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Global Integrated Circuit Package Substrate Market Research Report 2025
Published Date: July 2025
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Report Code: QYRE-Auto-15S10139
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Global Integrated Circuit Package Substrate Market Insights Forecast to 2028
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Global Integrated Circuit Package Substrate Market Research Report 2025

Code: QYRE-Auto-15S10139
Report
July 2025
Pages:110
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Integrated Circuit Package Substrate Market Size

The global market for Integrated Circuit Package Substrate was valued at US$ 14750 million in the year 2024 and is projected to reach a revised size of US$ 26560 million by 2031, growing at a CAGR of 8.9% during the forecast period.

Integrated Circuit Package Substrate Market

Integrated Circuit Package Substrate Market

Integrated circuit package substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Integrated Circuit Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Integrated Circuit Package Substrate.
The Integrated Circuit Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Integrated Circuit Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Integrated Circuit Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Integrated Circuit Package Substrate Market Report

Report Metric Details
Report Name Integrated Circuit Package Substrate Market
Accounted market size in year US$ 14750 million
Forecasted market size in 2031 US$ 26560 million
CAGR 8.9%
Base Year year
Forecasted years 2025 - 2031
by Type
  • FC-BGA
  • FC-CSP
  • WB BGA
  • WB CSP
  • Others
by Application
  • Smart Phones
  • PC (Tablet, Laptop)
  • Wearable Devices
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Ibiden, Kinsus, Unimicron, Shinko, Semco, Simmtech, Nanya, Kyocera, LG Innotek, AT&S, ASE, Daeduck, Toppan Printing, Shennan Circuit, Zhen Ding Technology, KCC (Korea Circuit Company), ACCESS, Shenzhen Fastprint Circuit Tech, TTM Technologies
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Integrated Circuit Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Integrated Circuit Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Integrated Circuit Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Integrated Circuit Package Substrate Market growing?

Ans: The Integrated Circuit Package Substrate Market witnessing a CAGR of 8.9% during the forecast period 2025-2031.

What is the Integrated Circuit Package Substrate Market size in 2031?

Ans: The Integrated Circuit Package Substrate Market size in 2031 will be US$ 26560 million.

Who are the main players in the Integrated Circuit Package Substrate Market report?

Ans: The main players in the Integrated Circuit Package Substrate Market are Ibiden, Kinsus, Unimicron, Shinko, Semco, Simmtech, Nanya, Kyocera, LG Innotek, AT&S, ASE, Daeduck, Toppan Printing, Shennan Circuit, Zhen Ding Technology, KCC (Korea Circuit Company), ACCESS, Shenzhen Fastprint Circuit Tech, TTM Technologies

What are the Application segmentation covered in the Integrated Circuit Package Substrate Market report?

Ans: The Applications covered in the Integrated Circuit Package Substrate Market report are Smart Phones, PC (Tablet, Laptop), Wearable Devices, Others

What are the Type segmentation covered in the Integrated Circuit Package Substrate Market report?

Ans: The Types covered in the Integrated Circuit Package Substrate Market report are FC-BGA, FC-CSP, WB BGA, WB CSP, Others

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1 Integrated Circuit Package Substrate Market Overview
1.1 Product Definition
1.2 Integrated Circuit Package Substrate by Type
1.2.1 Global Integrated Circuit Package Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 FC-BGA
1.2.3 FC-CSP
1.2.4 WB BGA
1.2.5 WB CSP
1.2.6 Others
1.3 Integrated Circuit Package Substrate by Application
1.3.1 Global Integrated Circuit Package Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Integrated Circuit Package Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Integrated Circuit Package Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Integrated Circuit Package Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global Integrated Circuit Package Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Integrated Circuit Package Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global Integrated Circuit Package Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Integrated Circuit Package Substrate, Industry Ranking, 2023 VS 2024
2.4 Global Integrated Circuit Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Integrated Circuit Package Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Integrated Circuit Package Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Integrated Circuit Package Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Integrated Circuit Package Substrate, Date of Enter into This Industry
2.9 Integrated Circuit Package Substrate Market Competitive Situation and Trends
2.9.1 Integrated Circuit Package Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Integrated Circuit Package Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Integrated Circuit Package Substrate Production by Region
3.1 Global Integrated Circuit Package Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Integrated Circuit Package Substrate Production Value by Region (2020-2031)
3.2.1 Global Integrated Circuit Package Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Integrated Circuit Package Substrate by Region (2026-2031)
3.3 Global Integrated Circuit Package Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Integrated Circuit Package Substrate Production Volume by Region (2020-2031)
3.4.1 Global Integrated Circuit Package Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Integrated Circuit Package Substrate by Region (2026-2031)
3.5 Global Integrated Circuit Package Substrate Market Price Analysis by Region (2020-2025)
3.6 Global Integrated Circuit Package Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Integrated Circuit Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Integrated Circuit Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Integrated Circuit Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Integrated Circuit Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Integrated Circuit Package Substrate Production Value Estimates and Forecasts (2020-2031)
4 Integrated Circuit Package Substrate Consumption by Region
4.1 Global Integrated Circuit Package Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Integrated Circuit Package Substrate Consumption by Region (2020-2031)
4.2.1 Global Integrated Circuit Package Substrate Consumption by Region (2020-2025)
4.2.2 Global Integrated Circuit Package Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Integrated Circuit Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Integrated Circuit Package Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Integrated Circuit Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Integrated Circuit Package Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Integrated Circuit Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Integrated Circuit Package Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Integrated Circuit Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Integrated Circuit Package Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Integrated Circuit Package Substrate Production by Type (2020-2031)
5.1.1 Global Integrated Circuit Package Substrate Production by Type (2020-2025)
5.1.2 Global Integrated Circuit Package Substrate Production by Type (2026-2031)
5.1.3 Global Integrated Circuit Package Substrate Production Market Share by Type (2020-2031)
5.2 Global Integrated Circuit Package Substrate Production Value by Type (2020-2031)
5.2.1 Global Integrated Circuit Package Substrate Production Value by Type (2020-2025)
5.2.2 Global Integrated Circuit Package Substrate Production Value by Type (2026-2031)
5.2.3 Global Integrated Circuit Package Substrate Production Value Market Share by Type (2020-2031)
5.3 Global Integrated Circuit Package Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global Integrated Circuit Package Substrate Production by Application (2020-2031)
6.1.1 Global Integrated Circuit Package Substrate Production by Application (2020-2025)
6.1.2 Global Integrated Circuit Package Substrate Production by Application (2026-2031)
6.1.3 Global Integrated Circuit Package Substrate Production Market Share by Application (2020-2031)
6.2 Global Integrated Circuit Package Substrate Production Value by Application (2020-2031)
6.2.1 Global Integrated Circuit Package Substrate Production Value by Application (2020-2025)
6.2.2 Global Integrated Circuit Package Substrate Production Value by Application (2026-2031)
6.2.3 Global Integrated Circuit Package Substrate Production Value Market Share by Application (2020-2031)
6.3 Global Integrated Circuit Package Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Ibiden
7.1.1 Ibiden Integrated Circuit Package Substrate Company Information
7.1.2 Ibiden Integrated Circuit Package Substrate Product Portfolio
7.1.3 Ibiden Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Ibiden Main Business and Markets Served
7.1.5 Ibiden Recent Developments/Updates
7.2 Kinsus
7.2.1 Kinsus Integrated Circuit Package Substrate Company Information
7.2.2 Kinsus Integrated Circuit Package Substrate Product Portfolio
7.2.3 Kinsus Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Kinsus Main Business and Markets Served
7.2.5 Kinsus Recent Developments/Updates
7.3 Unimicron
7.3.1 Unimicron Integrated Circuit Package Substrate Company Information
7.3.2 Unimicron Integrated Circuit Package Substrate Product Portfolio
7.3.3 Unimicron Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Unimicron Main Business and Markets Served
7.3.5 Unimicron Recent Developments/Updates
7.4 Shinko
7.4.1 Shinko Integrated Circuit Package Substrate Company Information
7.4.2 Shinko Integrated Circuit Package Substrate Product Portfolio
7.4.3 Shinko Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Shinko Main Business and Markets Served
7.4.5 Shinko Recent Developments/Updates
7.5 Semco
7.5.1 Semco Integrated Circuit Package Substrate Company Information
7.5.2 Semco Integrated Circuit Package Substrate Product Portfolio
7.5.3 Semco Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Semco Main Business and Markets Served
7.5.5 Semco Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech Integrated Circuit Package Substrate Company Information
7.6.2 Simmtech Integrated Circuit Package Substrate Product Portfolio
7.6.3 Simmtech Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Nanya
7.7.1 Nanya Integrated Circuit Package Substrate Company Information
7.7.2 Nanya Integrated Circuit Package Substrate Product Portfolio
7.7.3 Nanya Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Nanya Main Business and Markets Served
7.7.5 Nanya Recent Developments/Updates
7.8 Kyocera
7.8.1 Kyocera Integrated Circuit Package Substrate Company Information
7.8.2 Kyocera Integrated Circuit Package Substrate Product Portfolio
7.8.3 Kyocera Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Kyocera Main Business and Markets Served
7.8.5 Kyocera Recent Developments/Updates
7.9 LG Innotek
7.9.1 LG Innotek Integrated Circuit Package Substrate Company Information
7.9.2 LG Innotek Integrated Circuit Package Substrate Product Portfolio
7.9.3 LG Innotek Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 LG Innotek Main Business and Markets Served
7.9.5 LG Innotek Recent Developments/Updates
7.10 AT&S
7.10.1 AT&S Integrated Circuit Package Substrate Company Information
7.10.2 AT&S Integrated Circuit Package Substrate Product Portfolio
7.10.3 AT&S Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 AT&S Main Business and Markets Served
7.10.5 AT&S Recent Developments/Updates
7.11 ASE
7.11.1 ASE Integrated Circuit Package Substrate Company Information
7.11.2 ASE Integrated Circuit Package Substrate Product Portfolio
7.11.3 ASE Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 ASE Main Business and Markets Served
7.11.5 ASE Recent Developments/Updates
7.12 Daeduck
7.12.1 Daeduck Integrated Circuit Package Substrate Company Information
7.12.2 Daeduck Integrated Circuit Package Substrate Product Portfolio
7.12.3 Daeduck Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Daeduck Main Business and Markets Served
7.12.5 Daeduck Recent Developments/Updates
7.13 Toppan Printing
7.13.1 Toppan Printing Integrated Circuit Package Substrate Company Information
7.13.2 Toppan Printing Integrated Circuit Package Substrate Product Portfolio
7.13.3 Toppan Printing Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Toppan Printing Main Business and Markets Served
7.13.5 Toppan Printing Recent Developments/Updates
7.14 Shennan Circuit
7.14.1 Shennan Circuit Integrated Circuit Package Substrate Company Information
7.14.2 Shennan Circuit Integrated Circuit Package Substrate Product Portfolio
7.14.3 Shennan Circuit Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Shennan Circuit Main Business and Markets Served
7.14.5 Shennan Circuit Recent Developments/Updates
7.15 Zhen Ding Technology
7.15.1 Zhen Ding Technology Integrated Circuit Package Substrate Company Information
7.15.2 Zhen Ding Technology Integrated Circuit Package Substrate Product Portfolio
7.15.3 Zhen Ding Technology Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Zhen Ding Technology Main Business and Markets Served
7.15.5 Zhen Ding Technology Recent Developments/Updates
7.16 KCC (Korea Circuit Company)
7.16.1 KCC (Korea Circuit Company) Integrated Circuit Package Substrate Company Information
7.16.2 KCC (Korea Circuit Company) Integrated Circuit Package Substrate Product Portfolio
7.16.3 KCC (Korea Circuit Company) Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.16.4 KCC (Korea Circuit Company) Main Business and Markets Served
7.16.5 KCC (Korea Circuit Company) Recent Developments/Updates
7.17 ACCESS
7.17.1 ACCESS Integrated Circuit Package Substrate Company Information
7.17.2 ACCESS Integrated Circuit Package Substrate Product Portfolio
7.17.3 ACCESS Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.17.4 ACCESS Main Business and Markets Served
7.17.5 ACCESS Recent Developments/Updates
7.18 Shenzhen Fastprint Circuit Tech
7.18.1 Shenzhen Fastprint Circuit Tech Integrated Circuit Package Substrate Company Information
7.18.2 Shenzhen Fastprint Circuit Tech Integrated Circuit Package Substrate Product Portfolio
7.18.3 Shenzhen Fastprint Circuit Tech Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
7.18.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
7.19 TTM Technologies
7.19.1 TTM Technologies Integrated Circuit Package Substrate Company Information
7.19.2 TTM Technologies Integrated Circuit Package Substrate Product Portfolio
7.19.3 TTM Technologies Integrated Circuit Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.19.4 TTM Technologies Main Business and Markets Served
7.19.5 TTM Technologies Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Integrated Circuit Package Substrate Industry Chain Analysis
8.2 Integrated Circuit Package Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Integrated Circuit Package Substrate Production Mode & Process Analysis
8.4 Integrated Circuit Package Substrate Sales and Marketing
8.4.1 Integrated Circuit Package Substrate Sales Channels
8.4.2 Integrated Circuit Package Substrate Distributors
8.5 Integrated Circuit Package Substrate Customer Analysis
9 Integrated Circuit Package Substrate Market Dynamics
9.1 Integrated Circuit Package Substrate Industry Trends
9.2 Integrated Circuit Package Substrate Market Drivers
9.3 Integrated Circuit Package Substrate Market Challenges
9.4 Integrated Circuit Package Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Integrated Circuit Package Substrate Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Integrated Circuit Package Substrate Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Integrated Circuit Package Substrate Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Integrated Circuit Package Substrate Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Integrated Circuit Package Substrate Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Integrated Circuit Package Substrate Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Integrated Circuit Package Substrate Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Integrated Circuit Package Substrate, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Integrated Circuit Package Substrate as of 2024)
 Table 10. Global Market Integrated Circuit Package Substrate Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Integrated Circuit Package Substrate, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Integrated Circuit Package Substrate, Product Offered and Application
 Table 13. Global Key Manufacturers of Integrated Circuit Package Substrate, Date of Enter into This Industry
 Table 14. Global Integrated Circuit Package Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Integrated Circuit Package Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Integrated Circuit Package Substrate Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Integrated Circuit Package Substrate Production Value Market Share by Region (2020-2025)
 Table 19. Global Integrated Circuit Package Substrate Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Integrated Circuit Package Substrate Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Integrated Circuit Package Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Integrated Circuit Package Substrate Production (K Units) by Region (2020-2025)
 Table 23. Global Integrated Circuit Package Substrate Production Market Share by Region (2020-2025)
 Table 24. Global Integrated Circuit Package Substrate Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Integrated Circuit Package Substrate Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Integrated Circuit Package Substrate Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Integrated Circuit Package Substrate Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Integrated Circuit Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Integrated Circuit Package Substrate Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Integrated Circuit Package Substrate Consumption Market Share by Region (2020-2025)
 Table 31. Global Integrated Circuit Package Substrate Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Integrated Circuit Package Substrate Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Integrated Circuit Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Integrated Circuit Package Substrate Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Integrated Circuit Package Substrate Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Integrated Circuit Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Integrated Circuit Package Substrate Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Integrated Circuit Package Substrate Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Integrated Circuit Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Integrated Circuit Package Substrate Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Integrated Circuit Package Substrate Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Integrated Circuit Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Integrated Circuit Package Substrate Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Integrated Circuit Package Substrate Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Integrated Circuit Package Substrate Production (K Units) by Type (2020-2025)
 Table 46. Global Integrated Circuit Package Substrate Production (K Units) by Type (2026-2031)
 Table 47. Global Integrated Circuit Package Substrate Production Market Share by Type (2020-2025)
 Table 48. Global Integrated Circuit Package Substrate Production Market Share by Type (2026-2031)
 Table 49. Global Integrated Circuit Package Substrate Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Integrated Circuit Package Substrate Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Integrated Circuit Package Substrate Production Value Market Share by Type (2020-2025)
 Table 52. Global Integrated Circuit Package Substrate Production Value Market Share by Type (2026-2031)
 Table 53. Global Integrated Circuit Package Substrate Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Integrated Circuit Package Substrate Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Integrated Circuit Package Substrate Production (K Units) by Application (2020-2025)
 Table 56. Global Integrated Circuit Package Substrate Production (K Units) by Application (2026-2031)
 Table 57. Global Integrated Circuit Package Substrate Production Market Share by Application (2020-2025)
 Table 58. Global Integrated Circuit Package Substrate Production Market Share by Application (2026-2031)
 Table 59. Global Integrated Circuit Package Substrate Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Integrated Circuit Package Substrate Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Integrated Circuit Package Substrate Production Value Market Share by Application (2020-2025)
 Table 62. Global Integrated Circuit Package Substrate Production Value Market Share by Application (2026-2031)
 Table 63. Global Integrated Circuit Package Substrate Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Integrated Circuit Package Substrate Price (US$/Unit) by Application (2026-2031)
 Table 65. Ibiden Integrated Circuit Package Substrate Company Information
 Table 66. Ibiden Integrated Circuit Package Substrate Specification and Application
 Table 67. Ibiden Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. Ibiden Main Business and Markets Served
 Table 69. Ibiden Recent Developments/Updates
 Table 70. Kinsus Integrated Circuit Package Substrate Company Information
 Table 71. Kinsus Integrated Circuit Package Substrate Specification and Application
 Table 72. Kinsus Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Kinsus Main Business and Markets Served
 Table 74. Kinsus Recent Developments/Updates
 Table 75. Unimicron Integrated Circuit Package Substrate Company Information
 Table 76. Unimicron Integrated Circuit Package Substrate Specification and Application
 Table 77. Unimicron Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. Unimicron Main Business and Markets Served
 Table 79. Unimicron Recent Developments/Updates
 Table 80. Shinko Integrated Circuit Package Substrate Company Information
 Table 81. Shinko Integrated Circuit Package Substrate Specification and Application
 Table 82. Shinko Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. Shinko Main Business and Markets Served
 Table 84. Shinko Recent Developments/Updates
 Table 85. Semco Integrated Circuit Package Substrate Company Information
 Table 86. Semco Integrated Circuit Package Substrate Specification and Application
 Table 87. Semco Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. Semco Main Business and Markets Served
 Table 89. Semco Recent Developments/Updates
 Table 90. Simmtech Integrated Circuit Package Substrate Company Information
 Table 91. Simmtech Integrated Circuit Package Substrate Specification and Application
 Table 92. Simmtech Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. Simmtech Main Business and Markets Served
 Table 94. Simmtech Recent Developments/Updates
 Table 95. Nanya Integrated Circuit Package Substrate Company Information
 Table 96. Nanya Integrated Circuit Package Substrate Specification and Application
 Table 97. Nanya Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. Nanya Main Business and Markets Served
 Table 99. Nanya Recent Developments/Updates
 Table 100. Kyocera Integrated Circuit Package Substrate Company Information
 Table 101. Kyocera Integrated Circuit Package Substrate Specification and Application
 Table 102. Kyocera Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Kyocera Main Business and Markets Served
 Table 104. Kyocera Recent Developments/Updates
 Table 105. LG Innotek Integrated Circuit Package Substrate Company Information
 Table 106. LG Innotek Integrated Circuit Package Substrate Specification and Application
 Table 107. LG Innotek Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. LG Innotek Main Business and Markets Served
 Table 109. LG Innotek Recent Developments/Updates
 Table 110. AT&S Integrated Circuit Package Substrate Company Information
 Table 111. AT&S Integrated Circuit Package Substrate Specification and Application
 Table 112. AT&S Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. AT&S Main Business and Markets Served
 Table 114. AT&S Recent Developments/Updates
 Table 115. ASE Integrated Circuit Package Substrate Company Information
 Table 116. ASE Integrated Circuit Package Substrate Specification and Application
 Table 117. ASE Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 118. ASE Main Business and Markets Served
 Table 119. ASE Recent Developments/Updates
 Table 120. Daeduck Integrated Circuit Package Substrate Company Information
 Table 121. Daeduck Integrated Circuit Package Substrate Specification and Application
 Table 122. Daeduck Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 123. Daeduck Main Business and Markets Served
 Table 124. Daeduck Recent Developments/Updates
 Table 125. Toppan Printing Integrated Circuit Package Substrate Company Information
 Table 126. Toppan Printing Integrated Circuit Package Substrate Specification and Application
 Table 127. Toppan Printing Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 128. Toppan Printing Main Business and Markets Served
 Table 129. Toppan Printing Recent Developments/Updates
 Table 130. Shennan Circuit Integrated Circuit Package Substrate Company Information
 Table 131. Shennan Circuit Integrated Circuit Package Substrate Specification and Application
 Table 132. Shennan Circuit Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 133. Shennan Circuit Main Business and Markets Served
 Table 134. Shennan Circuit Recent Developments/Updates
 Table 135. Zhen Ding Technology Integrated Circuit Package Substrate Company Information
 Table 136. Zhen Ding Technology Integrated Circuit Package Substrate Specification and Application
 Table 137. Zhen Ding Technology Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 138. Zhen Ding Technology Main Business and Markets Served
 Table 139. Zhen Ding Technology Recent Developments/Updates
 Table 140. KCC (Korea Circuit Company) Integrated Circuit Package Substrate Company Information
 Table 141. KCC (Korea Circuit Company) Integrated Circuit Package Substrate Specification and Application
 Table 142. KCC (Korea Circuit Company) Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 143. KCC (Korea Circuit Company) Main Business and Markets Served
 Table 144. KCC (Korea Circuit Company) Recent Developments/Updates
 Table 145. ACCESS Integrated Circuit Package Substrate Company Information
 Table 146. ACCESS Integrated Circuit Package Substrate Specification and Application
 Table 147. ACCESS Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 148. ACCESS Main Business and Markets Served
 Table 149. ACCESS Recent Developments/Updates
 Table 150. Shenzhen Fastprint Circuit Tech Integrated Circuit Package Substrate Company Information
 Table 151. Shenzhen Fastprint Circuit Tech Integrated Circuit Package Substrate Specification and Application
 Table 152. Shenzhen Fastprint Circuit Tech Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 153. Shenzhen Fastprint Circuit Tech Main Business and Markets Served
 Table 154. Shenzhen Fastprint Circuit Tech Recent Developments/Updates
 Table 155. TTM Technologies Integrated Circuit Package Substrate Company Information
 Table 156. TTM Technologies Integrated Circuit Package Substrate Specification and Application
 Table 157. TTM Technologies Integrated Circuit Package Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 158. TTM Technologies Main Business and Markets Served
 Table 159. TTM Technologies Recent Developments/Updates
 Table 160. Key Raw Materials Lists
 Table 161. Raw Materials Key Suppliers Lists
 Table 162. Integrated Circuit Package Substrate Distributors List
 Table 163. Integrated Circuit Package Substrate Customers List
 Table 164. Integrated Circuit Package Substrate Market Trends
 Table 165. Integrated Circuit Package Substrate Market Drivers
 Table 166. Integrated Circuit Package Substrate Market Challenges
 Table 167. Integrated Circuit Package Substrate Market Restraints
 Table 168. Research Programs/Design for This Report
 Table 169. Key Data Information from Secondary Sources
 Table 170. Key Data Information from Primary Sources
 Table 171. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Integrated Circuit Package Substrate
 Figure 2. Global Integrated Circuit Package Substrate Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Integrated Circuit Package Substrate Market Share by Type: 2024 VS 2031
 Figure 4. FC-BGA Product Picture
 Figure 5. FC-CSP Product Picture
 Figure 6. WB BGA Product Picture
 Figure 7. WB CSP Product Picture
 Figure 8. Others Product Picture
 Figure 9. Global Integrated Circuit Package Substrate Market Value by Application, (US$ Million) & (2020-2031)
 Figure 10. Global Integrated Circuit Package Substrate Market Share by Application: 2024 VS 2031
 Figure 11. Smart Phones
 Figure 12. PC (Tablet, Laptop)
 Figure 13. Wearable Devices
 Figure 14. Others
 Figure 15. Global Integrated Circuit Package Substrate Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 16. Global Integrated Circuit Package Substrate Production Value (US$ Million) & (2020-2031)
 Figure 17. Global Integrated Circuit Package Substrate Production Capacity (K Units) & (2020-2031)
 Figure 18. Global Integrated Circuit Package Substrate Production (K Units) & (2020-2031)
 Figure 19. Global Integrated Circuit Package Substrate Average Price (US$/Unit) & (2020-2031)
 Figure 20. Integrated Circuit Package Substrate Report Years Considered
 Figure 21. Integrated Circuit Package Substrate Production Share by Manufacturers in 2024
 Figure 22. Global Integrated Circuit Package Substrate Production Value Share by Manufacturers (2024)
 Figure 23. Integrated Circuit Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 24. The Global 5 and 10 Largest Players: Market Share by Integrated Circuit Package Substrate Revenue in 2024
 Figure 25. Global Integrated Circuit Package Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 26. Global Integrated Circuit Package Substrate Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 27. Global Integrated Circuit Package Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 28. Global Integrated Circuit Package Substrate Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 29. North America Integrated Circuit Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Europe Integrated Circuit Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. China Integrated Circuit Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Japan Integrated Circuit Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. South Korea Integrated Circuit Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 34. Global Integrated Circuit Package Substrate Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 35. Global Integrated Circuit Package Substrate Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 36. North America Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 37. North America Integrated Circuit Package Substrate Consumption Market Share by Country (2020-2031)
 Figure 38. U.S. Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Canada Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. Europe Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. Europe Integrated Circuit Package Substrate Consumption Market Share by Country (2020-2031)
 Figure 42. Germany Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. France Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. U.K. Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Italy Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. Netherlands Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Asia Pacific Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. Asia Pacific Integrated Circuit Package Substrate Consumption Market Share by Region (2020-2031)
 Figure 49. China Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. Japan Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. South Korea Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. China Taiwan Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. Southeast Asia Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. India Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Latin America, Middle East & Africa Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 56. Latin America, Middle East & Africa Integrated Circuit Package Substrate Consumption Market Share by Country (2020-2031)
 Figure 57. Mexico Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Brazil Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 59. Israel Integrated Circuit Package Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 60. Global Production Market Share of Integrated Circuit Package Substrate by Type (2020-2031)
 Figure 61. Global Production Value Market Share of Integrated Circuit Package Substrate by Type (2020-2031)
 Figure 62. Global Integrated Circuit Package Substrate Price (US$/Unit) by Type (2020-2031)
 Figure 63. Global Production Market Share of Integrated Circuit Package Substrate by Application (2020-2031)
 Figure 64. Global Production Value Market Share of Integrated Circuit Package Substrate by Application (2020-2031)
 Figure 65. Global Integrated Circuit Package Substrate Price (US$/Unit) by Application (2020-2031)
 Figure 66. Integrated Circuit Package Substrate Value Chain
 Figure 67. Channels of Distribution (Direct Vs Distribution)
 Figure 68. Bottom-up and Top-down Approaches for This Report
 Figure 69. Data Triangulation
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