Global Liquid Molding Compounds (LMC) Market Research Report 2025

What is the Market Size of Liquid Molding Compounds (LMC)?

1. Liquid Epoxy Encapsulant Materials

• Represent the largest share of the LMC market, accounting for around 55% of demand in 2024.

• Widely used in conventional packaging formats such as Ball Grid Array (BGA) and Quad Flat No-lead (QFN).

• Growth is steady, supported by continuous demand in consumer electronics and automotive applications.

• Innovations focus on reducing thermal stress, improving flowability, and enhancing moisture resistance for reliability in harsh environments.

2. Liquid Epoxy Underfill Materials

• Account for roughly 45% of demand but are the fastest-growing segment.

• Critical in advanced packaging applications such as fan-out wafer level packaging (FOWLP), chip-on-wafer, and 2.5D/3D integrated circuits.

• Expected to grow at a significantly higher CAGR than encapsulants, driven by the expansion of high-density, high-performance packages.

• Latest developments include ultra-low viscosity formulations and higher thermal conductivity underfills designed for AI, networking, and EV chips.

Nagase ChemteX

• Market leader with deep expertise in fan-out wafer-level packaging compounds.

• Recently expanded production capacity, adding a full new LMC line to meet AI and server-related demand.

• Focused on high-value advanced materials and next-generation epoxy formulations.

NAMICS Corporation

• Specialized in advanced underfills and encapsulants.

• Strong customer base in flip-chip and wafer-level packaging markets.

• Continues to innovate in low-stress, fine-pitch materials.

Shin-Etsu Chemical

• Global chemical leader offering a wide range of high-performance epoxy compounds.

• Known for KMC series with low warpage, low cure temperature, and high thermal conductivity.

• Maintains strong market presence in high-reliability packaging for industrial and automotive use.

Eternal Materials

• Fastest-rising competitor, based in Taiwan.

• Successfully qualified as a key LMC and MUF supplier for TSMC, including next-generation Apple processors.

• Poised to challenge Japanese incumbents with competitive, high-performance formulations.

HHCK and Scienchem

• Chinese suppliers expanding within the domestic packaging industry.

• Focused on building local alternatives to Japanese suppliers, though global share remains small.

Wuhan Sanxuan Technology

• Emerging Chinese player with epoxy molding compounds for IC packaging.

• Positioned to benefit from China’s drive for semiconductor self-sufficiency.

• Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
• Chapter 2: Detailed analysis of Liquid Molding Compounds (LMC) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
• Chapter 3: Production/output, value of Liquid Molding Compounds (LMC) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
• Chapter 4: Consumption of Liquid Molding Compounds (LMC) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
• Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
• Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
• Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
• Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
• Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
• Chapter 10: The main points and conclusions of the report.

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