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Global Thin Wafers Temporary Bonding Equipment and Materials Market Research Report 2025
Published Date: July 2025
|
Report Code: QYRE-Auto-17G8419
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Global Thin Wafers Temporary Bonding Equipment and Materials Market Research Report 2025

Code: QYRE-Auto-17G8419
Report
July 2025
Pages:103
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
3M
ABB Ltd
ACCRETECH
AGC
AMD
Cabot
Corning Inc
Crystal Solar
Dalsa
DoubleCheck Semiconductors
1366 Technologies
Ebara
ERS
Hamamatsu
IBM
Intel
LG Innotek
Mitsubishi Electric
Qualcomm Inc
Robert Bosch
SAMSUNG
Sumitomo Chemical

Thin Wafers Temporary Bonding Equipment and Materials Market

The global market for Thin Wafers Temporary Bonding Equipment and Materials was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner and wafer diameter increases, thinning/handling procedures are required. This implies development in wafer thinning, wafer dicing and wafer temporary bonding. Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the “Magic” material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Thin Wafers Temporary Bonding Equipment and Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thin Wafers Temporary Bonding Equipment and Materials.
The Thin Wafers Temporary Bonding Equipment and Materials market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Thin Wafers Temporary Bonding Equipment and Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thin Wafers Temporary Bonding Equipment and Materials companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Thin Wafers Temporary Bonding Equipment and Materials Market Report

Report Metric Details
Report Name Thin Wafers Temporary Bonding Equipment and Materials Market
Segment by Type
  • Chemical Debonding
  • Hot Sliding Debonding
  • Mechanical Debonding
  • Laser Debonding
Segment by Application
  • < 100 µm Wafers
  • below 40µm Wafers
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company 3M, ABB, Accretech, AGC, AMD, Cabot, Corning, Crystal Solar, Dalsa, DoubleCheck Semiconductors, 1366 Technologies, Ebara, ERS, Hamamatsu, IBM, Intel, LG Innotek, Mitsubishi Electric, Qualcomm, Robert Bosch, Samsung, Sumitomo Chemical
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of Thin Wafers Temporary Bonding Equipment and Materials company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

What is the Thin Wafers Temporary Bonding Equipment and Materials Market share by region?

Ans: North America, Europe and Japan, have a combined market share of 23%.

Who are the main players in the Thin Wafers Temporary Bonding Equipment and Materials Market report?

Ans: The main players in the Thin Wafers Temporary Bonding Equipment and Materials Market are 3M, ABB, Accretech, AGC, AMD, Cabot, Corning, Crystal Solar, Dalsa, DoubleCheck Semiconductors, 1366 Technologies, Ebara, ERS, Hamamatsu, IBM, Intel, LG Innotek, Mitsubishi Electric, Qualcomm, Robert Bosch, Samsung, Sumitomo Chemical

What are the Application segmentation covered in the Thin Wafers Temporary Bonding Equipment and Materials Market report?

Ans: The Applications covered in the Thin Wafers Temporary Bonding Equipment and Materials Market report are < 100 µm Wafers, below 40µm Wafers

What are the Type segmentation covered in the Thin Wafers Temporary Bonding Equipment and Materials Market report?

Ans: The Types covered in the Thin Wafers Temporary Bonding Equipment and Materials Market report are Chemical Debonding, Hot Sliding Debonding, Mechanical Debonding, Laser Debonding

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 Chemical Debonding
1.2.3 Hot Sliding Debonding
1.2.4 Mechanical Debonding
1.2.5 Laser Debonding
1.3 Market by Application
1.3.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Growth by Application: 2020 VS 2024 VS 2031
1.3.2 < 100 µm Wafers
1.3.3 below 40µm Wafers
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Perspective (2020-2031)
2.2 Global Thin Wafers Temporary Bonding Equipment and Materials Growth Trends by Region
2.2.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region: 2020 VS 2024 VS 2031
2.2.2 Thin Wafers Temporary Bonding Equipment and Materials Historic Market Size by Region (2020-2025)
2.2.3 Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Region (2026-2031)
2.3 Thin Wafers Temporary Bonding Equipment and Materials Market Dynamics
2.3.1 Thin Wafers Temporary Bonding Equipment and Materials Industry Trends
2.3.2 Thin Wafers Temporary Bonding Equipment and Materials Market Drivers
2.3.3 Thin Wafers Temporary Bonding Equipment and Materials Market Challenges
2.3.4 Thin Wafers Temporary Bonding Equipment and Materials Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Revenue
3.1.1 Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Revenue (2020-2025)
3.1.2 Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Players (2020-2025)
3.2 Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Thin Wafers Temporary Bonding Equipment and Materials Revenue
3.4 Global Thin Wafers Temporary Bonding Equipment and Materials Market Concentration Ratio
3.4.1 Global Thin Wafers Temporary Bonding Equipment and Materials Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Thin Wafers Temporary Bonding Equipment and Materials Revenue in 2024
3.5 Global Key Players of Thin Wafers Temporary Bonding Equipment and Materials Head office and Area Served
3.6 Global Key Players of Thin Wafers Temporary Bonding Equipment and Materials, Product and Application
3.7 Global Key Players of Thin Wafers Temporary Bonding Equipment and Materials, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Thin Wafers Temporary Bonding Equipment and Materials Breakdown Data by Type
4.1 Global Thin Wafers Temporary Bonding Equipment and Materials Historic Market Size by Type (2020-2025)
4.2 Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Type (2026-2031)
5 Thin Wafers Temporary Bonding Equipment and Materials Breakdown Data by Application
5.1 Global Thin Wafers Temporary Bonding Equipment and Materials Historic Market Size by Application (2020-2025)
5.2 Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Application (2026-2031)
6 North America
6.1 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size (2020-2031)
6.2 North America Thin Wafers Temporary Bonding Equipment and Materials Market Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2020-2025)
6.4 North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size (2020-2031)
7.2 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2020-2025)
7.4 Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size (2020-2031)
8.2 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2020-2025)
8.4 Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size (2020-2031)
9.2 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2020-2025)
9.4 Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size (2020-2031)
10.2 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2020-2025)
10.4 Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 3M
11.1.1 3M Company Details
11.1.2 3M Business Overview
11.1.3 3M Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.1.4 3M Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.1.5 3M Recent Development
11.2 ABB
11.2.1 ABB Company Details
11.2.2 ABB Business Overview
11.2.3 ABB Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.2.4 ABB Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.2.5 ABB Recent Development
11.3 Accretech
11.3.1 Accretech Company Details
11.3.2 Accretech Business Overview
11.3.3 Accretech Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.3.4 Accretech Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.3.5 Accretech Recent Development
11.4 AGC
11.4.1 AGC Company Details
11.4.2 AGC Business Overview
11.4.3 AGC Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.4.4 AGC Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.4.5 AGC Recent Development
11.5 AMD
11.5.1 AMD Company Details
11.5.2 AMD Business Overview
11.5.3 AMD Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.5.4 AMD Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.5.5 AMD Recent Development
11.6 Cabot
11.6.1 Cabot Company Details
11.6.2 Cabot Business Overview
11.6.3 Cabot Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.6.4 Cabot Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.6.5 Cabot Recent Development
11.7 Corning
11.7.1 Corning Company Details
11.7.2 Corning Business Overview
11.7.3 Corning Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.7.4 Corning Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.7.5 Corning Recent Development
11.8 Crystal Solar
11.8.1 Crystal Solar Company Details
11.8.2 Crystal Solar Business Overview
11.8.3 Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.8.4 Crystal Solar Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.8.5 Crystal Solar Recent Development
11.9 Dalsa
11.9.1 Dalsa Company Details
11.9.2 Dalsa Business Overview
11.9.3 Dalsa Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.9.4 Dalsa Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.9.5 Dalsa Recent Development
11.10 DoubleCheck Semiconductors
11.10.1 DoubleCheck Semiconductors Company Details
11.10.2 DoubleCheck Semiconductors Business Overview
11.10.3 DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.10.4 DoubleCheck Semiconductors Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.10.5 DoubleCheck Semiconductors Recent Development
11.11 1366 Technologies
11.11.1 1366 Technologies Company Details
11.11.2 1366 Technologies Business Overview
11.11.3 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.11.4 1366 Technologies Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.11.5 1366 Technologies Recent Development
11.12 Ebara
11.12.1 Ebara Company Details
11.12.2 Ebara Business Overview
11.12.3 Ebara Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.12.4 Ebara Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.12.5 Ebara Recent Development
11.13 ERS
11.13.1 ERS Company Details
11.13.2 ERS Business Overview
11.13.3 ERS Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.13.4 ERS Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.13.5 ERS Recent Development
11.14 Hamamatsu
11.14.1 Hamamatsu Company Details
11.14.2 Hamamatsu Business Overview
11.14.3 Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.14.4 Hamamatsu Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.14.5 Hamamatsu Recent Development
11.15 IBM
11.15.1 IBM Company Details
11.15.2 IBM Business Overview
11.15.3 IBM Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.15.4 IBM Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.15.5 IBM Recent Development
11.16 Intel
11.16.1 Intel Company Details
11.16.2 Intel Business Overview
11.16.3 Intel Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.16.4 Intel Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.16.5 Intel Recent Development
11.17 LG Innotek
11.17.1 LG Innotek Company Details
11.17.2 LG Innotek Business Overview
11.17.3 LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.17.4 LG Innotek Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.17.5 LG Innotek Recent Development
11.18 Mitsubishi Electric
11.18.1 Mitsubishi Electric Company Details
11.18.2 Mitsubishi Electric Business Overview
11.18.3 Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.18.4 Mitsubishi Electric Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.18.5 Mitsubishi Electric Recent Development
11.19 Qualcomm
11.19.1 Qualcomm Company Details
11.19.2 Qualcomm Business Overview
11.19.3 Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.19.4 Qualcomm Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.19.5 Qualcomm Recent Development
11.20 Robert Bosch
11.20.1 Robert Bosch Company Details
11.20.2 Robert Bosch Business Overview
11.20.3 Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.20.4 Robert Bosch Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.20.5 Robert Bosch Recent Development
11.21 Samsung
11.21.1 Samsung Company Details
11.21.2 Samsung Business Overview
11.21.3 Samsung Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.21.4 Samsung Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.21.5 Samsung Recent Development
11.22 Sumitomo Chemical
11.22.1 Sumitomo Chemical Company Details
11.22.2 Sumitomo Chemical Business Overview
11.22.3 Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Introduction
11.22.4 Sumitomo Chemical Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
11.22.5 Sumitomo Chemical Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 Market Size Estimation
13.1.1.3 Market Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer
FEATURED COMPANIES
3M
ABB Ltd
ACCRETECH
AGC
AMD
Cabot
Corning Inc
Crystal Solar
Dalsa
DoubleCheck Semiconductors
1366 Technologies
Ebara
ERS
Hamamatsu
IBM
Intel
LG Innotek
Mitsubishi Electric
Qualcomm Inc
Robert Bosch
SAMSUNG
Sumitomo Chemical
List of Tables
 Table 1. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Type (US$ Million): 2020 VS 2024 VS 2031
 Table 2. Key Players of Chemical Debonding
 Table 3. Key Players of Hot Sliding Debonding
 Table 4. Key Players of Mechanical Debonding
 Table 5. Key Players of Laser Debonding
 Table 6. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth by Application (US$ Million): 2020 VS 2024 VS 2031
 Table 7. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 8. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2020-2025) & (US$ Million)
 Table 9. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Region (2020-2025)
 Table 10. Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Region (2026-2031) & (US$ Million)
 Table 11. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Region (2026-2031)
 Table 12. Thin Wafers Temporary Bonding Equipment and Materials Market Trends
 Table 13. Thin Wafers Temporary Bonding Equipment and Materials Market Drivers
 Table 14. Thin Wafers Temporary Bonding Equipment and Materials Market Challenges
 Table 15. Thin Wafers Temporary Bonding Equipment and Materials Market Restraints
 Table 16. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue by Players (2020-2025) & (US$ Million)
 Table 17. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Players (2020-2025)
 Table 18. Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Thin Wafers Temporary Bonding Equipment and Materials as of 2024)
 Table 19. Ranking of Global Top Thin Wafers Temporary Bonding Equipment and Materials Companies by Revenue (US$ Million) in 2024
 Table 20. Global 5 Largest Players Market Share by Thin Wafers Temporary Bonding Equipment and Materials Revenue (CR5 and HHI) & (2020-2025)
 Table 21. Global Key Players of Thin Wafers Temporary Bonding Equipment and Materials, Headquarters and Area Served
 Table 22. Global Key Players of Thin Wafers Temporary Bonding Equipment and Materials, Product and Application
 Table 23. Global Key Players of Thin Wafers Temporary Bonding Equipment and Materials, Date of Enter into This Industry
 Table 24. Mergers & Acquisitions, Expansion Plans
 Table 25. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Type (2020-2025) & (US$ Million)
 Table 26. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Type (2020-2025)
 Table 27. Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Type (2026-2031) & (US$ Million)
 Table 28. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Type (2026-2031)
 Table 29. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2020-2025) & (US$ Million)
 Table 30. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Application (2020-2025)
 Table 31. Global Thin Wafers Temporary Bonding Equipment and Materials Forecasted Market Size by Application (2026-2031) & (US$ Million)
 Table 32. Global Thin Wafers Temporary Bonding Equipment and Materials Revenue Market Share by Application (2026-2031)
 Table 33. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 34. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2020-2025) & (US$ Million)
 Table 35. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2026-2031) & (US$ Million)
 Table 36. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 37. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2020-2025) & (US$ Million)
 Table 38. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2026-2031) & (US$ Million)
 Table 39. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Region (US$ Million): 2020 VS 2024 VS 2031
 Table 40. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2020-2025) & (US$ Million)
 Table 41. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size by Region (2026-2031) & (US$ Million)
 Table 42. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 43. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2020-2025) & (US$ Million)
 Table 44. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2026-2031) & (US$ Million)
 Table 45. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size Growth Rate by Country (US$ Million): 2020 VS 2024 VS 2031
 Table 46. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2020-2025) & (US$ Million)
 Table 47. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size by Country (2026-2031) & (US$ Million)
 Table 48. 3M Company Details
 Table 49. 3M Business Overview
 Table 50. 3M Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 51. 3M Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 52. 3M Recent Development
 Table 53. ABB Company Details
 Table 54. ABB Business Overview
 Table 55. ABB Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 56. ABB Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 57. ABB Recent Development
 Table 58. Accretech Company Details
 Table 59. Accretech Business Overview
 Table 60. Accretech Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 61. Accretech Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 62. Accretech Recent Development
 Table 63. AGC Company Details
 Table 64. AGC Business Overview
 Table 65. AGC Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 66. AGC Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 67. AGC Recent Development
 Table 68. AMD Company Details
 Table 69. AMD Business Overview
 Table 70. AMD Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 71. AMD Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 72. AMD Recent Development
 Table 73. Cabot Company Details
 Table 74. Cabot Business Overview
 Table 75. Cabot Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 76. Cabot Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 77. Cabot Recent Development
 Table 78. Corning Company Details
 Table 79. Corning Business Overview
 Table 80. Corning Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 81. Corning Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 82. Corning Recent Development
 Table 83. Crystal Solar Company Details
 Table 84. Crystal Solar Business Overview
 Table 85. Crystal Solar Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 86. Crystal Solar Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 87. Crystal Solar Recent Development
 Table 88. Dalsa Company Details
 Table 89. Dalsa Business Overview
 Table 90. Dalsa Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 91. Dalsa Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 92. Dalsa Recent Development
 Table 93. DoubleCheck Semiconductors Company Details
 Table 94. DoubleCheck Semiconductors Business Overview
 Table 95. DoubleCheck Semiconductors Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 96. DoubleCheck Semiconductors Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 97. DoubleCheck Semiconductors Recent Development
 Table 98. 1366 Technologies Company Details
 Table 99. 1366 Technologies Business Overview
 Table 100. 1366 Technologies Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 101. 1366 Technologies Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 102. 1366 Technologies Recent Development
 Table 103. Ebara Company Details
 Table 104. Ebara Business Overview
 Table 105. Ebara Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 106. Ebara Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 107. Ebara Recent Development
 Table 108. ERS Company Details
 Table 109. ERS Business Overview
 Table 110. ERS Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 111. ERS Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 112. ERS Recent Development
 Table 113. Hamamatsu Company Details
 Table 114. Hamamatsu Business Overview
 Table 115. Hamamatsu Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 116. Hamamatsu Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 117. Hamamatsu Recent Development
 Table 118. IBM Company Details
 Table 119. IBM Business Overview
 Table 120. IBM Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 121. IBM Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 122. IBM Recent Development
 Table 123. Intel Company Details
 Table 124. Intel Business Overview
 Table 125. Intel Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 126. Intel Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 127. Intel Recent Development
 Table 128. LG Innotek Company Details
 Table 129. LG Innotek Business Overview
 Table 130. LG Innotek Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 131. LG Innotek Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 132. LG Innotek Recent Development
 Table 133. Mitsubishi Electric Company Details
 Table 134. Mitsubishi Electric Business Overview
 Table 135. Mitsubishi Electric Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 136. Mitsubishi Electric Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 137. Mitsubishi Electric Recent Development
 Table 138. Qualcomm Company Details
 Table 139. Qualcomm Business Overview
 Table 140. Qualcomm Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 141. Qualcomm Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 142. Qualcomm Recent Development
 Table 143. Robert Bosch Company Details
 Table 144. Robert Bosch Business Overview
 Table 145. Robert Bosch Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 146. Robert Bosch Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 147. Robert Bosch Recent Development
 Table 148. Samsung Company Details
 Table 149. Samsung Business Overview
 Table 150. Samsung Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 151. Samsung Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 152. Samsung Recent Development
 Table 153. Sumitomo Chemical Company Details
 Table 154. Sumitomo Chemical Business Overview
 Table 155. Sumitomo Chemical Thin Wafers Temporary Bonding Equipment and Materials Product
 Table 156. Sumitomo Chemical Revenue in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025) & (US$ Million)
 Table 157. Sumitomo Chemical Recent Development
 Table 158. Research Programs/Design for This Report
 Table 159. Key Data Information from Secondary Sources
 Table 160. Key Data Information from Primary Sources
 Table 161. Authors List of This Report


List of Figures
 Figure 1. Thin Wafers Temporary Bonding Equipment and Materials Picture
 Figure 2. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size Comparison by Type (2020-2031) & (US$ Million)
 Figure 3. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Type: 2024 VS 2031
 Figure 4. Chemical Debonding Features
 Figure 5. Hot Sliding Debonding Features
 Figure 6. Mechanical Debonding Features
 Figure 7. Laser Debonding Features
 Figure 8. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size by Application (2020-2031) & (US$ Million)
 Figure 9. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Application: 2024 VS 2031
 Figure 10. < 100 µm Wafers Case Studies
 Figure 11. below 40µm Wafers Case Studies
 Figure 12. Thin Wafers Temporary Bonding Equipment and Materials Report Years Considered
 Figure 13. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size (US$ Million), Year-over-Year: 2020-2031
 Figure 14. Global Thin Wafers Temporary Bonding Equipment and Materials Market Size, (US$ Million), 2020 VS 2024 VS 2031
 Figure 15. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Region: 2024 VS 2031
 Figure 16. Global Thin Wafers Temporary Bonding Equipment and Materials Market Share by Players in 2024
 Figure 17. Global Top Thin Wafers Temporary Bonding Equipment and Materials Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Thin Wafers Temporary Bonding Equipment and Materials as of 2024)
 Figure 18. The Top 10 and 5 Players Market Share by Thin Wafers Temporary Bonding Equipment and Materials Revenue in 2024
 Figure 19. North America Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 20. North America Thin Wafers Temporary Bonding Equipment and Materials Market Share by Country (2020-2031)
 Figure 21. United States Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 22. Canada Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 23. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 24. Europe Thin Wafers Temporary Bonding Equipment and Materials Market Share by Country (2020-2031)
 Figure 25. Germany Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 26. France Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 27. U.K. Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 28. Italy Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 29. Russia Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 30. Nordic Countries Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 31. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 32. Asia-Pacific Thin Wafers Temporary Bonding Equipment and Materials Market Share by Region (2020-2031)
 Figure 33. China Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 34. Japan Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 35. South Korea Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 36. Southeast Asia Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 37. India Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 38. Australia Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 39. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 40. Latin America Thin Wafers Temporary Bonding Equipment and Materials Market Share by Country (2020-2031)
 Figure 41. Mexico Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 42. Brazil Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 43. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 44. Middle East & Africa Thin Wafers Temporary Bonding Equipment and Materials Market Share by Country (2020-2031)
 Figure 45. Turkey Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 46. Saudi Arabia Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 47. UAE Thin Wafers Temporary Bonding Equipment and Materials Market Size YoY Growth (2020-2031) & (US$ Million)
 Figure 48. 3M Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 49. ABB Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 50. Accretech Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 51. AGC Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 52. AMD Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 53. Cabot Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 54. Corning Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 55. Crystal Solar Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 56. Dalsa Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 57. DoubleCheck Semiconductors Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 58. 1366 Technologies Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 59. Ebara Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 60. ERS Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 61. Hamamatsu Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 62. IBM Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 63. Intel Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 64. LG Innotek Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 65. Mitsubishi Electric Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 66. Qualcomm Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 67. Robert Bosch Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 68. Samsung Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 69. Sumitomo Chemical Revenue Growth Rate in Thin Wafers Temporary Bonding Equipment and Materials Business (2020-2025)
 Figure 70. Bottom-up and Top-down Approaches for This Report
 Figure 71. Data Triangulation
 Figure 72. Key Executives Interviewed
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