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Global Wafer Bumping Service Market Research Report 2025

Published Date: May 2025

Report Code: QYRE-Auto-30T12709

Global Wafer Bumping Service Market Research Report 2023

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Global Wafer Bumping Service Market Research Report 2025

Code: QYRE-Auto-30T12709

Report

May 2025

Pages:105

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

ASE Global

Fujitsu Limited

Amkor Technology

MacDermid Alpha Electronics Solutions

MaXell

JCET Group

Unisem Group

Powertech Technology

SFA Semicon

Semi-Pac Inc

ChipMOS TECHNOLOGIES

Nepes

International Micro Industries

Raytek Semiconductor

Jiangsu CAS Microelectronics Integration

Tianshui Huatian Technology

Chipbond

KYEC

Union Semiconductor (Hefei)

LB Semicon

Wafer Bumping Service Market Size

The global market for Wafer Bumping Service was valued at US$ 421 million in the year 2024 and is projected to reach a revised size of US$ 768 million by 2031, growing at a CAGR of 9.1% during the forecast period.

Wafer Bumping Service Market

Wafer ball placement service refers to a process that connects the chip and the packaging substrate through welding. Metal wires are used to connect the metal pins of the chip to the pins of the packaging substrate to achieve signal and power transmission between the chip and the packaging substrate. . Wafer ball placement services mainly include steps such as preparation, ball placement, welding and inspection.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

This report aims to provide a comprehensive presentation of the global market for Wafer Bumping Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Bumping Service.

The Wafer Bumping Service market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Bumping Service market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Wafer Bumping Service companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Wafer Bumping Service Market Report

Report Metric	Details
Report Name	Wafer Bumping Service Market
Accounted market size in year	US$ 421 million
Forecasted market size in 2031	US$ 768 million
CAGR	9.1%
Base Year	year
Forecasted years	2025 - 2031
Segment by Type	Copper Pillar Bumping Solder Bumping Gold Bumping
Segment by Application	4&6 Inch 8&12 Inch
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	ASE Global, Fujitsu, Amkor Technology, MacDermid Alpha Electronics Solutions, Maxell, JCET Group, Unisem Group, Powertech Technology, SFA Semicon, Semi-Pac Inc, ChipMOS TECHNOLOGIES, NEPES, TI, International Micro Industries, Raytek Semiconductor, Jiangsu CAS Microelectronics Integration, Tianshui Huatian Technology, Chipbond, LB Semicon, KYEC, Union Semiconductor (Hefei)
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Wafer Bumping Service company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Wafer Bumping Service Market growing?

Ans: The Wafer Bumping Service Market witnessing a CAGR of 9.1% during the forecast period 2025-2031.

What is the Wafer Bumping Service Market size in 2031?

Ans: The Wafer Bumping Service Market size in 2031 will be US$ 768 million.

What is the Wafer Bumping Service Market share by region?

Ans: Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year.

Who are the main players in the Wafer Bumping Service Market report?

Ans: The main players in the Wafer Bumping Service Market are ASE Global, Fujitsu, Amkor Technology, MacDermid Alpha Electronics Solutions, Maxell, JCET Group, Unisem Group, Powertech Technology, SFA Semicon, Semi-Pac Inc, ChipMOS TECHNOLOGIES, NEPES, TI, International Micro Industries, Raytek Semiconductor, Jiangsu CAS Microelectronics Integration, Tianshui Huatian Technology, Chipbond, LB Semicon, KYEC, Union Semiconductor (Hefei)

What are the Application segmentation covered in the Wafer Bumping Service Market report?

Ans: The Applications covered in the Wafer Bumping Service Market report are 4&6 Inch, 8&12 Inch

What are the Type segmentation covered in the Wafer Bumping Service Market report?

Ans: The Types covered in the Wafer Bumping Service Market report are Copper Pillar Bumping, Solder Bumping, Gold Bumping

Recommended Reports

Semiconductor Materials

Chip Packaging

Semiconductor Equipment

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global Wafer Bumping Service Market Size Growth Rate by Type: 2020 VS 2024 VS 2031

1.2.2 Copper Pillar Bumping

1.2.3 Solder Bumping

1.2.4 Gold Bumping

1.3 Market by Application

1.3.1 Global Wafer Bumping Service Market Growth by Application: 2020 VS 2024 VS 2031

1.3.2 4&6 Inch

1.3.3 8&12 Inch

1.4 Assumptions and Limitations

1.5 Study Objectives

1.6 Years Considered

2 Global Growth Trends

2.1 Global Wafer Bumping Service Market Perspective (2020-2031)

2.2 Global Wafer Bumping Service Growth Trends by Region

2.2.1 Global Wafer Bumping Service Market Size by Region: 2020 VS 2024 VS 2031

2.2.2 Wafer Bumping Service Historic Market Size by Region (2020-2025)

2.2.3 Wafer Bumping Service Forecasted Market Size by Region (2026-2031)

2.3 Wafer Bumping Service Market Dynamics

2.3.1 Wafer Bumping Service Industry Trends

2.3.2 Wafer Bumping Service Market Drivers

2.3.3 Wafer Bumping Service Market Challenges

2.3.4 Wafer Bumping Service Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top Wafer Bumping Service Players by Revenue

3.1.1 Global Top Wafer Bumping Service Players by Revenue (2020-2025)

3.1.2 Global Wafer Bumping Service Revenue Market Share by Players (2020-2025)

3.2 Global Wafer Bumping Service Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Global Key Players Ranking by Wafer Bumping Service Revenue

3.4 Global Wafer Bumping Service Market Concentration Ratio

3.4.1 Global Wafer Bumping Service Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by Wafer Bumping Service Revenue in 2024

3.5 Global Key Players of Wafer Bumping Service Head office and Area Served

3.6 Global Key Players of Wafer Bumping Service, Product and Application

3.7 Global Key Players of Wafer Bumping Service, Date of Enter into This Industry

3.8 Mergers & Acquisitions, Expansion Plans

4 Wafer Bumping Service Breakdown Data by Type

4.1 Global Wafer Bumping Service Historic Market Size by Type (2020-2025)

4.2 Global Wafer Bumping Service Forecasted Market Size by Type (2026-2031)

5 Wafer Bumping Service Breakdown Data by Application

5.1 Global Wafer Bumping Service Historic Market Size by Application (2020-2025)

5.2 Global Wafer Bumping Service Forecasted Market Size by Application (2026-2031)

6 North America

6.1 North America Wafer Bumping Service Market Size (2020-2031)

6.2 North America Wafer Bumping Service Market Growth Rate by Country: 2020 VS 2024 VS 2031

6.3 North America Wafer Bumping Service Market Size by Country (2020-2025)

6.4 North America Wafer Bumping Service Market Size by Country (2026-2031)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe Wafer Bumping Service Market Size (2020-2031)

7.2 Europe Wafer Bumping Service Market Growth Rate by Country: 2020 VS 2024 VS 2031

7.3 Europe Wafer Bumping Service Market Size by Country (2020-2025)

7.4 Europe Wafer Bumping Service Market Size by Country (2026-2031)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific Wafer Bumping Service Market Size (2020-2031)

8.2 Asia-Pacific Wafer Bumping Service Market Growth Rate by Region: 2020 VS 2024 VS 2031

8.3 Asia-Pacific Wafer Bumping Service Market Size by Region (2020-2025)

8.4 Asia-Pacific Wafer Bumping Service Market Size by Region (2026-2031)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America Wafer Bumping Service Market Size (2020-2031)

9.2 Latin America Wafer Bumping Service Market Growth Rate by Country: 2020 VS 2024 VS 2031

9.3 Latin America Wafer Bumping Service Market Size by Country (2020-2025)

9.4 Latin America Wafer Bumping Service Market Size by Country (2026-2031)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa Wafer Bumping Service Market Size (2020-2031)

10.2 Middle East & Africa Wafer Bumping Service Market Growth Rate by Country: 2020 VS 2024 VS 2031

10.3 Middle East & Africa Wafer Bumping Service Market Size by Country (2020-2025)

10.4 Middle East & Africa Wafer Bumping Service Market Size by Country (2026-2031)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 ASE Global

11.1.1 ASE Global Company Details

11.1.2 ASE Global Business Overview

11.1.3 ASE Global Wafer Bumping Service Introduction

11.1.4 ASE Global Revenue in Wafer Bumping Service Business (2020-2025)

11.1.5 ASE Global Recent Development

11.2 Fujitsu

11.2.1 Fujitsu Company Details

11.2.2 Fujitsu Business Overview

11.2.3 Fujitsu Wafer Bumping Service Introduction

11.2.4 Fujitsu Revenue in Wafer Bumping Service Business (2020-2025)

11.2.5 Fujitsu Recent Development

11.3 Amkor Technology

11.3.1 Amkor Technology Company Details

11.3.2 Amkor Technology Business Overview

11.3.3 Amkor Technology Wafer Bumping Service Introduction

11.3.4 Amkor Technology Revenue in Wafer Bumping Service Business (2020-2025)

11.3.5 Amkor Technology Recent Development

11.4 MacDermid Alpha Electronics Solutions

11.4.1 MacDermid Alpha Electronics Solutions Company Details

11.4.2 MacDermid Alpha Electronics Solutions Business Overview

11.4.3 MacDermid Alpha Electronics Solutions Wafer Bumping Service Introduction

11.4.4 MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Service Business (2020-2025)

11.4.5 MacDermid Alpha Electronics Solutions Recent Development

11.5 Maxell

11.5.1 Maxell Company Details

11.5.2 Maxell Business Overview

11.5.3 Maxell Wafer Bumping Service Introduction

11.5.4 Maxell Revenue in Wafer Bumping Service Business (2020-2025)

11.5.5 Maxell Recent Development

11.6 JCET Group

11.6.1 JCET Group Company Details

11.6.2 JCET Group Business Overview

11.6.3 JCET Group Wafer Bumping Service Introduction

11.6.4 JCET Group Revenue in Wafer Bumping Service Business (2020-2025)

11.6.5 JCET Group Recent Development

11.7 Unisem Group

11.7.1 Unisem Group Company Details

11.7.2 Unisem Group Business Overview

11.7.3 Unisem Group Wafer Bumping Service Introduction

11.7.4 Unisem Group Revenue in Wafer Bumping Service Business (2020-2025)

11.7.5 Unisem Group Recent Development

11.8 Powertech Technology

11.8.1 Powertech Technology Company Details

11.8.2 Powertech Technology Business Overview

11.8.3 Powertech Technology Wafer Bumping Service Introduction

11.8.4 Powertech Technology Revenue in Wafer Bumping Service Business (2020-2025)

11.8.5 Powertech Technology Recent Development

11.9 SFA Semicon

11.9.1 SFA Semicon Company Details

11.9.2 SFA Semicon Business Overview

11.9.3 SFA Semicon Wafer Bumping Service Introduction

11.9.4 SFA Semicon Revenue in Wafer Bumping Service Business (2020-2025)

11.9.5 SFA Semicon Recent Development

11.10 Semi-Pac Inc

11.10.1 Semi-Pac Inc Company Details

11.10.2 Semi-Pac Inc Business Overview

11.10.3 Semi-Pac Inc Wafer Bumping Service Introduction

11.10.4 Semi-Pac Inc Revenue in Wafer Bumping Service Business (2020-2025)

11.10.5 Semi-Pac Inc Recent Development

11.11 ChipMOS TECHNOLOGIES

11.11.1 ChipMOS TECHNOLOGIES Company Details

11.11.2 ChipMOS TECHNOLOGIES Business Overview

11.11.3 ChipMOS TECHNOLOGIES Wafer Bumping Service Introduction

11.11.4 ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Service Business (2020-2025)

11.11.5 ChipMOS TECHNOLOGIES Recent Development

11.12 NEPES

11.12.1 NEPES Company Details

11.12.2 NEPES Business Overview

11.12.3 NEPES Wafer Bumping Service Introduction

11.12.4 NEPES Revenue in Wafer Bumping Service Business (2020-2025)

11.12.5 NEPES Recent Development

11.13 TI

11.13.1 TI Company Details

11.13.2 TI Business Overview

11.13.3 TI Wafer Bumping Service Introduction

11.13.4 TI Revenue in Wafer Bumping Service Business (2020-2025)

11.13.5 TI Recent Development

11.14 International Micro Industries

11.14.1 International Micro Industries Company Details

11.14.2 International Micro Industries Business Overview

11.14.3 International Micro Industries Wafer Bumping Service Introduction

11.14.4 International Micro Industries Revenue in Wafer Bumping Service Business (2020-2025)

11.14.5 International Micro Industries Recent Development

11.15 Raytek Semiconductor

11.15.1 Raytek Semiconductor Company Details

11.15.2 Raytek Semiconductor Business Overview

11.15.3 Raytek Semiconductor Wafer Bumping Service Introduction

11.15.4 Raytek Semiconductor Revenue in Wafer Bumping Service Business (2020-2025)

11.15.5 Raytek Semiconductor Recent Development

11.16 Jiangsu CAS Microelectronics Integration

11.16.1 Jiangsu CAS Microelectronics Integration Company Details

11.16.2 Jiangsu CAS Microelectronics Integration Business Overview

11.16.3 Jiangsu CAS Microelectronics Integration Wafer Bumping Service Introduction

11.16.4 Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Service Business (2020-2025)

11.16.5 Jiangsu CAS Microelectronics Integration Recent Development

11.17 Tianshui Huatian Technology

11.17.1 Tianshui Huatian Technology Company Details

11.17.2 Tianshui Huatian Technology Business Overview

11.17.3 Tianshui Huatian Technology Wafer Bumping Service Introduction

11.17.4 Tianshui Huatian Technology Revenue in Wafer Bumping Service Business (2020-2025)

11.17.5 Tianshui Huatian Technology Recent Development

11.18 Chipbond

11.18.1 Chipbond Company Details

11.18.2 Chipbond Business Overview

11.18.3 Chipbond Wafer Bumping Service Introduction

11.18.4 Chipbond Revenue in Wafer Bumping Service Business (2020-2025)

11.18.5 Chipbond Recent Development

11.19 LB Semicon

11.19.1 LB Semicon Company Details

11.19.2 LB Semicon Business Overview

11.19.3 LB Semicon Wafer Bumping Service Introduction

11.19.4 LB Semicon Revenue in Wafer Bumping Service Business (2020-2025)

11.19.5 LB Semicon Recent Development

11.20 KYEC

11.20.1 KYEC Company Details

11.20.2 KYEC Business Overview

11.20.3 KYEC Wafer Bumping Service Introduction

11.20.4 KYEC Revenue in Wafer Bumping Service Business (2020-2025)

11.20.5 KYEC Recent Development

11.21 Union Semiconductor (Hefei)

11.21.1 Union Semiconductor (Hefei) Company Details

11.21.2 Union Semiconductor (Hefei) Business Overview

11.21.3 Union Semiconductor (Hefei) Wafer Bumping Service Introduction

11.21.4 Union Semiconductor (Hefei) Revenue in Wafer Bumping Service Business (2020-2025)

11.21.5 Union Semiconductor (Hefei) Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.1.1 Research Programs/Design

13.1.1.2 Market Size Estimation

13.1.1.3 Market Breakdown and Data Triangulation

13.1.2 Data Source

13.1.2.1 Secondary Sources

13.1.2.2 Primary Sources

13.2 Author Details

13.3 Disclaimer

FEATURED COMPANIES

ASE Global

Fujitsu Limited

Amkor Technology

MacDermid Alpha Electronics Solutions

MaXell

JCET Group

Unisem Group

Powertech Technology

SFA Semicon

Semi-Pac Inc

ChipMOS TECHNOLOGIES

Nepes

International Micro Industries

Raytek Semiconductor

Jiangsu CAS Microelectronics Integration

Tianshui Huatian Technology

Chipbond

KYEC

Union Semiconductor (Hefei)

LB Semicon

List of Tables

Table 1. Global Wafer Bumping Service Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031

Table 2. Key Players of Copper Pillar Bumping

Table 3. Key Players of Solder Bumping

Table 4. Key Players of Gold Bumping

Table 5. Global Wafer Bumping Service Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031

Table 6. Global Wafer Bumping Service Market Size by Region (US$ Million): 2020 VS 2024 VS 2031

Table 7. Global Wafer Bumping Service Market Size by Region (2020-2025) & (US$ Million)

Table 8. Global Wafer Bumping Service Market Share by Region (2020-2025)

Table 9. Global Wafer Bumping Service Forecasted Market Size by Region (2026-2031) & (US$ Million)

Table 10. Global Wafer Bumping Service Market Share by Region (2026-2031)

Table 11. Wafer Bumping Service Market Trends

Table 12. Wafer Bumping Service Market Drivers

Table 13. Wafer Bumping Service Market Challenges

Table 14. Wafer Bumping Service Market Restraints

Table 15. Global Wafer Bumping Service Revenue by Players (2020-2025) & (US$ Million)

Table 16. Global Wafer Bumping Service Market Share by Players (2020-2025)

Table 17. Global Top Wafer Bumping Service Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping Service as of 2024)

Table 18. Ranking of Global Top Wafer Bumping Service Companies by Revenue (US$ Million) in 2024

Table 19. Global 5 Largest Players Market Share by Wafer Bumping Service Revenue (CR5 and HHI) & (2020-2025)

Table 20. Global Key Players of Wafer Bumping Service, Headquarters and Area Served

Table 21. Global Key Players of Wafer Bumping Service, Product and Application

Table 22. Global Key Players of Wafer Bumping Service, Date of Enter into This Industry

Table 23. Mergers & Acquisitions, Expansion Plans

Table 24. Global Wafer Bumping Service Market Size by Type (2020-2025) & (US$ Million)

Table 25. Global Wafer Bumping Service Revenue Market Share by Type (2020-2025)

Table 26. Global Wafer Bumping Service Forecasted Market Size by Type (2026-2031) & (US$ Million)

Table 27. Global Wafer Bumping Service Revenue Market Share by Type (2026-2031)

Table 28. Global Wafer Bumping Service Market Size by Application (2020-2025) & (US$ Million)

Table 29. Global Wafer Bumping Service Revenue Market Share by Application (2020-2025)

Table 30. Global Wafer Bumping Service Forecasted Market Size by Application (2026-2031) & (US$ Million)

Table 31. Global Wafer Bumping Service Revenue Market Share by Application (2026-2031)

Table 32. North America Wafer Bumping Service Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 33. North America Wafer Bumping Service Market Size by Country (2020-2025) & (US$ Million)

Table 34. North America Wafer Bumping Service Market Size by Country (2026-2031) & (US$ Million)

Table 35. Europe Wafer Bumping Service Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 36. Europe Wafer Bumping Service Market Size by Country (2020-2025) & (US$ Million)

Table 37. Europe Wafer Bumping Service Market Size by Country (2026-2031) & (US$ Million)

Table 38. Asia-Pacific Wafer Bumping Service Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031

Table 39. Asia-Pacific Wafer Bumping Service Market Size by Region (2020-2025) & (US$ Million)

Table 40. Asia-Pacific Wafer Bumping Service Market Size by Region (2026-2031) & (US$ Million)

Table 41. Latin America Wafer Bumping Service Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 42. Latin America Wafer Bumping Service Market Size by Country (2020-2025) & (US$ Million)

Table 43. Latin America Wafer Bumping Service Market Size by Country (2026-2031) & (US$ Million)

Table 44. Middle East & Africa Wafer Bumping Service Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031

Table 45. Middle East & Africa Wafer Bumping Service Market Size by Country (2020-2025) & (US$ Million)

Table 46. Middle East & Africa Wafer Bumping Service Market Size by Country (2026-2031) & (US$ Million)

Table 47. ASE Global Company Details

Table 48. ASE Global Business Overview

Table 49. ASE Global Wafer Bumping Service Product

Table 50. ASE Global Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 51. ASE Global Recent Development

Table 52. Fujitsu Company Details

Table 53. Fujitsu Business Overview

Table 54. Fujitsu Wafer Bumping Service Product

Table 55. Fujitsu Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 56. Fujitsu Recent Development

Table 57. Amkor Technology Company Details

Table 58. Amkor Technology Business Overview

Table 59. Amkor Technology Wafer Bumping Service Product

Table 60. Amkor Technology Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 61. Amkor Technology Recent Development

Table 62. MacDermid Alpha Electronics Solutions Company Details

Table 63. MacDermid Alpha Electronics Solutions Business Overview

Table 64. MacDermid Alpha Electronics Solutions Wafer Bumping Service Product

Table 65. MacDermid Alpha Electronics Solutions Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 66. MacDermid Alpha Electronics Solutions Recent Development

Table 67. Maxell Company Details

Table 68. Maxell Business Overview

Table 69. Maxell Wafer Bumping Service Product

Table 70. Maxell Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 71. Maxell Recent Development

Table 72. JCET Group Company Details

Table 73. JCET Group Business Overview

Table 74. JCET Group Wafer Bumping Service Product

Table 75. JCET Group Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 76. JCET Group Recent Development

Table 77. Unisem Group Company Details

Table 78. Unisem Group Business Overview

Table 79. Unisem Group Wafer Bumping Service Product

Table 80. Unisem Group Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 81. Unisem Group Recent Development

Table 82. Powertech Technology Company Details

Table 83. Powertech Technology Business Overview

Table 84. Powertech Technology Wafer Bumping Service Product

Table 85. Powertech Technology Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 86. Powertech Technology Recent Development

Table 87. SFA Semicon Company Details

Table 88. SFA Semicon Business Overview

Table 89. SFA Semicon Wafer Bumping Service Product

Table 90. SFA Semicon Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 91. SFA Semicon Recent Development

Table 92. Semi-Pac Inc Company Details

Table 93. Semi-Pac Inc Business Overview

Table 94. Semi-Pac Inc Wafer Bumping Service Product

Table 95. Semi-Pac Inc Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 96. Semi-Pac Inc Recent Development

Table 97. ChipMOS TECHNOLOGIES Company Details

Table 98. ChipMOS TECHNOLOGIES Business Overview

Table 99. ChipMOS TECHNOLOGIES Wafer Bumping Service Product

Table 100. ChipMOS TECHNOLOGIES Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 101. ChipMOS TECHNOLOGIES Recent Development

Table 102. NEPES Company Details

Table 103. NEPES Business Overview

Table 104. NEPES Wafer Bumping Service Product

Table 105. NEPES Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 106. NEPES Recent Development

Table 107. TI Company Details

Table 108. TI Business Overview

Table 109. TI Wafer Bumping Service Product

Table 110. TI Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 111. TI Recent Development

Table 112. International Micro Industries Company Details

Table 113. International Micro Industries Business Overview

Table 114. International Micro Industries Wafer Bumping Service Product

Table 115. International Micro Industries Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 116. International Micro Industries Recent Development

Table 117. Raytek Semiconductor Company Details

Table 118. Raytek Semiconductor Business Overview

Table 119. Raytek Semiconductor Wafer Bumping Service Product

Table 120. Raytek Semiconductor Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 121. Raytek Semiconductor Recent Development

Table 122. Jiangsu CAS Microelectronics Integration Company Details

Table 123. Jiangsu CAS Microelectronics Integration Business Overview

Table 124. Jiangsu CAS Microelectronics Integration Wafer Bumping Service Product

Table 125. Jiangsu CAS Microelectronics Integration Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 126. Jiangsu CAS Microelectronics Integration Recent Development

Table 127. Tianshui Huatian Technology Company Details

Table 128. Tianshui Huatian Technology Business Overview

Table 129. Tianshui Huatian Technology Wafer Bumping Service Product

Table 130. Tianshui Huatian Technology Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 131. Tianshui Huatian Technology Recent Development

Table 132. Chipbond Company Details

Table 133. Chipbond Business Overview

Table 134. Chipbond Wafer Bumping Service Product

Table 135. Chipbond Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 136. Chipbond Recent Development

Table 137. LB Semicon Company Details

Table 138. LB Semicon Business Overview

Table 139. LB Semicon Wafer Bumping Service Product

Table 140. LB Semicon Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 141. LB Semicon Recent Development

Table 142. KYEC Company Details

Table 143. KYEC Business Overview

Table 144. KYEC Wafer Bumping Service Product

Table 145. KYEC Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 146. KYEC Recent Development

Table 147. Union Semiconductor (Hefei) Company Details

Table 148. Union Semiconductor (Hefei) Business Overview

Table 149. Union Semiconductor (Hefei) Wafer Bumping Service Product

Table 150. Union Semiconductor (Hefei) Revenue in Wafer Bumping Service Business (2020-2025) & (US$ Million)

Table 151. Union Semiconductor (Hefei) Recent Development

Table 152. Research Programs/Design for This Report

Table 153. Key Data Information from Secondary Sources

Table 154. Key Data Information from Primary Sources

Table 155. Authors List of This Report

List of Figures

Figure 1. Wafer Bumping Service Picture

Figure 2. Global Wafer Bumping Service Market Size Comparison by Type (2020-2031) & (US$ Million)

Figure 3. Global Wafer Bumping Service Market Share by Type: 2024 VS 2031

Figure 4. Copper Pillar Bumping Features

Figure 5. Solder Bumping Features

Figure 6. Gold Bumping Features

Figure 7. Global Wafer Bumping Service Market Size by Application (2020-2031) & (US$ Million)

Figure 8. Global Wafer Bumping Service Market Share by Application: 2024 VS 2031

Figure 9. 4&6 Inch Case Studies

Figure 10. 8&12 Inch Case Studies

Figure 11. Wafer Bumping Service Report Years Considered

Figure 12. Global Wafer Bumping Service Market Size (US$ Million), Year-over-Year: 2020-2031

Figure 13. Global Wafer Bumping Service Market Size, (US$ Million), 2020 VS 2024 VS 2031

Figure 14. Global Wafer Bumping Service Market Share by Region: 2024 VS 2031

Figure 15. Global Wafer Bumping Service Market Share by Players in 2024

Figure 16. Global Top Wafer Bumping Service Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Bumping Service as of 2024)

Figure 17. The Top 10 and 5 Players Market Share by Wafer Bumping Service Revenue in 2024

Figure 18. North America Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 19. North America Wafer Bumping Service Market Share by Country (2020-2031)

Figure 20. United States Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 21. Canada Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 22. Europe Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 23. Europe Wafer Bumping Service Market Share by Country (2020-2031)

Figure 24. Germany Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 25. France Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 26. U.K. Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 27. Italy Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 28. Russia Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 29. Nordic Countries Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 30. Asia-Pacific Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 31. Asia-Pacific Wafer Bumping Service Market Share by Region (2020-2031)

Figure 32. China Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 33. Japan Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 34. South Korea Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 35. Southeast Asia Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 36. India Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 37. Australia Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 38. Latin America Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 39. Latin America Wafer Bumping Service Market Share by Country (2020-2031)

Figure 40. Mexico Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 41. Brazil Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 42. Middle East & Africa Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 43. Middle East & Africa Wafer Bumping Service Market Share by Country (2020-2031)

Figure 44. Turkey Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 45. Saudi Arabia Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 46. UAE Wafer Bumping Service Market Size YoY Growth (2020-2031) & (US$ Million)

Figure 47. ASE Global Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 48. Fujitsu Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 49. Amkor Technology Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 50. MacDermid Alpha Electronics Solutions Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 51. Maxell Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 52. JCET Group Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 53. Unisem Group Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 54. Powertech Technology Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 55. SFA Semicon Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 56. Semi-Pac Inc Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 57. ChipMOS TECHNOLOGIES Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 58. NEPES Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 59. TI Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 60. International Micro Industries Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 61. Raytek Semiconductor Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 62. Jiangsu CAS Microelectronics Integration Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 63. Tianshui Huatian Technology Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 64. Chipbond Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 65. LB Semicon Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 66. KYEC Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 67. Union Semiconductor (Hefei) Revenue Growth Rate in Wafer Bumping Service Business (2020-2025)

Figure 68. Bottom-up and Top-down Approaches for This Report

Figure 69. Data Triangulation

Figure 70. Key Executives Interviewed

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Global Wafer Bumping Market Research Report 2025

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