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Global Non-Memory Chip Packaging Substrate Market Research Report 2025
Published Date: June 2025
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Report Code: QYRE-Auto-19R18083
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Global Non Memory Chip Packaging Substrate Market Research Report 2024
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Global Non-Memory Chip Packaging Substrate Market Research Report 2025

Code: QYRE-Auto-19R18083
Report
June 2025
Pages:105
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Non-Memory Chip Packaging Substrate Market

The global market for Non-Memory Chip Packaging Substrate was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF chips, sensors, etc.). Similar to the memory chip packaging substrate, it plays a key role in chip packaging, providing electrical connection, mechanical support, heat dissipation management and other functions, but its design and application requirements may be different.
North American market for Non-Memory Chip Packaging Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Non-Memory Chip Packaging Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Non-Memory Chip Packaging Substrate include Ibiden, Shinko, kyocera, LGInnotek, Samsung Electro Mechanics, AT&S, ASE Group, Unimicron, KINSUS, Hemei Jingyi Technology, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Non-Memory Chip Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Non-Memory Chip Packaging Substrate.
The Non-Memory Chip Packaging Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Non-Memory Chip Packaging Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Non-Memory Chip Packaging Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Non-Memory Chip Packaging Substrate Market Report

Report Metric Details
Report Name Non-Memory Chip Packaging Substrate Market
by Type
by Application
  • Consumer Electronics
  • Industrial Control
  • Communication Equipment
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Ibiden, Shinko, kyocera, LGInnotek, Samsung Electro Mechanics, AT&S, ASE Group, Unimicron, KINSUS, Hemei Jingyi Technology, NanYa PCB, Simmtech
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Non-Memory Chip Packaging Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Non-Memory Chip Packaging Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Non-Memory Chip Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Non-Memory Chip Packaging Substrate Market report?

Ans: The main players in the Non-Memory Chip Packaging Substrate Market are Ibiden, Shinko, kyocera, LGInnotek, Samsung Electro Mechanics, AT&S, ASE Group, Unimicron, KINSUS, Hemei Jingyi Technology, NanYa PCB, Simmtech

What are the Application segmentation covered in the Non-Memory Chip Packaging Substrate Market report?

Ans: The Applications covered in the Non-Memory Chip Packaging Substrate Market report are Consumer Electronics, Industrial Control, Communication Equipment, Others

What are the Type segmentation covered in the Non-Memory Chip Packaging Substrate Market report?

Ans: The Types covered in the Non-Memory Chip Packaging Substrate Market report are Logic Chip Packaging Substrate, Communication Chip Packaging Substrate, Sensor Chip Packaging Substrate, Others

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1 Non-Memory Chip Packaging Substrate Market Overview
1.1 Product Definition
1.2 Non-Memory Chip Packaging Substrate by Type
1.2.1 Global Non-Memory Chip Packaging Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Logic Chip Packaging Substrate
1.2.3 Communication Chip Packaging Substrate
1.2.4 Sensor Chip Packaging Substrate
1.2.5 Others
1.3 Non-Memory Chip Packaging Substrate by Application
1.3.1 Global Non-Memory Chip Packaging Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Industrial Control
1.3.4 Communication Equipment
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Non-Memory Chip Packaging Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Non-Memory Chip Packaging Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global Non-Memory Chip Packaging Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Non-Memory Chip Packaging Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global Non-Memory Chip Packaging Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Non-Memory Chip Packaging Substrate, Industry Ranking, 2023 VS 2024
2.4 Global Non-Memory Chip Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Non-Memory Chip Packaging Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Date of Enter into This Industry
2.9 Non-Memory Chip Packaging Substrate Market Competitive Situation and Trends
2.9.1 Non-Memory Chip Packaging Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Non-Memory Chip Packaging Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Non-Memory Chip Packaging Substrate Production by Region
3.1 Global Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Non-Memory Chip Packaging Substrate Production Value by Region (2020-2031)
3.2.1 Global Non-Memory Chip Packaging Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Non-Memory Chip Packaging Substrate by Region (2026-2031)
3.3 Global Non-Memory Chip Packaging Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Non-Memory Chip Packaging Substrate Production Volume by Region (2020-2031)
3.4.1 Global Non-Memory Chip Packaging Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Non-Memory Chip Packaging Substrate by Region (2026-2031)
3.5 Global Non-Memory Chip Packaging Substrate Market Price Analysis by Region (2020-2025)
3.6 Global Non-Memory Chip Packaging Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Non-Memory Chip Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
4 Non-Memory Chip Packaging Substrate Consumption by Region
4.1 Global Non-Memory Chip Packaging Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Non-Memory Chip Packaging Substrate Consumption by Region (2020-2031)
4.2.1 Global Non-Memory Chip Packaging Substrate Consumption by Region (2020-2025)
4.2.2 Global Non-Memory Chip Packaging Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Non-Memory Chip Packaging Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Non-Memory Chip Packaging Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Non-Memory Chip Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Non-Memory Chip Packaging Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Non-Memory Chip Packaging Substrate Production by Type (2020-2031)
5.1.1 Global Non-Memory Chip Packaging Substrate Production by Type (2020-2025)
5.1.2 Global Non-Memory Chip Packaging Substrate Production by Type (2026-2031)
5.1.3 Global Non-Memory Chip Packaging Substrate Production Market Share by Type (2020-2031)
5.2 Global Non-Memory Chip Packaging Substrate Production Value by Type (2020-2031)
5.2.1 Global Non-Memory Chip Packaging Substrate Production Value by Type (2020-2025)
5.2.2 Global Non-Memory Chip Packaging Substrate Production Value by Type (2026-2031)
5.2.3 Global Non-Memory Chip Packaging Substrate Production Value Market Share by Type (2020-2031)
5.3 Global Non-Memory Chip Packaging Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global Non-Memory Chip Packaging Substrate Production by Application (2020-2031)
6.1.1 Global Non-Memory Chip Packaging Substrate Production by Application (2020-2025)
6.1.2 Global Non-Memory Chip Packaging Substrate Production by Application (2026-2031)
6.1.3 Global Non-Memory Chip Packaging Substrate Production Market Share by Application (2020-2031)
6.2 Global Non-Memory Chip Packaging Substrate Production Value by Application (2020-2031)
6.2.1 Global Non-Memory Chip Packaging Substrate Production Value by Application (2020-2025)
6.2.2 Global Non-Memory Chip Packaging Substrate Production Value by Application (2026-2031)
6.2.3 Global Non-Memory Chip Packaging Substrate Production Value Market Share by Application (2020-2031)
6.3 Global Non-Memory Chip Packaging Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Ibiden
7.1.1 Ibiden Non-Memory Chip Packaging Substrate Company Information
7.1.2 Ibiden Non-Memory Chip Packaging Substrate Product Portfolio
7.1.3 Ibiden Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Ibiden Main Business and Markets Served
7.1.5 Ibiden Recent Developments/Updates
7.2 Shinko
7.2.1 Shinko Non-Memory Chip Packaging Substrate Company Information
7.2.2 Shinko Non-Memory Chip Packaging Substrate Product Portfolio
7.2.3 Shinko Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Shinko Main Business and Markets Served
7.2.5 Shinko Recent Developments/Updates
7.3 kyocera
7.3.1 kyocera Non-Memory Chip Packaging Substrate Company Information
7.3.2 kyocera Non-Memory Chip Packaging Substrate Product Portfolio
7.3.3 kyocera Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 kyocera Main Business and Markets Served
7.3.5 kyocera Recent Developments/Updates
7.4 LGInnotek
7.4.1 LGInnotek Non-Memory Chip Packaging Substrate Company Information
7.4.2 LGInnotek Non-Memory Chip Packaging Substrate Product Portfolio
7.4.3 LGInnotek Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 LGInnotek Main Business and Markets Served
7.4.5 LGInnotek Recent Developments/Updates
7.5 Samsung Electro Mechanics
7.5.1 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Company Information
7.5.2 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Product Portfolio
7.5.3 Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Samsung Electro Mechanics Main Business and Markets Served
7.5.5 Samsung Electro Mechanics Recent Developments/Updates
7.6 AT&S
7.6.1 AT&S Non-Memory Chip Packaging Substrate Company Information
7.6.2 AT&S Non-Memory Chip Packaging Substrate Product Portfolio
7.6.3 AT&S Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 AT&S Main Business and Markets Served
7.6.5 AT&S Recent Developments/Updates
7.7 ASE Group
7.7.1 ASE Group Non-Memory Chip Packaging Substrate Company Information
7.7.2 ASE Group Non-Memory Chip Packaging Substrate Product Portfolio
7.7.3 ASE Group Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 ASE Group Main Business and Markets Served
7.7.5 ASE Group Recent Developments/Updates
7.8 Unimicron
7.8.1 Unimicron Non-Memory Chip Packaging Substrate Company Information
7.8.2 Unimicron Non-Memory Chip Packaging Substrate Product Portfolio
7.8.3 Unimicron Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Unimicron Main Business and Markets Served
7.8.5 Unimicron Recent Developments/Updates
7.9 KINSUS
7.9.1 KINSUS Non-Memory Chip Packaging Substrate Company Information
7.9.2 KINSUS Non-Memory Chip Packaging Substrate Product Portfolio
7.9.3 KINSUS Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 KINSUS Main Business and Markets Served
7.9.5 KINSUS Recent Developments/Updates
7.10 Hemei Jingyi Technology
7.10.1 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Company Information
7.10.2 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Product Portfolio
7.10.3 Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Hemei Jingyi Technology Main Business and Markets Served
7.10.5 Hemei Jingyi Technology Recent Developments/Updates
7.11 NanYa PCB
7.11.1 NanYa PCB Non-Memory Chip Packaging Substrate Company Information
7.11.2 NanYa PCB Non-Memory Chip Packaging Substrate Product Portfolio
7.11.3 NanYa PCB Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 NanYa PCB Main Business and Markets Served
7.11.5 NanYa PCB Recent Developments/Updates
7.12 Simmtech
7.12.1 Simmtech Non-Memory Chip Packaging Substrate Company Information
7.12.2 Simmtech Non-Memory Chip Packaging Substrate Product Portfolio
7.12.3 Simmtech Non-Memory Chip Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Simmtech Main Business and Markets Served
7.12.5 Simmtech Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Non-Memory Chip Packaging Substrate Industry Chain Analysis
8.2 Non-Memory Chip Packaging Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Non-Memory Chip Packaging Substrate Production Mode & Process Analysis
8.4 Non-Memory Chip Packaging Substrate Sales and Marketing
8.4.1 Non-Memory Chip Packaging Substrate Sales Channels
8.4.2 Non-Memory Chip Packaging Substrate Distributors
8.5 Non-Memory Chip Packaging Substrate Customer Analysis
9 Non-Memory Chip Packaging Substrate Market Dynamics
9.1 Non-Memory Chip Packaging Substrate Industry Trends
9.2 Non-Memory Chip Packaging Substrate Market Drivers
9.3 Non-Memory Chip Packaging Substrate Market Challenges
9.4 Non-Memory Chip Packaging Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Non-Memory Chip Packaging Substrate Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Non-Memory Chip Packaging Substrate Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Non-Memory Chip Packaging Substrate Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Non-Memory Chip Packaging Substrate Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Non-Memory Chip Packaging Substrate Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Non-Memory Chip Packaging Substrate Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Non-Memory Chip Packaging Substrate Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Non-Memory Chip Packaging Substrate, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Non-Memory Chip Packaging Substrate as of 2024)
 Table 10. Global Market Non-Memory Chip Packaging Substrate Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Product Offered and Application
 Table 13. Global Key Manufacturers of Non-Memory Chip Packaging Substrate, Date of Enter into This Industry
 Table 14. Global Non-Memory Chip Packaging Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Non-Memory Chip Packaging Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Non-Memory Chip Packaging Substrate Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Non-Memory Chip Packaging Substrate Production Value Market Share by Region (2020-2025)
 Table 19. Global Non-Memory Chip Packaging Substrate Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Non-Memory Chip Packaging Substrate Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Non-Memory Chip Packaging Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Non-Memory Chip Packaging Substrate Production (K Units) by Region (2020-2025)
 Table 23. Global Non-Memory Chip Packaging Substrate Production Market Share by Region (2020-2025)
 Table 24. Global Non-Memory Chip Packaging Substrate Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Non-Memory Chip Packaging Substrate Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Non-Memory Chip Packaging Substrate Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Non-Memory Chip Packaging Substrate Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Non-Memory Chip Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Non-Memory Chip Packaging Substrate Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Non-Memory Chip Packaging Substrate Consumption Market Share by Region (2020-2025)
 Table 31. Global Non-Memory Chip Packaging Substrate Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Non-Memory Chip Packaging Substrate Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Non-Memory Chip Packaging Substrate Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Non-Memory Chip Packaging Substrate Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Non-Memory Chip Packaging Substrate Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Non-Memory Chip Packaging Substrate Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Non-Memory Chip Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Non-Memory Chip Packaging Substrate Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Non-Memory Chip Packaging Substrate Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Non-Memory Chip Packaging Substrate Production (K Units) by Type (2020-2025)
 Table 46. Global Non-Memory Chip Packaging Substrate Production (K Units) by Type (2026-2031)
 Table 47. Global Non-Memory Chip Packaging Substrate Production Market Share by Type (2020-2025)
 Table 48. Global Non-Memory Chip Packaging Substrate Production Market Share by Type (2026-2031)
 Table 49. Global Non-Memory Chip Packaging Substrate Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Non-Memory Chip Packaging Substrate Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Non-Memory Chip Packaging Substrate Production Value Market Share by Type (2020-2025)
 Table 52. Global Non-Memory Chip Packaging Substrate Production Value Market Share by Type (2026-2031)
 Table 53. Global Non-Memory Chip Packaging Substrate Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Non-Memory Chip Packaging Substrate Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Non-Memory Chip Packaging Substrate Production (K Units) by Application (2020-2025)
 Table 56. Global Non-Memory Chip Packaging Substrate Production (K Units) by Application (2026-2031)
 Table 57. Global Non-Memory Chip Packaging Substrate Production Market Share by Application (2020-2025)
 Table 58. Global Non-Memory Chip Packaging Substrate Production Market Share by Application (2026-2031)
 Table 59. Global Non-Memory Chip Packaging Substrate Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Non-Memory Chip Packaging Substrate Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Non-Memory Chip Packaging Substrate Production Value Market Share by Application (2020-2025)
 Table 62. Global Non-Memory Chip Packaging Substrate Production Value Market Share by Application (2026-2031)
 Table 63. Global Non-Memory Chip Packaging Substrate Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Non-Memory Chip Packaging Substrate Price (US$/Unit) by Application (2026-2031)
 Table 65. Ibiden Non-Memory Chip Packaging Substrate Company Information
 Table 66. Ibiden Non-Memory Chip Packaging Substrate Specification and Application
 Table 67. Ibiden Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. Ibiden Main Business and Markets Served
 Table 69. Ibiden Recent Developments/Updates
 Table 70. Shinko Non-Memory Chip Packaging Substrate Company Information
 Table 71. Shinko Non-Memory Chip Packaging Substrate Specification and Application
 Table 72. Shinko Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Shinko Main Business and Markets Served
 Table 74. Shinko Recent Developments/Updates
 Table 75. kyocera Non-Memory Chip Packaging Substrate Company Information
 Table 76. kyocera Non-Memory Chip Packaging Substrate Specification and Application
 Table 77. kyocera Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. kyocera Main Business and Markets Served
 Table 79. kyocera Recent Developments/Updates
 Table 80. LGInnotek Non-Memory Chip Packaging Substrate Company Information
 Table 81. LGInnotek Non-Memory Chip Packaging Substrate Specification and Application
 Table 82. LGInnotek Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. LGInnotek Main Business and Markets Served
 Table 84. LGInnotek Recent Developments/Updates
 Table 85. Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Company Information
 Table 86. Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Specification and Application
 Table 87. Samsung Electro Mechanics Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. Samsung Electro Mechanics Main Business and Markets Served
 Table 89. Samsung Electro Mechanics Recent Developments/Updates
 Table 90. AT&S Non-Memory Chip Packaging Substrate Company Information
 Table 91. AT&S Non-Memory Chip Packaging Substrate Specification and Application
 Table 92. AT&S Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. AT&S Main Business and Markets Served
 Table 94. AT&S Recent Developments/Updates
 Table 95. ASE Group Non-Memory Chip Packaging Substrate Company Information
 Table 96. ASE Group Non-Memory Chip Packaging Substrate Specification and Application
 Table 97. ASE Group Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. ASE Group Main Business and Markets Served
 Table 99. ASE Group Recent Developments/Updates
 Table 100. Unimicron Non-Memory Chip Packaging Substrate Company Information
 Table 101. Unimicron Non-Memory Chip Packaging Substrate Specification and Application
 Table 102. Unimicron Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Unimicron Main Business and Markets Served
 Table 104. Unimicron Recent Developments/Updates
 Table 105. KINSUS Non-Memory Chip Packaging Substrate Company Information
 Table 106. KINSUS Non-Memory Chip Packaging Substrate Specification and Application
 Table 107. KINSUS Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. KINSUS Main Business and Markets Served
 Table 109. KINSUS Recent Developments/Updates
 Table 110. Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Company Information
 Table 111. Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Specification and Application
 Table 112. Hemei Jingyi Technology Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. Hemei Jingyi Technology Main Business and Markets Served
 Table 114. Hemei Jingyi Technology Recent Developments/Updates
 Table 115. NanYa PCB Non-Memory Chip Packaging Substrate Company Information
 Table 116. NanYa PCB Non-Memory Chip Packaging Substrate Specification and Application
 Table 117. NanYa PCB Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 118. NanYa PCB Main Business and Markets Served
 Table 119. NanYa PCB Recent Developments/Updates
 Table 120. Simmtech Non-Memory Chip Packaging Substrate Company Information
 Table 121. Simmtech Non-Memory Chip Packaging Substrate Specification and Application
 Table 122. Simmtech Non-Memory Chip Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 123. Simmtech Main Business and Markets Served
 Table 124. Simmtech Recent Developments/Updates
 Table 125. Key Raw Materials Lists
 Table 126. Raw Materials Key Suppliers Lists
 Table 127. Non-Memory Chip Packaging Substrate Distributors List
 Table 128. Non-Memory Chip Packaging Substrate Customers List
 Table 129. Non-Memory Chip Packaging Substrate Market Trends
 Table 130. Non-Memory Chip Packaging Substrate Market Drivers
 Table 131. Non-Memory Chip Packaging Substrate Market Challenges
 Table 132. Non-Memory Chip Packaging Substrate Market Restraints
 Table 133. Research Programs/Design for This Report
 Table 134. Key Data Information from Secondary Sources
 Table 135. Key Data Information from Primary Sources
 Table 136. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Non-Memory Chip Packaging Substrate
 Figure 2. Global Non-Memory Chip Packaging Substrate Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Non-Memory Chip Packaging Substrate Market Share by Type: 2024 VS 2031
 Figure 4. Logic Chip Packaging Substrate Product Picture
 Figure 5. Communication Chip Packaging Substrate Product Picture
 Figure 6. Sensor Chip Packaging Substrate Product Picture
 Figure 7. Others Product Picture
 Figure 8. Global Non-Memory Chip Packaging Substrate Market Value by Application, (US$ Million) & (2020-2031)
 Figure 9. Global Non-Memory Chip Packaging Substrate Market Share by Application: 2024 VS 2031
 Figure 10. Consumer Electronics
 Figure 11. Industrial Control
 Figure 12. Communication Equipment
 Figure 13. Others
 Figure 14. Global Non-Memory Chip Packaging Substrate Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 15. Global Non-Memory Chip Packaging Substrate Production Value (US$ Million) & (2020-2031)
 Figure 16. Global Non-Memory Chip Packaging Substrate Production Capacity (K Units) & (2020-2031)
 Figure 17. Global Non-Memory Chip Packaging Substrate Production (K Units) & (2020-2031)
 Figure 18. Global Non-Memory Chip Packaging Substrate Average Price (US$/Unit) & (2020-2031)
 Figure 19. Non-Memory Chip Packaging Substrate Report Years Considered
 Figure 20. Non-Memory Chip Packaging Substrate Production Share by Manufacturers in 2024
 Figure 21. Global Non-Memory Chip Packaging Substrate Production Value Share by Manufacturers (2024)
 Figure 22. Non-Memory Chip Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 23. The Global 5 and 10 Largest Players: Market Share by Non-Memory Chip Packaging Substrate Revenue in 2024
 Figure 24. Global Non-Memory Chip Packaging Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 25. Global Non-Memory Chip Packaging Substrate Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 26. Global Non-Memory Chip Packaging Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 27. Global Non-Memory Chip Packaging Substrate Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 28. North America Non-Memory Chip Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Europe Non-Memory Chip Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. China Non-Memory Chip Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. Japan Non-Memory Chip Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. South Korea Non-Memory Chip Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. Global Non-Memory Chip Packaging Substrate Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 34. Global Non-Memory Chip Packaging Substrate Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 35. North America Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 36. North America Non-Memory Chip Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 37. U.S. Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 38. Canada Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Europe Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. Europe Non-Memory Chip Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 41. Germany Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 42. France Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. U.K. Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. Italy Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Netherlands Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. Asia Pacific Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Asia Pacific Non-Memory Chip Packaging Substrate Consumption Market Share by Region (2020-2031)
 Figure 48. China Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 49. Japan Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. South Korea Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. China Taiwan Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. Southeast Asia Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. India Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Latin America, Middle East & Africa Non-Memory Chip Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 56. Mexico Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 57. Brazil Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Israel Non-Memory Chip Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 59. Global Production Market Share of Non-Memory Chip Packaging Substrate by Type (2020-2031)
 Figure 60. Global Production Value Market Share of Non-Memory Chip Packaging Substrate by Type (2020-2031)
 Figure 61. Global Non-Memory Chip Packaging Substrate Price (US$/Unit) by Type (2020-2031)
 Figure 62. Global Production Market Share of Non-Memory Chip Packaging Substrate by Application (2020-2031)
 Figure 63. Global Production Value Market Share of Non-Memory Chip Packaging Substrate by Application (2020-2031)
 Figure 64. Global Non-Memory Chip Packaging Substrate Price (US$/Unit) by Application (2020-2031)
 Figure 65. Non-Memory Chip Packaging Substrate Value Chain
 Figure 66. Channels of Distribution (Direct Vs Distribution)
 Figure 67. Bottom-up and Top-down Approaches for This Report
 Figure 68. Data Triangulation
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