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Global Advanced Packaging for Automotive Chips Market Research Report 2024
Published Date: August 2024
|
Report Code: QYRE-Auto-29J15427
Home | Market Reports | Autos & Vehicles| Vehicle Parts & Services| Vehicle Parts & Accessories
Global Advanced Packaging for Automotive Chips Market Research Report 2023
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Global Advanced Packaging for Automotive Chips Market Research Report 2024

Code: QYRE-Auto-29J15427
Report
August 2024
Pages:104
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
Onsemi
Mitsubishi Electric
Rapidus
ROHM CO LTD
ADI
Microchip (Microsemi)
Amkor
ASE(SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co. Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)

Advanced Packaging for Automotive Chips Market Size

The global Advanced Packaging for Automotive Chips market was valued at US$ 463 million in 2023 and is anticipated to reach US$ 969.1 million by 2030, witnessing a CAGR of 11.7% during the forecast period 2024-2030.

Advanced Packaging for Automotive Chips Market

Advanced Packaging for Automotive Chips Market

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. This report studies the Advanced Packaging for Automotive Chips.
Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.
This report aims to provide a comprehensive presentation of the global market for Advanced Packaging for Automotive Chips, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Advanced Packaging for Automotive Chips.

Report Scope

The Advanced Packaging for Automotive Chips market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Advanced Packaging for Automotive Chips market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Advanced Packaging for Automotive Chips companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Advanced Packaging for Automotive Chips Market Report

Report Metric Details
Report Name Advanced Packaging for Automotive Chips Market
Accounted market size in 2023 US$ 463 million
Forecasted market size in 2030 US$ 969.1 million
CAGR 11.7%
Base Year 2023
Forecasted years 2024 - 2030
Segment by Type
  • FC (Flip Chip)
  • WLCSP
  • Others
Segment by Application
  • Automotive OSAT
  • Automotive IDM
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company NXP, Infineon (Cypress), Renesas, Texas Instrument, STMicroelectronics, Bosch, onsemi, Mitsubishi Electric, Rapidus, Rohm, ADI, Microchip (Microsemi), Amkor, ASE (SPIL), UTAC, JCET (STATS ChipPAC), Carsem, King Yuan Electronics Corp. (KYEC), KINGPAK Technology Inc, Powertech Technology Inc. (PTI), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, KESM Industries Berhad, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., HT-tech, China Wafer Level CSP Co., Ltd, Ningbo ChipEx Semiconductor Co., Ltd, Guangdong Leadyo IC Testing, Unimos Microelectronics (Shanghai), Sino Technology, Taiji Semiconductor (Suzhou)
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of Advanced Packaging for Automotive Chips companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Advanced Packaging for Automotive Chips Market growing?

Ans: The Advanced Packaging for Automotive Chips Market witnessing a CAGR of 11.7% during the forecast period 2024-2030.

What is the Advanced Packaging for Automotive Chips Market size in 2030?

Ans: The Advanced Packaging for Automotive Chips Market size in 2030 will be US$ 969.1 million.

Who are the main players in the Advanced Packaging for Automotive Chips Market report?

Ans: The main players in the Advanced Packaging for Automotive Chips Market are NXP, Infineon (Cypress), Renesas, Texas Instrument, STMicroelectronics, Bosch, onsemi, Mitsubishi Electric, Rapidus, Rohm, ADI, Microchip (Microsemi), Amkor, ASE (SPIL), UTAC, JCET (STATS ChipPAC), Carsem, King Yuan Electronics Corp. (KYEC), KINGPAK Technology Inc, Powertech Technology Inc. (PTI), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, KESM Industries Berhad, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., HT-tech, China Wafer Level CSP Co., Ltd, Ningbo ChipEx Semiconductor Co., Ltd, Guangdong Leadyo IC Testing, Unimos Microelectronics (Shanghai), Sino Technology, Taiji Semiconductor (Suzhou)

What are the Application segmentation covered in the Advanced Packaging for Automotive Chips Market report?

Ans: The Applications covered in the Advanced Packaging for Automotive Chips Market report are Automotive OSAT, Automotive IDM

What are the Type segmentation covered in the Advanced Packaging for Automotive Chips Market report?

Ans: The Types covered in the Advanced Packaging for Automotive Chips Market report are FC (Flip Chip), WLCSP, Others

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Advanced Packaging for Automotive Chips Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 FC (Flip Chip)
1.2.3 WLCSP
1.2.4 Others
1.3 Market by Application
1.3.1 Global Advanced Packaging for Automotive Chips Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive OSAT
1.3.3 Automotive IDM
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Advanced Packaging for Automotive Chips Market Perspective (2019-2030)
2.2 Advanced Packaging for Automotive Chips Growth Trends by Region
2.2.1 Global Advanced Packaging for Automotive Chips Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Advanced Packaging for Automotive Chips Historic Market Size by Region (2019-2024)
2.2.3 Advanced Packaging for Automotive Chips Forecasted Market Size by Region (2025-2030)
2.3 Advanced Packaging for Automotive Chips Market Dynamics
2.3.1 Advanced Packaging for Automotive Chips Industry Trends
2.3.2 Advanced Packaging for Automotive Chips Market Drivers
2.3.3 Advanced Packaging for Automotive Chips Market Challenges
2.3.4 Advanced Packaging for Automotive Chips Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Advanced Packaging for Automotive Chips Players by Revenue
3.1.1 Global Top Advanced Packaging for Automotive Chips Players by Revenue (2019-2024)
3.1.2 Global Advanced Packaging for Automotive Chips Revenue Market Share by Players (2019-2024)
3.2 Global Advanced Packaging for Automotive Chips Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Advanced Packaging for Automotive Chips Revenue
3.4 Global Advanced Packaging for Automotive Chips Market Concentration Ratio
3.4.1 Global Advanced Packaging for Automotive Chips Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Advanced Packaging for Automotive Chips Revenue in 2023
3.5 Advanced Packaging for Automotive Chips Key Players Head office and Area Served
3.6 Key Players Advanced Packaging for Automotive Chips Product Solution and Service
3.7 Date of Enter into Advanced Packaging for Automotive Chips Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Advanced Packaging for Automotive Chips Breakdown Data by Type
4.1 Global Advanced Packaging for Automotive Chips Historic Market Size by Type (2019-2024)
4.2 Global Advanced Packaging for Automotive Chips Forecasted Market Size by Type (2025-2030)
5 Advanced Packaging for Automotive Chips Breakdown Data by Application
5.1 Global Advanced Packaging for Automotive Chips Historic Market Size by Application (2019-2024)
5.2 Global Advanced Packaging for Automotive Chips Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Advanced Packaging for Automotive Chips Market Size (2019-2030)
6.2 North America Advanced Packaging for Automotive Chips Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Advanced Packaging for Automotive Chips Market Size by Country (2019-2024)
6.4 North America Advanced Packaging for Automotive Chips Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Advanced Packaging for Automotive Chips Market Size (2019-2030)
7.2 Europe Advanced Packaging for Automotive Chips Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Advanced Packaging for Automotive Chips Market Size by Country (2019-2024)
7.4 Europe Advanced Packaging for Automotive Chips Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Advanced Packaging for Automotive Chips Market Size (2019-2030)
8.2 Asia-Pacific Advanced Packaging for Automotive Chips Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Advanced Packaging for Automotive Chips Market Size by Region (2019-2024)
8.4 Asia-Pacific Advanced Packaging for Automotive Chips Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Advanced Packaging for Automotive Chips Market Size (2019-2030)
9.2 Latin America Advanced Packaging for Automotive Chips Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Advanced Packaging for Automotive Chips Market Size by Country (2019-2024)
9.4 Latin America Advanced Packaging for Automotive Chips Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Advanced Packaging for Automotive Chips Market Size (2019-2030)
10.2 Middle East & Africa Advanced Packaging for Automotive Chips Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Advanced Packaging for Automotive Chips Market Size by Country (2019-2024)
10.4 Middle East & Africa Advanced Packaging for Automotive Chips Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 NXP
11.1.1 NXP Company Detail
11.1.2 NXP Business Overview
11.1.3 NXP Advanced Packaging for Automotive Chips Introduction
11.1.4 NXP Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.1.5 NXP Recent Development
11.2 Infineon (Cypress)
11.2.1 Infineon (Cypress) Company Detail
11.2.2 Infineon (Cypress) Business Overview
11.2.3 Infineon (Cypress) Advanced Packaging for Automotive Chips Introduction
11.2.4 Infineon (Cypress) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.2.5 Infineon (Cypress) Recent Development
11.3 Renesas
11.3.1 Renesas Company Detail
11.3.2 Renesas Business Overview
11.3.3 Renesas Advanced Packaging for Automotive Chips Introduction
11.3.4 Renesas Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.3.5 Renesas Recent Development
11.4 Texas Instrument
11.4.1 Texas Instrument Company Detail
11.4.2 Texas Instrument Business Overview
11.4.3 Texas Instrument Advanced Packaging for Automotive Chips Introduction
11.4.4 Texas Instrument Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.4.5 Texas Instrument Recent Development
11.5 STMicroelectronics
11.5.1 STMicroelectronics Company Detail
11.5.2 STMicroelectronics Business Overview
11.5.3 STMicroelectronics Advanced Packaging for Automotive Chips Introduction
11.5.4 STMicroelectronics Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.5.5 STMicroelectronics Recent Development
11.6 Bosch
11.6.1 Bosch Company Detail
11.6.2 Bosch Business Overview
11.6.3 Bosch Advanced Packaging for Automotive Chips Introduction
11.6.4 Bosch Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.6.5 Bosch Recent Development
11.7 onsemi
11.7.1 onsemi Company Detail
11.7.2 onsemi Business Overview
11.7.3 onsemi Advanced Packaging for Automotive Chips Introduction
11.7.4 onsemi Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.7.5 onsemi Recent Development
11.8 Mitsubishi Electric
11.8.1 Mitsubishi Electric Company Detail
11.8.2 Mitsubishi Electric Business Overview
11.8.3 Mitsubishi Electric Advanced Packaging for Automotive Chips Introduction
11.8.4 Mitsubishi Electric Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.8.5 Mitsubishi Electric Recent Development
11.9 Rapidus
11.9.1 Rapidus Company Detail
11.9.2 Rapidus Business Overview
11.9.3 Rapidus Advanced Packaging for Automotive Chips Introduction
11.9.4 Rapidus Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.9.5 Rapidus Recent Development
11.10 Rohm
11.10.1 Rohm Company Detail
11.10.2 Rohm Business Overview
11.10.3 Rohm Advanced Packaging for Automotive Chips Introduction
11.10.4 Rohm Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.10.5 Rohm Recent Development
11.11 ADI
11.11.1 ADI Company Detail
11.11.2 ADI Business Overview
11.11.3 ADI Advanced Packaging for Automotive Chips Introduction
11.11.4 ADI Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.11.5 ADI Recent Development
11.12 Microchip (Microsemi)
11.12.1 Microchip (Microsemi) Company Detail
11.12.2 Microchip (Microsemi) Business Overview
11.12.3 Microchip (Microsemi) Advanced Packaging for Automotive Chips Introduction
11.12.4 Microchip (Microsemi) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.12.5 Microchip (Microsemi) Recent Development
11.13 Amkor
11.13.1 Amkor Company Detail
11.13.2 Amkor Business Overview
11.13.3 Amkor Advanced Packaging for Automotive Chips Introduction
11.13.4 Amkor Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.13.5 Amkor Recent Development
11.14 ASE (SPIL)
11.14.1 ASE (SPIL) Company Detail
11.14.2 ASE (SPIL) Business Overview
11.14.3 ASE (SPIL) Advanced Packaging for Automotive Chips Introduction
11.14.4 ASE (SPIL) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.14.5 ASE (SPIL) Recent Development
11.15 UTAC
11.15.1 UTAC Company Detail
11.15.2 UTAC Business Overview
11.15.3 UTAC Advanced Packaging for Automotive Chips Introduction
11.15.4 UTAC Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.15.5 UTAC Recent Development
11.16 JCET (STATS ChipPAC)
11.16.1 JCET (STATS ChipPAC) Company Detail
11.16.2 JCET (STATS ChipPAC) Business Overview
11.16.3 JCET (STATS ChipPAC) Advanced Packaging for Automotive Chips Introduction
11.16.4 JCET (STATS ChipPAC) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.16.5 JCET (STATS ChipPAC) Recent Development
11.17 Carsem
11.17.1 Carsem Company Detail
11.17.2 Carsem Business Overview
11.17.3 Carsem Advanced Packaging for Automotive Chips Introduction
11.17.4 Carsem Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.17.5 Carsem Recent Development
11.18 King Yuan Electronics Corp. (KYEC)
11.18.1 King Yuan Electronics Corp. (KYEC) Company Detail
11.18.2 King Yuan Electronics Corp. (KYEC) Business Overview
11.18.3 King Yuan Electronics Corp. (KYEC) Advanced Packaging for Automotive Chips Introduction
11.18.4 King Yuan Electronics Corp. (KYEC) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.18.5 King Yuan Electronics Corp. (KYEC) Recent Development
11.19 KINGPAK Technology Inc
11.19.1 KINGPAK Technology Inc Company Detail
11.19.2 KINGPAK Technology Inc Business Overview
11.19.3 KINGPAK Technology Inc Advanced Packaging for Automotive Chips Introduction
11.19.4 KINGPAK Technology Inc Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.19.5 KINGPAK Technology Inc Recent Development
11.20 Powertech Technology Inc. (PTI)
11.20.1 Powertech Technology Inc. (PTI) Company Detail
11.20.2 Powertech Technology Inc. (PTI) Business Overview
11.20.3 Powertech Technology Inc. (PTI) Advanced Packaging for Automotive Chips Introduction
11.20.4 Powertech Technology Inc. (PTI) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.20.5 Powertech Technology Inc. (PTI) Recent Development
11.21 SFA Semicon
11.21.1 SFA Semicon Company Detail
11.21.2 SFA Semicon Business Overview
11.21.3 SFA Semicon Advanced Packaging for Automotive Chips Introduction
11.21.4 SFA Semicon Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.21.5 SFA Semicon Recent Development
11.22 Unisem Group
11.22.1 Unisem Group Company Detail
11.22.2 Unisem Group Business Overview
11.22.3 Unisem Group Advanced Packaging for Automotive Chips Introduction
11.22.4 Unisem Group Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.22.5 Unisem Group Recent Development
11.23 Chipbond Technology Corporation
11.23.1 Chipbond Technology Corporation Company Detail
11.23.2 Chipbond Technology Corporation Business Overview
11.23.3 Chipbond Technology Corporation Advanced Packaging for Automotive Chips Introduction
11.23.4 Chipbond Technology Corporation Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.23.5 Chipbond Technology Corporation Recent Development
11.24 ChipMOS TECHNOLOGIES
11.24.1 ChipMOS TECHNOLOGIES Company Detail
11.24.2 ChipMOS TECHNOLOGIES Business Overview
11.24.3 ChipMOS TECHNOLOGIES Advanced Packaging for Automotive Chips Introduction
11.24.4 ChipMOS TECHNOLOGIES Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.24.5 ChipMOS TECHNOLOGIES Recent Development
11.25 OSE CORP.
11.25.1 OSE CORP. Company Detail
11.25.2 OSE CORP. Business Overview
11.25.3 OSE CORP. Advanced Packaging for Automotive Chips Introduction
11.25.4 OSE CORP. Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.25.5 OSE CORP. Recent Development
11.26 Sigurd Microelectronics
11.26.1 Sigurd Microelectronics Company Detail
11.26.2 Sigurd Microelectronics Business Overview
11.26.3 Sigurd Microelectronics Advanced Packaging for Automotive Chips Introduction
11.26.4 Sigurd Microelectronics Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.26.5 Sigurd Microelectronics Recent Development
11.27 Natronix Semiconductor Technology
11.27.1 Natronix Semiconductor Technology Company Detail
11.27.2 Natronix Semiconductor Technology Business Overview
11.27.3 Natronix Semiconductor Technology Advanced Packaging for Automotive Chips Introduction
11.27.4 Natronix Semiconductor Technology Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.27.5 Natronix Semiconductor Technology Recent Development
11.28 Nepes
11.28.1 Nepes Company Detail
11.28.2 Nepes Business Overview
11.28.3 Nepes Advanced Packaging for Automotive Chips Introduction
11.28.4 Nepes Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.28.5 Nepes Recent Development
11.29 KESM Industries Berhad
11.29.1 KESM Industries Berhad Company Detail
11.29.2 KESM Industries Berhad Business Overview
11.29.3 KESM Industries Berhad Advanced Packaging for Automotive Chips Introduction
11.29.4 KESM Industries Berhad Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.29.5 KESM Industries Berhad Recent Development
11.30 Forehope Electronic (Ningbo) Co.,Ltd.
11.30.1 Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
11.30.2 Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
11.30.3 Forehope Electronic (Ningbo) Co.,Ltd. Advanced Packaging for Automotive Chips Introduction
11.30.4 Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.30.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
11.31 Union Semiconductor（Hefei）Co., Ltd.
11.31.1 Union Semiconductor（Hefei）Co., Ltd. Company Detail
11.31.2 Union Semiconductor（Hefei）Co., Ltd. Business Overview
11.31.3 Union Semiconductor（Hefei）Co., Ltd. Advanced Packaging for Automotive Chips Introduction
11.31.4 Union Semiconductor（Hefei）Co., Ltd. Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.31.5 Union Semiconductor（Hefei）Co., Ltd. Recent Development
11.32 Tongfu Microelectronics (TFME)
11.32.1 Tongfu Microelectronics (TFME) Company Detail
11.32.2 Tongfu Microelectronics (TFME) Business Overview
11.32.3 Tongfu Microelectronics (TFME) Advanced Packaging for Automotive Chips Introduction
11.32.4 Tongfu Microelectronics (TFME) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.32.5 Tongfu Microelectronics (TFME) Recent Development
11.33 Hefei Chipmore Technology Co.,Ltd.
11.33.1 Hefei Chipmore Technology Co.,Ltd. Company Detail
11.33.2 Hefei Chipmore Technology Co.,Ltd. Business Overview
11.33.3 Hefei Chipmore Technology Co.,Ltd. Advanced Packaging for Automotive Chips Introduction
11.33.4 Hefei Chipmore Technology Co.,Ltd. Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.33.5 Hefei Chipmore Technology Co.,Ltd. Recent Development
11.34 HT-tech
11.34.1 HT-tech Company Detail
11.34.2 HT-tech Business Overview
11.34.3 HT-tech Advanced Packaging for Automotive Chips Introduction
11.34.4 HT-tech Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.34.5 HT-tech Recent Development
11.35 China Wafer Level CSP Co., Ltd
11.35.1 China Wafer Level CSP Co., Ltd Company Detail
11.35.2 China Wafer Level CSP Co., Ltd Business Overview
11.35.3 China Wafer Level CSP Co., Ltd Advanced Packaging for Automotive Chips Introduction
11.35.4 China Wafer Level CSP Co., Ltd Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.35.5 China Wafer Level CSP Co., Ltd Recent Development
11.36 Ningbo ChipEx Semiconductor Co., Ltd
11.36.1 Ningbo ChipEx Semiconductor Co., Ltd Company Detail
11.36.2 Ningbo ChipEx Semiconductor Co., Ltd Business Overview
11.36.3 Ningbo ChipEx Semiconductor Co., Ltd Advanced Packaging for Automotive Chips Introduction
11.36.4 Ningbo ChipEx Semiconductor Co., Ltd Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.36.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Development
11.37 Guangdong Leadyo IC Testing
11.37.1 Guangdong Leadyo IC Testing Company Detail
11.37.2 Guangdong Leadyo IC Testing Business Overview
11.37.3 Guangdong Leadyo IC Testing Advanced Packaging for Automotive Chips Introduction
11.37.4 Guangdong Leadyo IC Testing Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.37.5 Guangdong Leadyo IC Testing Recent Development
11.38 Unimos Microelectronics (Shanghai)
11.38.1 Unimos Microelectronics (Shanghai) Company Detail
11.38.2 Unimos Microelectronics (Shanghai) Business Overview
11.38.3 Unimos Microelectronics (Shanghai) Advanced Packaging for Automotive Chips Introduction
11.38.4 Unimos Microelectronics (Shanghai) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.38.5 Unimos Microelectronics (Shanghai) Recent Development
11.39 Sino Technology
11.39.1 Sino Technology Company Detail
11.39.2 Sino Technology Business Overview
11.39.3 Sino Technology Advanced Packaging for Automotive Chips Introduction
11.39.4 Sino Technology Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.39.5 Sino Technology Recent Development
11.40 Taiji Semiconductor (Suzhou)
11.40.1 Taiji Semiconductor (Suzhou) Company Detail
11.40.2 Taiji Semiconductor (Suzhou) Business Overview
11.40.3 Taiji Semiconductor (Suzhou) Advanced Packaging for Automotive Chips Introduction
11.40.4 Taiji Semiconductor (Suzhou) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024)
11.40.5 Taiji Semiconductor (Suzhou) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
FEATURED COMPANIES
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
Onsemi
Mitsubishi Electric
Rapidus
ROHM CO LTD
ADI
Microchip (Microsemi)
Amkor
ASE(SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Tongfu Microelectronics (TFME)
Hefei Chipmore Technology Co.,Ltd.
HT-tech
China Wafer Level CSP Co. Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
List of Tables
    Table 1. Global Advanced Packaging for Automotive Chips Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
    Table 2. Key Players of FC (Flip Chip)
    Table 3. Key Players of WLCSP
    Table 4. Key Players of Others
    Table 5. Global Advanced Packaging for Automotive Chips Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
    Table 6. Global Advanced Packaging for Automotive Chips Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 7. Global Advanced Packaging for Automotive Chips Market Size by Region (2019-2024) & (US$ Million)
    Table 8. Global Advanced Packaging for Automotive Chips Market Share by Region (2019-2024)
    Table 9. Global Advanced Packaging for Automotive Chips Forecasted Market Size by Region (2025-2030) & (US$ Million)
    Table 10. Global Advanced Packaging for Automotive Chips Market Share by Region (2025-2030)
    Table 11. Advanced Packaging for Automotive Chips Market Trends
    Table 12. Advanced Packaging for Automotive Chips Market Drivers
    Table 13. Advanced Packaging for Automotive Chips Market Challenges
    Table 14. Advanced Packaging for Automotive Chips Market Restraints
    Table 15. Global Advanced Packaging for Automotive Chips Revenue by Players (2019-2024) & (US$ Million)
    Table 16. Global Advanced Packaging for Automotive Chips Market Share by Players (2019-2024)
    Table 17. Global Top Advanced Packaging for Automotive Chips Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Advanced Packaging for Automotive Chips as of 2023)
    Table 18. Ranking of Global Top Advanced Packaging for Automotive Chips Companies by Revenue (US$ Million) in 2023
    Table 19. Global 5 Largest Players Market Share by Advanced Packaging for Automotive Chips Revenue (CR5 and HHI) & (2019-2024)
    Table 20. Key Players Headquarters and Area Served
    Table 21. Key Players Advanced Packaging for Automotive Chips Product Solution and Service
    Table 22. Date of Enter into Advanced Packaging for Automotive Chips Market
    Table 23. Mergers & Acquisitions, Expansion Plans
    Table 24. Global Advanced Packaging for Automotive Chips Market Size by Type (2019-2024) & (US$ Million)
    Table 25. Global Advanced Packaging for Automotive Chips Revenue Market Share by Type (2019-2024)
    Table 26. Global Advanced Packaging for Automotive Chips Forecasted Market Size by Type (2025-2030) & (US$ Million)
    Table 27. Global Advanced Packaging for Automotive Chips Revenue Market Share by Type (2025-2030)
    Table 28. Global Advanced Packaging for Automotive Chips Market Size by Application (2019-2024) & (US$ Million)
    Table 29. Global Advanced Packaging for Automotive Chips Revenue Market Share by Application (2019-2024)
    Table 30. Global Advanced Packaging for Automotive Chips Forecasted Market Size by Application (2025-2030) & (US$ Million)
    Table 31. Global Advanced Packaging for Automotive Chips Revenue Market Share by Application (2025-2030)
    Table 32. North America Advanced Packaging for Automotive Chips Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 33. North America Advanced Packaging for Automotive Chips Market Size by Country (2019-2024) & (US$ Million)
    Table 34. North America Advanced Packaging for Automotive Chips Market Size by Country (2025-2030) & (US$ Million)
    Table 35. Europe Advanced Packaging for Automotive Chips Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 36. Europe Advanced Packaging for Automotive Chips Market Size by Country (2019-2024) & (US$ Million)
    Table 37. Europe Advanced Packaging for Automotive Chips Market Size by Country (2025-2030) & (US$ Million)
    Table 38. Asia-Pacific Advanced Packaging for Automotive Chips Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 39. Asia-Pacific Advanced Packaging for Automotive Chips Market Size by Region (2019-2024) & (US$ Million)
    Table 40. Asia-Pacific Advanced Packaging for Automotive Chips Market Size by Region (2025-2030) & (US$ Million)
    Table 41. Latin America Advanced Packaging for Automotive Chips Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 42. Latin America Advanced Packaging for Automotive Chips Market Size by Country (2019-2024) & (US$ Million)
    Table 43. Latin America Advanced Packaging for Automotive Chips Market Size by Country (2025-2030) & (US$ Million)
    Table 44. Middle East & Africa Advanced Packaging for Automotive Chips Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 45. Middle East & Africa Advanced Packaging for Automotive Chips Market Size by Country (2019-2024) & (US$ Million)
    Table 46. Middle East & Africa Advanced Packaging for Automotive Chips Market Size by Country (2025-2030) & (US$ Million)
    Table 47. NXP Company Detail
    Table 48. NXP Business Overview
    Table 49. NXP Advanced Packaging for Automotive Chips Product
    Table 50. NXP Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 51. NXP Recent Development
    Table 52. Infineon (Cypress) Company Detail
    Table 53. Infineon (Cypress) Business Overview
    Table 54. Infineon (Cypress) Advanced Packaging for Automotive Chips Product
    Table 55. Infineon (Cypress) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 56. Infineon (Cypress) Recent Development
    Table 57. Renesas Company Detail
    Table 58. Renesas Business Overview
    Table 59. Renesas Advanced Packaging for Automotive Chips Product
    Table 60. Renesas Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 61. Renesas Recent Development
    Table 62. Texas Instrument Company Detail
    Table 63. Texas Instrument Business Overview
    Table 64. Texas Instrument Advanced Packaging for Automotive Chips Product
    Table 65. Texas Instrument Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 66. Texas Instrument Recent Development
    Table 67. STMicroelectronics Company Detail
    Table 68. STMicroelectronics Business Overview
    Table 69. STMicroelectronics Advanced Packaging for Automotive Chips Product
    Table 70. STMicroelectronics Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 71. STMicroelectronics Recent Development
    Table 72. Bosch Company Detail
    Table 73. Bosch Business Overview
    Table 74. Bosch Advanced Packaging for Automotive Chips Product
    Table 75. Bosch Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 76. Bosch Recent Development
    Table 77. onsemi Company Detail
    Table 78. onsemi Business Overview
    Table 79. onsemi Advanced Packaging for Automotive Chips Product
    Table 80. onsemi Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 81. onsemi Recent Development
    Table 82. Mitsubishi Electric Company Detail
    Table 83. Mitsubishi Electric Business Overview
    Table 84. Mitsubishi Electric Advanced Packaging for Automotive Chips Product
    Table 85. Mitsubishi Electric Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 86. Mitsubishi Electric Recent Development
    Table 87. Rapidus Company Detail
    Table 88. Rapidus Business Overview
    Table 89. Rapidus Advanced Packaging for Automotive Chips Product
    Table 90. Rapidus Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 91. Rapidus Recent Development
    Table 92. Rohm Company Detail
    Table 93. Rohm Business Overview
    Table 94. Rohm Advanced Packaging for Automotive Chips Product
    Table 95. Rohm Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 96. Rohm Recent Development
    Table 97. ADI Company Detail
    Table 98. ADI Business Overview
    Table 99. ADI Advanced Packaging for Automotive Chips Product
    Table 100. ADI Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 101. ADI Recent Development
    Table 102. Microchip (Microsemi) Company Detail
    Table 103. Microchip (Microsemi) Business Overview
    Table 104. Microchip (Microsemi) Advanced Packaging for Automotive Chips Product
    Table 105. Microchip (Microsemi) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 106. Microchip (Microsemi) Recent Development
    Table 107. Amkor Company Detail
    Table 108. Amkor Business Overview
    Table 109. Amkor Advanced Packaging for Automotive Chips Product
    Table 110. Amkor Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 111. Amkor Recent Development
    Table 112. ASE (SPIL) Company Detail
    Table 113. ASE (SPIL) Business Overview
    Table 114. ASE (SPIL) Advanced Packaging for Automotive Chips Product
    Table 115. ASE (SPIL) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 116. ASE (SPIL) Recent Development
    Table 117. UTAC Company Detail
    Table 118. UTAC Business Overview
    Table 119. UTAC Advanced Packaging for Automotive Chips Product
    Table 120. UTAC Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 121. UTAC Recent Development
    Table 122. JCET (STATS ChipPAC) Company Detail
    Table 123. JCET (STATS ChipPAC) Business Overview
    Table 124. JCET (STATS ChipPAC) Advanced Packaging for Automotive Chips Product
    Table 125. JCET (STATS ChipPAC) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 126. JCET (STATS ChipPAC) Recent Development
    Table 127. Carsem Company Detail
    Table 128. Carsem Business Overview
    Table 129. Carsem Advanced Packaging for Automotive Chips Product
    Table 130. Carsem Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 131. Carsem Recent Development
    Table 132. King Yuan Electronics Corp. (KYEC) Company Detail
    Table 133. King Yuan Electronics Corp. (KYEC) Business Overview
    Table 134. King Yuan Electronics Corp. (KYEC) Advanced Packaging for Automotive Chips Product
    Table 135. King Yuan Electronics Corp. (KYEC) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 136. King Yuan Electronics Corp. (KYEC) Recent Development
    Table 137. KINGPAK Technology Inc Company Detail
    Table 138. KINGPAK Technology Inc Business Overview
    Table 139. KINGPAK Technology Inc Advanced Packaging for Automotive Chips Product
    Table 140. KINGPAK Technology Inc Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 141. KINGPAK Technology Inc Recent Development
    Table 142. Powertech Technology Inc. (PTI) Company Detail
    Table 143. Powertech Technology Inc. (PTI) Business Overview
    Table 144. Powertech Technology Inc. (PTI) Advanced Packaging for Automotive Chips Product
    Table 145. Powertech Technology Inc. (PTI) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 146. Powertech Technology Inc. (PTI) Recent Development
    Table 147. SFA Semicon Company Detail
    Table 148. SFA Semicon Business Overview
    Table 149. SFA Semicon Advanced Packaging for Automotive Chips Product
    Table 150. SFA Semicon Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 151. SFA Semicon Recent Development
    Table 152. Unisem Group Company Detail
    Table 153. Unisem Group Business Overview
    Table 154. Unisem Group Advanced Packaging for Automotive Chips Product
    Table 155. Unisem Group Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 156. Unisem Group Recent Development
    Table 157. Chipbond Technology Corporation Company Detail
    Table 158. Chipbond Technology Corporation Business Overview
    Table 159. Chipbond Technology Corporation Advanced Packaging for Automotive Chips Product
    Table 160. Chipbond Technology Corporation Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 161. Chipbond Technology Corporation Recent Development
    Table 162. ChipMOS TECHNOLOGIES Company Detail
    Table 163. ChipMOS TECHNOLOGIES Business Overview
    Table 164. ChipMOS TECHNOLOGIES Advanced Packaging for Automotive Chips Product
    Table 165. ChipMOS TECHNOLOGIES Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 166. ChipMOS TECHNOLOGIES Recent Development
    Table 167. OSE CORP. Company Detail
    Table 168. OSE CORP. Business Overview
    Table 169. OSE CORP. Advanced Packaging for Automotive Chips Product
    Table 170. OSE CORP. Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 171. OSE CORP. Recent Development
    Table 172. Sigurd Microelectronics Company Detail
    Table 173. Sigurd Microelectronics Business Overview
    Table 174. Sigurd Microelectronics Advanced Packaging for Automotive Chips Product
    Table 175. Sigurd Microelectronics Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 176. Sigurd Microelectronics Recent Development
    Table 177. Natronix Semiconductor Technology Company Detail
    Table 178. Natronix Semiconductor Technology Business Overview
    Table 179. Natronix Semiconductor Technology Advanced Packaging for Automotive Chips Product
    Table 180. Natronix Semiconductor Technology Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 181. Natronix Semiconductor Technology Recent Development
    Table 182. Nepes Company Detail
    Table 183. Nepes Business Overview
    Table 184. Nepes Advanced Packaging for Automotive Chips Product
    Table 185. Nepes Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 186. Nepes Recent Development
    Table 187. KESM Industries Berhad Company Detail
    Table 188. KESM Industries Berhad Business Overview
    Table 189. KESM Industries Berhad Advanced Packaging for Automotive Chips Product
    Table 190. KESM Industries Berhad Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 191. KESM Industries Berhad Recent Development
    Table 192. Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
    Table 193. Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
    Table 194. Forehope Electronic (Ningbo) Co.,Ltd. Advanced Packaging for Automotive Chips Product
    Table 195. Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 196. Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
    Table 197. Union Semiconductor（Hefei）Co., Ltd. Company Detail
    Table 198. Union Semiconductor（Hefei）Co., Ltd. Business Overview
    Table 199. Union Semiconductor（Hefei）Co., Ltd. Advanced Packaging for Automotive Chips Product
    Table 200. Union Semiconductor（Hefei）Co., Ltd. Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 201. Union Semiconductor（Hefei）Co., Ltd. Recent Development
    Table 202. Tongfu Microelectronics (TFME) Company Detail
    Table 203. Tongfu Microelectronics (TFME) Business Overview
    Table 204. Tongfu Microelectronics (TFME) Advanced Packaging for Automotive Chips Product
    Table 205. Tongfu Microelectronics (TFME) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 206. Tongfu Microelectronics (TFME) Recent Development
    Table 207. Hefei Chipmore Technology Co.,Ltd. Company Detail
    Table 208. Hefei Chipmore Technology Co.,Ltd. Business Overview
    Table 209. Hefei Chipmore Technology Co.,Ltd. Advanced Packaging for Automotive Chips Product
    Table 210. Hefei Chipmore Technology Co.,Ltd. Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 211. Hefei Chipmore Technology Co.,Ltd. Recent Development
    Table 212. HT-tech Company Detail
    Table 213. HT-tech Business Overview
    Table 214. HT-tech Advanced Packaging for Automotive Chips Product
    Table 215. HT-tech Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 216. HT-tech Recent Development
    Table 217. China Wafer Level CSP Co., Ltd Company Detail
    Table 218. China Wafer Level CSP Co., Ltd Business Overview
    Table 219. China Wafer Level CSP Co., Ltd Advanced Packaging for Automotive Chips Product
    Table 220. China Wafer Level CSP Co., Ltd Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 221. China Wafer Level CSP Co., Ltd Recent Development
    Table 222. Ningbo ChipEx Semiconductor Co., Ltd Company Detail
    Table 223. Ningbo ChipEx Semiconductor Co., Ltd Business Overview
    Table 224. Ningbo ChipEx Semiconductor Co., Ltd Advanced Packaging for Automotive Chips Product
    Table 225. Ningbo ChipEx Semiconductor Co., Ltd Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 226. Ningbo ChipEx Semiconductor Co., Ltd Recent Development
    Table 227. Guangdong Leadyo IC Testing Company Detail
    Table 228. Guangdong Leadyo IC Testing Business Overview
    Table 229. Guangdong Leadyo IC Testing Advanced Packaging for Automotive Chips Product
    Table 230. Guangdong Leadyo IC Testing Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 231. Guangdong Leadyo IC Testing Recent Development
    Table 232. Unimos Microelectronics (Shanghai) Company Detail
    Table 233. Unimos Microelectronics (Shanghai) Business Overview
    Table 234. Unimos Microelectronics (Shanghai) Advanced Packaging for Automotive Chips Product
    Table 235. Unimos Microelectronics (Shanghai) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 236. Unimos Microelectronics (Shanghai) Recent Development
    Table 237. Sino Technology Company Detail
    Table 238. Sino Technology Business Overview
    Table 239. Sino Technology Advanced Packaging for Automotive Chips Product
    Table 240. Sino Technology Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 241. Sino Technology Recent Development
    Table 242. Taiji Semiconductor (Suzhou) Company Detail
    Table 243. Taiji Semiconductor (Suzhou) Business Overview
    Table 244. Taiji Semiconductor (Suzhou) Advanced Packaging for Automotive Chips Product
    Table 245. Taiji Semiconductor (Suzhou) Revenue in Advanced Packaging for Automotive Chips Business (2019-2024) & (US$ Million)
    Table 246. Taiji Semiconductor (Suzhou) Recent Development
    Table 247. Research Programs/Design for This Report
    Table 248. Key Data Information from Secondary Sources
    Table 249. Key Data Information from Primary Sources
List of Figures
    Figure 1. Global Advanced Packaging for Automotive Chips Market Size Comparison by Type (2024-2030) & (US$ Million)
    Figure 2. Global Advanced Packaging for Automotive Chips Market Share by Type: 2023 VS 2030
    Figure 3. FC (Flip Chip) Features
    Figure 4. WLCSP Features
    Figure 5. Others Features
    Figure 6. Global Advanced Packaging for Automotive Chips Market Size Comparison by Application (2024-2030) & (US$ Million)
    Figure 7. Global Advanced Packaging for Automotive Chips Market Share by Application: 2023 VS 2030
    Figure 8. Automotive OSAT Case Studies
    Figure 9. Automotive IDM Case Studies
    Figure 10. Advanced Packaging for Automotive Chips Report Years Considered
    Figure 11. Global Advanced Packaging for Automotive Chips Market Size (US$ Million), Year-over-Year: 2019-2030
    Figure 12. Global Advanced Packaging for Automotive Chips Market Size, (US$ Million), 2019 VS 2023 VS 2030
    Figure 13. Global Advanced Packaging for Automotive Chips Market Share by Region: 2023 VS 2030
    Figure 14. Global Advanced Packaging for Automotive Chips Market Share by Players in 2023
    Figure 15. Global Top Advanced Packaging for Automotive Chips Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Advanced Packaging for Automotive Chips as of 2023)
    Figure 16. The Top 10 and 5 Players Market Share by Advanced Packaging for Automotive Chips Revenue in 2023
    Figure 17. North America Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 18. North America Advanced Packaging for Automotive Chips Market Share by Country (2019-2030)
    Figure 19. United States Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 20. Canada Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 21. Europe Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 22. Europe Advanced Packaging for Automotive Chips Market Share by Country (2019-2030)
    Figure 23. Germany Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 24. France Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 25. U.K. Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 26. Italy Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 27. Russia Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 28. Nordic Countries Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 29. Asia-Pacific Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 30. Asia-Pacific Advanced Packaging for Automotive Chips Market Share by Region (2019-2030)
    Figure 31. China Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 32. Japan Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 33. South Korea Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 34. Southeast Asia Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 35. India Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 36. Australia Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 37. Latin America Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 38. Latin America Advanced Packaging for Automotive Chips Market Share by Country (2019-2030)
    Figure 39. Mexico Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 40. Brazil Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 41. Middle East & Africa Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 42. Middle East & Africa Advanced Packaging for Automotive Chips Market Share by Country (2019-2030)
    Figure 43. Turkey Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 44. Saudi Arabia Advanced Packaging for Automotive Chips Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 45. NXP Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 46. Infineon (Cypress) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 47. Renesas Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 48. Texas Instrument Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 49. STMicroelectronics Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 50. Bosch Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 51. onsemi Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 52. Mitsubishi Electric Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 53. Rapidus Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 54. Rohm Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 55. ADI Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 56. Microchip (Microsemi) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 57. Amkor Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 58. ASE (SPIL) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 59. UTAC Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 60. JCET (STATS ChipPAC) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 61. Carsem Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 62. King Yuan Electronics Corp. (KYEC) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 63. KINGPAK Technology Inc Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 64. Powertech Technology Inc. (PTI) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 65. SFA Semicon Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 66. Unisem Group Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 67. Chipbond Technology Corporation Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 68. ChipMOS TECHNOLOGIES Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 69. OSE CORP. Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 70. Sigurd Microelectronics Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 71. Natronix Semiconductor Technology Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 72. Nepes Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 73. KESM Industries Berhad Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 74. Forehope Electronic (Ningbo) Co.,Ltd. Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 75. Union Semiconductor（Hefei）Co., Ltd. Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 76. Tongfu Microelectronics (TFME) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 77. Hefei Chipmore Technology Co.,Ltd. Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 78. HT-tech Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 79. China Wafer Level CSP Co., Ltd Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 80. Ningbo ChipEx Semiconductor Co., Ltd Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 81. Guangdong Leadyo IC Testing Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 82. Unimos Microelectronics (Shanghai) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 83. Sino Technology Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 84. Taiji Semiconductor (Suzhou) Revenue Growth Rate in Advanced Packaging for Automotive Chips Business (2019-2024)
    Figure 85. Bottom-up and Top-down Approaches for This Report
    Figure 86. Data Triangulation
    Figure 87. Key Executives Interviewed
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