PTI) Business Overview
    Table 147. Powertech Technology Inc. (PTI) Automotive Chip Packaging Product
    Table 148. Powertech Technology Inc. (PTI) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 149. Powertech Technology Inc. (PTI) Recent Development
    Table 150. SFA Semicon Company Detail
    Table 151. SFA Semicon Business Overview
    Table 152. SFA Semicon Automotive Chip Packaging Product
    Table 153. SFA Semicon Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 154. SFA Semicon Recent Development
    Table 155. Unisem Group Company Detail
    Table 156. Unisem Group Business Overview
    Table 157. Unisem Group Automotive Chip Packaging Product
    Table 158. Unisem Group Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 159. Unisem Group Recent Development
    Table 160. Chipbond Technology Corporation Company Detail
    Table 161. Chipbond Technology Corporation Business Overview
    Table 162. Chipbond Technology Corporation Automotive Chip Packaging Product
    Table 163. Chipbond Technology Corporation Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 164. Chipbond Technology Corporation Recent Development
    Table 165. ChipMOS TECHNOLOGIES Company Detail
    Table 166. ChipMOS TECHNOLOGIES Business Overview
    Table 167. ChipMOS TECHNOLOGIES Automotive Chip Packaging Product
    Table 168. ChipMOS TECHNOLOGIES Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 169. ChipMOS TECHNOLOGIES Recent Development
    Table 170. OSE CORP. Company Detail
    Table 171. OSE CORP. Business Overview
    Table 172. OSE CORP. Automotive Chip Packaging Product
    Table 173. OSE CORP. Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 174. OSE CORP. Recent Development
    Table 175. Sigurd Microelectronics Company Detail
    Table 176. Sigurd Microelectronics Business Overview
    Table 177. Sigurd Microelectronics Automotive Chip Packaging Product
    Table 178. Sigurd Microelectronics Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 179. Sigurd Microelectronics Recent Development
    Table 180. Natronix Semiconductor Technology Company Detail
    Table 181. Natronix Semiconductor Technology Business Overview
    Table 182. Natronix Semiconductor Technology Automotive Chip Packaging Product
    Table 183. Natronix Semiconductor Technology Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 184. Natronix Semiconductor Technology Recent Development
    Table 185. Nepes Company Detail
    Table 186. Nepes Business Overview
    Table 187. Nepes Automotive Chip Packaging Product
    Table 188. Nepes Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 189. Nepes Recent Development
    Table 190. KESM Industries Berhad Company Detail
    Table 191. KESM Industries Berhad Business Overview
    Table 192. KESM Industries Berhad Automotive Chip Packaging Product
    Table 193. KESM Industries Berhad Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 194. KESM Industries Berhad Recent Development
    Table 195. Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
    Table 196. Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
    Table 197. Forehope Electronic (Ningbo) Co.,Ltd. Automotive Chip Packaging Product
    Table 198. Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 199. Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
    Table 200. Union Semiconductor（Hefei）Co., Ltd. Company Detail
    Table 201. Union Semiconductor（Hefei）Co., Ltd. Business Overview
    Table 202. Union Semiconductor（Hefei）Co., Ltd. Automotive Chip Packaging Product
    Table 203. Union Semiconductor（Hefei）Co., Ltd. Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 204. Union Semiconductor（Hefei）Co., Ltd. Recent Development
    Table 205. Tongfu Microelectronics (TFME) Company Detail
    Table 206. Tongfu Microelectronics (TFME) Business Overview
    Table 207. Tongfu Microelectronics (TFME) Automotive Chip Packaging Product
    Table 208. Tongfu Microelectronics (TFME) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 209. Tongfu Microelectronics (TFME) Recent Development
    Table 210. Hefei Chipmore Technology Co.,Ltd. Company Detail
    Table 211. Hefei Chipmore Technology Co.,Ltd. Business Overview
    Table 212. Hefei Chipmore Technology Co.,Ltd. Automotive Chip Packaging Product
    Table 213. Hefei Chipmore Technology Co.,Ltd. Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 214. Hefei Chipmore Technology Co.,Ltd. Recent Development
    Table 215. HT-tech Company Detail
    Table 216. HT-tech Business Overview
    Table 217. HT-tech Automotive Chip Packaging Product
    Table 218. HT-tech Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 219. HT-tech Recent Development
    Table 220. China Wafer Level CSP Co., Ltd Company Detail
    Table 221. China Wafer Level CSP Co., Ltd Business Overview
    Table 222. China Wafer Level CSP Co., Ltd Automotive Chip Packaging Product
    Table 223. China Wafer Level CSP Co., Ltd Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 224. China Wafer Level CSP Co., Ltd Recent Development
    Table 225. Ningbo ChipEx Semiconductor Co., Ltd Company Detail
    Table 226. Ningbo ChipEx Semiconductor Co., Ltd Business Overview
    Table 227. Ningbo ChipEx Semiconductor Co., Ltd Automotive Chip Packaging Product
    Table 228. Ningbo ChipEx Semiconductor Co., Ltd Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 229. Ningbo ChipEx Semiconductor Co., Ltd Recent Development
    Table 230. Guangdong Leadyo IC Testing Company Detail
    Table 231. Guangdong Leadyo IC Testing Business Overview
    Table 232. Guangdong Leadyo IC Testing Automotive Chip Packaging Product
    Table 233. Guangdong Leadyo IC Testing Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 234. Guangdong Leadyo IC Testing Recent Development
    Table 235. Unimos Microelectronics (Shanghai) Company Detail
    Table 236. Unimos Microelectronics (Shanghai) Business Overview
    Table 237. Unimos Microelectronics (Shanghai) Automotive Chip Packaging Product
    Table 238. Unimos Microelectronics (Shanghai) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 239. Unimos Microelectronics (Shanghai) Recent Development
    Table 240. Sino Technology Company Detail
    Table 241. Sino Technology Business Overview
    Table 242. Sino Technology Automotive Chip Packaging Product
    Table 243. Sino Technology Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 244. Sino Technology Recent Development
    Table 245. Taiji Semiconductor (Suzhou) Company Detail
    Table 246. Taiji Semiconductor (Suzhou) Business Overview
    Table 247. Taiji Semiconductor (Suzhou) Automotive Chip Packaging Product
    Table 248. Taiji Semiconductor (Suzhou) Revenue in Automotive Chip Packaging Business (2019-2024) & (US$ Million)
    Table 249. Taiji Semiconductor (Suzhou) Recent Development
    Table 250. Research Programs/Design for This Report
    Table 251. Key Data Information from Secondary Sources
    Table 252. Key Data Information from Primary Sources
List of Figures
    Figure 1. Global Automotive Chip Packaging Market Size Comparison by Type (2024-2030) & (US$ Million)
    Figure 2. Global Automotive Chip Packaging Market Share by Type: 2023 VS 2030
    Figure 3. Ceramic Substrate Features
    Figure 4. WB BGA Features
    Figure 5. Lead Frame Features
    Figure 6. FC BGA Features
    Figure 7. Power Module Features
    Figure 8. Others Features
    Figure 9. Global Automotive Chip Packaging Market Size Comparison by Application (2024-2030) & (US$ Million)
    Figure 10. Global Automotive Chip Packaging Market Share by Application: 2023 VS 2030
    Figure 11. Automotive OSAT Case Studies
    Figure 12. Automotive IDM Case Studies
    Figure 13. Automotive Chip Packaging Report Years Considered
    Figure 14. Global Automotive Chip Packaging Market Size (US$ Million), Year-over-Year: 2019-2030
    Figure 15. Global Automotive Chip Packaging Market Size, (US$ Million), 2019 VS 2023 VS 2030
    Figure 16. Global Automotive Chip Packaging Market Share by Region: 2023 VS 2030
    Figure 17. Global Automotive Chip Packaging Market Share by Players in 2023
    Figure 18. Global Top Automotive Chip Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Automotive Chip Packaging as of 2023)
    Figure 19. The Top 10 and 5 Players Market Share by Automotive Chip Packaging Revenue in 2023
    Figure 20. North America Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 21. North America Automotive Chip Packaging Market Share by Country (2019-2030)
    Figure 22. United States Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 23. Canada Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 24. Europe Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 25. Europe Automotive Chip Packaging Market Share by Country (2019-2030)
    Figure 26. Germany Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 27. France Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 28. U.K. Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 29. Italy Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 30. Russia Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 31. Nordic Countries Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 32. Asia-Pacific Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 33. Asia-Pacific Automotive Chip Packaging Market Share by Region (2019-2030)
    Figure 34. China Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 35. Japan Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 36. South Korea Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 37. Southeast Asia Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 38. India Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 39. Australia Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 40. Latin America Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 41. Latin America Automotive Chip Packaging Market Share by Country (2019-2030)
    Figure 42. Mexico Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 43. Brazil Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 44. Middle East & Africa Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 45. Middle East & Africa Automotive Chip Packaging Market Share by Country (2019-2030)
    Figure 46. Turkey Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 47. Saudi Arabia Automotive Chip Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 48. NXP Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 49. Infineon (Cypress) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 50. Renesas Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 51. Texas Instrument Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 52. STMicroelectronics Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 53. Bosch Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 54. onsemi Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 55. Mitsubishi Electric Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 56. Rapidus Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 57. Rohm Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 58. ADI Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 59. Microchip (Microsemi) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 60. Amkor Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 61. ASE (SPIL) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 62. UTAC Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 63. JCET (STATS ChipPAC) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 64. Carsem Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 65. King Yuan Electronics Corp. (KYEC) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 66. KINGPAK Technology Inc Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 67. Powertech Technology Inc. (PTI) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 68. SFA Semicon Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 69. Unisem Group Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 70. Chipbond Technology Corporation Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 71. ChipMOS TECHNOLOGIES Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 72. OSE CORP. Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 73. Sigurd Microelectronics Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 74. Natronix Semiconductor Technology Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 75. Nepes Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 76. KESM Industries Berhad Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 77. Forehope Electronic (Ningbo) Co.,Ltd. Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 78. Union Semiconductor（Hefei）Co., Ltd. Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 79. Tongfu Microelectronics (TFME) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 80. Hefei Chipmore Technology Co.,Ltd. Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 81. HT-tech Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 82. China Wafer Level CSP Co., Ltd Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 83. Ningbo ChipEx Semiconductor Co., Ltd Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 84. Guangdong Leadyo IC Testing Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 85. Unimos Microelectronics (Shanghai) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 86. Sino Technology Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 87. Taiji Semiconductor (Suzhou) Revenue Growth Rate in Automotive Chip Packaging Business (2019-2024)
    Figure 88. Bottom-up and Top-down Approaches for This Report
    Figure 89. Data Triangulation
    Figure 90. Key Executives Interviewed
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