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Global Wafer Grinder (Wafer Thinning Equipment) Market Research Report 2025
Published Date: March 2025
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Report Code: QYRE-Auto-32N11356
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Global Wafer Grinder Wafer Thinning Equipment Market Research Report 2022
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Global Wafer Grinder (Wafer Thinning Equipment) Market Research Report 2025

Code: QYRE-Auto-32N11356
Report
March 2025
Pages:105
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Disco
Tokyo Seimitsu
G&N
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS

Wafer Grinder (Wafer Thinning Equipment) Market Size

The global market for Wafer Grinder (Wafer Thinning Equipment) was valued at US$ 1042 million in the year 2024 and is projected to reach a revised size of US$ 1699 million by 2031, growing at a CAGR of 7.1% during the forecast period.

Wafer Grinder (Wafer Thinning Equipment) Market

Wafer Grinder (Wafer Thinning Equipment) Market

Wafer Grinder (Wafer Thinning Equipment) uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.
The Wafer Grinder (Wafer Thinning Equipment) market, primarily driven by the increasing demand for precision and efficiency in semiconductor manufacturing, is growing rapidly across the globe. Wafer Grinder (Wafer Thinning Equipment)s are integral in wafer thinning processes, where the primary applications include the processing of 200mm and 300mm wafers. Among the various types of Wafer Grinder (Wafer Thinning Equipment)s, the fully automatic Wafer Grinder (Wafer Thinning Equipment)s dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share. The most significant application market is for 300mm wafers, which accounts for 83% of the global demand, primarily driven by the advanced semiconductor manufacturing processes that require thinner wafers with high precision. Geographically, the Asia-Pacific (APAC) region holds the largest consumption share, accounting for about 78% of the global market, driven by the robust semiconductor manufacturing ecosystem in countries like China, Japan, South Korea, and Taiwan.
Manufacturers, like Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. are well-known for the wonderful performance of their Wafer Grinder (Wafer Thinning Equipment) and related services. The top five players account for about 90% of the revenue market in 2024.
Market Drivers:
Technological Advancements in Semiconductor Manufacturing: As the demand for smaller, more powerful, and energy-efficient electronic devices grows, semiconductor manufacturers are continuously advancing their processes to meet these demands. This includes the need for thinner, more precisely engineered wafers, driving the demand for high-performance Wafer Grinder (Wafer Thinning Equipment)s. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s, known for their precision and ability to handle larger volumes, are particularly in demand to meet these stringent manufacturing requirements.
Miniaturization of Electronic Devices: The global trend towards smaller, more compact electronic devices—such as smartphones, wearables, and IoT devices—requires thinner semiconductor wafers. As a result, there is a growing demand for wafer thinning solutions that can maintain high quality while reducing thickness. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s are the preferred solution, as they offer high precision and productivity.
Surge in Semiconductor Demand: The semiconductor industry is experiencing significant growth, driven by the rise in demand for various electronic applications, including computing, communication, and automotive systems. As the industry's focus shifts towards advanced technology nodes, the demand for larger wafers, particularly 300mm wafers, is growing. These trends are contributing to the expansion of the Wafer Grinder (Wafer Thinning Equipment) market, especially in regions such as APAC, which dominate semiconductor manufacturing.
Growth in 300mm Wafer Demand: The 300mm wafer segment is the most significant application for Wafer Grinder (Wafer Thinning Equipment)s, accounting for 83% of the global market share. Larger wafers allow for more chips to be processed at once, reducing manufacturing costs per chip. This increase in 300mm wafer production is a significant growth factor for the Wafer Grinder (Wafer Thinning Equipment) market, as manufacturers need specialized equipment to handle the larger wafers efficiently.
Shift Towards Fully Automated Solutions: Fully automated Wafer Grinder (Wafer Thinning Equipment)s are gaining popularity due to their higher efficiency, reduced labor costs, and the ability to maintain consistency across large batches. As semiconductor manufacturers continue to scale production, automation becomes increasingly essential to meet high-volume production requirements without compromising quality.
Market Restraints:
Despite the strong growth, several factors may restrain the expansion of the Wafer Grinder (Wafer Thinning Equipment) market:
High Initial Investment: Fully automatic Wafer Grinder (Wafer Thinning Equipment)s come with a high initial cost, which could be prohibitive for smaller semiconductor manufacturers or emerging markets with limited capital. Additionally, the cost of maintaining and upgrading these high-tech machines can be a barrier for smaller players who may prefer less expensive, semi-automatic models.
Technological Complexity: Fully automatic Wafer Grinder (Wafer Thinning Equipment)s are highly complex systems that require specialized knowledge to operate, program, and maintain. This could limit the adoption of such systems in regions with a shortage of skilled technicians and engineers. The technical complexity can also result in extended downtime during maintenance or troubleshooting, affecting overall production efficiency.
Conclusion:
The Wafer Grinder (Wafer Thinning Equipment) market is poised for significant growth, driven by advancements in semiconductor manufacturing, the increasing demand for thinner and more precise wafers, and the rise in 300mm wafer processing. Fully automatic Wafer Grinder (Wafer Thinning Equipment)s, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.
The APAC region remains the largest consumer of Wafer Grinder (Wafer Thinning Equipment)s, accounting for 78% of the global market. However, despite these strong growth drivers, challenges such as high initial investment costs and technological complexity may pose barriers to market entry for smaller players. Manufacturers will need to innovate and focus on automation, precision, and cost-effective solutions to capitalize on the growing demand for wafer thinning equipment.
In conclusion, the Wafer Grinder (Wafer Thinning Equipment) market offers abundant opportunities for companies that can provide high-quality, efficient, and cost-effective wafer grinding solutions, particularly those that address the increasing demand for 300mm wafers and advanced semiconductor manufacturing processes.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer Grinder (Wafer Thinning Equipment), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinder (Wafer Thinning Equipment).
The Wafer Grinder (Wafer Thinning Equipment) market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Grinder (Wafer Thinning Equipment) market comprehensively. Regional market sizes, concerning products by Level of Automation, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Grinder (Wafer Thinning Equipment) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Level of Automation, by Application, and by regions.
Market Segmentation

Scope of Wafer Grinder (Wafer Thinning Equipment) Market Report

Report Metric Details
Report Name Wafer Grinder (Wafer Thinning Equipment) Market
Accounted market size in year US$ 1042 million
Forecasted market size in 2031 US$ 1699 million
CAGR 7.1%
Base Year year
Forecasted years 2025 - 2031
by Application
  • 200mm Wafer
  • 300mm Wafer
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation, NTS, by Level of Automation, Fully Automatic, Semi-Automatic
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Level of Automation, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Wafer Grinder (Wafer Thinning Equipment) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Wafer Grinder (Wafer Thinning Equipment) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Wafer Grinder (Wafer Thinning Equipment) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Level of Automation, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Wafer Grinder (Wafer Thinning Equipment) Market growing?

Ans: The Wafer Grinder (Wafer Thinning Equipment) Market witnessing a CAGR of 7.1% during the forecast period 2025-2031.

What is the Wafer Grinder (Wafer Thinning Equipment) Market size in 2031?

Ans: The Wafer Grinder (Wafer Thinning Equipment) Market size in 2031 will be US$ 1699 million.

What is the fully automatic share in Wafer Grinder (Wafer Thinning Equipment) Market?

Ans: Among the various types of Wafer Grinder (Wafer Thinning Equipment)s, the fully automatic Wafer Grinder (Wafer Thinning Equipment)s dominate the market, they have higher automation levels, allowing for increased efficiency and precision, accounting for approximately 52% of the global market share.

What is the market share of major companies in Wafer Grinder (Wafer Thinning Equipment) Market?

Ans: The top five players account for about 90% of the revenue market in 2024.

What is the Fully automatic share in Wafer Grinder (Wafer Thinning Equipment) Market?

Ans: Fully automatic Wafer Grinder (Wafer Thinning Equipment)s, which dominate the market with a 52% share, will continue to lead the market due to their higher efficiency and precision.

What is the Wafer Grinder (Wafer Thinning Equipment) Market share by region?

Ans: The APAC region remains the largest consumer of Wafer Grinder (Wafer Thinning Equipment)s, accounting for 78% of the global market.

Who are the main players in the Wafer Grinder (Wafer Thinning Equipment) Market report?

Ans: The main players in the Wafer Grinder (Wafer Thinning Equipment) Market are Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation, NTS, by Level of Automation, Fully Automatic, Semi-Automatic

What are the Application segmentation covered in the Wafer Grinder (Wafer Thinning Equipment) Market report?

Ans: The Applications covered in the Wafer Grinder (Wafer Thinning Equipment) Market report are 200mm Wafer, 300mm Wafer, Others

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1 Wafer Grinder (Wafer Thinning Equipment) Market Overview
1.1 Product Definition
1.2 Wafer Grinder (Wafer Thinning Equipment) by Level of Automation
1.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Market Value Growth Rate Analysis by Level of Automation: 2024 VS 2031
1.2.2 Fully Automatic
1.2.3 Semi-Automatic
1.3 Wafer Grinder (Wafer Thinning Equipment) by Application
1.3.1 Global Wafer Grinder (Wafer Thinning Equipment) Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 200mm Wafer
1.3.3 300mm Wafer
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Grinder (Wafer Thinning Equipment) Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Wafer Grinder (Wafer Thinning Equipment) Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Wafer Grinder (Wafer Thinning Equipment) Production Estimates and Forecasts (2020-2031)
1.4.4 Global Wafer Grinder (Wafer Thinning Equipment) Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Manufacturers (2020-2025)
2.2 Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Wafer Grinder (Wafer Thinning Equipment), Industry Ranking, 2023 VS 2024
2.4 Global Wafer Grinder (Wafer Thinning Equipment) Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Wafer Grinder (Wafer Thinning Equipment) Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Wafer Grinder (Wafer Thinning Equipment), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Grinder (Wafer Thinning Equipment), Product Offered and Application
2.8 Global Key Manufacturers of Wafer Grinder (Wafer Thinning Equipment), Date of Enter into This Industry
2.9 Wafer Grinder (Wafer Thinning Equipment) Market Competitive Situation and Trends
2.9.1 Wafer Grinder (Wafer Thinning Equipment) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Grinder (Wafer Thinning Equipment) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Grinder (Wafer Thinning Equipment) Production by Region
3.1 Global Wafer Grinder (Wafer Thinning Equipment) Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Region (2020-2031)
3.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Wafer Grinder (Wafer Thinning Equipment) by Region (2026-2031)
3.3 Global Wafer Grinder (Wafer Thinning Equipment) Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Wafer Grinder (Wafer Thinning Equipment) Production Volume by Region (2020-2031)
3.4.1 Global Wafer Grinder (Wafer Thinning Equipment) Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Wafer Grinder (Wafer Thinning Equipment) by Region (2026-2031)
3.5 Global Wafer Grinder (Wafer Thinning Equipment) Market Price Analysis by Region (2020-2025)
3.6 Global Wafer Grinder (Wafer Thinning Equipment) Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Grinder (Wafer Thinning Equipment) Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Wafer Grinder (Wafer Thinning Equipment) Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Wafer Grinder (Wafer Thinning Equipment) Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Wafer Grinder (Wafer Thinning Equipment) Production Value Estimates and Forecasts (2020-2031)
4 Wafer Grinder (Wafer Thinning Equipment) Consumption by Region
4.1 Global Wafer Grinder (Wafer Thinning Equipment) Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Wafer Grinder (Wafer Thinning Equipment) Consumption by Region (2020-2031)
4.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Consumption by Region (2020-2025)
4.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Level of Automation
5.1 Global Wafer Grinder (Wafer Thinning Equipment) Production by Level of Automation (2020-2031)
5.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Production by Level of Automation (2020-2025)
5.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Production by Level of Automation (2026-2031)
5.1.3 Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Level of Automation (2020-2031)
5.2 Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Level of Automation (2020-2031)
5.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Level of Automation (2020-2025)
5.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Level of Automation (2026-2031)
5.2.3 Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Level of Automation (2020-2031)
5.3 Global Wafer Grinder (Wafer Thinning Equipment) Price by Level of Automation (2020-2031)
6 Segment by Application
6.1 Global Wafer Grinder (Wafer Thinning Equipment) Production by Application (2020-2031)
6.1.1 Global Wafer Grinder (Wafer Thinning Equipment) Production by Application (2020-2025)
6.1.2 Global Wafer Grinder (Wafer Thinning Equipment) Production by Application (2026-2031)
6.1.3 Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Application (2020-2031)
6.2 Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Application (2020-2031)
6.2.1 Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Application (2020-2025)
6.2.2 Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Application (2026-2031)
6.2.3 Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Application (2020-2031)
6.3 Global Wafer Grinder (Wafer Thinning Equipment) Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Disco
7.1.1 Disco Wafer Grinder (Wafer Thinning Equipment) Company Information
7.1.2 Disco Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.1.3 Disco Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Disco Main Business and Markets Served
7.1.5 Disco Recent Developments/Updates
7.2 TOKYO SEIMITSU
7.2.1 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Company Information
7.2.2 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.2.3 TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.2.4 TOKYO SEIMITSU Main Business and Markets Served
7.2.5 TOKYO SEIMITSU Recent Developments/Updates
7.3 G&N
7.3.1 G&N Wafer Grinder (Wafer Thinning Equipment) Company Information
7.3.2 G&N Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.3.3 G&N Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.3.4 G&N Main Business and Markets Served
7.3.5 G&N Recent Developments/Updates
7.4 Okamoto Semiconductor Equipment Division
7.4.1 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Company Information
7.4.2 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.4.3 Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Okamoto Semiconductor Equipment Division Main Business and Markets Served
7.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
7.5 CETC
7.5.1 CETC Wafer Grinder (Wafer Thinning Equipment) Company Information
7.5.2 CETC Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.5.3 CETC Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.5.4 CETC Main Business and Markets Served
7.5.5 CETC Recent Developments/Updates
7.6 Koyo Machinery
7.6.1 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Company Information
7.6.2 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.6.3 Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Koyo Machinery Main Business and Markets Served
7.6.5 Koyo Machinery Recent Developments/Updates
7.7 Revasum
7.7.1 Revasum Wafer Grinder (Wafer Thinning Equipment) Company Information
7.7.2 Revasum Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.7.3 Revasum Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Revasum Main Business and Markets Served
7.7.5 Revasum Recent Developments/Updates
7.8 WAIDA MFG
7.8.1 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Company Information
7.8.2 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.8.3 WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.8.4 WAIDA MFG Main Business and Markets Served
7.8.5 WAIDA MFG Recent Developments/Updates
7.9 Hunan Yujing Machine Industrial
7.9.1 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Company Information
7.9.2 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.9.3 Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Hunan Yujing Machine Industrial Main Business and Markets Served
7.9.5 Hunan Yujing Machine Industrial Recent Developments/Updates
7.10 SpeedFam
7.10.1 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Company Information
7.10.2 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.10.3 SpeedFam Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.10.4 SpeedFam Main Business and Markets Served
7.10.5 SpeedFam Recent Developments/Updates
7.11 TSD
7.11.1 TSD Wafer Grinder (Wafer Thinning Equipment) Company Information
7.11.2 TSD Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.11.3 TSD Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.11.4 TSD Main Business and Markets Served
7.11.5 TSD Recent Developments/Updates
7.12 Engis Corporation
7.12.1 Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Company Information
7.12.2 Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.12.3 Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Engis Corporation Main Business and Markets Served
7.12.5 Engis Corporation Recent Developments/Updates
7.13 NTS
7.13.1 NTS Wafer Grinder (Wafer Thinning Equipment) Company Information
7.13.2 NTS Wafer Grinder (Wafer Thinning Equipment) Product Portfolio
7.13.3 NTS Wafer Grinder (Wafer Thinning Equipment) Production, Value, Price and Gross Margin (2020-2025)
7.13.4 NTS Main Business and Markets Served
7.13.5 NTS Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Grinder (Wafer Thinning Equipment) Industry Chain Analysis
8.2 Wafer Grinder (Wafer Thinning Equipment) Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Grinder (Wafer Thinning Equipment) Production Mode & Process Analysis
8.4 Wafer Grinder (Wafer Thinning Equipment) Sales and Marketing
8.4.1 Wafer Grinder (Wafer Thinning Equipment) Sales Channels
8.4.2 Wafer Grinder (Wafer Thinning Equipment) Distributors
8.5 Wafer Grinder (Wafer Thinning Equipment) Customer Analysis
9 Wafer Grinder (Wafer Thinning Equipment) Market Dynamics
9.1 Wafer Grinder (Wafer Thinning Equipment) Industry Trends
9.2 Wafer Grinder (Wafer Thinning Equipment) Market Drivers
9.3 Wafer Grinder (Wafer Thinning Equipment) Market Challenges
9.4 Wafer Grinder (Wafer Thinning Equipment) Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
Disco
Tokyo Seimitsu
G&N
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
TSD
Engis Corporation
NTS
List of Tables
 Table 1. Global Wafer Grinder (Wafer Thinning Equipment) Market Value by Level of Automation, (US$ Million) & (2024 VS 2031)
 Table 2. Global Wafer Grinder (Wafer Thinning Equipment) Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Wafer Grinder (Wafer Thinning Equipment) Production Capacity (Units) by Manufacturers in 2024
 Table 4. Global Wafer Grinder (Wafer Thinning Equipment) Production by Manufacturers (2020-2025) & (Units)
 Table 5. Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Wafer Grinder (Wafer Thinning Equipment), Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Wafer Grinder (Wafer Thinning Equipment) as of 2024)
 Table 10. Global Market Wafer Grinder (Wafer Thinning Equipment) Average Price by Manufacturers (K US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Wafer Grinder (Wafer Thinning Equipment), Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Wafer Grinder (Wafer Thinning Equipment), Product Offered and Application
 Table 13. Global Key Manufacturers of Wafer Grinder (Wafer Thinning Equipment), Date of Enter into This Industry
 Table 14. Global Wafer Grinder (Wafer Thinning Equipment) Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Region (2020-2025)
 Table 19. Global Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Wafer Grinder (Wafer Thinning Equipment) Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)
 Table 22. Global Wafer Grinder (Wafer Thinning Equipment) Production (Units) by Region (2020-2025)
 Table 23. Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Region (2020-2025)
 Table 24. Global Wafer Grinder (Wafer Thinning Equipment) Production (Units) Forecast by Region (2026-2031)
 Table 25. Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Wafer Grinder (Wafer Thinning Equipment) Market Average Price (K US$/Unit) by Region (2020-2025)
 Table 27. Global Wafer Grinder (Wafer Thinning Equipment) Market Average Price (K US$/Unit) by Region (2026-2031)
 Table 28. Global Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)
 Table 29. Global Wafer Grinder (Wafer Thinning Equipment) Consumption by Region (2020-2025) & (Units)
 Table 30. Global Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share by Region (2020-2025)
 Table 31. Global Wafer Grinder (Wafer Thinning Equipment) Forecasted Consumption by Region (2026-2031) & (Units)
 Table 32. Global Wafer Grinder (Wafer Thinning Equipment) Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 34. North America Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2020-2025) & (Units)
 Table 35. North America Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2026-2031) & (Units)
 Table 36. Europe Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 37. Europe Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2020-2025) & (Units)
 Table 38. Europe Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2026-2031) & (Units)
 Table 39. Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)
 Table 40. Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption by Region (2020-2025) & (Units)
 Table 41. Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption by Region (2026-2031) & (Units)
 Table 42. Latin America, Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 43. Latin America, Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2020-2025) & (Units)
 Table 44. Latin America, Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption by Country (2026-2031) & (Units)
 Table 45. Global Wafer Grinder (Wafer Thinning Equipment) Production (Units) by Level of Automation (2020-2025)
 Table 46. Global Wafer Grinder (Wafer Thinning Equipment) Production (Units) by Level of Automation (2026-2031)
 Table 47. Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Level of Automation (2020-2025)
 Table 48. Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Level of Automation (2026-2031)
 Table 49. Global Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) by Level of Automation (2020-2025)
 Table 50. Global Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) by Level of Automation (2026-2031)
 Table 51. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Level of Automation (2020-2025)
 Table 52. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Level of Automation (2026-2031)
 Table 53. Global Wafer Grinder (Wafer Thinning Equipment) Price (K US$/Unit) by Level of Automation (2020-2025)
 Table 54. Global Wafer Grinder (Wafer Thinning Equipment) Price (K US$/Unit) by Level of Automation (2026-2031)
 Table 55. Global Wafer Grinder (Wafer Thinning Equipment) Production (Units) by Application (2020-2025)
 Table 56. Global Wafer Grinder (Wafer Thinning Equipment) Production (Units) by Application (2026-2031)
 Table 57. Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Application (2020-2025)
 Table 58. Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Application (2026-2031)
 Table 59. Global Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Application (2020-2025)
 Table 62. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Application (2026-2031)
 Table 63. Global Wafer Grinder (Wafer Thinning Equipment) Price (K US$/Unit) by Application (2020-2025)
 Table 64. Global Wafer Grinder (Wafer Thinning Equipment) Price (K US$/Unit) by Application (2026-2031)
 Table 65. Disco Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 66. Disco Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 67. Disco Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 68. Disco Main Business and Markets Served
 Table 69. Disco Recent Developments/Updates
 Table 70. TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 71. TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 72. TOKYO SEIMITSU Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 73. TOKYO SEIMITSU Main Business and Markets Served
 Table 74. TOKYO SEIMITSU Recent Developments/Updates
 Table 75. G&N Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 76. G&N Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 77. G&N Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 78. G&N Main Business and Markets Served
 Table 79. G&N Recent Developments/Updates
 Table 80. Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 81. Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 82. Okamoto Semiconductor Equipment Division Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 83. Okamoto Semiconductor Equipment Division Main Business and Markets Served
 Table 84. Okamoto Semiconductor Equipment Division Recent Developments/Updates
 Table 85. CETC Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 86. CETC Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 87. CETC Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 88. CETC Main Business and Markets Served
 Table 89. CETC Recent Developments/Updates
 Table 90. Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 91. Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 92. Koyo Machinery Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 93. Koyo Machinery Main Business and Markets Served
 Table 94. Koyo Machinery Recent Developments/Updates
 Table 95. Revasum Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 96. Revasum Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 97. Revasum Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 98. Revasum Main Business and Markets Served
 Table 99. Revasum Recent Developments/Updates
 Table 100. WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 101. WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 102. WAIDA MFG Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 103. WAIDA MFG Main Business and Markets Served
 Table 104. WAIDA MFG Recent Developments/Updates
 Table 105. Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 106. Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 107. Hunan Yujing Machine Industrial Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 108. Hunan Yujing Machine Industrial Main Business and Markets Served
 Table 109. Hunan Yujing Machine Industrial Recent Developments/Updates
 Table 110. SpeedFam Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 111. SpeedFam Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 112. SpeedFam Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 113. SpeedFam Main Business and Markets Served
 Table 114. SpeedFam Recent Developments/Updates
 Table 115. TSD Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 116. TSD Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 117. TSD Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 118. TSD Main Business and Markets Served
 Table 119. TSD Recent Developments/Updates
 Table 120. Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 121. Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 122. Engis Corporation Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 123. Engis Corporation Main Business and Markets Served
 Table 124. Engis Corporation Recent Developments/Updates
 Table 125. NTS Wafer Grinder (Wafer Thinning Equipment) Company Information
 Table 126. NTS Wafer Grinder (Wafer Thinning Equipment) Specification and Application
 Table 127. NTS Wafer Grinder (Wafer Thinning Equipment) Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 128. NTS Main Business and Markets Served
 Table 129. NTS Recent Developments/Updates
 Table 130. Key Raw Materials Lists
 Table 131. Raw Materials Key Suppliers Lists
 Table 132. Wafer Grinder (Wafer Thinning Equipment) Distributors List
 Table 133. Wafer Grinder (Wafer Thinning Equipment) Customers List
 Table 134. Wafer Grinder (Wafer Thinning Equipment) Market Trends
 Table 135. Wafer Grinder (Wafer Thinning Equipment) Market Drivers
 Table 136. Wafer Grinder (Wafer Thinning Equipment) Market Challenges
 Table 137. Wafer Grinder (Wafer Thinning Equipment) Market Restraints
 Table 138. Research Programs/Design for This Report
 Table 139. Key Data Information from Secondary Sources
 Table 140. Key Data Information from Primary Sources
 Table 141. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Wafer Grinder (Wafer Thinning Equipment)
 Figure 2. Global Wafer Grinder (Wafer Thinning Equipment) Market Value by Level of Automation, (US$ Million) & (2020-2031)
 Figure 3. Global Wafer Grinder (Wafer Thinning Equipment) Market Share by Level of Automation: 2024 VS 2031
 Figure 4. Fully Automatic Product Picture
 Figure 5. Semi-Automatic Product Picture
 Figure 6. Global Wafer Grinder (Wafer Thinning Equipment) Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global Wafer Grinder (Wafer Thinning Equipment) Market Share by Application: 2024 VS 2031
 Figure 8. 200mm Wafer
 Figure 9. 300mm Wafer
 Figure 10. Others
 Figure 11. Global Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 12. Global Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) & (2020-2031)
 Figure 13. Global Wafer Grinder (Wafer Thinning Equipment) Production Capacity (Units) & (2020-2031)
 Figure 14. Global Wafer Grinder (Wafer Thinning Equipment) Production (Units) & (2020-2031)
 Figure 15. Global Wafer Grinder (Wafer Thinning Equipment) Average Price (K US$/Unit) & (2020-2031)
 Figure 16. Wafer Grinder (Wafer Thinning Equipment) Report Years Considered
 Figure 17. Wafer Grinder (Wafer Thinning Equipment) Production Share by Manufacturers in 2024
 Figure 18. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Share by Manufacturers (2024)
 Figure 19. Wafer Grinder (Wafer Thinning Equipment) Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 20. The Global 5 and 10 Largest Players: Market Share by Wafer Grinder (Wafer Thinning Equipment) Revenue in 2024
 Figure 21. Global Wafer Grinder (Wafer Thinning Equipment) Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 22. Global Wafer Grinder (Wafer Thinning Equipment) Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 23. Global Wafer Grinder (Wafer Thinning Equipment) Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)
 Figure 24. Global Wafer Grinder (Wafer Thinning Equipment) Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 25. North America Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 26. Europe Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. China Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Japan Wafer Grinder (Wafer Thinning Equipment) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Global Wafer Grinder (Wafer Thinning Equipment) Consumption by Region: 2020 VS 2024 VS 2031 (Units)
 Figure 30. Global Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 31. North America Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 32. North America Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share by Country (2020-2031)
 Figure 33. U.S. Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 34. Canada Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 35. Europe Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 36. Europe Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share by Country (2020-2031)
 Figure 37. Germany Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 38. France Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 39. U.K. Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 40. Italy Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 41. Netherlands Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 42. Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 43. Asia Pacific Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share by Region (2020-2031)
 Figure 44. China Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 45. Japan Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 46. South Korea Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 47. China Taiwan Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 48. Southeast Asia Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 49. India Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 50. Latin America, Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 51. Latin America, Middle East & Africa Wafer Grinder (Wafer Thinning Equipment) Consumption Market Share by Country (2020-2031)
 Figure 52. Mexico Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 53. Brazil Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 54. Israel Wafer Grinder (Wafer Thinning Equipment) Consumption and Growth Rate (2020-2031) & (Units)
 Figure 55. Global Production Market Share of Wafer Grinder (Wafer Thinning Equipment) by Level of Automation (2020-2031)
 Figure 56. Global Production Value Market Share of Wafer Grinder (Wafer Thinning Equipment) by Level of Automation (2020-2031)
 Figure 57. Global Wafer Grinder (Wafer Thinning Equipment) Price (K US$/Unit) by Level of Automation (2020-2031)
 Figure 58. Global Production Market Share of Wafer Grinder (Wafer Thinning Equipment) by Application (2020-2031)
 Figure 59. Global Production Value Market Share of Wafer Grinder (Wafer Thinning Equipment) by Application (2020-2031)
 Figure 60. Global Wafer Grinder (Wafer Thinning Equipment) Price (K US$/Unit) by Application (2020-2031)
 Figure 61. Wafer Grinder (Wafer Thinning Equipment) Value Chain
 Figure 62. Channels of Distribution (Direct Vs Distribution)
 Figure 63. Bottom-up and Top-down Approaches for This Report
 Figure 64. Data Triangulation
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