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Global Wafer Bonding Equipment Market Research Report 2025

Published Date: March 2025

Report Code: QYRE-Auto-2H11614

Global Wafer Bonding Equipment Market Research Report 2022

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Global Wafer Bonding Equipment Market Research Report 2025

Code: QYRE-Auto-2H11614

Report

March 2025

Pages:96

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

EV Group

Suss Microtec

Applied Microengineering

Ayumi Industry

Hutem

Canon Inc

Bondtech

Tazmo

Shanghai Micro Electronics

U-Precision Tech

Tokyo Electron

Nidec Machine Tool

AIMECHATEC

Wafer Bonding Equipment Market Size

The global market for Wafer Bonding Equipment was valued at US$ 321 million in the year 2024 and is projected to reach a revised size of US$ 449 million by 2031, growing at a CAGR of 5.0% during the forecast period.

Wafer Bonding Equipment Market

Wafer bonding equipment refers to specialized machinery used to bond two or more semiconductor wafers together, creating a single composite structure. This process is crucial in semiconductor manufacturing and is used for a variety of applications.

The Wafer Bonding Equipment market is a specialized segment of the semiconductor equipment industry. It supports the manufacturing of advanced semiconductors and MEMS devices by enabling the bonding of silicon wafers through various techniques, including direct bonding, anodic bonding, and adhesive bonding. This equipment is pivotal in producing devices such as MEMS sensors, CMOS image sensors, photonic devices, and power ICs.

Market Drivers:

Growing Demand for Miniaturized Electronics: Increased adoption of smaller, high-performance consumer electronics such as smartphones and wearables drives demand for compact semiconductor designs achieved through wafer bonding technologies. 5G and IoT Proliferation: The rollout of 5G networks and Internet of Things (IoT) devices is driving innovations in semiconductor packaging, especially 3D integration and hybrid bonding for high-speed, efficient chips. Advancements in Semiconductor Packaging: Rising interest in advanced packaging methods like System-in-Package (SiP) and wafer-level packaging propels the adoption of wafer bonding equipment.

Market Restraints:

High Costs: The significant cost of wafer bonding equipment and maintenance limits adoption, particularly among small and medium-sized enterprises (SMEs). Technical Challenges: The increasing complexity of bonding processes, including the need for ultra-clean environments and precise control, can pose operational hurdles. Supply Chain Vulnerabilities: Semiconductor industry supply chain disruptions, such as material shortages or geopolitical issues, may impact the availability of bonding equipment.

Market Opportunities:

Silicon Photonics Growth: Rising demand for integrating photonics into silicon platforms, such as in data centers and optical communications, provides significant growth opportunities. Emerging Technologies: Hybrid bonding and laser-assisted bonding techniques are advancing, catering to the need for higher-performance devices and enabling new applications in AI, automotive, and healthcare. Geographic Expansion: Increasing investments in semiconductor manufacturing in regions like Southeast Asia, the Middle East, and Eastern Europe are creating new markets for bonding equipment.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer Bonding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Bonding Equipment.

The Wafer Bonding Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Bonding Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Wafer Bonding Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Wafer Bonding Equipment Market Report

Report Metric	Details
Report Name	Wafer Bonding Equipment Market
Accounted market size in year	US$ 321 million
Forecasted market size in 2031	US$ 449 million
CAGR	5.0%
Base Year	year
Forecasted years	2025 - 2031
by Type	Fully Automatic Semi Automatic
by Application	MEMS Advanced Packaging CIS Others
Production by Region	South Korea Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, Hutem, Shanghai Micro Electronics, Canon
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Bonding Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Bonding Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Bonding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Wafer Bonding Equipment Market growing?

Ans: The Wafer Bonding Equipment Market witnessing a CAGR of 5.0% during the forecast period 2025-2031.

What is the Wafer Bonding Equipment Market size in 2031?

Ans: The Wafer Bonding Equipment Market size in 2031 will be US$ 449 million.

Who are the main players in the Wafer Bonding Equipment Market report?

Ans: The main players in the Wafer Bonding Equipment Market are EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, Hutem, Shanghai Micro Electronics, Canon

What are the Application segmentation covered in the Wafer Bonding Equipment Market report?

Ans: The Applications covered in the Wafer Bonding Equipment Market report are MEMS, Advanced Packaging, CIS, Others

What are the Type segmentation covered in the Wafer Bonding Equipment Market report?

Ans: The Types covered in the Wafer Bonding Equipment Market report are Fully Automatic, Semi Automatic

1 Wafer Bonding Equipment Market Overview

1.1 Product Definition

1.2 Wafer Bonding Equipment by Type

1.2.1 Global Wafer Bonding Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Fully Automatic

1.2.3 Semi Automatic

1.3 Wafer Bonding Equipment by Application

1.3.1 Global Wafer Bonding Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 MEMS

1.3.3 Advanced Packaging

1.3.4 CIS

1.3.5 Others

1.4 Global Market Growth Prospects

1.4.1 Global Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Wafer Bonding Equipment Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Wafer Bonding Equipment Production Estimates and Forecasts (2020-2031)

1.4.4 Global Wafer Bonding Equipment Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Wafer Bonding Equipment Production Market Share by Manufacturers (2020-2025)

2.2 Global Wafer Bonding Equipment Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Wafer Bonding Equipment, Industry Ranking, 2023 VS 2024

2.4 Global Wafer Bonding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Wafer Bonding Equipment Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Wafer Bonding Equipment, Product Offered and Application

2.8 Global Key Manufacturers of Wafer Bonding Equipment, Date of Enter into This Industry

2.9 Wafer Bonding Equipment Market Competitive Situation and Trends

2.9.1 Wafer Bonding Equipment Market Concentration Rate

2.9.2 Global 5 and 10 Largest Wafer Bonding Equipment Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Wafer Bonding Equipment Production by Region

3.1 Global Wafer Bonding Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Wafer Bonding Equipment Production Value by Region (2020-2031)

3.2.1 Global Wafer Bonding Equipment Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Wafer Bonding Equipment by Region (2026-2031)

3.3 Global Wafer Bonding Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Wafer Bonding Equipment Production Volume by Region (2020-2031)

3.4.1 Global Wafer Bonding Equipment Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Wafer Bonding Equipment by Region (2026-2031)

3.5 Global Wafer Bonding Equipment Market Price Analysis by Region (2020-2025)

3.6 Global Wafer Bonding Equipment Production and Value, Year-over-Year Growth

3.6.1 South Korea Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

4 Wafer Bonding Equipment Consumption by Region

4.1 Global Wafer Bonding Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Wafer Bonding Equipment Consumption by Region (2020-2031)

4.2.1 Global Wafer Bonding Equipment Consumption by Region (2020-2025)

4.2.2 Global Wafer Bonding Equipment Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Wafer Bonding Equipment Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Wafer Bonding Equipment Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Wafer Bonding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Wafer Bonding Equipment Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Wafer Bonding Equipment Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global Wafer Bonding Equipment Production by Type (2020-2031)

5.1.1 Global Wafer Bonding Equipment Production by Type (2020-2025)

5.1.2 Global Wafer Bonding Equipment Production by Type (2026-2031)

5.1.3 Global Wafer Bonding Equipment Production Market Share by Type (2020-2031)

5.2 Global Wafer Bonding Equipment Production Value by Type (2020-2031)

5.2.1 Global Wafer Bonding Equipment Production Value by Type (2020-2025)

5.2.2 Global Wafer Bonding Equipment Production Value by Type (2026-2031)

5.2.3 Global Wafer Bonding Equipment Production Value Market Share by Type (2020-2031)

5.3 Global Wafer Bonding Equipment Price by Type (2020-2031)

6 Segment by Application

6.1 Global Wafer Bonding Equipment Production by Application (2020-2031)

6.1.1 Global Wafer Bonding Equipment Production by Application (2020-2025)

6.1.2 Global Wafer Bonding Equipment Production by Application (2026-2031)

6.1.3 Global Wafer Bonding Equipment Production Market Share by Application (2020-2031)

6.2 Global Wafer Bonding Equipment Production Value by Application (2020-2031)

6.2.1 Global Wafer Bonding Equipment Production Value by Application (2020-2025)

6.2.2 Global Wafer Bonding Equipment Production Value by Application (2026-2031)

6.2.3 Global Wafer Bonding Equipment Production Value Market Share by Application (2020-2031)

6.3 Global Wafer Bonding Equipment Price by Application (2020-2031)

7 Key Companies Profiled

7.1 EV Group

7.1.1 EV Group Wafer Bonding Equipment Company Information

7.1.2 EV Group Wafer Bonding Equipment Product Portfolio

7.1.3 EV Group Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.1.4 EV Group Main Business and Markets Served

7.1.5 EV Group Recent Developments/Updates

7.2 SUSS MicroTec

7.2.1 SUSS MicroTec Wafer Bonding Equipment Company Information

7.2.2 SUSS MicroTec Wafer Bonding Equipment Product Portfolio

7.2.3 SUSS MicroTec Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.2.4 SUSS MicroTec Main Business and Markets Served

7.2.5 SUSS MicroTec Recent Developments/Updates

7.3 Tokyo Electron

7.3.1 Tokyo Electron Wafer Bonding Equipment Company Information

7.3.2 Tokyo Electron Wafer Bonding Equipment Product Portfolio

7.3.3 Tokyo Electron Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.3.4 Tokyo Electron Main Business and Markets Served

7.3.5 Tokyo Electron Recent Developments/Updates

7.4 Applied Microengineering

7.4.1 Applied Microengineering Wafer Bonding Equipment Company Information

7.4.2 Applied Microengineering Wafer Bonding Equipment Product Portfolio

7.4.3 Applied Microengineering Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Applied Microengineering Main Business and Markets Served

7.4.5 Applied Microengineering Recent Developments/Updates

7.5 Nidec Machine Tool

7.5.1 Nidec Machine Tool Wafer Bonding Equipment Company Information

7.5.2 Nidec Machine Tool Wafer Bonding Equipment Product Portfolio

7.5.3 Nidec Machine Tool Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Nidec Machine Tool Main Business and Markets Served

7.5.5 Nidec Machine Tool Recent Developments/Updates

7.6 Ayumi Industry

7.6.1 Ayumi Industry Wafer Bonding Equipment Company Information

7.6.2 Ayumi Industry Wafer Bonding Equipment Product Portfolio

7.6.3 Ayumi Industry Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Ayumi Industry Main Business and Markets Served

7.6.5 Ayumi Industry Recent Developments/Updates

7.7 Bondtech

7.7.1 Bondtech Wafer Bonding Equipment Company Information

7.7.2 Bondtech Wafer Bonding Equipment Product Portfolio

7.7.3 Bondtech Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Bondtech Main Business and Markets Served

7.7.5 Bondtech Recent Developments/Updates

7.8 Aimechatec

7.8.1 Aimechatec Wafer Bonding Equipment Company Information

7.8.2 Aimechatec Wafer Bonding Equipment Product Portfolio

7.8.3 Aimechatec Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Aimechatec Main Business and Markets Served

7.8.5 Aimechatec Recent Developments/Updates

7.9 U-Precision Tech

7.9.1 U-Precision Tech Wafer Bonding Equipment Company Information

7.9.2 U-Precision Tech Wafer Bonding Equipment Product Portfolio

7.9.3 U-Precision Tech Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.9.4 U-Precision Tech Main Business and Markets Served

7.9.5 U-Precision Tech Recent Developments/Updates

7.10 TAZMO

7.10.1 TAZMO Wafer Bonding Equipment Company Information

7.10.2 TAZMO Wafer Bonding Equipment Product Portfolio

7.10.3 TAZMO Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.10.4 TAZMO Main Business and Markets Served

7.10.5 TAZMO Recent Developments/Updates

7.11 Hutem

7.11.1 Hutem Wafer Bonding Equipment Company Information

7.11.2 Hutem Wafer Bonding Equipment Product Portfolio

7.11.3 Hutem Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.11.4 Hutem Main Business and Markets Served

7.11.5 Hutem Recent Developments/Updates

7.12 Shanghai Micro Electronics

7.12.1 Shanghai Micro Electronics Wafer Bonding Equipment Company Information

7.12.2 Shanghai Micro Electronics Wafer Bonding Equipment Product Portfolio

7.12.3 Shanghai Micro Electronics Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.12.4 Shanghai Micro Electronics Main Business and Markets Served

7.12.5 Shanghai Micro Electronics Recent Developments/Updates

7.13 Canon

7.13.1 Canon Wafer Bonding Equipment Company Information

7.13.2 Canon Wafer Bonding Equipment Product Portfolio

7.13.3 Canon Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.13.4 Canon Main Business and Markets Served

7.13.5 Canon Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Wafer Bonding Equipment Industry Chain Analysis

8.2 Wafer Bonding Equipment Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Wafer Bonding Equipment Production Mode & Process Analysis

8.4 Wafer Bonding Equipment Sales and Marketing

8.4.1 Wafer Bonding Equipment Sales Channels

8.4.2 Wafer Bonding Equipment Distributors

8.5 Wafer Bonding Equipment Customer Analysis

9 Wafer Bonding Equipment Market Dynamics

9.1 Wafer Bonding Equipment Industry Trends

9.2 Wafer Bonding Equipment Market Drivers

9.3 Wafer Bonding Equipment Market Challenges

9.4 Wafer Bonding Equipment Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

EV Group

Suss Microtec

Applied Microengineering

Ayumi Industry

Hutem

Canon Inc

Bondtech

Tazmo

Shanghai Micro Electronics

U-Precision Tech

Tokyo Electron

Nidec Machine Tool

AIMECHATEC

List of Tables

Table 1. Global Wafer Bonding Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Wafer Bonding Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Wafer Bonding Equipment Production Capacity (Units) by Manufacturers in 2024

Table 4. Global Wafer Bonding Equipment Production by Manufacturers (2020-2025) & (Units)

Table 5. Global Wafer Bonding Equipment Production Market Share by Manufacturers (2020-2025)

Table 6. Global Wafer Bonding Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Wafer Bonding Equipment Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Wafer Bonding Equipment, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Wafer Bonding Equipment as of 2024)

Table 10. Global Market Wafer Bonding Equipment Average Price by Manufacturers (K USD/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Wafer Bonding Equipment, Product Offered and Application

Table 13. Global Key Manufacturers of Wafer Bonding Equipment, Date of Enter into This Industry

Table 14. Global Wafer Bonding Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Wafer Bonding Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Wafer Bonding Equipment Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Wafer Bonding Equipment Production Value Market Share by Region (2020-2025)

Table 19. Global Wafer Bonding Equipment Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Wafer Bonding Equipment Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Wafer Bonding Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global Wafer Bonding Equipment Production (Units) by Region (2020-2025)

Table 23. Global Wafer Bonding Equipment Production Market Share by Region (2020-2025)

Table 24. Global Wafer Bonding Equipment Production (Units) Forecast by Region (2026-2031)

Table 25. Global Wafer Bonding Equipment Production Market Share Forecast by Region (2026-2031)

Table 26. Global Wafer Bonding Equipment Market Average Price (K USD/Unit) by Region (2020-2025)

Table 27. Global Wafer Bonding Equipment Market Average Price (K USD/Unit) by Region (2026-2031)

Table 28. Global Wafer Bonding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global Wafer Bonding Equipment Consumption by Region (2020-2025) & (Units)

Table 30. Global Wafer Bonding Equipment Consumption Market Share by Region (2020-2025)

Table 31. Global Wafer Bonding Equipment Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global Wafer Bonding Equipment Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America Wafer Bonding Equipment Consumption by Country (2020-2025) & (Units)

Table 35. North America Wafer Bonding Equipment Consumption by Country (2026-2031) & (Units)

Table 36. Europe Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe Wafer Bonding Equipment Consumption by Country (2020-2025) & (Units)

Table 38. Europe Wafer Bonding Equipment Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific Wafer Bonding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific Wafer Bonding Equipment Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific Wafer Bonding Equipment Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa Wafer Bonding Equipment Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa Wafer Bonding Equipment Consumption by Country (2026-2031) & (Units)

Table 45. Global Wafer Bonding Equipment Production (Units) by Type (2020-2025)

Table 46. Global Wafer Bonding Equipment Production (Units) by Type (2026-2031)

Table 47. Global Wafer Bonding Equipment Production Market Share by Type (2020-2025)

Table 48. Global Wafer Bonding Equipment Production Market Share by Type (2026-2031)

Table 49. Global Wafer Bonding Equipment Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Wafer Bonding Equipment Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Wafer Bonding Equipment Production Value Market Share by Type (2020-2025)

Table 52. Global Wafer Bonding Equipment Production Value Market Share by Type (2026-2031)

Table 53. Global Wafer Bonding Equipment Price (K USD/Unit) by Type (2020-2025)

Table 54. Global Wafer Bonding Equipment Price (K USD/Unit) by Type (2026-2031)

Table 55. Global Wafer Bonding Equipment Production (Units) by Application (2020-2025)

Table 56. Global Wafer Bonding Equipment Production (Units) by Application (2026-2031)

Table 57. Global Wafer Bonding Equipment Production Market Share by Application (2020-2025)

Table 58. Global Wafer Bonding Equipment Production Market Share by Application (2026-2031)

Table 59. Global Wafer Bonding Equipment Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Wafer Bonding Equipment Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Wafer Bonding Equipment Production Value Market Share by Application (2020-2025)

Table 62. Global Wafer Bonding Equipment Production Value Market Share by Application (2026-2031)

Table 63. Global Wafer Bonding Equipment Price (K USD/Unit) by Application (2020-2025)

Table 64. Global Wafer Bonding Equipment Price (K USD/Unit) by Application (2026-2031)

Table 65. EV Group Wafer Bonding Equipment Company Information

Table 66. EV Group Wafer Bonding Equipment Specification and Application

Table 67. EV Group Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 68. EV Group Main Business and Markets Served

Table 69. EV Group Recent Developments/Updates

Table 70. SUSS MicroTec Wafer Bonding Equipment Company Information

Table 71. SUSS MicroTec Wafer Bonding Equipment Specification and Application

Table 72. SUSS MicroTec Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 73. SUSS MicroTec Main Business and Markets Served

Table 74. SUSS MicroTec Recent Developments/Updates

Table 75. Tokyo Electron Wafer Bonding Equipment Company Information

Table 76. Tokyo Electron Wafer Bonding Equipment Specification and Application

Table 77. Tokyo Electron Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 78. Tokyo Electron Main Business and Markets Served

Table 79. Tokyo Electron Recent Developments/Updates

Table 80. Applied Microengineering Wafer Bonding Equipment Company Information

Table 81. Applied Microengineering Wafer Bonding Equipment Specification and Application

Table 82. Applied Microengineering Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 83. Applied Microengineering Main Business and Markets Served

Table 84. Applied Microengineering Recent Developments/Updates

Table 85. Nidec Machine Tool Wafer Bonding Equipment Company Information

Table 86. Nidec Machine Tool Wafer Bonding Equipment Specification and Application

Table 87. Nidec Machine Tool Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 88. Nidec Machine Tool Main Business and Markets Served

Table 89. Nidec Machine Tool Recent Developments/Updates

Table 90. Ayumi Industry Wafer Bonding Equipment Company Information

Table 91. Ayumi Industry Wafer Bonding Equipment Specification and Application

Table 92. Ayumi Industry Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 93. Ayumi Industry Main Business and Markets Served

Table 94. Ayumi Industry Recent Developments/Updates

Table 95. Bondtech Wafer Bonding Equipment Company Information

Table 96. Bondtech Wafer Bonding Equipment Specification and Application

Table 97. Bondtech Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 98. Bondtech Main Business and Markets Served

Table 99. Bondtech Recent Developments/Updates

Table 100. Aimechatec Wafer Bonding Equipment Company Information

Table 101. Aimechatec Wafer Bonding Equipment Specification and Application

Table 102. Aimechatec Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 103. Aimechatec Main Business and Markets Served

Table 104. Aimechatec Recent Developments/Updates

Table 105. U-Precision Tech Wafer Bonding Equipment Company Information

Table 106. U-Precision Tech Wafer Bonding Equipment Specification and Application

Table 107. U-Precision Tech Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 108. U-Precision Tech Main Business and Markets Served

Table 109. U-Precision Tech Recent Developments/Updates

Table 110. TAZMO Wafer Bonding Equipment Company Information

Table 111. TAZMO Wafer Bonding Equipment Specification and Application

Table 112. TAZMO Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 113. TAZMO Main Business and Markets Served

Table 114. TAZMO Recent Developments/Updates

Table 115. Hutem Wafer Bonding Equipment Company Information

Table 116. Hutem Wafer Bonding Equipment Specification and Application

Table 117. Hutem Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 118. Hutem Main Business and Markets Served

Table 119. Hutem Recent Developments/Updates

Table 120. Shanghai Micro Electronics Wafer Bonding Equipment Company Information

Table 121. Shanghai Micro Electronics Wafer Bonding Equipment Specification and Application

Table 122. Shanghai Micro Electronics Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 123. Shanghai Micro Electronics Main Business and Markets Served

Table 124. Shanghai Micro Electronics Recent Developments/Updates

Table 125. Canon Wafer Bonding Equipment Company Information

Table 126. Canon Wafer Bonding Equipment Specification and Application

Table 127. Canon Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (K USD/Unit) and Gross Margin (2020-2025)

Table 128. Canon Main Business and Markets Served

Table 129. Canon Recent Developments/Updates

Table 130. Key Raw Materials Lists

Table 131. Raw Materials Key Suppliers Lists

Table 132. Wafer Bonding Equipment Distributors List

Table 133. Wafer Bonding Equipment Customers List

Table 134. Wafer Bonding Equipment Market Trends

Table 135. Wafer Bonding Equipment Market Drivers

Table 136. Wafer Bonding Equipment Market Challenges

Table 137. Wafer Bonding Equipment Market Restraints

Table 138. Research Programs/Design for This Report

Table 139. Key Data Information from Secondary Sources

Table 140. Key Data Information from Primary Sources

Table 141. Authors List of This Report

List of Figures

Figure 1. Product Picture of Wafer Bonding Equipment

Figure 2. Global Wafer Bonding Equipment Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Wafer Bonding Equipment Market Share by Type: 2024 VS 2031

Figure 4. Fully Automatic Product Picture

Figure 5. Semi Automatic Product Picture

Figure 6. Global Wafer Bonding Equipment Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global Wafer Bonding Equipment Market Share by Application: 2024 VS 2031

Figure 8. MEMS

Figure 9. Advanced Packaging

Figure 10. CIS

Figure 11. Others

Figure 12. Global Wafer Bonding Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 13. Global Wafer Bonding Equipment Production Value (US$ Million) & (2020-2031)

Figure 14. Global Wafer Bonding Equipment Production Capacity (Units) & (2020-2031)

Figure 15. Global Wafer Bonding Equipment Production (Units) & (2020-2031)

Figure 16. Global Wafer Bonding Equipment Average Price (K USD/Unit) & (2020-2031)

Figure 17. Wafer Bonding Equipment Report Years Considered

Figure 18. Wafer Bonding Equipment Production Share by Manufacturers in 2024

Figure 19. Global Wafer Bonding Equipment Production Value Share by Manufacturers (2024)

Figure 20. Wafer Bonding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 21. The Global 5 and 10 Largest Players: Market Share by Wafer Bonding Equipment Revenue in 2024

Figure 22. Global Wafer Bonding Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 23. Global Wafer Bonding Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 24. Global Wafer Bonding Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 25. Global Wafer Bonding Equipment Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 26. South Korea Wafer Bonding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. Europe Wafer Bonding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. China Wafer Bonding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 29. Japan Wafer Bonding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 30. Global Wafer Bonding Equipment Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 31. Global Wafer Bonding Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 32. North America Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 33. North America Wafer Bonding Equipment Consumption Market Share by Country (2020-2031)

Figure 34. U.S. Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 35. Canada Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 36. Europe Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 37. Europe Wafer Bonding Equipment Consumption Market Share by Country (2020-2031)

Figure 38. Germany Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 39. France Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. U.K. Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. Italy Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 42. Netherlands Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 43. Asia Pacific Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 44. Asia Pacific Wafer Bonding Equipment Consumption Market Share by Region (2020-2031)

Figure 45. China Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 46. Japan Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. South Korea Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. China Taiwan Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. Southeast Asia Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 50. India Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 51. Latin America, Middle East & Africa Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 52. Latin America, Middle East & Africa Wafer Bonding Equipment Consumption Market Share by Country (2020-2031)

Figure 53. Mexico Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 54. Brazil Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 55. Turkey Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 56. GCC Countries Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 57. Global Production Market Share of Wafer Bonding Equipment by Type (2020-2031)

Figure 58. Global Production Value Market Share of Wafer Bonding Equipment by Type (2020-2031)

Figure 59. Global Wafer Bonding Equipment Price (K USD/Unit) by Type (2020-2031)

Figure 60. Global Production Market Share of Wafer Bonding Equipment by Application (2020-2031)

Figure 61. Global Production Value Market Share of Wafer Bonding Equipment by Application (2020-2031)

Figure 62. Global Wafer Bonding Equipment Price (K USD/Unit) by Application (2020-2031)

Figure 63. Wafer Bonding Equipment Value Chain

Figure 64. Channels of Distribution (Direct Vs Distribution)

Figure 65. Bottom-up and Top-down Approaches for This Report

Figure 66. Data Triangulation

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Global Wafer Bonding Equipment Market Research Report 2025

Published Date: March 2025

Report Code: QYRE-Auto-2H11614

Global Wafer Bonding Equipment Market Research Report 2025

FEATURED COMPANIES

Wafer Bonding Equipment Market Size

Wafer Bonding Equipment Market

Report Scope

Scope of Wafer Bonding Equipment Market Report

Chapter Outline

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