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Global Fully Automatic Semiconductor Molding Machine Market Research Report 2025

Published Date: February 2025

Report Code: QYRE-Auto-11R12491

Global Fully Automatic Semiconductor Molding Machine Market Research Report 2022

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Global Fully Automatic Semiconductor Molding Machine Market Research Report 2025

Code: QYRE-Auto-11R12491

Report

February 2025

Pages:98

QYResearch

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DESCRIPTION

TABLE OF CONTENT

TABLES & FIGURES

FEATURED COMPANIES

TOWA

Besi

APIC YAMADA

Asahi Engineering

ASMPT

I-PEX Inc

Tongling Trinity Technology

Shanghai Xinsheng

Mtex Matsumura

Nextool Technology Co., Ltd.

Suzhou Bopai Semiconductor (Boschman)

Anhui Zhonghe

Fully Automatic Semiconductor Molding Machine Market Size

The global market for Fully Automatic Semiconductor Molding Machine was valued at US$ 442 million in the year 2024 and is projected to reach a revised size of US$ 710 million by 2031, growing at a CAGR of 7.1% during the forecast period.

Fully Automatic Semiconductor Molding Machine Market

The semiconductor production process includes wafer manufacturing, wafer testing, chip packaging testing and other links. Packaging refers to the process of cutting, wire bonding, molding, trimming and other processes of the processed wafers to enable the integrated circuit to achieve electrical and signal connections with external devices, while providing physical and chemical protection for the integrated circuit. Plastic encapsulation is to protect the chip by injecting liquid resin around the semiconductor chip from the gate and solidifying it.

The roles of Molding products in semiconductor packaging are as follows:

1. Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging.

2. Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged.

3. Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it.

4. Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.

Semiconductor packaging equipment plays a vital role in the semiconductor manufacturing process, especially in the molding process, ensuring that the chip is protected, the stability of the electrical connection to the external circuit board and enhanced mechanical stability.

In various regions around the world, Semiconductor Molding Systems production areas are mainly distributed in Japan and China, with Japan occupying the majority of the market share. There are still certain differences between China Molding Systems and international leading companies (such as TOWA) in terms of product performance and packaging technology. However, as Chinese companies have continued to achieve breakthroughs in product development technology in recent years, some companies have also occupied a certain market share in the advanced packaging market, such as Tongling Trinity Technology.

The degree of automation of Molding Systems determines the cost of the entire packaging process, such as labor costs and packaging raw material costs. Prices vary greatly between different products, mainly depending on the Press. The greater the number of Presses, the more expensive the price. At present, the share of fully automatic systems is relatively large, reaching 64% in 2023, and is expected to reach 67% by 2030, and will gradually replace manual Molding Systems.

Global Semiconductor Molding Systems companies are mainly located in Japan, China, and Europe. Core companies include Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, etc., among which the Top 3 market share is nearly 77%. The competition in the fully automatic market is fierce, and the main market share is concentrated in the hands of leading companies.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Fully Automatic Semiconductor Molding Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fully Automatic Semiconductor Molding Machine.

The Fully Automatic Semiconductor Molding Machine market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Fully Automatic Semiconductor Molding Machine market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Fully Automatic Semiconductor Molding Machine manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Fully Automatic Semiconductor Molding Machine Market Report

Report Metric	Details
Report Name	Fully Automatic Semiconductor Molding Machine Market
Accounted market size in year	US$ 442 million
Forecasted market size in 2031	US$ 710 million
CAGR	7.1%
Base Year	year
Forecasted years	2025 - 2031
by Type	T-Molding C-Molding
by Application	Advanced Packaging Traditional Packaging
Production by Region	Japan Europe China
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, Shanghai Xinsheng, Mtex Matsumura, Asahi Engineering, Nextool Technology Co., Ltd., APIC YAMADA, Suzhou Bopai Semiconductor (Boschman), Anhui Zhonghe
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Fully Automatic Semiconductor Molding Machine manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Fully Automatic Semiconductor Molding Machine by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Fully Automatic Semiconductor Molding Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Fully Automatic Semiconductor Molding Machine Market growing?

Ans: The Fully Automatic Semiconductor Molding Machine Market witnessing a CAGR of 7.1% during the forecast period 2025-2031.

What is the Fully Automatic Semiconductor Molding Machine Market size in 2031?

Ans: The Fully Automatic Semiconductor Molding Machine Market size in 2031 will be US$ 710 million.

What is the market share of major companies in Fully Automatic Semiconductor Molding Machine Market?

Ans: Core companies include Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, etc., among which the Top 3 market share is nearly 77%.

Who are the main players in the Fully Automatic Semiconductor Molding Machine Market report?

Ans: The main players in the Fully Automatic Semiconductor Molding Machine Market are Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, Shanghai Xinsheng, Mtex Matsumura, Asahi Engineering, Nextool Technology Co., Ltd., APIC YAMADA, Suzhou Bopai Semiconductor (Boschman), Anhui Zhonghe

What are the Application segmentation covered in the Fully Automatic Semiconductor Molding Machine Market report?

Ans: The Applications covered in the Fully Automatic Semiconductor Molding Machine Market report are Advanced Packaging, Traditional Packaging

What are the Type segmentation covered in the Fully Automatic Semiconductor Molding Machine Market report?

Ans: The Types covered in the Fully Automatic Semiconductor Molding Machine Market report are T-Molding, C-Molding

Recommended Reports

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1 Fully Automatic Semiconductor Molding Machine Market Overview

1.1 Product Definition

1.2 Fully Automatic Semiconductor Molding Machine by Type

1.2.1 Global Fully Automatic Semiconductor Molding Machine Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 T-Molding

1.2.3 C-Molding

1.3 Fully Automatic Semiconductor Molding Machine by Application

1.3.1 Global Fully Automatic Semiconductor Molding Machine Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 Advanced Packaging

1.3.3 Traditional Packaging

1.4 Global Market Growth Prospects

1.4.1 Global Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Fully Automatic Semiconductor Molding Machine Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Fully Automatic Semiconductor Molding Machine Production Estimates and Forecasts (2020-2031)

1.4.4 Global Fully Automatic Semiconductor Molding Machine Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Fully Automatic Semiconductor Molding Machine Production Market Share by Manufacturers (2020-2025)

2.2 Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Fully Automatic Semiconductor Molding Machine, Industry Ranking, 2023 VS 2024

2.4 Global Fully Automatic Semiconductor Molding Machine Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Fully Automatic Semiconductor Molding Machine Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Product Offered and Application

2.8 Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Date of Enter into This Industry

2.9 Fully Automatic Semiconductor Molding Machine Market Competitive Situation and Trends

2.9.1 Fully Automatic Semiconductor Molding Machine Market Concentration Rate

2.9.2 Global 5 and 10 Largest Fully Automatic Semiconductor Molding Machine Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Fully Automatic Semiconductor Molding Machine Production by Region

3.1 Global Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Region (2020-2031)

3.2.1 Global Fully Automatic Semiconductor Molding Machine Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Fully Automatic Semiconductor Molding Machine by Region (2026-2031)

3.3 Global Fully Automatic Semiconductor Molding Machine Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Fully Automatic Semiconductor Molding Machine Production Volume by Region (2020-2031)

3.4.1 Global Fully Automatic Semiconductor Molding Machine Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Fully Automatic Semiconductor Molding Machine by Region (2026-2031)

3.5 Global Fully Automatic Semiconductor Molding Machine Market Price Analysis by Region (2020-2025)

3.6 Global Fully Automatic Semiconductor Molding Machine Production and Value, Year-over-Year Growth

3.6.1 Japan Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Fully Automatic Semiconductor Molding Machine Production Value Estimates and Forecasts (2020-2031)

4 Fully Automatic Semiconductor Molding Machine Consumption by Region

4.1 Global Fully Automatic Semiconductor Molding Machine Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Fully Automatic Semiconductor Molding Machine Consumption by Region (2020-2031)

4.2.1 Global Fully Automatic Semiconductor Molding Machine Consumption by Region (2020-2025)

4.2.2 Global Fully Automatic Semiconductor Molding Machine Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global Fully Automatic Semiconductor Molding Machine Production by Type (2020-2031)

5.1.1 Global Fully Automatic Semiconductor Molding Machine Production by Type (2020-2025)

5.1.2 Global Fully Automatic Semiconductor Molding Machine Production by Type (2026-2031)

5.1.3 Global Fully Automatic Semiconductor Molding Machine Production Market Share by Type (2020-2031)

5.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Type (2020-2031)

5.2.1 Global Fully Automatic Semiconductor Molding Machine Production Value by Type (2020-2025)

5.2.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Type (2026-2031)

5.2.3 Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Type (2020-2031)

5.3 Global Fully Automatic Semiconductor Molding Machine Price by Type (2020-2031)

6 Segment by Application

6.1 Global Fully Automatic Semiconductor Molding Machine Production by Application (2020-2031)

6.1.1 Global Fully Automatic Semiconductor Molding Machine Production by Application (2020-2025)

6.1.2 Global Fully Automatic Semiconductor Molding Machine Production by Application (2026-2031)

6.1.3 Global Fully Automatic Semiconductor Molding Machine Production Market Share by Application (2020-2031)

6.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Application (2020-2031)

6.2.1 Global Fully Automatic Semiconductor Molding Machine Production Value by Application (2020-2025)

6.2.2 Global Fully Automatic Semiconductor Molding Machine Production Value by Application (2026-2031)

6.2.3 Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Application (2020-2031)

6.3 Global Fully Automatic Semiconductor Molding Machine Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Towa

7.1.1 Towa Fully Automatic Semiconductor Molding Machine Company Information

7.1.2 Towa Fully Automatic Semiconductor Molding Machine Product Portfolio

7.1.3 Towa Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Towa Main Business and Markets Served

7.1.5 Towa Recent Developments/Updates

7.2 Besi

7.2.1 Besi Fully Automatic Semiconductor Molding Machine Company Information

7.2.2 Besi Fully Automatic Semiconductor Molding Machine Product Portfolio

7.2.3 Besi Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.2.4 Besi Main Business and Markets Served

7.2.5 Besi Recent Developments/Updates

7.3 ASMPT

7.3.1 ASMPT Fully Automatic Semiconductor Molding Machine Company Information

7.3.2 ASMPT Fully Automatic Semiconductor Molding Machine Product Portfolio

7.3.3 ASMPT Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.3.4 ASMPT Main Business and Markets Served

7.3.5 ASMPT Recent Developments/Updates

7.4 I-PEX Inc

7.4.1 I-PEX Inc Fully Automatic Semiconductor Molding Machine Company Information

7.4.2 I-PEX Inc Fully Automatic Semiconductor Molding Machine Product Portfolio

7.4.3 I-PEX Inc Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.4.4 I-PEX Inc Main Business and Markets Served

7.4.5 I-PEX Inc Recent Developments/Updates

7.5 Tongling Trinity Technology

7.5.1 Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Company Information

7.5.2 Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Product Portfolio

7.5.3 Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Tongling Trinity Technology Main Business and Markets Served

7.5.5 Tongling Trinity Technology Recent Developments/Updates

7.6 Shanghai Xinsheng

7.6.1 Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Company Information

7.6.2 Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Product Portfolio

7.6.3 Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Shanghai Xinsheng Main Business and Markets Served

7.6.5 Shanghai Xinsheng Recent Developments/Updates

7.7 Mtex Matsumura

7.7.1 Mtex Matsumura Fully Automatic Semiconductor Molding Machine Company Information

7.7.2 Mtex Matsumura Fully Automatic Semiconductor Molding Machine Product Portfolio

7.7.3 Mtex Matsumura Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Mtex Matsumura Main Business and Markets Served

7.7.5 Mtex Matsumura Recent Developments/Updates

7.8 Asahi Engineering

7.8.1 Asahi Engineering Fully Automatic Semiconductor Molding Machine Company Information

7.8.2 Asahi Engineering Fully Automatic Semiconductor Molding Machine Product Portfolio

7.8.3 Asahi Engineering Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Asahi Engineering Main Business and Markets Served

7.8.5 Asahi Engineering Recent Developments/Updates

7.9 Nextool Technology Co., Ltd.

7.9.1 Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Company Information

7.9.2 Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Product Portfolio

7.9.3 Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.9.4 Nextool Technology Co., Ltd. Main Business and Markets Served

7.9.5 Nextool Technology Co., Ltd. Recent Developments/Updates

7.10 APIC YAMADA

7.10.1 APIC YAMADA Fully Automatic Semiconductor Molding Machine Company Information

7.10.2 APIC YAMADA Fully Automatic Semiconductor Molding Machine Product Portfolio

7.10.3 APIC YAMADA Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.10.4 APIC YAMADA Main Business and Markets Served

7.10.5 APIC YAMADA Recent Developments/Updates

7.11 Suzhou Bopai Semiconductor (Boschman)

7.11.1 Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Company Information

7.11.2 Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Product Portfolio

7.11.3 Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.11.4 Suzhou Bopai Semiconductor (Boschman) Main Business and Markets Served

7.11.5 Suzhou Bopai Semiconductor (Boschman) Recent Developments/Updates

7.12 Anhui Zhonghe

7.12.1 Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Company Information

7.12.2 Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Product Portfolio

7.12.3 Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Production, Value, Price and Gross Margin (2020-2025)

7.12.4 Anhui Zhonghe Main Business and Markets Served

7.12.5 Anhui Zhonghe Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Fully Automatic Semiconductor Molding Machine Industry Chain Analysis

8.2 Fully Automatic Semiconductor Molding Machine Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Fully Automatic Semiconductor Molding Machine Production Mode & Process Analysis

8.4 Fully Automatic Semiconductor Molding Machine Sales and Marketing

8.4.1 Fully Automatic Semiconductor Molding Machine Sales Channels

8.4.2 Fully Automatic Semiconductor Molding Machine Distributors

8.5 Fully Automatic Semiconductor Molding Machine Customer Analysis

9 Fully Automatic Semiconductor Molding Machine Market Dynamics

9.1 Fully Automatic Semiconductor Molding Machine Industry Trends

9.2 Fully Automatic Semiconductor Molding Machine Market Drivers

9.3 Fully Automatic Semiconductor Molding Machine Market Challenges

9.4 Fully Automatic Semiconductor Molding Machine Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

TOWA

Besi

APIC YAMADA

Asahi Engineering

ASMPT

I-PEX Inc

Tongling Trinity Technology

Shanghai Xinsheng

Mtex Matsumura

Nextool Technology Co., Ltd.

Suzhou Bopai Semiconductor (Boschman)

Anhui Zhonghe

List of Tables

Table 1. Global Fully Automatic Semiconductor Molding Machine Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Fully Automatic Semiconductor Molding Machine Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Fully Automatic Semiconductor Molding Machine Production Capacity (Units) by Manufacturers in 2024

Table 4. Global Fully Automatic Semiconductor Molding Machine Production by Manufacturers (2020-2025) & (Units)

Table 5. Global Fully Automatic Semiconductor Molding Machine Production Market Share by Manufacturers (2020-2025)

Table 6. Global Fully Automatic Semiconductor Molding Machine Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Fully Automatic Semiconductor Molding Machine Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Fully Automatic Semiconductor Molding Machine, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Fully Automatic Semiconductor Molding Machine as of 2024)

Table 10. Global Market Fully Automatic Semiconductor Molding Machine Average Price by Manufacturers (K US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Product Offered and Application

Table 13. Global Key Manufacturers of Fully Automatic Semiconductor Molding Machine, Date of Enter into This Industry

Table 14. Global Fully Automatic Semiconductor Molding Machine Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Fully Automatic Semiconductor Molding Machine Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Region (2020-2025)

Table 19. Global Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Fully Automatic Semiconductor Molding Machine Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Fully Automatic Semiconductor Molding Machine Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global Fully Automatic Semiconductor Molding Machine Production (Units) by Region (2020-2025)

Table 23. Global Fully Automatic Semiconductor Molding Machine Production Market Share by Region (2020-2025)

Table 24. Global Fully Automatic Semiconductor Molding Machine Production (Units) Forecast by Region (2026-2031)

Table 25. Global Fully Automatic Semiconductor Molding Machine Production Market Share Forecast by Region (2026-2031)

Table 26. Global Fully Automatic Semiconductor Molding Machine Market Average Price (K US$/Unit) by Region (2020-2025)

Table 27. Global Fully Automatic Semiconductor Molding Machine Market Average Price (K US$/Unit) by Region (2026-2031)

Table 28. Global Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global Fully Automatic Semiconductor Molding Machine Consumption by Region (2020-2025) & (Units)

Table 30. Global Fully Automatic Semiconductor Molding Machine Consumption Market Share by Region (2020-2025)

Table 31. Global Fully Automatic Semiconductor Molding Machine Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global Fully Automatic Semiconductor Molding Machine Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2025) & (Units)

Table 35. North America Fully Automatic Semiconductor Molding Machine Consumption by Country (2026-2031) & (Units)

Table 36. Europe Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2025) & (Units)

Table 38. Europe Fully Automatic Semiconductor Molding Machine Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption by Country (2026-2031) & (Units)

Table 45. Global Fully Automatic Semiconductor Molding Machine Production (Units) by Type (2020-2025)

Table 46. Global Fully Automatic Semiconductor Molding Machine Production (Units) by Type (2026-2031)

Table 47. Global Fully Automatic Semiconductor Molding Machine Production Market Share by Type (2020-2025)

Table 48. Global Fully Automatic Semiconductor Molding Machine Production Market Share by Type (2026-2031)

Table 49. Global Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Type (2020-2025)

Table 52. Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Type (2026-2031)

Table 53. Global Fully Automatic Semiconductor Molding Machine Price (K US$/Unit) by Type (2020-2025)

Table 54. Global Fully Automatic Semiconductor Molding Machine Price (K US$/Unit) by Type (2026-2031)

Table 55. Global Fully Automatic Semiconductor Molding Machine Production (Units) by Application (2020-2025)

Table 56. Global Fully Automatic Semiconductor Molding Machine Production (Units) by Application (2026-2031)

Table 57. Global Fully Automatic Semiconductor Molding Machine Production Market Share by Application (2020-2025)

Table 58. Global Fully Automatic Semiconductor Molding Machine Production Market Share by Application (2026-2031)

Table 59. Global Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Application (2020-2025)

Table 62. Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Application (2026-2031)

Table 63. Global Fully Automatic Semiconductor Molding Machine Price (K US$/Unit) by Application (2020-2025)

Table 64. Global Fully Automatic Semiconductor Molding Machine Price (K US$/Unit) by Application (2026-2031)

Table 65. Towa Fully Automatic Semiconductor Molding Machine Company Information

Table 66. Towa Fully Automatic Semiconductor Molding Machine Specification and Application

Table 67. Towa Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 68. Towa Main Business and Markets Served

Table 69. Towa Recent Developments/Updates

Table 70. Besi Fully Automatic Semiconductor Molding Machine Company Information

Table 71. Besi Fully Automatic Semiconductor Molding Machine Specification and Application

Table 72. Besi Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 73. Besi Main Business and Markets Served

Table 74. Besi Recent Developments/Updates

Table 75. ASMPT Fully Automatic Semiconductor Molding Machine Company Information

Table 76. ASMPT Fully Automatic Semiconductor Molding Machine Specification and Application

Table 77. ASMPT Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 78. ASMPT Main Business and Markets Served

Table 79. ASMPT Recent Developments/Updates

Table 80. I-PEX Inc Fully Automatic Semiconductor Molding Machine Company Information

Table 81. I-PEX Inc Fully Automatic Semiconductor Molding Machine Specification and Application

Table 82. I-PEX Inc Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 83. I-PEX Inc Main Business and Markets Served

Table 84. I-PEX Inc Recent Developments/Updates

Table 85. Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Company Information

Table 86. Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Specification and Application

Table 87. Tongling Trinity Technology Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 88. Tongling Trinity Technology Main Business and Markets Served

Table 89. Tongling Trinity Technology Recent Developments/Updates

Table 90. Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Company Information

Table 91. Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Specification and Application

Table 92. Shanghai Xinsheng Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 93. Shanghai Xinsheng Main Business and Markets Served

Table 94. Shanghai Xinsheng Recent Developments/Updates

Table 95. Mtex Matsumura Fully Automatic Semiconductor Molding Machine Company Information

Table 96. Mtex Matsumura Fully Automatic Semiconductor Molding Machine Specification and Application

Table 97. Mtex Matsumura Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 98. Mtex Matsumura Main Business and Markets Served

Table 99. Mtex Matsumura Recent Developments/Updates

Table 100. Asahi Engineering Fully Automatic Semiconductor Molding Machine Company Information

Table 101. Asahi Engineering Fully Automatic Semiconductor Molding Machine Specification and Application

Table 102. Asahi Engineering Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 103. Asahi Engineering Main Business and Markets Served

Table 104. Asahi Engineering Recent Developments/Updates

Table 105. Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Company Information

Table 106. Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Specification and Application

Table 107. Nextool Technology Co., Ltd. Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 108. Nextool Technology Co., Ltd. Main Business and Markets Served

Table 109. Nextool Technology Co., Ltd. Recent Developments/Updates

Table 110. APIC YAMADA Fully Automatic Semiconductor Molding Machine Company Information

Table 111. APIC YAMADA Fully Automatic Semiconductor Molding Machine Specification and Application

Table 112. APIC YAMADA Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 113. APIC YAMADA Main Business and Markets Served

Table 114. APIC YAMADA Recent Developments/Updates

Table 115. Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Company Information

Table 116. Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Specification and Application

Table 117. Suzhou Bopai Semiconductor (Boschman) Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 118. Suzhou Bopai Semiconductor (Boschman) Main Business and Markets Served

Table 119. Suzhou Bopai Semiconductor (Boschman) Recent Developments/Updates

Table 120. Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Company Information

Table 121. Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Specification and Application

Table 122. Anhui Zhonghe Fully Automatic Semiconductor Molding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)

Table 123. Anhui Zhonghe Main Business and Markets Served

Table 124. Anhui Zhonghe Recent Developments/Updates

Table 125. Key Raw Materials Lists

Table 126. Raw Materials Key Suppliers Lists

Table 127. Fully Automatic Semiconductor Molding Machine Distributors List

Table 128. Fully Automatic Semiconductor Molding Machine Customers List

Table 129. Fully Automatic Semiconductor Molding Machine Market Trends

Table 130. Fully Automatic Semiconductor Molding Machine Market Drivers

Table 131. Fully Automatic Semiconductor Molding Machine Market Challenges

Table 132. Fully Automatic Semiconductor Molding Machine Market Restraints

Table 133. Research Programs/Design for This Report

Table 134. Key Data Information from Secondary Sources

Table 135. Key Data Information from Primary Sources

Table 136. Authors List of This Report

List of Figures

Figure 1. Product Picture of Fully Automatic Semiconductor Molding Machine

Figure 2. Global Fully Automatic Semiconductor Molding Machine Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Fully Automatic Semiconductor Molding Machine Market Share by Type: 2024 VS 2031

Figure 4. T-Molding Product Picture

Figure 5. C-Molding Product Picture

Figure 6. Global Fully Automatic Semiconductor Molding Machine Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global Fully Automatic Semiconductor Molding Machine Market Share by Application: 2024 VS 2031

Figure 8. Advanced Packaging

Figure 9. Traditional Packaging

Figure 10. Global Fully Automatic Semiconductor Molding Machine Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 11. Global Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) & (2020-2031)

Figure 12. Global Fully Automatic Semiconductor Molding Machine Production Capacity (Units) & (2020-2031)

Figure 13. Global Fully Automatic Semiconductor Molding Machine Production (Units) & (2020-2031)

Figure 14. Global Fully Automatic Semiconductor Molding Machine Average Price (K US$/Unit) & (2020-2031)

Figure 15. Fully Automatic Semiconductor Molding Machine Report Years Considered

Figure 16. Fully Automatic Semiconductor Molding Machine Production Share by Manufacturers in 2024

Figure 17. Global Fully Automatic Semiconductor Molding Machine Production Value Share by Manufacturers (2024)

Figure 18. Fully Automatic Semiconductor Molding Machine Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 19. The Global 5 and 10 Largest Players: Market Share by Fully Automatic Semiconductor Molding Machine Revenue in 2024

Figure 20. Global Fully Automatic Semiconductor Molding Machine Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 21. Global Fully Automatic Semiconductor Molding Machine Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 22. Global Fully Automatic Semiconductor Molding Machine Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 23. Global Fully Automatic Semiconductor Molding Machine Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 24. Japan Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) Growth Rate (2020-2031)

Figure 25. Europe Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. China Fully Automatic Semiconductor Molding Machine Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. Global Fully Automatic Semiconductor Molding Machine Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 28. Global Fully Automatic Semiconductor Molding Machine Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 29. North America Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 30. North America Fully Automatic Semiconductor Molding Machine Consumption Market Share by Country (2020-2031)

Figure 31. U.S. Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 32. Canada Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 33. Europe Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 34. Europe Fully Automatic Semiconductor Molding Machine Consumption Market Share by Country (2020-2031)

Figure 35. Germany Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 36. France Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 37. U.K. Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 38. Italy Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 39. Netherlands Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. Asia Pacific Fully Automatic Semiconductor Molding Machine Consumption Market Share by Region (2020-2031)

Figure 42. China Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 43. Japan Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 44. South Korea Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 45. China Taiwan Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 46. Southeast Asia Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. India Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. Latin America, Middle East & Africa Fully Automatic Semiconductor Molding Machine Consumption Market Share by Country (2020-2031)

Figure 50. Mexico Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 51. Brazil Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 52. Turkey Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 53. GCC Countries Fully Automatic Semiconductor Molding Machine Consumption and Growth Rate (2020-2031) & (Units)

Figure 54. Global Production Market Share of Fully Automatic Semiconductor Molding Machine by Type (2020-2031)

Figure 55. Global Production Value Market Share of Fully Automatic Semiconductor Molding Machine by Type (2020-2031)

Figure 56. Global Fully Automatic Semiconductor Molding Machine Price (K US$/Unit) by Type (2020-2031)

Figure 57. Global Production Market Share of Fully Automatic Semiconductor Molding Machine by Application (2020-2031)

Figure 58. Global Production Value Market Share of Fully Automatic Semiconductor Molding Machine by Application (2020-2031)

Figure 59. Global Fully Automatic Semiconductor Molding Machine Price (K US$/Unit) by Application (2020-2031)

Figure 60. Fully Automatic Semiconductor Molding Machine Value Chain

Figure 61. Channels of Distribution (Direct Vs Distribution)

Figure 62. Bottom-up and Top-down Approaches for This Report

Figure 63. Data Triangulation

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