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Global Automatic Wafer Bonder Market Research Report 2025
Published Date: February 2025
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Report Code: QYRE-Auto-19I11646
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Global Automatic Wafer Bonder Market Research Report 2022
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Global Automatic Wafer Bonder Market Research Report 2025

Code: QYRE-Auto-19I11646
Report
February 2025
Pages:105
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Automatic Wafer Bonder Market Size

The global market for Automatic Wafer Bonder was valued at US$ 321 million in the year 2024 and is projected to reach a revised size of US$ 449 million by 2031, growing at a CAGR of 5.0% during the forecast period.

Automatic Wafer Bonder Market

Automatic Wafer Bonder Market

Automatic Wafer Bonder is a type of semiconductor bonding equipment that automates the process of bonding two or more semiconductor wafers together. These machines are designed to handle the precise alignment, bonding, and sometimes, debonding of wafers, offering higher throughput, repeatability, and accuracy.
The Automatic Wafer Bonder market is a key segment within the semiconductor manufacturing industry, driven by advancements in wafer-level packaging, 3D integrated circuits (3D ICs), micro-electromechanical systems (MEMS), optoelectronics, and other high-precision semiconductor applications. As the demand for smaller, more powerful, and more efficient electronic devices increases, automatic wafer bonding technology is playing an increasingly important role in meeting the growing complexity of semiconductor packaging.
Key Market Trends & Drivers
Growth of Advanced Semiconductor Packaging: 3D ICs and system-in-package (SiP) technologies require advanced bonding techniques to stack wafers or integrate heterogeneous materials. Automatic wafer bonders are essential for performing precise bonding processes like direct bonding, adhesive bonding, and fusion bonding at high throughput, which is key to the success of advanced packaging solutions. Miniaturization of Electronics: Consumer electronics such as smartphones, wearable devices, and IoT products are driving the demand for more compact, multi-functional devices. Automatic wafer bonding machines are essential for packaging miniaturized components, such as MEMS sensors and high-performance processors, in a space-efficient manner. Advances in 5G, Photonics, and Quantum Technologies: 5G infrastructure and photonics devices (e.g., Photonic Integrated Circuits (PICs)) are driving the need for wafer bonding solutions that can handle diverse materials, such as silicon, gallium arsenide (GaAs), indium phosphide (InP), and silicon photonics. The growing focus on quantum computing also necessitates advanced wafer bonding techniques to integrate quantum devices with traditional electronics. These applications require high-precision alignment and bonding under specific conditions, which automatic wafer bonders can provide.
Market Challenges
High Initial Investment: While automatic wafer bonders offer long-term operational benefits, the high capital cost for acquiring and maintaining these systems can be a barrier for smaller manufacturers or those with lower production volumes. As a result, smaller-scale production lines may rely on semi-automated or manual bonding solutions. Process Complexity: Automatic wafer bonding systems can be complex, requiring careful setup, calibration, and maintenance to ensure optimal bonding performance. In some cases, the bonding process requires specialized knowledge to handle the specific bonding method (e.g., adhesive, direct, or fusion bonding), and improper setup can lead to production inefficiencies or bonding failures.
Market Opportunities
Expansion of 5G Infrastructure: The expansion of 5G networks is a major growth area for the semiconductor industry, driving demand for advanced packaging solutions. Automatic wafer bonders are integral to the production of components such as power amplifiers, radio frequency (RF) components, and MEMS sensors used in 5G infrastructure. Healthcare and Medical Device Market: The demand for medical devices, such as bioMEMS and lab-on-a-chip technologies, is expected to rise. Automatic wafer bonders will play an important role in manufacturing miniaturized medical devices for diagnostics, monitoring, and treatment. The ability to bond materials such as polymers, glass, and silicon at high precision without damaging sensitive biomedical components makes automatic wafer bonders an ideal solution.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Automatic Wafer Bonder, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Automatic Wafer Bonder.
The Automatic Wafer Bonder market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Automatic Wafer Bonder market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Automatic Wafer Bonder manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Automatic Wafer Bonder Market Report

Report Metric Details
Report Name Automatic Wafer Bonder Market
Accounted market size in year US$ 321 million
Forecasted market size in 2031 US$ 449 million
CAGR 5.0%
Base Year year
Forecasted years 2025 - 2031
by Type
  • Semi-Automated Wafer Bonder
  • Fully-Automated Wafer Bonder
by Application
  • MEMS
  • Advanced Packaging
  • CIS
  • Others
Production by Region
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, Hutem, Shanghai Micro Electronics, Canon
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Automatic Wafer Bonder manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Automatic Wafer Bonder by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Automatic Wafer Bonder in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Automatic Wafer Bonder Market growing?

Ans: The Automatic Wafer Bonder Market witnessing a CAGR of 5.0% during the forecast period 2025-2031.

What is the Automatic Wafer Bonder Market size in 2031?

Ans: The Automatic Wafer Bonder Market size in 2031 will be US$ 449 million.

Who are the main players in the Automatic Wafer Bonder Market report?

Ans: The main players in the Automatic Wafer Bonder Market are EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, U-Precision Tech, TAZMO, Hutem, Shanghai Micro Electronics, Canon

What are the Application segmentation covered in the Automatic Wafer Bonder Market report?

Ans: The Applications covered in the Automatic Wafer Bonder Market report are MEMS, Advanced Packaging, CIS, Others

What are the Type segmentation covered in the Automatic Wafer Bonder Market report?

Ans: The Types covered in the Automatic Wafer Bonder Market report are Semi-Automated Wafer Bonder, Fully-Automated Wafer Bonder

1 Automatic Wafer Bonder Market Overview
1.1 Product Definition
1.2 Automatic Wafer Bonder by Type
1.2.1 Global Automatic Wafer Bonder Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Semi-Automated Wafer Bonder
1.2.3 Fully-Automated Wafer Bonder
1.3 Automatic Wafer Bonder by Application
1.3.1 Global Automatic Wafer Bonder Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 MEMS
1.3.3 Advanced Packaging
1.3.4 CIS
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Automatic Wafer Bonder Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Automatic Wafer Bonder Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Automatic Wafer Bonder Production Estimates and Forecasts (2020-2031)
1.4.4 Global Automatic Wafer Bonder Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Automatic Wafer Bonder Production Market Share by Manufacturers (2020-2025)
2.2 Global Automatic Wafer Bonder Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Automatic Wafer Bonder, Industry Ranking, 2023 VS 2024
2.4 Global Automatic Wafer Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Automatic Wafer Bonder Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Automatic Wafer Bonder, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Automatic Wafer Bonder, Product Offered and Application
2.8 Global Key Manufacturers of Automatic Wafer Bonder, Date of Enter into This Industry
2.9 Automatic Wafer Bonder Market Competitive Situation and Trends
2.9.1 Automatic Wafer Bonder Market Concentration Rate
2.9.2 Global 5 and 10 Largest Automatic Wafer Bonder Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Automatic Wafer Bonder Production by Region
3.1 Global Automatic Wafer Bonder Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Automatic Wafer Bonder Production Value by Region (2020-2031)
3.2.1 Global Automatic Wafer Bonder Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Automatic Wafer Bonder by Region (2026-2031)
3.3 Global Automatic Wafer Bonder Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Automatic Wafer Bonder Production Volume by Region (2020-2031)
3.4.1 Global Automatic Wafer Bonder Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Automatic Wafer Bonder by Region (2026-2031)
3.5 Global Automatic Wafer Bonder Market Price Analysis by Region (2020-2025)
3.6 Global Automatic Wafer Bonder Production and Value, Year-over-Year Growth
3.6.1 Europe Automatic Wafer Bonder Production Value Estimates and Forecasts (2020-2031)
3.6.2 China Automatic Wafer Bonder Production Value Estimates and Forecasts (2020-2031)
3.6.3 Japan Automatic Wafer Bonder Production Value Estimates and Forecasts (2020-2031)
4 Automatic Wafer Bonder Consumption by Region
4.1 Global Automatic Wafer Bonder Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Automatic Wafer Bonder Consumption by Region (2020-2031)
4.2.1 Global Automatic Wafer Bonder Consumption by Region (2020-2025)
4.2.2 Global Automatic Wafer Bonder Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Automatic Wafer Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Automatic Wafer Bonder Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Automatic Wafer Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Automatic Wafer Bonder Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Automatic Wafer Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Automatic Wafer Bonder Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Automatic Wafer Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Automatic Wafer Bonder Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Automatic Wafer Bonder Production by Type (2020-2031)
5.1.1 Global Automatic Wafer Bonder Production by Type (2020-2025)
5.1.2 Global Automatic Wafer Bonder Production by Type (2026-2031)
5.1.3 Global Automatic Wafer Bonder Production Market Share by Type (2020-2031)
5.2 Global Automatic Wafer Bonder Production Value by Type (2020-2031)
5.2.1 Global Automatic Wafer Bonder Production Value by Type (2020-2025)
5.2.2 Global Automatic Wafer Bonder Production Value by Type (2026-2031)
5.2.3 Global Automatic Wafer Bonder Production Value Market Share by Type (2020-2031)
5.3 Global Automatic Wafer Bonder Price by Type (2020-2031)
6 Segment by Application
6.1 Global Automatic Wafer Bonder Production by Application (2020-2031)
6.1.1 Global Automatic Wafer Bonder Production by Application (2020-2025)
6.1.2 Global Automatic Wafer Bonder Production by Application (2026-2031)
6.1.3 Global Automatic Wafer Bonder Production Market Share by Application (2020-2031)
6.2 Global Automatic Wafer Bonder Production Value by Application (2020-2031)
6.2.1 Global Automatic Wafer Bonder Production Value by Application (2020-2025)
6.2.2 Global Automatic Wafer Bonder Production Value by Application (2026-2031)
6.2.3 Global Automatic Wafer Bonder Production Value Market Share by Application (2020-2031)
6.3 Global Automatic Wafer Bonder Price by Application (2020-2031)
7 Key Companies Profiled
7.1 EV Group
7.1.1 EV Group Automatic Wafer Bonder Company Information
7.1.2 EV Group Automatic Wafer Bonder Product Portfolio
7.1.3 EV Group Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.1.4 EV Group Main Business and Markets Served
7.1.5 EV Group Recent Developments/Updates
7.2 SUSS MicroTec
7.2.1 SUSS MicroTec Automatic Wafer Bonder Company Information
7.2.2 SUSS MicroTec Automatic Wafer Bonder Product Portfolio
7.2.3 SUSS MicroTec Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.2.4 SUSS MicroTec Main Business and Markets Served
7.2.5 SUSS MicroTec Recent Developments/Updates
7.3 Tokyo Electron
7.3.1 Tokyo Electron Automatic Wafer Bonder Company Information
7.3.2 Tokyo Electron Automatic Wafer Bonder Product Portfolio
7.3.3 Tokyo Electron Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Tokyo Electron Main Business and Markets Served
7.3.5 Tokyo Electron Recent Developments/Updates
7.4 Applied Microengineering
7.4.1 Applied Microengineering Automatic Wafer Bonder Company Information
7.4.2 Applied Microengineering Automatic Wafer Bonder Product Portfolio
7.4.3 Applied Microengineering Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Applied Microengineering Main Business and Markets Served
7.4.5 Applied Microengineering Recent Developments/Updates
7.5 Nidec Machine Tool
7.5.1 Nidec Machine Tool Automatic Wafer Bonder Company Information
7.5.2 Nidec Machine Tool Automatic Wafer Bonder Product Portfolio
7.5.3 Nidec Machine Tool Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Nidec Machine Tool Main Business and Markets Served
7.5.5 Nidec Machine Tool Recent Developments/Updates
7.6 Ayumi Industry
7.6.1 Ayumi Industry Automatic Wafer Bonder Company Information
7.6.2 Ayumi Industry Automatic Wafer Bonder Product Portfolio
7.6.3 Ayumi Industry Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Ayumi Industry Main Business and Markets Served
7.6.5 Ayumi Industry Recent Developments/Updates
7.7 Bondtech
7.7.1 Bondtech Automatic Wafer Bonder Company Information
7.7.2 Bondtech Automatic Wafer Bonder Product Portfolio
7.7.3 Bondtech Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Bondtech Main Business and Markets Served
7.7.5 Bondtech Recent Developments/Updates
7.8 Aimechatec
7.8.1 Aimechatec Automatic Wafer Bonder Company Information
7.8.2 Aimechatec Automatic Wafer Bonder Product Portfolio
7.8.3 Aimechatec Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Aimechatec Main Business and Markets Served
7.8.5 Aimechatec Recent Developments/Updates
7.9 U-Precision Tech
7.9.1 U-Precision Tech Automatic Wafer Bonder Company Information
7.9.2 U-Precision Tech Automatic Wafer Bonder Product Portfolio
7.9.3 U-Precision Tech Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.9.4 U-Precision Tech Main Business and Markets Served
7.9.5 U-Precision Tech Recent Developments/Updates
7.10 TAZMO
7.10.1 TAZMO Automatic Wafer Bonder Company Information
7.10.2 TAZMO Automatic Wafer Bonder Product Portfolio
7.10.3 TAZMO Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.10.4 TAZMO Main Business and Markets Served
7.10.5 TAZMO Recent Developments/Updates
7.11 Hutem
7.11.1 Hutem Automatic Wafer Bonder Company Information
7.11.2 Hutem Automatic Wafer Bonder Product Portfolio
7.11.3 Hutem Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Hutem Main Business and Markets Served
7.11.5 Hutem Recent Developments/Updates
7.12 Shanghai Micro Electronics
7.12.1 Shanghai Micro Electronics Automatic Wafer Bonder Company Information
7.12.2 Shanghai Micro Electronics Automatic Wafer Bonder Product Portfolio
7.12.3 Shanghai Micro Electronics Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Shanghai Micro Electronics Main Business and Markets Served
7.12.5 Shanghai Micro Electronics Recent Developments/Updates
7.13 Canon
7.13.1 Canon Automatic Wafer Bonder Company Information
7.13.2 Canon Automatic Wafer Bonder Product Portfolio
7.13.3 Canon Automatic Wafer Bonder Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Canon Main Business and Markets Served
7.13.5 Canon Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Automatic Wafer Bonder Industry Chain Analysis
8.2 Automatic Wafer Bonder Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Automatic Wafer Bonder Production Mode & Process Analysis
8.4 Automatic Wafer Bonder Sales and Marketing
8.4.1 Automatic Wafer Bonder Sales Channels
8.4.2 Automatic Wafer Bonder Distributors
8.5 Automatic Wafer Bonder Customer Analysis
9 Automatic Wafer Bonder Market Dynamics
9.1 Automatic Wafer Bonder Industry Trends
9.2 Automatic Wafer Bonder Market Drivers
9.3 Automatic Wafer Bonder Market Challenges
9.4 Automatic Wafer Bonder Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Automatic Wafer Bonder Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Automatic Wafer Bonder Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Automatic Wafer Bonder Production Capacity (Units) by Manufacturers in 2024
 Table 4. Global Automatic Wafer Bonder Production by Manufacturers (2020-2025) & (Units)
 Table 5. Global Automatic Wafer Bonder Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Automatic Wafer Bonder Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Automatic Wafer Bonder Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Automatic Wafer Bonder, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Automatic Wafer Bonder as of 2024)
 Table 10. Global Market Automatic Wafer Bonder Average Price by Manufacturers (K US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Automatic Wafer Bonder, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Automatic Wafer Bonder, Product Offered and Application
 Table 13. Global Key Manufacturers of Automatic Wafer Bonder, Date of Enter into This Industry
 Table 14. Global Automatic Wafer Bonder Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Automatic Wafer Bonder Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Automatic Wafer Bonder Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Automatic Wafer Bonder Production Value Market Share by Region (2020-2025)
 Table 19. Global Automatic Wafer Bonder Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Automatic Wafer Bonder Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Automatic Wafer Bonder Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)
 Table 22. Global Automatic Wafer Bonder Production (Units) by Region (2020-2025)
 Table 23. Global Automatic Wafer Bonder Production Market Share by Region (2020-2025)
 Table 24. Global Automatic Wafer Bonder Production (Units) Forecast by Region (2026-2031)
 Table 25. Global Automatic Wafer Bonder Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Automatic Wafer Bonder Market Average Price (K US$/Unit) by Region (2020-2025)
 Table 27. Global Automatic Wafer Bonder Market Average Price (K US$/Unit) by Region (2026-2031)
 Table 28. Global Automatic Wafer Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)
 Table 29. Global Automatic Wafer Bonder Consumption by Region (2020-2025) & (Units)
 Table 30. Global Automatic Wafer Bonder Consumption Market Share by Region (2020-2025)
 Table 31. Global Automatic Wafer Bonder Forecasted Consumption by Region (2026-2031) & (Units)
 Table 32. Global Automatic Wafer Bonder Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Automatic Wafer Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 34. North America Automatic Wafer Bonder Consumption by Country (2020-2025) & (Units)
 Table 35. North America Automatic Wafer Bonder Consumption by Country (2026-2031) & (Units)
 Table 36. Europe Automatic Wafer Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 37. Europe Automatic Wafer Bonder Consumption by Country (2020-2025) & (Units)
 Table 38. Europe Automatic Wafer Bonder Consumption by Country (2026-2031) & (Units)
 Table 39. Asia Pacific Automatic Wafer Bonder Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)
 Table 40. Asia Pacific Automatic Wafer Bonder Consumption by Region (2020-2025) & (Units)
 Table 41. Asia Pacific Automatic Wafer Bonder Consumption by Region (2026-2031) & (Units)
 Table 42. Latin America, Middle East & Africa Automatic Wafer Bonder Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 43. Latin America, Middle East & Africa Automatic Wafer Bonder Consumption by Country (2020-2025) & (Units)
 Table 44. Latin America, Middle East & Africa Automatic Wafer Bonder Consumption by Country (2026-2031) & (Units)
 Table 45. Global Automatic Wafer Bonder Production (Units) by Type (2020-2025)
 Table 46. Global Automatic Wafer Bonder Production (Units) by Type (2026-2031)
 Table 47. Global Automatic Wafer Bonder Production Market Share by Type (2020-2025)
 Table 48. Global Automatic Wafer Bonder Production Market Share by Type (2026-2031)
 Table 49. Global Automatic Wafer Bonder Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Automatic Wafer Bonder Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Automatic Wafer Bonder Production Value Market Share by Type (2020-2025)
 Table 52. Global Automatic Wafer Bonder Production Value Market Share by Type (2026-2031)
 Table 53. Global Automatic Wafer Bonder Price (K US$/Unit) by Type (2020-2025)
 Table 54. Global Automatic Wafer Bonder Price (K US$/Unit) by Type (2026-2031)
 Table 55. Global Automatic Wafer Bonder Production (Units) by Application (2020-2025)
 Table 56. Global Automatic Wafer Bonder Production (Units) by Application (2026-2031)
 Table 57. Global Automatic Wafer Bonder Production Market Share by Application (2020-2025)
 Table 58. Global Automatic Wafer Bonder Production Market Share by Application (2026-2031)
 Table 59. Global Automatic Wafer Bonder Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Automatic Wafer Bonder Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Automatic Wafer Bonder Production Value Market Share by Application (2020-2025)
 Table 62. Global Automatic Wafer Bonder Production Value Market Share by Application (2026-2031)
 Table 63. Global Automatic Wafer Bonder Price (K US$/Unit) by Application (2020-2025)
 Table 64. Global Automatic Wafer Bonder Price (K US$/Unit) by Application (2026-2031)
 Table 65. EV Group Automatic Wafer Bonder Company Information
 Table 66. EV Group Automatic Wafer Bonder Specification and Application
 Table 67. EV Group Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 68. EV Group Main Business and Markets Served
 Table 69. EV Group Recent Developments/Updates
 Table 70. SUSS MicroTec Automatic Wafer Bonder Company Information
 Table 71. SUSS MicroTec Automatic Wafer Bonder Specification and Application
 Table 72. SUSS MicroTec Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 73. SUSS MicroTec Main Business and Markets Served
 Table 74. SUSS MicroTec Recent Developments/Updates
 Table 75. Tokyo Electron Automatic Wafer Bonder Company Information
 Table 76. Tokyo Electron Automatic Wafer Bonder Specification and Application
 Table 77. Tokyo Electron Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 78. Tokyo Electron Main Business and Markets Served
 Table 79. Tokyo Electron Recent Developments/Updates
 Table 80. Applied Microengineering Automatic Wafer Bonder Company Information
 Table 81. Applied Microengineering Automatic Wafer Bonder Specification and Application
 Table 82. Applied Microengineering Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 83. Applied Microengineering Main Business and Markets Served
 Table 84. Applied Microengineering Recent Developments/Updates
 Table 85. Nidec Machine Tool Automatic Wafer Bonder Company Information
 Table 86. Nidec Machine Tool Automatic Wafer Bonder Specification and Application
 Table 87. Nidec Machine Tool Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 88. Nidec Machine Tool Main Business and Markets Served
 Table 89. Nidec Machine Tool Recent Developments/Updates
 Table 90. Ayumi Industry Automatic Wafer Bonder Company Information
 Table 91. Ayumi Industry Automatic Wafer Bonder Specification and Application
 Table 92. Ayumi Industry Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 93. Ayumi Industry Main Business and Markets Served
 Table 94. Ayumi Industry Recent Developments/Updates
 Table 95. Bondtech Automatic Wafer Bonder Company Information
 Table 96. Bondtech Automatic Wafer Bonder Specification and Application
 Table 97. Bondtech Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 98. Bondtech Main Business and Markets Served
 Table 99. Bondtech Recent Developments/Updates
 Table 100. Aimechatec Automatic Wafer Bonder Company Information
 Table 101. Aimechatec Automatic Wafer Bonder Specification and Application
 Table 102. Aimechatec Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 103. Aimechatec Main Business and Markets Served
 Table 104. Aimechatec Recent Developments/Updates
 Table 105. U-Precision Tech Automatic Wafer Bonder Company Information
 Table 106. U-Precision Tech Automatic Wafer Bonder Specification and Application
 Table 107. U-Precision Tech Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 108. U-Precision Tech Main Business and Markets Served
 Table 109. U-Precision Tech Recent Developments/Updates
 Table 110. TAZMO Automatic Wafer Bonder Company Information
 Table 111. TAZMO Automatic Wafer Bonder Specification and Application
 Table 112. TAZMO Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 113. TAZMO Main Business and Markets Served
 Table 114. TAZMO Recent Developments/Updates
 Table 115. Hutem Automatic Wafer Bonder Company Information
 Table 116. Hutem Automatic Wafer Bonder Specification and Application
 Table 117. Hutem Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 118. Hutem Main Business and Markets Served
 Table 119. Hutem Recent Developments/Updates
 Table 120. Shanghai Micro Electronics Automatic Wafer Bonder Company Information
 Table 121. Shanghai Micro Electronics Automatic Wafer Bonder Specification and Application
 Table 122. Shanghai Micro Electronics Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 123. Shanghai Micro Electronics Main Business and Markets Served
 Table 124. Shanghai Micro Electronics Recent Developments/Updates
 Table 125. Canon Automatic Wafer Bonder Company Information
 Table 126. Canon Automatic Wafer Bonder Specification and Application
 Table 127. Canon Automatic Wafer Bonder Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 128. Canon Main Business and Markets Served
 Table 129. Canon Recent Developments/Updates
 Table 130. Key Raw Materials Lists
 Table 131. Raw Materials Key Suppliers Lists
 Table 132. Automatic Wafer Bonder Distributors List
 Table 133. Automatic Wafer Bonder Customers List
 Table 134. Automatic Wafer Bonder Market Trends
 Table 135. Automatic Wafer Bonder Market Drivers
 Table 136. Automatic Wafer Bonder Market Challenges
 Table 137. Automatic Wafer Bonder Market Restraints
 Table 138. Research Programs/Design for This Report
 Table 139. Key Data Information from Secondary Sources
 Table 140. Key Data Information from Primary Sources
 Table 141. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Automatic Wafer Bonder
 Figure 2. Global Automatic Wafer Bonder Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Automatic Wafer Bonder Market Share by Type: 2024 VS 2031
 Figure 4. Semi-Automated Wafer Bonder Product Picture
 Figure 5. Fully-Automated Wafer Bonder Product Picture
 Figure 6. Global Automatic Wafer Bonder Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global Automatic Wafer Bonder Market Share by Application: 2024 VS 2031
 Figure 8. MEMS
 Figure 9. Advanced Packaging
 Figure 10. CIS
 Figure 11. Others
 Figure 12. Global Automatic Wafer Bonder Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 13. Global Automatic Wafer Bonder Production Value (US$ Million) & (2020-2031)
 Figure 14. Global Automatic Wafer Bonder Production Capacity (Units) & (2020-2031)
 Figure 15. Global Automatic Wafer Bonder Production (Units) & (2020-2031)
 Figure 16. Global Automatic Wafer Bonder Average Price (K US$/Unit) & (2020-2031)
 Figure 17. Automatic Wafer Bonder Report Years Considered
 Figure 18. Automatic Wafer Bonder Production Share by Manufacturers in 2024
 Figure 19. Global Automatic Wafer Bonder Production Value Share by Manufacturers (2024)
 Figure 20. Automatic Wafer Bonder Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 21. The Global 5 and 10 Largest Players: Market Share by Automatic Wafer Bonder Revenue in 2024
 Figure 22. Global Automatic Wafer Bonder Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 23. Global Automatic Wafer Bonder Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 24. Global Automatic Wafer Bonder Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)
 Figure 25. Global Automatic Wafer Bonder Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 26. Europe Automatic Wafer Bonder Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. China Automatic Wafer Bonder Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Japan Automatic Wafer Bonder Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Global Automatic Wafer Bonder Consumption by Region: 2020 VS 2024 VS 2031 (Units)
 Figure 30. Global Automatic Wafer Bonder Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 31. North America Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 32. North America Automatic Wafer Bonder Consumption Market Share by Country (2020-2031)
 Figure 33. U.S. Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 34. Canada Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 35. Europe Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 36. Europe Automatic Wafer Bonder Consumption Market Share by Country (2020-2031)
 Figure 37. Germany Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 38. France Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 39. U.K. Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 40. Italy Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 41. Netherlands Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 42. Asia Pacific Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 43. Asia Pacific Automatic Wafer Bonder Consumption Market Share by Region (2020-2031)
 Figure 44. China Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 45. Japan Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 46. South Korea Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 47. China Taiwan Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 48. Southeast Asia Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 49. India Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 50. Latin America, Middle East & Africa Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 51. Latin America, Middle East & Africa Automatic Wafer Bonder Consumption Market Share by Country (2020-2031)
 Figure 52. Mexico Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 53. Brazil Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 54. Turkey Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 55. GCC Countries Automatic Wafer Bonder Consumption and Growth Rate (2020-2031) & (Units)
 Figure 56. Global Production Market Share of Automatic Wafer Bonder by Type (2020-2031)
 Figure 57. Global Production Value Market Share of Automatic Wafer Bonder by Type (2020-2031)
 Figure 58. Global Automatic Wafer Bonder Price (K US$/Unit) by Type (2020-2031)
 Figure 59. Global Production Market Share of Automatic Wafer Bonder by Application (2020-2031)
 Figure 60. Global Production Value Market Share of Automatic Wafer Bonder by Application (2020-2031)
 Figure 61. Global Automatic Wafer Bonder Price (K US$/Unit) by Application (2020-2031)
 Figure 62. Automatic Wafer Bonder Value Chain
 Figure 63. Channels of Distribution (Direct Vs Distribution)
 Figure 64. Bottom-up and Top-down Approaches for This Report
 Figure 65. Data Triangulation
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