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Wafer Bumping Service - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030
Published Date: September 2024
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Report Code: QYRE-Auto-30T12709
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Global Wafer Bumping Service Market Research Report 2023
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Wafer Bumping Service - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Code: QYRE-Auto-30T12709
Report
September 2024
Pages:156
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Wafer Bumping Service - Market Size

The global market for Wafer Bumping Service was estimated to be worth US$ 362 million in 2023 and is forecast to a readjusted size of US$ 656 million by 2030 with a CAGR of 9.1% during the forecast period 2024-2030

Wafer Bumping Service - Market

Wafer Bumping Service - Market

Wafer ball placement service refers to a process that connects the chip and the packaging substrate through welding. Metal wires are used to connect the metal pins of the chip to the pins of the packaging substrate to achieve signal and power transmission between the chip and the packaging substrate. . Wafer ball placement services mainly include steps such as preparation, ball placement, welding and inspection.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer Bumping Service, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Wafer Bumping Service by region & country, by Type, and by Application.
The Wafer Bumping Service market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Bumping Service.
Market Segmentation

Scope of Wafer Bumping Service - Market Report

Report Metric Details
Report Name Wafer Bumping Service - Market
Forecasted market size in 2030 US$ 656 million
CAGR 9.1%
Forecasted years 2024 - 2030
Segment by Type:
  • Copper Pillar Bumping
  • Solder Bumping
  • Gold Bumping
Segment by Application
  • 4&6 Inch
  • 8&12 Inch
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company ASE Global, Fujitsu, Amkor Technology, MacDermid Alpha Electronics Solutions, Maxell, JCET Group, Unisem Group, Powertech Technology, SFA Semicon, Semi-Pac Inc, ChipMOS TECHNOLOGIES, NEPES, TI, International Micro Industries, Raytek Semiconductor, Jiangsu CAS Microelectronics Integration, Tianshui Huatian Technology, Chipbond, LB Semicon, KYEC, Union Semiconductor (Hefei)
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 2: Detailed analysis of Wafer Bumping Service manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 5: Revenue of Wafer Bumping Service in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
  • Chapter 6: Revenue of Wafer Bumping Service in country level. It provides sigmate data by Type, and by Application for each country/region.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Conclusion.

FAQ for this report

What is the Wafer Bumping Service - Market size in 2030?

Ans: The Wafer Bumping Service - Market size in 2030 will be US$ 656 million.

What is the Wafer Bumping Service - Market share by region?

Ans: Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year.

Who are the main players in the Wafer Bumping Service - Market report?

Ans: The main players in the Wafer Bumping Service - Market are ASE Global, Fujitsu, Amkor Technology, MacDermid Alpha Electronics Solutions, Maxell, JCET Group, Unisem Group, Powertech Technology, SFA Semicon, Semi-Pac Inc, ChipMOS TECHNOLOGIES, NEPES, TI, International Micro Industries, Raytek Semiconductor, Jiangsu CAS Microelectronics Integration, Tianshui Huatian Technology, Chipbond, LB Semicon, KYEC, Union Semiconductor (Hefei)

What are the Application segmentation covered in the Wafer Bumping Service - Market report?

Ans: The Applications covered in the Wafer Bumping Service - Market report are 4&6 Inch, 8&12 Inch

What are the Type segmentation covered in the Wafer Bumping Service - Market report?

Ans: The Types covered in the Wafer Bumping Service - Market report are Copper Pillar Bumping, Solder Bumping, Gold Bumping

1 Market Overview
1.1 Wafer Bumping Service Product Introduction
1.2 Global Wafer Bumping Service Market Size Forecast
1.3 Wafer Bumping Service Market Trends & Drivers
1.3.1 Wafer Bumping Service Industry Trends
1.3.2 Wafer Bumping Service Market Drivers & Opportunity
1.3.3 Wafer Bumping Service Market Challenges
1.3.4 Wafer Bumping Service Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Wafer Bumping Service Players Revenue Ranking (2023)
2.2 Global Wafer Bumping Service Revenue by Company (2019-2024)
2.3 Key Companies Wafer Bumping Service Manufacturing Base Distribution and Headquarters
2.4 Key Companies Wafer Bumping Service Product Offered
2.5 Key Companies Time to Begin Mass Production of Wafer Bumping Service
2.6 Wafer Bumping Service Market Competitive Analysis
2.6.1 Wafer Bumping Service Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Wafer Bumping Service Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping Service as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Copper Pillar Bumping
3.1.2 Solder Bumping
3.1.3 Gold Bumping
3.2 Global Wafer Bumping Service Sales Value by Type
3.2.1 Global Wafer Bumping Service Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Wafer Bumping Service Sales Value, by Type (2019-2030)
3.2.3 Global Wafer Bumping Service Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 4&6 Inch
4.1.2 8&12 Inch
4.2 Global Wafer Bumping Service Sales Value by Application
4.2.1 Global Wafer Bumping Service Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Wafer Bumping Service Sales Value, by Application (2019-2030)
4.2.3 Global Wafer Bumping Service Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Wafer Bumping Service Sales Value by Region
5.1.1 Global Wafer Bumping Service Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Wafer Bumping Service Sales Value by Region (2019-2024)
5.1.3 Global Wafer Bumping Service Sales Value by Region (2025-2030)
5.1.4 Global Wafer Bumping Service Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Wafer Bumping Service Sales Value, 2019-2030
5.2.2 North America Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Wafer Bumping Service Sales Value, 2019-2030
5.3.2 Europe Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Wafer Bumping Service Sales Value, 2019-2030
5.4.2 Asia Pacific Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Wafer Bumping Service Sales Value, 2019-2030
5.5.2 South America Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Wafer Bumping Service Sales Value, 2019-2030
5.6.2 Middle East & Africa Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Wafer Bumping Service Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Wafer Bumping Service Sales Value
6.3 United States
6.3.1 United States Wafer Bumping Service Sales Value, 2019-2030
6.3.2 United States Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Wafer Bumping Service Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Wafer Bumping Service Sales Value, 2019-2030
6.4.2 Europe Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Wafer Bumping Service Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Wafer Bumping Service Sales Value, 2019-2030
6.5.2 China Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
6.5.3 China Wafer Bumping Service Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Wafer Bumping Service Sales Value, 2019-2030
6.6.2 Japan Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Wafer Bumping Service Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Wafer Bumping Service Sales Value, 2019-2030
6.7.2 South Korea Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Wafer Bumping Service Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Wafer Bumping Service Sales Value, 2019-2030
6.8.2 Southeast Asia Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Wafer Bumping Service Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Wafer Bumping Service Sales Value, 2019-2030
6.9.2 India Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
6.9.3 India Wafer Bumping Service Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 ASE Global
7.1.1 ASE Global Profile
7.1.2 ASE Global Main Business
7.1.3 ASE Global Wafer Bumping Service Products, Services and Solutions
7.1.4 ASE Global Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.1.5 ASE Global Recent Developments
7.2 Fujitsu
7.2.1 Fujitsu Profile
7.2.2 Fujitsu Main Business
7.2.3 Fujitsu Wafer Bumping Service Products, Services and Solutions
7.2.4 Fujitsu Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.2.5 Fujitsu Recent Developments
7.3 Amkor Technology
7.3.1 Amkor Technology Profile
7.3.2 Amkor Technology Main Business
7.3.3 Amkor Technology Wafer Bumping Service Products, Services and Solutions
7.3.4 Amkor Technology Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.3.5 MacDermid Alpha Electronics Solutions Recent Developments
7.4 MacDermid Alpha Electronics Solutions
7.4.1 MacDermid Alpha Electronics Solutions Profile
7.4.2 MacDermid Alpha Electronics Solutions Main Business
7.4.3 MacDermid Alpha Electronics Solutions Wafer Bumping Service Products, Services and Solutions
7.4.4 MacDermid Alpha Electronics Solutions Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.4.5 MacDermid Alpha Electronics Solutions Recent Developments
7.5 Maxell
7.5.1 Maxell Profile
7.5.2 Maxell Main Business
7.5.3 Maxell Wafer Bumping Service Products, Services and Solutions
7.5.4 Maxell Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.5.5 Maxell Recent Developments
7.6 JCET Group
7.6.1 JCET Group Profile
7.6.2 JCET Group Main Business
7.6.3 JCET Group Wafer Bumping Service Products, Services and Solutions
7.6.4 JCET Group Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.6.5 JCET Group Recent Developments
7.7 Unisem Group
7.7.1 Unisem Group Profile
7.7.2 Unisem Group Main Business
7.7.3 Unisem Group Wafer Bumping Service Products, Services and Solutions
7.7.4 Unisem Group Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.7.5 Unisem Group Recent Developments
7.8 Powertech Technology
7.8.1 Powertech Technology Profile
7.8.2 Powertech Technology Main Business
7.8.3 Powertech Technology Wafer Bumping Service Products, Services and Solutions
7.8.4 Powertech Technology Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.8.5 Powertech Technology Recent Developments
7.9 SFA Semicon
7.9.1 SFA Semicon Profile
7.9.2 SFA Semicon Main Business
7.9.3 SFA Semicon Wafer Bumping Service Products, Services and Solutions
7.9.4 SFA Semicon Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.9.5 SFA Semicon Recent Developments
7.10 Semi-Pac Inc
7.10.1 Semi-Pac Inc Profile
7.10.2 Semi-Pac Inc Main Business
7.10.3 Semi-Pac Inc Wafer Bumping Service Products, Services and Solutions
7.10.4 Semi-Pac Inc Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.10.5 Semi-Pac Inc Recent Developments
7.11 ChipMOS TECHNOLOGIES
7.11.1 ChipMOS TECHNOLOGIES Profile
7.11.2 ChipMOS TECHNOLOGIES Main Business
7.11.3 ChipMOS TECHNOLOGIES Wafer Bumping Service Products, Services and Solutions
7.11.4 ChipMOS TECHNOLOGIES Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.11.5 ChipMOS TECHNOLOGIES Recent Developments
7.12 NEPES
7.12.1 NEPES Profile
7.12.2 NEPES Main Business
7.12.3 NEPES Wafer Bumping Service Products, Services and Solutions
7.12.4 NEPES Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.12.5 NEPES Recent Developments
7.13 TI
7.13.1 TI Profile
7.13.2 TI Main Business
7.13.3 TI Wafer Bumping Service Products, Services and Solutions
7.13.4 TI Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.13.5 TI Recent Developments
7.14 International Micro Industries
7.14.1 International Micro Industries Profile
7.14.2 International Micro Industries Main Business
7.14.3 International Micro Industries Wafer Bumping Service Products, Services and Solutions
7.14.4 International Micro Industries Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.14.5 International Micro Industries Recent Developments
7.15 Raytek Semiconductor
7.15.1 Raytek Semiconductor Profile
7.15.2 Raytek Semiconductor Main Business
7.15.3 Raytek Semiconductor Wafer Bumping Service Products, Services and Solutions
7.15.4 Raytek Semiconductor Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.15.5 Raytek Semiconductor Recent Developments
7.16 Jiangsu CAS Microelectronics Integration
7.16.1 Jiangsu CAS Microelectronics Integration Profile
7.16.2 Jiangsu CAS Microelectronics Integration Main Business
7.16.3 Jiangsu CAS Microelectronics Integration Wafer Bumping Service Products, Services and Solutions
7.16.4 Jiangsu CAS Microelectronics Integration Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.16.5 Jiangsu CAS Microelectronics Integration Recent Developments
7.17 Tianshui Huatian Technology
7.17.1 Tianshui Huatian Technology Profile
7.17.2 Tianshui Huatian Technology Main Business
7.17.3 Tianshui Huatian Technology Wafer Bumping Service Products, Services and Solutions
7.17.4 Tianshui Huatian Technology Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.17.5 Tianshui Huatian Technology Recent Developments
7.18 Chipbond
7.18.1 Chipbond Profile
7.18.2 Chipbond Main Business
7.18.3 Chipbond Wafer Bumping Service Products, Services and Solutions
7.18.4 Chipbond Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.18.5 Chipbond Recent Developments
7.19 LB Semicon
7.19.1 LB Semicon Profile
7.19.2 LB Semicon Main Business
7.19.3 LB Semicon Wafer Bumping Service Products, Services and Solutions
7.19.4 LB Semicon Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.19.5 LB Semicon Recent Developments
7.20 KYEC
7.20.1 KYEC Profile
7.20.2 KYEC Main Business
7.20.3 KYEC Wafer Bumping Service Products, Services and Solutions
7.20.4 KYEC Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.20.5 KYEC Recent Developments
7.21 Union Semiconductor (Hefei)
7.21.1 Union Semiconductor (Hefei) Profile
7.21.2 Union Semiconductor (Hefei) Main Business
7.21.3 Union Semiconductor (Hefei) Wafer Bumping Service Products, Services and Solutions
7.21.4 Union Semiconductor (Hefei) Wafer Bumping Service Revenue (US$ Million) & (2019-2024)
7.21.5 Union Semiconductor (Hefei) Recent Developments
8 Industry Chain Analysis
8.1 Wafer Bumping Service Industrial Chain
8.2 Wafer Bumping Service Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Wafer Bumping Service Sales Model
8.5.2 Sales Channel
8.5.3 Wafer Bumping Service Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
List of Tables
    Table 1. Wafer Bumping Service Market Trends
    Table 2. Wafer Bumping Service Market Drivers & Opportunity
    Table 3. Wafer Bumping Service Market Challenges
    Table 4. Wafer Bumping Service Market Restraints
    Table 5. Global Wafer Bumping Service Revenue by Company (2019-2024) & (US$ Million)
    Table 6. Global Wafer Bumping Service Revenue Market Share by Company (2019-2024)
    Table 7. Key Companies Wafer Bumping Service Manufacturing Base Distribution and Headquarters
    Table 8. Key Companies Wafer Bumping Service Product Type
    Table 9. Key Companies Time to Begin Mass Production of Wafer Bumping Service
    Table 10. Global Wafer Bumping Service Companies Market Concentration Ratio (CR5 and HHI)
    Table 11. Global Top Companies Market Share by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping Service as of 2023)
    Table 12. Mergers & Acquisitions, Expansion Plans
    Table 13. Global Wafer Bumping Service Sales Value by Type: 2019 VS 2023 VS 2030 (US$ Million)
    Table 14. Global Wafer Bumping Service Sales Value by Type (2019-2024) & (US$ Million)
    Table 15. Global Wafer Bumping Service Sales Value by Type (2025-2030) & (US$ Million)
    Table 16. Global Wafer Bumping Service Sales Market Share in Value by Type (2019-2024) & (%)
    Table 17. Global Wafer Bumping Service Sales Market Share in Value by Type (2025-2030) & (%)
    Table 18. Global Wafer Bumping Service Sales Value by Application: 2019 VS 2023 VS 2030 (US$ Million)
    Table 19. Global Wafer Bumping Service Sales Value by Application (2019-2024) & (US$ Million)
    Table 20. Global Wafer Bumping Service Sales Value by Application (2025-2030) & (US$ Million)
    Table 21. Global Wafer Bumping Service Sales Market Share in Value by Application (2019-2024) & (%)
    Table 22. Global Wafer Bumping Service Sales Market Share in Value by Application (2025-2030) & (%)
    Table 23. Global Wafer Bumping Service Sales Value by Region: 2019 VS 2023 VS 2030 (US$ Million)
    Table 24. Global Wafer Bumping Service Sales Value by Region (2019-2024) & (US$ Million)
    Table 25. Global Wafer Bumping Service Sales Value by Region (2025-2030) & (US$ Million)
    Table 26. Global Wafer Bumping Service Sales Value by Region (2019-2024) & (%)
    Table 27. Global Wafer Bumping Service Sales Value by Region (2025-2030) & (%)
    Table 28. Key Countries/Regions Wafer Bumping Service Sales Value Growth Trends, (US$ Million): 2019 VS 2023 VS 2030
    Table 29. Key Countries/Regions Wafer Bumping Service Sales Value, (2019-2024) & (US$ Million)
    Table 30. Key Countries/Regions Wafer Bumping Service Sales Value, (2025-2030) & (US$ Million)
    Table 31. ASE Global Basic Information List
    Table 32. ASE Global Description and Business Overview
    Table 33. ASE Global Wafer Bumping Service Products, Services and Solutions
    Table 34. Revenue (US$ Million) in Wafer Bumping Service Business of ASE Global (2019-2024)
    Table 35. ASE Global Recent Developments
    Table 36. Fujitsu Basic Information List
    Table 37. Fujitsu Description and Business Overview
    Table 38. Fujitsu Wafer Bumping Service Products, Services and Solutions
    Table 39. Revenue (US$ Million) in Wafer Bumping Service Business of Fujitsu (2019-2024)
    Table 40. Fujitsu Recent Developments
    Table 41. Amkor Technology Basic Information List
    Table 42. Amkor Technology Description and Business Overview
    Table 43. Amkor Technology Wafer Bumping Service Products, Services and Solutions
    Table 44. Revenue (US$ Million) in Wafer Bumping Service Business of Amkor Technology (2019-2024)
    Table 45. Amkor Technology Recent Developments
    Table 46. MacDermid Alpha Electronics Solutions Basic Information List
    Table 47. MacDermid Alpha Electronics Solutions Description and Business Overview
    Table 48. MacDermid Alpha Electronics Solutions Wafer Bumping Service Products, Services and Solutions
    Table 49. Revenue (US$ Million) in Wafer Bumping Service Business of MacDermid Alpha Electronics Solutions (2019-2024)
    Table 50. MacDermid Alpha Electronics Solutions Recent Developments
    Table 51. Maxell Basic Information List
    Table 52. Maxell Description and Business Overview
    Table 53. Maxell Wafer Bumping Service Products, Services and Solutions
    Table 54. Revenue (US$ Million) in Wafer Bumping Service Business of Maxell (2019-2024)
    Table 55. Maxell Recent Developments
    Table 56. JCET Group Basic Information List
    Table 57. JCET Group Description and Business Overview
    Table 58. JCET Group Wafer Bumping Service Products, Services and Solutions
    Table 59. Revenue (US$ Million) in Wafer Bumping Service Business of JCET Group (2019-2024)
    Table 60. JCET Group Recent Developments
    Table 61. Unisem Group Basic Information List
    Table 62. Unisem Group Description and Business Overview
    Table 63. Unisem Group Wafer Bumping Service Products, Services and Solutions
    Table 64. Revenue (US$ Million) in Wafer Bumping Service Business of Unisem Group (2019-2024)
    Table 65. Unisem Group Recent Developments
    Table 66. Powertech Technology Basic Information List
    Table 67. Powertech Technology Description and Business Overview
    Table 68. Powertech Technology Wafer Bumping Service Products, Services and Solutions
    Table 69. Revenue (US$ Million) in Wafer Bumping Service Business of Powertech Technology (2019-2024)
    Table 70. Powertech Technology Recent Developments
    Table 71. SFA Semicon Basic Information List
    Table 72. SFA Semicon Description and Business Overview
    Table 73. SFA Semicon Wafer Bumping Service Products, Services and Solutions
    Table 74. Revenue (US$ Million) in Wafer Bumping Service Business of SFA Semicon (2019-2024)
    Table 75. SFA Semicon Recent Developments
    Table 76. Semi-Pac Inc Basic Information List
    Table 77. Semi-Pac Inc Description and Business Overview
    Table 78. Semi-Pac Inc Wafer Bumping Service Products, Services and Solutions
    Table 79. Revenue (US$ Million) in Wafer Bumping Service Business of Semi-Pac Inc (2019-2024)
    Table 80. Semi-Pac Inc Recent Developments
    Table 81. ChipMOS TECHNOLOGIES Basic Information List
    Table 82. ChipMOS TECHNOLOGIES Description and Business Overview
    Table 83. ChipMOS TECHNOLOGIES Wafer Bumping Service Products, Services and Solutions
    Table 84. Revenue (US$ Million) in Wafer Bumping Service Business of ChipMOS TECHNOLOGIES (2019-2024)
    Table 85. ChipMOS TECHNOLOGIES Recent Developments
    Table 86. NEPES Basic Information List
    Table 87. NEPES Description and Business Overview
    Table 88. NEPES Wafer Bumping Service Products, Services and Solutions
    Table 89. Revenue (US$ Million) in Wafer Bumping Service Business of NEPES (2019-2024)
    Table 90. NEPES Recent Developments
    Table 91. TI Basic Information List
    Table 92. TI Description and Business Overview
    Table 93. TI Wafer Bumping Service Products, Services and Solutions
    Table 94. Revenue (US$ Million) in Wafer Bumping Service Business of TI (2019-2024)
    Table 95. TI Recent Developments
    Table 96. International Micro Industries Basic Information List
    Table 97. International Micro Industries Description and Business Overview
    Table 98. International Micro Industries Wafer Bumping Service Products, Services and Solutions
    Table 99. Revenue (US$ Million) in Wafer Bumping Service Business of International Micro Industries (2019-2024)
    Table 100. International Micro Industries Recent Developments
    Table 101. Raytek Semiconductor Basic Information List
    Table 102. Raytek Semiconductor Description and Business Overview
    Table 103. Raytek Semiconductor Wafer Bumping Service Products, Services and Solutions
    Table 104. Revenue (US$ Million) in Wafer Bumping Service Business of Raytek Semiconductor (2019-2024)
    Table 105. Raytek Semiconductor Recent Developments
    Table 106. Jiangsu CAS Microelectronics Integration Basic Information List
    Table 107. Jiangsu CAS Microelectronics Integration Description and Business Overview
    Table 108. Jiangsu CAS Microelectronics Integration Wafer Bumping Service Products, Services and Solutions
    Table 109. Revenue (US$ Million) in Wafer Bumping Service Business of Jiangsu CAS Microelectronics Integration (2019-2024)
    Table 110. Jiangsu CAS Microelectronics Integration Recent Developments
    Table 111. Tianshui Huatian Technology Basic Information List
    Table 112. Tianshui Huatian Technology Description and Business Overview
    Table 113. Tianshui Huatian Technology Wafer Bumping Service Products, Services and Solutions
    Table 114. Revenue (US$ Million) in Wafer Bumping Service Business of Tianshui Huatian Technology (2019-2024)
    Table 115. Tianshui Huatian Technology Recent Developments
    Table 116. Chipbond Basic Information List
    Table 117. Chipbond Description and Business Overview
    Table 118. Chipbond Wafer Bumping Service Products, Services and Solutions
    Table 119. Revenue (US$ Million) in Wafer Bumping Service Business of Chipbond (2019-2024)
    Table 120. Chipbond Recent Developments
    Table 121. LB Semicon Basic Information List
    Table 122. LB Semicon Description and Business Overview
    Table 123. LB Semicon Wafer Bumping Service Products, Services and Solutions
    Table 124. Revenue (US$ Million) in Wafer Bumping Service Business of LB Semicon (2019-2024)
    Table 125. LB Semicon Recent Developments
    Table 126. KYEC Basic Information List
    Table 127. KYEC Description and Business Overview
    Table 128. KYEC Wafer Bumping Service Products, Services and Solutions
    Table 129. Revenue (US$ Million) in Wafer Bumping Service Business of KYEC (2019-2024)
    Table 130. KYEC Recent Developments
    Table 131. Union Semiconductor (Hefei) Basic Information List
    Table 132. Union Semiconductor (Hefei) Description and Business Overview
    Table 133. Union Semiconductor (Hefei) Wafer Bumping Service Products, Services and Solutions
    Table 134. Revenue (US$ Million) in Wafer Bumping Service Business of Union Semiconductor (Hefei) (2019-2024)
    Table 135. Union Semiconductor (Hefei) Recent Developments
    Table 136. Key Raw Materials Lists
    Table 137. Raw Materials Key Suppliers Lists
    Table 138. Wafer Bumping Service Downstream Customers
    Table 139. Wafer Bumping Service Distributors List
    Table 140. Research Programs/Design for This Report
    Table 141. Key Data Information from Secondary Sources
    Table 142. Key Data Information from Primary Sources
    Table 143. Business Unit and Senior & Team Lead Analysts
List of Figures
    Figure 1. Wafer Bumping Service Product Picture
    Figure 2. Global Wafer Bumping Service Sales Value, 2019 VS 2023 VS 2030 (US$ Million)
    Figure 3. Global Wafer Bumping Service Sales Value (2019-2030) & (US$ Million)
    Figure 4. Wafer Bumping Service Report Years Considered
    Figure 5. Global Wafer Bumping Service Players Revenue Ranking (2023) & (US$ Million)
    Figure 6. The 5 and 10 Largest Manufacturers in the World: Market Share by Wafer Bumping Service Revenue in 2023
    Figure 7. Wafer Bumping Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2019 VS 2023
    Figure 8. Copper Pillar Bumping Picture
    Figure 9. Solder Bumping Picture
    Figure 10. Gold Bumping Picture
    Figure 11. Global Wafer Bumping Service Sales Value by Type (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 12. Global Wafer Bumping Service Sales Value Market Share by Type, 2023 & 2030
    Figure 13. Product Picture of 4&6 Inch
    Figure 14. Product Picture of 8&12 Inch
    Figure 15. Global Wafer Bumping Service Sales Value by Application (2019 VS 2023 VS 2030) & (US$ Million)
    Figure 16. Global Wafer Bumping Service Sales Value Market Share by Application, 2023 & 2030
    Figure 17. North America Wafer Bumping Service Sales Value (2019-2030) & (US$ Million)
    Figure 18. North America Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
    Figure 19. Europe Wafer Bumping Service Sales Value (2019-2030) & (US$ Million)
    Figure 20. Europe Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
    Figure 21. Asia Pacific Wafer Bumping Service Sales Value (2019-2030) & (US$ Million)
    Figure 22. Asia Pacific Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
    Figure 23. South America Wafer Bumping Service Sales Value (2019-2030) & (US$ Million)
    Figure 24. South America Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
    Figure 25. Middle East & Africa Wafer Bumping Service Sales Value (2019-2030) & (US$ Million)
    Figure 26. Middle East & Africa Wafer Bumping Service Sales Value by Country (%), 2023 VS 2030
    Figure 27. Key Countries/Regions Wafer Bumping Service Sales Value (%), (2019-2030)
    Figure 28. United States Wafer Bumping Service Sales Value, (2019-2030) & (US$ Million)
    Figure 29. United States Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
    Figure 30. United States Wafer Bumping Service Sales Value by Application (%), 2023 VS 2030
    Figure 31. Europe Wafer Bumping Service Sales Value, (2019-2030) & (US$ Million)
    Figure 32. Europe Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
    Figure 33. Europe Wafer Bumping Service Sales Value by Application (%), 2023 VS 2030
    Figure 34. China Wafer Bumping Service Sales Value, (2019-2030) & (US$ Million)
    Figure 35. China Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
    Figure 36. China Wafer Bumping Service Sales Value by Application (%), 2023 VS 2030
    Figure 37. Japan Wafer Bumping Service Sales Value, (2019-2030) & (US$ Million)
    Figure 38. Japan Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
    Figure 39. Japan Wafer Bumping Service Sales Value by Application (%), 2023 VS 2030
    Figure 40. South Korea Wafer Bumping Service Sales Value, (2019-2030) & (US$ Million)
    Figure 41. South Korea Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
    Figure 42. South Korea Wafer Bumping Service Sales Value by Application (%), 2023 VS 2030
    Figure 43. Southeast Asia Wafer Bumping Service Sales Value, (2019-2030) & (US$ Million)
    Figure 44. Southeast Asia Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
    Figure 45. Southeast Asia Wafer Bumping Service Sales Value by Application (%), 2023 VS 2030
    Figure 46. India Wafer Bumping Service Sales Value, (2019-2030) & (US$ Million)
    Figure 47. India Wafer Bumping Service Sales Value by Type (%), 2023 VS 2030
    Figure 48. India Wafer Bumping Service Sales Value by Application (%), 2023 VS 2030
    Figure 49. Wafer Bumping Service Industrial Chain
    Figure 50. Wafer Bumping Service Manufacturing Cost Structure
    Figure 51. Channels of Distribution (Direct Sales, and Distribution)
    Figure 52. Bottom-up and Top-down Approaches for This Report
    Figure 53. Data Triangulation
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