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Global Wafer Bumping Market Research Report 2025

Published Date: February 2025

Report Code: QYRE-Auto-17J10636

Global Wafer Bumping Market Research Report 2022

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Global Wafer Bumping Market Research Report 2025

Code: QYRE-Auto-17J10636

Report

February 2025

Pages:111

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

Amkor Technology

JCET Group

Unisem Group

Powertech Technology

SFA Semicon

ChipMOS TECHNOLOGIES

Nepes

ASE Global

International Micro Industries

Raytek Semiconductor

Jiangsu CAS Microelectronics Integration

Tianshui Huatian Technology

Chipbond

LB Semicon

KYEC

Union Semiconductor (Hefei)

Chipmore Technology

Shinko Electric Industries

Tongfu Microelectronics

Faraday Technology Corporation

Siliconware Precision Industries

Winstek Semiconductor

Intel

Samsung Semiconductor

SMIC

UTAC

SJ Semiconductor

ATX Group

Wafer Bumping Market Size

The global market for Wafer Bumping was valued at US$ 18940 million in the year 2024 and is projected to reach a revised size of US$ 35980 million by 2031, growing at a CAGR of 9.7% during the forecast period.

Wafer Bumping Market

Wafer bumping technology can provide significant performance, form factor and cost advantages in a semiconductor package. Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device. Solder bump composition and dimension depends on a number of factors such as form factor, cost and the electrical, mechanical and thermal performance requirements of the semiconductor device.

The enterprise statistics in this article include IDM, IC Foundry and OSAT. Wafer bumps include gold bumps, tin bumps, copper pillar bumps, etc. There are certain differences in different types of downstream applications. For example, gold bumps are mainly used for display driver chips, which have high requirements for line accuracy, heat dissipation and other indicators, and gold bumps can meet such requirements. At the same time, gold bumps can increase current transmission efficiency and reduce resistance and thermal resistance. Different bumps also differ in size. For example, tin bumps are generally more solderable and 3-5 times larger than copper pillar bumps in size. At present, from the perspective of application scenarios, copper pillar bumps have a wide range of applications, including but not limited to general-purpose processors, image processors, memory chips, ASICs, FPGAs, power management chips, RF front-end chips, automotive electronics, etc. Wafer bumps are one of the representative technologies of advanced packaging. According to our internal statistics, the proportion of advanced packaging will exceed 50% in 2025. At the same time, with the continuous upgrading of downstream terminal demand, especially terminals represented by consumer electronics, which have higher requirements on power management stability, power consumption and chip size, chip packaging technology is gradually moving towards advanced packaging, such as WLCSP, SiP and 3D packaging.

This report aims to provide a comprehensive presentation of the global market for Wafer Bumping, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Bumping.

The Wafer Bumping market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Bumping market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Wafer Bumping companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Wafer Bumping Market Report

Report Metric	Details
Report Name	Wafer Bumping Market
Accounted market size in year	US$ 18940 million
Forecasted market size in 2031	US$ 35980 million
CAGR	9.7%
Base Year	year
Forecasted years	2025 - 2031
Segment by Type	IC Foundry IDM OSAT
Segment by Application	200mm Wafer 300mm Wafer Others
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Intel, Samsung Semiconductor, Amkor Technology, ASE Global, JCET Group, Chipmore Technology, ChipMOS TECHNOLOGIES, NEPES, Tianshui Huatian Technology, Chipbond, Union Semiconductor (Hefei), SMIC, Raytek Semiconductor, Jiangsu CAS Microelectronics Integration, KYEC, Shinko Electric Industries, LB Semicon, Tongfu Microelectronics, UTAC, Powertech Technology, Faraday Technology Corporation, Siliconware Precision Industries, SFA Semicon, Winstek Semiconductor, Unisem Group, SJ Semiconductor, International Micro Industries, ATX Group
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Wafer Bumping company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Wafer Bumping Market growing?

Ans: The Wafer Bumping Market witnessing a CAGR of 9.7% during the forecast period 2025-2031.

What is the Wafer Bumping Market size in 2031?

Ans: The Wafer Bumping Market size in 2031 will be US$ 35980 million.

Who are the main players in the Wafer Bumping Market report?

Ans: The main players in the Wafer Bumping Market are Intel, Samsung Semiconductor, Amkor Technology, ASE Global, JCET Group, Chipmore Technology, ChipMOS TECHNOLOGIES, NEPES, Tianshui Huatian Technology, Chipbond, Union Semiconductor (Hefei), SMIC, Raytek Semiconductor, Jiangsu CAS Microelectronics Integration, KYEC, Shinko Electric Industries, LB Semicon, Tongfu Microelectronics, UTAC, Powertech Technology, Faraday Technology Corporation, Siliconware Precision Industries, SFA Semicon, Winstek Semiconductor, Unisem Group, SJ Semiconductor, International Micro Industries, ATX Group

What are the Application segmentation covered in the Wafer Bumping Market report?

Ans: The Applications covered in the Wafer Bumping Market report are 200mm Wafer, 300mm Wafer, Others

What are the Type segmentation covered in the Wafer Bumping Market report?

Ans: The Types covered in the Wafer Bumping Market report are IC Foundry, IDM, OSAT

Recommended Reports

Wafer Handling Equipment

Wafer Processing Materials

Wafer Inspection & Packaging

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Wafer Bumping Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 Copper Pillar Bumping

1.2.3 Solder Bumping

1.2.4 Gold Bumping

1.2.5 Others (Nickel Plated Copper/Tin)

1.3 Market by Application

1.3.1 Global Wafer Bumping Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 8 Inch

1.3.3 12 Inch

1.3.4 Others

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Wafer Bumping Market Perspective (2020-2031)

2.2 Global Wafer Bumping Growth Trends by Region

2.2.1 Global Wafer Bumping Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 Wafer Bumping Historic Market Size by Region (2020-2025)

2.2.3 Wafer Bumping Forecasted Market Size by Region (2026-2031)

2.3 Wafer Bumping Market Dynamics

2.3.1 Wafer Bumping Industry Trends

2.3.2 Wafer Bumping Market Drivers

2.3.3 Wafer Bumping Market Challenges

2.3.4 Wafer Bumping Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Wafer Bumping Players by Revenue

3.1.1 Global Top Wafer Bumping Players by Revenue (2020-2025)

3.1.2 Global Wafer Bumping Revenue Market Share by Players (2020-2025)

3.2 Global Wafer Bumping Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Wafer Bumping Revenue

3.4 Global Wafer Bumping Market Concentration Ratio

3.4.1 Global Wafer Bumping Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Wafer Bumping Revenue in 2024

3.5 Global Key Players of Wafer Bumping Head office and Area Served

3.6 Global Key Players of Wafer Bumping, Product and Application

3.7 Global Key Players of Wafer Bumping, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Wafer Bumping Breakdown Data by Type

4.1 Global Wafer Bumping Historic Market Size by Type (2020-2025)

4.2 Global Wafer Bumping Forecasted Market Size by Type (2026-2031)

5 Wafer Bumping Breakdown Data by Application

5.1 Global Wafer Bumping Historic Market Size by Application (2020-2025)

5.2 Global Wafer Bumping Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America Wafer Bumping Market Size (2020-2031)

6.2 North America Wafer Bumping Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America Wafer Bumping Market Size by Country (2020-2025)

6.4 North America Wafer Bumping Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Wafer Bumping Market Size (2020-2031)

7.2 Europe Wafer Bumping Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe Wafer Bumping Market Size by Country (2020-2025)

7.4 Europe Wafer Bumping Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Wafer Bumping Market Size (2020-2031)

8.2 Asia-Pacific Wafer Bumping Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific Wafer Bumping Market Size by Region (2020-2025)

8.4 Asia-Pacific Wafer Bumping Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Wafer Bumping Market Size (2020-2031)

9.2 Latin America Wafer Bumping Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America Wafer Bumping Market Size by Country (2020-2025)

9.4 Latin America Wafer Bumping Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Wafer Bumping Market Size (2020-2031)

10.2 Middle East & Africa Wafer Bumping Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa Wafer Bumping Market Size by Country (2020-2025)

10.4 Middle East & Africa Wafer Bumping Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 ASE Global

11.1.1 ASE Global Company Details

11.1.2 ASE Global Business Overview

11.1.3 ASE Global Wafer Bumping Introduction

11.1.4 ASE Global Revenue in Wafer Bumping Business (2020-2025)

11.1.5 ASE Global Recent Development

11.2 Fujitsu

11.2.1 Fujitsu Company Details

11.2.2 Fujitsu Business Overview

11.2.3 Fujitsu Wafer Bumping Introduction

11.2.4 Fujitsu Revenue in Wafer Bumping Business (2020-2025)

11.2.5 Fujitsu Recent Development

11.3 Amkor Technology

11.3.1 Amkor Technology Company Details

11.3.2 Amkor Technology Business Overview

11.3.3 Amkor Technology Wafer Bumping Introduction

11.3.4 Amkor Technology Revenue in Wafer Bumping Business (2020-2025)

11.3.5 Amkor Technology Recent Development

11.4 Samsung

11.4.1 Samsung Company Details

11.4.2 Samsung Business Overview

11.4.3 Samsung Wafer Bumping Introduction

11.4.4 Samsung Revenue in Wafer Bumping Business (2020-2025)

11.4.5 Samsung Recent Development

11.5 Maxell

11.5.1 Maxell Company Details

11.5.2 Maxell Business Overview

11.5.3 Maxell Wafer Bumping Introduction

11.5.4 Maxell Revenue in Wafer Bumping Business (2020-2025)

11.5.5 Maxell Recent Development

11.6 JCET Group

11.6.1 JCET Group Company Details

11.6.2 JCET Group Business Overview

11.6.3 JCET Group Wafer Bumping Introduction

11.6.4 JCET Group Revenue in Wafer Bumping Business (2020-2025)

11.6.5 JCET Group Recent Development

11.7 Chipmore Technology

11.7.1 Chipmore Technology Company Details

11.7.2 Chipmore Technology Business Overview

11.7.3 Chipmore Technology Wafer Bumping Introduction

11.7.4 Chipmore Technology Revenue in Wafer Bumping Business (2020-2025)

11.7.5 Chipmore Technology Recent Development

11.8 ChipMOS TECHNOLOGIES

11.8.1 ChipMOS TECHNOLOGIES Company Details

11.8.2 ChipMOS TECHNOLOGIES Business Overview

11.8.3 ChipMOS TECHNOLOGIES Wafer Bumping Introduction

11.8.4 ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Business (2020-2025)

11.8.5 ChipMOS TECHNOLOGIES Recent Development

11.9 NEPES

11.9.1 NEPES Company Details

11.9.2 NEPES Business Overview

11.9.3 NEPES Wafer Bumping Introduction

11.9.4 NEPES Revenue in Wafer Bumping Business (2020-2025)

11.9.5 NEPES Recent Development

11.10 Tianshui Huatian Technology

11.10.1 Tianshui Huatian Technology Company Details

11.10.2 Tianshui Huatian Technology Business Overview

11.10.3 Tianshui Huatian Technology Wafer Bumping Introduction

11.10.4 Tianshui Huatian Technology Revenue in Wafer Bumping Business (2020-2025)

11.10.5 Tianshui Huatian Technology Recent Development

11.11 Chipbond

11.11.1 Chipbond Company Details

11.11.2 Chipbond Business Overview

11.11.3 Chipbond Wafer Bumping Introduction

11.11.4 Chipbond Revenue in Wafer Bumping Business (2020-2025)

11.11.5 Chipbond Recent Development

11.12 Union Semiconductor (Hefei)

11.12.1 Union Semiconductor (Hefei) Company Details

11.12.2 Union Semiconductor (Hefei) Business Overview

11.12.3 Union Semiconductor (Hefei) Wafer Bumping Introduction

11.12.4 Union Semiconductor (Hefei) Revenue in Wafer Bumping Business (2020-2025)

11.12.5 Union Semiconductor (Hefei) Recent Development

11.13 TI

11.13.1 TI Company Details

11.13.2 TI Business Overview

11.13.3 TI Wafer Bumping Introduction

11.13.4 TI Revenue in Wafer Bumping Business (2020-2025)

11.13.5 TI Recent Development

11.14 International Micro Industries

11.14.1 International Micro Industries Company Details

11.14.2 International Micro Industries Business Overview

11.14.3 International Micro Industries Wafer Bumping Introduction

11.14.4 International Micro Industries Revenue in Wafer Bumping Business (2020-2025)

11.14.5 International Micro Industries Recent Development

11.15 Raytek Semiconductor

11.15.1 Raytek Semiconductor Company Details

11.15.2 Raytek Semiconductor Business Overview

11.15.3 Raytek Semiconductor Wafer Bumping Introduction

11.15.4 Raytek Semiconductor Revenue in Wafer Bumping Business (2020-2025)

11.15.5 Raytek Semiconductor Recent Development

11.16 Jiangsu CAS Microelectronics Integration

11.16.1 Jiangsu CAS Microelectronics Integration Company Details

11.16.2 Jiangsu CAS Microelectronics Integration Business Overview

11.16.3 Jiangsu CAS Microelectronics Integration Wafer Bumping Introduction

11.16.4 Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Business (2020-2025)

11.16.5 Jiangsu CAS Microelectronics Integration Recent Development

11.17 KYEC

11.17.1 KYEC Company Details

11.17.2 KYEC Business Overview

11.17.3 KYEC Wafer Bumping Introduction

11.17.4 KYEC Revenue in Wafer Bumping Business (2020-2025)

11.17.5 KYEC Recent Development

11.18 Shinko Electric Industries

11.18.1 Shinko Electric Industries Company Details

11.18.2 Shinko Electric Industries Business Overview

11.18.3 Shinko Electric Industries Wafer Bumping Introduction

11.18.4 Shinko Electric Industries Revenue in Wafer Bumping Business (2020-2025)

11.18.5 Shinko Electric Industries Recent Development

11.19 LB Semicon

11.19.1 LB Semicon Company Details

11.19.2 LB Semicon Business Overview

11.19.3 LB Semicon Wafer Bumping Introduction

11.19.4 LB Semicon Revenue in Wafer Bumping Business (2020-2025)

11.19.5 LB Semicon Recent Development

11.20 Tongfu Microelectronics

11.20.1 Tongfu Microelectronics Company Details

11.20.2 Tongfu Microelectronics Business Overview

11.20.3 Tongfu Microelectronics Wafer Bumping Introduction

11.20.4 Tongfu Microelectronics Revenue in Wafer Bumping Business (2020-2025)

11.20.5 Tongfu Microelectronics Recent Development

11.21 MacDermid Alpha Electronics Solutions

11.21.1 MacDermid Alpha Electronics Solutions Company Details

11.21.2 MacDermid Alpha Electronics Solutions Business Overview

11.21.3 MacDermid Alpha Electronics Solutions Wafer Bumping Introduction

11.21.4 MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Business (2020-2025)

11.21.5 MacDermid Alpha Electronics Solutions Recent Development

11.22 Powertech Technology

11.22.1 Powertech Technology Company Details

11.22.2 Powertech Technology Business Overview

11.22.3 Powertech Technology Wafer Bumping Introduction

11.22.4 Powertech Technology Revenue in Wafer Bumping Business (2020-2025)

11.22.5 Powertech Technology Recent Development

11.23 Faraday Technology Corporation

11.23.1 Faraday Technology Corporation Company Details

11.23.2 Faraday Technology Corporation Business Overview

11.23.3 Faraday Technology Corporation Wafer Bumping Introduction

11.23.4 Faraday Technology Corporation Revenue in Wafer Bumping Business (2020-2025)

11.23.5 Faraday Technology Corporation Recent Development

11.24 Siliconware Precision Industries

11.24.1 Siliconware Precision Industries Company Details

11.24.2 Siliconware Precision Industries Business Overview

11.24.3 Siliconware Precision Industries Wafer Bumping Introduction

11.24.4 Siliconware Precision Industries Revenue in Wafer Bumping Business (2020-2025)

11.24.5 Siliconware Precision Industries Recent Development

11.25 SFA Semicon

11.25.1 SFA Semicon Company Details

11.25.2 SFA Semicon Business Overview

11.25.3 SFA Semicon Wafer Bumping Introduction

11.25.4 SFA Semicon Revenue in Wafer Bumping Business (2020-2025)

11.25.5 SFA Semicon Recent Development

11.26 Winstek Semiconductor

11.26.1 Winstek Semiconductor Company Details

11.26.2 Winstek Semiconductor Business Overview

11.26.3 Winstek Semiconductor Wafer Bumping Introduction

11.26.4 Winstek Semiconductor Revenue in Wafer Bumping Business (2020-2025)

11.26.5 Winstek Semiconductor Recent Development

11.27 Semi-Pac Inc

11.27.1 Semi-Pac Inc Company Details

11.27.2 Semi-Pac Inc Business Overview

11.27.3 Semi-Pac Inc Wafer Bumping Introduction

11.27.4 Semi-Pac Inc Revenue in Wafer Bumping Business (2020-2025)

11.27.5 Semi-Pac Inc Recent Development

11.28 Unisem Group

11.28.1 Unisem Group Company Details

11.28.2 Unisem Group Business Overview

11.28.3 Unisem Group Wafer Bumping Introduction

11.28.4 Unisem Group Revenue in Wafer Bumping Business (2020-2025)

11.28.5 Unisem Group Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

Amkor Technology

JCET Group

Unisem Group

Powertech Technology

SFA Semicon

ChipMOS TECHNOLOGIES

Nepes

ASE Global

International Micro Industries

Raytek Semiconductor

Jiangsu CAS Microelectronics Integration

Tianshui Huatian Technology

Chipbond

LB Semicon

KYEC

Union Semiconductor (Hefei)

Chipmore Technology

Shinko Electric Industries

Tongfu Microelectronics

Faraday Technology Corporation

Siliconware Precision Industries

Winstek Semiconductor

Intel

Samsung Semiconductor

SMIC

UTAC

SJ Semiconductor

ATX Group

List of Tables

Table 1. Global Wafer Bumping Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of Copper Pillar Bumping

Table 3. Key Players of Solder Bumping

Table 4. Key Players of Gold Bumping

Table 5. Key Players of Others (Nickel Plated Copper/Tin)

Table 6. Global Wafer Bumping Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 7. Global Wafer Bumping Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 8. Global Wafer Bumping Market Size by Region (2020-2025) & (US$ Million)

Table 9. Global Wafer Bumping Market Share by Region (2020-2025)

Table 10. Global Wafer Bumping Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 11. Global Wafer Bumping Market Share by Region (2026-2031)

Table 12. Wafer Bumping Market Trends

Table 13. Wafer Bumping Market Drivers

Table 14. Wafer Bumping Market Challenges

Table 15. Wafer Bumping Market Restraints

Table 16. Global Wafer Bumping Revenue by Players (2020-2025) & (US$ Million)

Table 17. Global Wafer Bumping Market Share by Players (2020-2025)

Table 18. Global Top Wafer Bumping Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping as of 2024)

Table 19. Ranking of Global Top Wafer Bumping Companies by Revenue (US$ Million) in 2024

Table 20. Global 5 Largest Players Market Share by Wafer Bumping Revenue (CR5 and HHI) & (2020-2025)

Table 21. Global Key Players of Wafer Bumping, Headquarters and Area Served

Table 22. Global Key Players of Wafer Bumping, Product and Application

Table 23. Global Key Players of Wafer Bumping, Date of Enter into This Industry

Table 24. Mergers & Acquisitions, Expansion Plans

Table 25. Global Wafer Bumping Market Size by Type (2020-2025) & (US$ Million)

Table 26. Global Wafer Bumping Revenue Market Share by Type (2020-2025)

Table 27. Global Wafer Bumping Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 28. Global Wafer Bumping Revenue Market Share by Type (2026-2031)

Table 29. Global Wafer Bumping Market Size by Application (2020-2025) & (US$ Million)

Table 30. Global Wafer Bumping Revenue Market Share by Application (2020-2025)

Table 31. Global Wafer Bumping Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 32. Global Wafer Bumping Revenue Market Share by Application (2026-2031)

Table 33. North America Wafer Bumping Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 34. North America Wafer Bumping Market Size by Country (2020-2025) & (US$ Million)

Table 35. North America Wafer Bumping Market Size by Country (2026-2031) & (US$ Million)

Table 36. Europe Wafer Bumping Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 37. Europe Wafer Bumping Market Size by Country (2020-2025) & (US$ Million)

Table 38. Europe Wafer Bumping Market Size by Country (2026-2031) & (US$ Million)

Table 39. Asia-Pacific Wafer Bumping Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 40. Asia-Pacific Wafer Bumping Market Size by Region (2020-2025) & (US$ Million)

Table 41. Asia-Pacific Wafer Bumping Market Size by Region (2026-2031) & (US$ Million)

Table 42. Latin America Wafer Bumping Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 43. Latin America Wafer Bumping Market Size by Country (2020-2025) & (US$ Million)

Table 44. Latin America Wafer Bumping Market Size by Country (2026-2031) & (US$ Million)

Table 45. Middle East & Africa Wafer Bumping Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 46. Middle East & Africa Wafer Bumping Market Size by Country (2020-2025) & (US$ Million)

Table 47. Middle East & Africa Wafer Bumping Market Size by Country (2026-2031) & (US$ Million)

Table 48. ASE Global Company Details

Table 49. ASE Global Business Overview

Table 50. ASE Global Wafer Bumping Product

Table 51. ASE Global Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 52. ASE Global Recent Development

Table 53. Fujitsu Company Details

Table 54. Fujitsu Business Overview

Table 55. Fujitsu Wafer Bumping Product

Table 56. Fujitsu Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 57. Fujitsu Recent Development

Table 58. Amkor Technology Company Details

Table 59. Amkor Technology Business Overview

Table 60. Amkor Technology Wafer Bumping Product

Table 61. Amkor Technology Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 62. Amkor Technology Recent Development

Table 63. Samsung Company Details

Table 64. Samsung Business Overview

Table 65. Samsung Wafer Bumping Product

Table 66. Samsung Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 67. Samsung Recent Development

Table 68. Maxell Company Details

Table 69. Maxell Business Overview

Table 70. Maxell Wafer Bumping Product

Table 71. Maxell Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 72. Maxell Recent Development

Table 73. JCET Group Company Details

Table 74. JCET Group Business Overview

Table 75. JCET Group Wafer Bumping Product

Table 76. JCET Group Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 77. JCET Group Recent Development

Table 78. Chipmore Technology Company Details

Table 79. Chipmore Technology Business Overview

Table 80. Chipmore Technology Wafer Bumping Product

Table 81. Chipmore Technology Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 82. Chipmore Technology Recent Development

Table 83. ChipMOS TECHNOLOGIES Company Details

Table 84. ChipMOS TECHNOLOGIES Business Overview

Table 85. ChipMOS TECHNOLOGIES Wafer Bumping Product

Table 86. ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 87. ChipMOS TECHNOLOGIES Recent Development

Table 88. NEPES Company Details

Table 89. NEPES Business Overview

Table 90. NEPES Wafer Bumping Product

Table 91. NEPES Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 92. NEPES Recent Development

Table 93. Tianshui Huatian Technology Company Details

Table 94. Tianshui Huatian Technology Business Overview

Table 95. Tianshui Huatian Technology Wafer Bumping Product

Table 96. Tianshui Huatian Technology Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 97. Tianshui Huatian Technology Recent Development

Table 98. Chipbond Company Details

Table 99. Chipbond Business Overview

Table 100. Chipbond Wafer Bumping Product

Table 101. Chipbond Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 102. Chipbond Recent Development

Table 103. Union Semiconductor (Hefei) Company Details

Table 104. Union Semiconductor (Hefei) Business Overview

Table 105. Union Semiconductor (Hefei) Wafer Bumping Product

Table 106. Union Semiconductor (Hefei) Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 107. Union Semiconductor (Hefei) Recent Development

Table 108. TI Company Details

Table 109. TI Business Overview

Table 110. TI Wafer Bumping Product

Table 111. TI Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 112. TI Recent Development

Table 113. International Micro Industries Company Details

Table 114. International Micro Industries Business Overview

Table 115. International Micro Industries Wafer Bumping Product

Table 116. International Micro Industries Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 117. International Micro Industries Recent Development

Table 118. Raytek Semiconductor Company Details

Table 119. Raytek Semiconductor Business Overview

Table 120. Raytek Semiconductor Wafer Bumping Product

Table 121. Raytek Semiconductor Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 122. Raytek Semiconductor Recent Development

Table 123. Jiangsu CAS Microelectronics Integration Company Details

Table 124. Jiangsu CAS Microelectronics Integration Business Overview

Table 125. Jiangsu CAS Microelectronics Integration Wafer Bumping Product

Table 126. Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 127. Jiangsu CAS Microelectronics Integration Recent Development

Table 128. KYEC Company Details

Table 129. KYEC Business Overview

Table 130. KYEC Wafer Bumping Product

Table 131. KYEC Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 132. KYEC Recent Development

Table 133. Shinko Electric Industries Company Details

Table 134. Shinko Electric Industries Business Overview

Table 135. Shinko Electric Industries Wafer Bumping Product

Table 136. Shinko Electric Industries Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 137. Shinko Electric Industries Recent Development

Table 138. LB Semicon Company Details

Table 139. LB Semicon Business Overview

Table 140. LB Semicon Wafer Bumping Product

Table 141. LB Semicon Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 142. LB Semicon Recent Development

Table 143. Tongfu Microelectronics Company Details

Table 144. Tongfu Microelectronics Business Overview

Table 145. Tongfu Microelectronics Wafer Bumping Product

Table 146. Tongfu Microelectronics Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 147. Tongfu Microelectronics Recent Development

Table 148. MacDermid Alpha Electronics Solutions Company Details

Table 149. MacDermid Alpha Electronics Solutions Business Overview

Table 150. MacDermid Alpha Electronics Solutions Wafer Bumping Product

Table 151. MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 152. MacDermid Alpha Electronics Solutions Recent Development

Table 153. Powertech Technology Company Details

Table 154. Powertech Technology Business Overview

Table 155. Powertech Technology Wafer Bumping Product

Table 156. Powertech Technology Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 157. Powertech Technology Recent Development

Table 158. Faraday Technology Corporation Company Details

Table 159. Faraday Technology Corporation Business Overview

Table 160. Faraday Technology Corporation Wafer Bumping Product

Table 161. Faraday Technology Corporation Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 162. Faraday Technology Corporation Recent Development

Table 163. Siliconware Precision Industries Company Details

Table 164. Siliconware Precision Industries Business Overview

Table 165. Siliconware Precision Industries Wafer Bumping Product

Table 166. Siliconware Precision Industries Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 167. Siliconware Precision Industries Recent Development

Table 168. SFA Semicon Company Details

Table 169. SFA Semicon Business Overview

Table 170. SFA Semicon Wafer Bumping Product

Table 171. SFA Semicon Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 172. SFA Semicon Recent Development

Table 173. Winstek Semiconductor Company Details

Table 174. Winstek Semiconductor Business Overview

Table 175. Winstek Semiconductor Wafer Bumping Product

Table 176. Winstek Semiconductor Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 177. Winstek Semiconductor Recent Development

Table 178. Semi-Pac Inc Company Details

Table 179. Semi-Pac Inc Business Overview

Table 180. Semi-Pac Inc Wafer Bumping Product

Table 181. Semi-Pac Inc Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 182. Semi-Pac Inc Recent Development

Table 183. Unisem Group Company Details

Table 184. Unisem Group Business Overview

Table 185. Unisem Group Wafer Bumping Product

Table 186. Unisem Group Revenue in Wafer Bumping Business (2020-2025) & (US$ Million)

Table 187. Unisem Group Recent Development

Table 188. Research Programs/Design for This Report

Table 189. Key Data Information from Secondary Sources

Table 190. Key Data Information from Primary Sources

Table 191. Authors List of This Report

List of Figures

Figure 1. Wafer Bumping Picture

Figure 2. Global Wafer Bumping Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global Wafer Bumping Market Share by Type: 2024 VS 2031

Figure 4. Copper Pillar Bumping Features

Figure 5. Solder Bumping Features

Figure 6. Gold Bumping Features

Figure 7. Others (Nickel Plated Copper/Tin) Features

Figure 8. Global Wafer Bumping Market Size by Application (2020-2031) & (US$ Million)

Figure 9. Global Wafer Bumping Market Share by Application: 2024 VS 2031

Figure 10. 8 Inch Case Studies

Figure 11. 12 Inch Case Studies

Figure 12. Others Case Studies

Figure 13. Wafer Bumping Report Years Considered

Figure 14. Global Wafer Bumping Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 15. Global Wafer Bumping Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 16. Global Wafer Bumping Market Share by Region: 2024 VS 2031

Figure 17. Global Wafer Bumping Market Share by Players in 2024

Figure 18. Global Top Wafer Bumping Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping as of 2024)

Figure 19. The Top 10 and 5 Players Market Share by Wafer Bumping Revenue in 2024

Figure 20. North America Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 21. North America Wafer Bumping Market Share by Country (2020-2031)

Figure 22. United States Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 23. Canada Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 24. Europe Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 25. Europe Wafer Bumping Market Share by Country (2020-2031)

Figure 26. Germany Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. France Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 28. U.K. Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. Italy Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. Russia Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Nordic Countries Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 32. Asia-Pacific Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 33. Asia-Pacific Wafer Bumping Market Share by Region (2020-2031)

Figure 34. China Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. Japan Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 36. South Korea Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. Southeast Asia Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. India Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Australia Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 40. Latin America Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 41. Latin America Wafer Bumping Market Share by Country (2020-2031)

Figure 42. Mexico Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Brazil Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 44. Middle East & Africa Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 45. Middle East & Africa Wafer Bumping Market Share by Country (2020-2031)

Figure 46. Turkey Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. Saudi Arabia Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 48. UAE Wafer Bumping Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 49. ASE Global Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 50. Fujitsu Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 51. Amkor Technology Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 52. Samsung Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 53. Maxell Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 54. JCET Group Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 55. Chipmore Technology Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 56. ChipMOS TECHNOLOGIES Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 57. NEPES Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 58. Tianshui Huatian Technology Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 59. Chipbond Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 60. Union Semiconductor (Hefei) Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 61. TI Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 62. International Micro Industries Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 63. Raytek Semiconductor Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 64. Jiangsu CAS Microelectronics Integration Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 65. KYEC Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 66. Shinko Electric Industries Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 67. LB Semicon Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 68. Tongfu Microelectronics Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 69. MacDermid Alpha Electronics Solutions Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 70. Powertech Technology Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 71. Faraday Technology Corporation Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 72. Siliconware Precision Industries Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 73. SFA Semicon Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 74. Winstek Semiconductor Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 75. Semi-Pac Inc Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 76. Unisem Group Revenue Growth Rate in Wafer Bumping Business (2020-2025)

Figure 77. Bottom-up and Top-down Approaches for This Report

Figure 78. Data Triangulation

Figure 79. Key Executives Interviewed

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Global Wafer Level Bump Packaging and Testing Service Market Research Report 2024

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