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Global Wafer Temporary Bonder Market Research Report 2025

Published Date: February 2025

Report Code: QYRE-Auto-23I11256

Global Wafer Temporary Bonder Market Research Report 2022

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Global Wafer Temporary Bonder Market Research Report 2025

Code: QYRE-Auto-23I11256

Report

February 2025

Pages:89

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

EV Group

Suss Microtec

Tokyo Electron

Ayumi Industry

SMEE

Applied Microengineering

Nidec Machine Tool

Wafer Temporary Bonder Market Size

The global market for Wafer Temporary Bonder was valued at US$ 176 million in the year 2024 and is projected to reach a revised size of US$ 260 million by 2031, growing at a CAGR of 5.8% during the forecast period.

Wafer Temporary Bonder Market

A Wafer Temporary Bonder is a specialized machine used in the semiconductor manufacturing process to temporarily bond semiconductor wafers to a carrier wafer or another substrate during various stages of processing. This temporary bonding process is commonly used in wafer thinning, 3D IC stacking, MEMS fabrication, and advanced packaging technologies. The wafer is typically bonded to a support or carrier wafer using a temporary adhesive or adhesion layer, which can later be easily removed without damaging the wafer or the components on it.

The Wafer Temporary Bonder market is a critical segment of the semiconductor manufacturing and packaging industry. Wafer temporary bonding technologies are essential for advanced packaging solutions, 3D integrated circuits (3D ICs), MEMS devices, and wafer thinning. This market is driven by the growing demand for miniaturized electronic devices, such as smartphones, wearables, IoT devices, and automotive electronics, which require increasingly complex semiconductor packaging and advanced manufacturing processes. Temporary bonding technologies allow wafers to be securely bonded during multiple processing steps and later debonded without damage, enabling the production of smaller, more powerful, and multi-functional devices.

Key Market Trends & Drivers

Advancement in 3D IC and Wafer-Level Packaging: The growing demand for 3D ICs (3D integrated circuits) and System-in-Package (SiP) technologies is a significant driver for the wafer temporary bonding market. 3D ICs, which involve stacking multiple layers of wafers or chips, require a reliable and temporary bond to hold the wafers in place during the assembly and processing stages. Temporary bonding technology ensures that the wafers remain aligned and securely positioned without causing any damage during post-processing steps. Miniaturization of Semiconductor Devices: As consumer electronics, including smartphones, wearables, and IoT devices, continue to shrink in size and increase in functionality, there is a growing need for wafer bonding technologies to enable the manufacturing of smaller, high-performance components. Temporary bonding plays a key role in wafer thinning, which is necessary for producing ultra-thin wafers required for compact device packaging.

Market Challenges

High Capital Investment: Wafer temporary bonders are high-precision machines that require significant capital investment. For smaller manufacturers or those in emerging markets, the cost of acquiring and maintaining these machines can be prohibitive. This makes it difficult for smaller-scale manufacturers to adopt these technologies.

Material Compatibility: Different wafer bonding techniques require specific materials, and ensuring compatibility between the adhesive or bonding materials and the wafers being processed can be challenging. Factors such as temperature sensitivity, adhesion strength, and material properties must be carefully considered to ensure the quality of the bond and successful debonding.

Market Opportunities

Growth in Advanced Packaging Applications: The increasing complexity of advanced packaging technologies, such as Fan-Out Wafer-Level Packaging (FOWLP) and Chip-on-Wafer-on-Substrate (CoWos), is creating new opportunities for wafer temporary bonding. These technologies often require the bonding of multiple layers or heterogeneous materials, which can be efficiently handled with temporary bonding solutions. Rise of Flexible Electronics: The growth of flexible electronics—such as flexible sensors, displays, and wearables—requires new bonding techniques to handle non-traditional materials. Wafer temporary bonding plays a key role in processing flexible substrates and ensuring that components are securely bonded during fabrication.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer Temporary Bonder, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Temporary Bonder.

The Wafer Temporary Bonder market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Temporary Bonder market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Wafer Temporary Bonder manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Wafer Temporary Bonder Market Report

Report Metric	Details
Report Name	Wafer Temporary Bonder Market
Accounted market size in year	US$ 176 million
Forecasted market size in 2031	US$ 260 million
CAGR	5.8%
Base Year	year
Forecasted years	2025 - 2031
by Type	Semi-Automated Wafer Bonder Fully-Automated Wafer Bonder
by Application	MEMS Advanced Packaging CIS Others
Production by Region	Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, SMEE
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Temporary Bonder manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Temporary Bonder by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Temporary Bonder in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Wafer Temporary Bonder Market growing?

Ans: The Wafer Temporary Bonder Market witnessing a CAGR of 5.8% during the forecast period 2025-2031.

What is the Wafer Temporary Bonder Market size in 2031?

Ans: The Wafer Temporary Bonder Market size in 2031 will be US$ 260 million.

Who are the main players in the Wafer Temporary Bonder Market report?

Ans: The main players in the Wafer Temporary Bonder Market are EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, SMEE

What are the Application segmentation covered in the Wafer Temporary Bonder Market report?

Ans: The Applications covered in the Wafer Temporary Bonder Market report are MEMS, Advanced Packaging, CIS, Others

What are the Type segmentation covered in the Wafer Temporary Bonder Market report?

Ans: The Types covered in the Wafer Temporary Bonder Market report are Semi-Automated Wafer Bonder, Fully-Automated Wafer Bonder

1 Wafer Temporary Bonder Market Overview

1.1 Product Definition

1.2 Wafer Temporary Bonder by Type

1.2.1 Global Wafer Temporary Bonder Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Semi-Automated Wafer Bonder

1.2.3 Fully-Automated Wafer Bonder

1.3 Wafer Temporary Bonder by Application

1.3.1 Global Wafer Temporary Bonder Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 MEMS

1.3.3 Advanced Packaging

1.3.4 CIS

1.3.5 Others

1.4 Global Market Growth Prospects

1.4.1 Global Wafer Temporary Bonder Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Wafer Temporary Bonder Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Wafer Temporary Bonder Production Estimates and Forecasts (2020-2031)

1.4.4 Global Wafer Temporary Bonder Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Wafer Temporary Bonder Production Market Share by Manufacturers (2020-2025)

2.2 Global Wafer Temporary Bonder Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Wafer Temporary Bonder, Industry Ranking, 2023 VS 2024

2.4 Global Wafer Temporary Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Wafer Temporary Bonder Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Wafer Temporary Bonder, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Wafer Temporary Bonder, Product Offered and Application

2.8 Global Key Manufacturers of Wafer Temporary Bonder, Date of Enter into This Industry

2.9 Wafer Temporary Bonder Market Competitive Situation and Trends

2.9.1 Wafer Temporary Bonder Market Concentration Rate

2.9.2 Global 5 and 10 Largest Wafer Temporary Bonder Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Wafer Temporary Bonder Production by Region

3.1 Global Wafer Temporary Bonder Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Wafer Temporary Bonder Production Value by Region (2020-2031)

3.2.1 Global Wafer Temporary Bonder Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Wafer Temporary Bonder by Region (2026-2031)

3.3 Global Wafer Temporary Bonder Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Wafer Temporary Bonder Production Volume by Region (2020-2031)

3.4.1 Global Wafer Temporary Bonder Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Wafer Temporary Bonder by Region (2026-2031)

3.5 Global Wafer Temporary Bonder Market Price Analysis by Region (2020-2025)

3.6 Global Wafer Temporary Bonder Production and Value, Year-over-Year Growth

3.6.1 Europe Wafer Temporary Bonder Production Value Estimates and Forecasts (2020-2031)

3.6.2 China Wafer Temporary Bonder Production Value Estimates and Forecasts (2020-2031)

3.6.3 Japan Wafer Temporary Bonder Production Value Estimates and Forecasts (2020-2031)

4 Wafer Temporary Bonder Consumption by Region

4.1 Global Wafer Temporary Bonder Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Wafer Temporary Bonder Consumption by Region (2020-2031)

4.2.1 Global Wafer Temporary Bonder Consumption by Region (2020-2025)

4.2.2 Global Wafer Temporary Bonder Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Wafer Temporary Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Wafer Temporary Bonder Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Wafer Temporary Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Wafer Temporary Bonder Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Wafer Temporary Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Wafer Temporary Bonder Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Wafer Temporary Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Wafer Temporary Bonder Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global Wafer Temporary Bonder Production by Type (2020-2031)

5.1.1 Global Wafer Temporary Bonder Production by Type (2020-2025)

5.1.2 Global Wafer Temporary Bonder Production by Type (2026-2031)

5.1.3 Global Wafer Temporary Bonder Production Market Share by Type (2020-2031)

5.2 Global Wafer Temporary Bonder Production Value by Type (2020-2031)

5.2.1 Global Wafer Temporary Bonder Production Value by Type (2020-2025)

5.2.2 Global Wafer Temporary Bonder Production Value by Type (2026-2031)

5.2.3 Global Wafer Temporary Bonder Production Value Market Share by Type (2020-2031)

5.3 Global Wafer Temporary Bonder Price by Type (2020-2031)

6 Segment by Application

6.1 Global Wafer Temporary Bonder Production by Application (2020-2031)

6.1.1 Global Wafer Temporary Bonder Production by Application (2020-2025)

6.1.2 Global Wafer Temporary Bonder Production by Application (2026-2031)

6.1.3 Global Wafer Temporary Bonder Production Market Share by Application (2020-2031)

6.2 Global Wafer Temporary Bonder Production Value by Application (2020-2031)

6.2.1 Global Wafer Temporary Bonder Production Value by Application (2020-2025)

6.2.2 Global Wafer Temporary Bonder Production Value by Application (2026-2031)

6.2.3 Global Wafer Temporary Bonder Production Value Market Share by Application (2020-2031)

6.3 Global Wafer Temporary Bonder Price by Application (2020-2031)

7 Key Companies Profiled

7.1 EV Group

7.1.1 EV Group Wafer Temporary Bonder Company Information

7.1.2 EV Group Wafer Temporary Bonder Product Portfolio

7.1.3 EV Group Wafer Temporary Bonder Production, Value, Price and Gross Margin (2020-2025)

7.1.4 EV Group Main Business and Markets Served

7.1.5 EV Group Recent Developments/Updates

7.2 SUSS MicroTec

7.2.1 SUSS MicroTec Wafer Temporary Bonder Company Information

7.2.2 SUSS MicroTec Wafer Temporary Bonder Product Portfolio

7.2.3 SUSS MicroTec Wafer Temporary Bonder Production, Value, Price and Gross Margin (2020-2025)

7.2.4 SUSS MicroTec Main Business and Markets Served

7.2.5 SUSS MicroTec Recent Developments/Updates

7.3 Tokyo Electron

7.3.1 Tokyo Electron Wafer Temporary Bonder Company Information

7.3.2 Tokyo Electron Wafer Temporary Bonder Product Portfolio

7.3.3 Tokyo Electron Wafer Temporary Bonder Production, Value, Price and Gross Margin (2020-2025)

7.3.4 Tokyo Electron Main Business and Markets Served

7.3.5 Tokyo Electron Recent Developments/Updates

7.4 Applied Microengineering

7.4.1 Applied Microengineering Wafer Temporary Bonder Company Information

7.4.2 Applied Microengineering Wafer Temporary Bonder Product Portfolio

7.4.3 Applied Microengineering Wafer Temporary Bonder Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Applied Microengineering Main Business and Markets Served

7.4.5 Applied Microengineering Recent Developments/Updates

7.5 Nidec Machine Tool

7.5.1 Nidec Machine Tool Wafer Temporary Bonder Company Information

7.5.2 Nidec Machine Tool Wafer Temporary Bonder Product Portfolio

7.5.3 Nidec Machine Tool Wafer Temporary Bonder Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Nidec Machine Tool Main Business and Markets Served

7.5.5 Nidec Machine Tool Recent Developments/Updates

7.6 Ayumi Industry

7.6.1 Ayumi Industry Wafer Temporary Bonder Company Information

7.6.2 Ayumi Industry Wafer Temporary Bonder Product Portfolio

7.6.3 Ayumi Industry Wafer Temporary Bonder Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Ayumi Industry Main Business and Markets Served

7.6.5 Ayumi Industry Recent Developments/Updates

7.7 SMEE

7.7.1 SMEE Wafer Temporary Bonder Company Information

7.7.2 SMEE Wafer Temporary Bonder Product Portfolio

7.7.3 SMEE Wafer Temporary Bonder Production, Value, Price and Gross Margin (2020-2025)

7.7.4 SMEE Main Business and Markets Served

7.7.5 SMEE Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Wafer Temporary Bonder Industry Chain Analysis

8.2 Wafer Temporary Bonder Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Wafer Temporary Bonder Production Mode & Process Analysis

8.4 Wafer Temporary Bonder Sales and Marketing

8.4.1 Wafer Temporary Bonder Sales Channels

8.4.2 Wafer Temporary Bonder Distributors

8.5 Wafer Temporary Bonder Customer Analysis

9 Wafer Temporary Bonder Market Dynamics

9.1 Wafer Temporary Bonder Industry Trends

9.2 Wafer Temporary Bonder Market Drivers

9.3 Wafer Temporary Bonder Market Challenges

9.4 Wafer Temporary Bonder Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

EV Group

Suss Microtec

Tokyo Electron

Ayumi Industry

SMEE

Applied Microengineering

Nidec Machine Tool

List of Tables

Table 1. Global Wafer Temporary Bonder Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Wafer Temporary Bonder Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Wafer Temporary Bonder Production Capacity (Units) by Manufacturers in 2024

Table 4. Global Wafer Temporary Bonder Production by Manufacturers (2020-2025) & (Units)

Table 5. Global Wafer Temporary Bonder Production Market Share by Manufacturers (2020-2025)

Table 6. Global Wafer Temporary Bonder Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Wafer Temporary Bonder Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Wafer Temporary Bonder, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Wafer Temporary Bonder as of 2024)

Table 10. Global Market Wafer Temporary Bonder Average Price by Manufacturers (K US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Wafer Temporary Bonder, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Wafer Temporary Bonder, Product Offered and Application

Table 13. Global Key Manufacturers of Wafer Temporary Bonder, Date of Enter into This Industry

Table 14. Global Wafer Temporary Bonder Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Wafer Temporary Bonder Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Wafer Temporary Bonder Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Wafer Temporary Bonder Production Value Market Share by Region (2020-2025)

Table 19. Global Wafer Temporary Bonder Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Wafer Temporary Bonder Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Wafer Temporary Bonder Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global Wafer Temporary Bonder Production (Units) by Region (2020-2025)

Table 23. Global Wafer Temporary Bonder Production Market Share by Region (2020-2025)

Table 24. Global Wafer Temporary Bonder Production (Units) Forecast by Region (2026-2031)

Table 25. Global Wafer Temporary Bonder Production Market Share Forecast by Region (2026-2031)

Table 26. Global Wafer Temporary Bonder Market Average Price (K US$/Unit) by Region (2020-2025)

Table 27. Global Wafer Temporary Bonder Market Average Price (K US$/Unit) by Region (2026-2031)

Table 28. Global Wafer Temporary Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global Wafer Temporary Bonder Consumption by Region (2020-2025) & (Units)

Table 30. Global Wafer Temporary Bonder Consumption Market Share by Region (2020-2025)

Table 31. Global Wafer Temporary Bonder Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global Wafer Temporary Bonder Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Wafer Temporary Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America Wafer Temporary Bonder Consumption by Country (2020-2025) & (Units)

Table 35. North America Wafer Temporary Bonder Consumption by Country (2026-2031) & (Units)

Table 36. Europe Wafer Temporary Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe Wafer Temporary Bonder Consumption by Country (2020-2025) & (Units)

Table 38. Europe Wafer Temporary Bonder Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific Wafer Temporary Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific Wafer Temporary Bonder Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific Wafer Temporary Bonder Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa Wafer Temporary Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa Wafer Temporary Bonder Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa Wafer Temporary Bonder Consumption by Country (2026-2031) & (Units)

Table 45. Global Wafer Temporary Bonder Production (Units) by Type (2020-2025)

Table 46. Global Wafer Temporary Bonder Production (Units) by Type (2026-2031)

Table 47. Global Wafer Temporary Bonder Production Market Share by Type (2020-2025)

Table 48. Global Wafer Temporary Bonder Production Market Share by Type (2026-2031)

Table 49. Global Wafer Temporary Bonder Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Wafer Temporary Bonder Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Wafer Temporary Bonder Production Value Market Share by Type (2020-2025)

Table 52. Global Wafer Temporary Bonder Production Value Market Share by Type (2026-2031)

Table 53. Global Wafer Temporary Bonder Price (K US$/Unit) by Type (2020-2025)

Table 54. Global Wafer Temporary Bonder Price (K US$/Unit) by Type (2026-2031)

Table 55. Global Wafer Temporary Bonder Production (Units) by Application (2020-2025)

Table 56. Global Wafer Temporary Bonder Production (Units) by Application (2026-2031)

Table 57. Global Wafer Temporary Bonder Production Market Share by Application (2020-2025)

Table 58. Global Wafer Temporary Bonder Production Market Share by Application (2026-2031)

Table 59. Global Wafer Temporary Bonder Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Wafer Temporary Bonder Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Wafer Temporary Bonder Production Value Market Share by Application (2020-2025)

Table 62. Global Wafer Temporary Bonder Production Value Market Share by Application (2026-2031)

Table 63. Global Wafer Temporary Bonder Price (K US$/Unit) by Application (2020-2025)

Table 64. Global Wafer Temporary Bonder Price (K US$/Unit) by Application (2026-2031)

Table 65. EV Group Wafer Temporary Bonder Company Information

Table 66. EV Group Wafer Temporary Bonder Specification and Application

Table 67. EV Group Wafer Temporary Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 68. EV Group Main Business and Markets Served

Table 69. EV Group Recent Developments/Updates

Table 70. SUSS MicroTec Wafer Temporary Bonder Company Information

Table 71. SUSS MicroTec Wafer Temporary Bonder Specification and Application

Table 72. SUSS MicroTec Wafer Temporary Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 73. SUSS MicroTec Main Business and Markets Served

Table 74. SUSS MicroTec Recent Developments/Updates

Table 75. Tokyo Electron Wafer Temporary Bonder Company Information

Table 76. Tokyo Electron Wafer Temporary Bonder Specification and Application

Table 77. Tokyo Electron Wafer Temporary Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 78. Tokyo Electron Main Business and Markets Served

Table 79. Tokyo Electron Recent Developments/Updates

Table 80. Applied Microengineering Wafer Temporary Bonder Company Information

Table 81. Applied Microengineering Wafer Temporary Bonder Specification and Application

Table 82. Applied Microengineering Wafer Temporary Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 83. Applied Microengineering Main Business and Markets Served

Table 84. Applied Microengineering Recent Developments/Updates

Table 85. Nidec Machine Tool Wafer Temporary Bonder Company Information

Table 86. Nidec Machine Tool Wafer Temporary Bonder Specification and Application

Table 87. Nidec Machine Tool Wafer Temporary Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 88. Nidec Machine Tool Main Business and Markets Served

Table 89. Nidec Machine Tool Recent Developments/Updates

Table 90. Ayumi Industry Wafer Temporary Bonder Company Information

Table 91. Ayumi Industry Wafer Temporary Bonder Specification and Application

Table 92. Ayumi Industry Wafer Temporary Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 93. Ayumi Industry Main Business and Markets Served

Table 94. Ayumi Industry Recent Developments/Updates

Table 95. SMEE Wafer Temporary Bonder Company Information

Table 96. SMEE Wafer Temporary Bonder Specification and Application

Table 97. SMEE Wafer Temporary Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 98. SMEE Main Business and Markets Served

Table 99. SMEE Recent Developments/Updates

Table 100. Key Raw Materials Lists

Table 101. Raw Materials Key Suppliers Lists

Table 102. Wafer Temporary Bonder Distributors List

Table 103. Wafer Temporary Bonder Customers List

Table 104. Wafer Temporary Bonder Market Trends

Table 105. Wafer Temporary Bonder Market Drivers

Table 106. Wafer Temporary Bonder Market Challenges

Table 107. Wafer Temporary Bonder Market Restraints

Table 108. Research Programs/Design for This Report

Table 109. Key Data Information from Secondary Sources

Table 110. Key Data Information from Primary Sources

Table 111. Authors List of This Report

List of Figures

Figure 1. Product Picture of Wafer Temporary Bonder

Figure 2. Global Wafer Temporary Bonder Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Wafer Temporary Bonder Market Share by Type: 2024 VS 2031

Figure 4. Semi-Automated Wafer Bonder Product Picture

Figure 5. Fully-Automated Wafer Bonder Product Picture

Figure 6. Global Wafer Temporary Bonder Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global Wafer Temporary Bonder Market Share by Application: 2024 VS 2031

Figure 8. MEMS

Figure 9. Advanced Packaging

Figure 10. CIS

Figure 11. Others

Figure 12. Global Wafer Temporary Bonder Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 13. Global Wafer Temporary Bonder Production Value (US$ Million) & (2020-2031)

Figure 14. Global Wafer Temporary Bonder Production Capacity (Units) & (2020-2031)

Figure 15. Global Wafer Temporary Bonder Production (Units) & (2020-2031)

Figure 16. Global Wafer Temporary Bonder Average Price (K US$/Unit) & (2020-2031)

Figure 17. Wafer Temporary Bonder Report Years Considered

Figure 18. Wafer Temporary Bonder Production Share by Manufacturers in 2024

Figure 19. Global Wafer Temporary Bonder Production Value Share by Manufacturers (2024)

Figure 20. Wafer Temporary Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 21. The Global 5 and 10 Largest Players: Market Share by Wafer Temporary Bonder Revenue in 2024

Figure 22. Global Wafer Temporary Bonder Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 23. Global Wafer Temporary Bonder Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 24. Global Wafer Temporary Bonder Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 25. Global Wafer Temporary Bonder Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 26. Europe Wafer Temporary Bonder Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. China Wafer Temporary Bonder Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Japan Wafer Temporary Bonder Production Value (US$ Million) Growth Rate (2020-2031)

Figure 29. Global Wafer Temporary Bonder Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 30. Global Wafer Temporary Bonder Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 31. North America Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 32. North America Wafer Temporary Bonder Consumption Market Share by Country (2020-2031)

Figure 33. U.S. Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 34. Canada Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 35. Europe Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 36. Europe Wafer Temporary Bonder Consumption Market Share by Country (2020-2031)

Figure 37. Germany Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 38. France Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 39. U.K. Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. Italy Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. Netherlands Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 42. Asia Pacific Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 43. Asia Pacific Wafer Temporary Bonder Consumption Market Share by Region (2020-2031)

Figure 44. China Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 45. Japan Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 46. South Korea Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. China Taiwan Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. Southeast Asia Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. India Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 50. Latin America, Middle East & Africa Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 51. Latin America, Middle East & Africa Wafer Temporary Bonder Consumption Market Share by Country (2020-2031)

Figure 52. Mexico Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 53. Brazil Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 54. Turkey Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 55. GCC Countries Wafer Temporary Bonder Consumption and Growth Rate (2020-2031) & (Units)

Figure 56. Global Production Market Share of Wafer Temporary Bonder by Type (2020-2031)

Figure 57. Global Production Value Market Share of Wafer Temporary Bonder by Type (2020-2031)

Figure 58. Global Wafer Temporary Bonder Price (K US$/Unit) by Type (2020-2031)

Figure 59. Global Production Market Share of Wafer Temporary Bonder by Application (2020-2031)

Figure 60. Global Production Value Market Share of Wafer Temporary Bonder by Application (2020-2031)

Figure 61. Global Wafer Temporary Bonder Price (K US$/Unit) by Application (2020-2031)

Figure 62. Wafer Temporary Bonder Value Chain

Figure 63. Channels of Distribution (Direct Vs Distribution)

Figure 64. Bottom-up and Top-down Approaches for This Report

Figure 65. Data Triangulation

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