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Global Wafer Back-Grinding Machine Market Research Report 2025
Published Date: January 2025
|
Report Code: QYRE-Auto-5G11468
Home | Market Reports | Business & Industrial| Industrial Materials & Equipment| Heavy Machinery
Global Wafer Back Grinding Machine Market Research Report 2022
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Global Wafer Back-Grinding Machine Market Research Report 2025

Code: QYRE-Auto-5G11468
Report
January 2025
Pages:100
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Disco
Tokyo Seimitsu
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam

Wafer Back-Grinding Machine Market

The global market for Wafer Back-Grinding Machine was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Wafer Back-Grinding Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Back-Grinding Machine.
The Wafer Back-Grinding Machine market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Back-Grinding Machine market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Back-Grinding Machine manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Wafer Back-Grinding Machine Market Report

Report Metric Details
Report Name Wafer Back-Grinding Machine Market
by Type
by Application
Production by Region
  • North America
  • Europe
  • China
  • Japan
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, Daitron, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Wafer Back-Grinding Machine manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Wafer Back-Grinding Machine by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Wafer Back-Grinding Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

What is the Wafer Back-Grinding Machine Market share by region?

Ans: North America, Europe and Japan, have a combined market share of 23%.

Who are the main players in the Wafer Back-Grinding Machine Market report?

Ans: The main players in the Wafer Back-Grinding Machine Market are Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, Daitron, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam

What are the Application segmentation covered in the Wafer Back-Grinding Machine Market report?

Ans: The Applications covered in the Wafer Back-Grinding Machine Market report are Silicon Wafer, SiC Wafer, Sapphire Wafer

What are the Type segmentation covered in the Wafer Back-Grinding Machine Market report?

Ans: The Types covered in the Wafer Back-Grinding Machine Market report are Wafer Edge Grinding Machine, Wafer Surface Grinding Machine

Recommended Reports

Wafer Grinding & Polishing

Semiconductor Wafer Machines

Silicon & SiC Equipment

1 Wafer Back-Grinding Machine Market Overview
1.1 Product Definition
1.2 Wafer Back-Grinding Machine by Type
1.2.1 Global Wafer Back-Grinding Machine Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Wafer Edge Grinding Machine
1.2.3 Wafer Surface Grinding Machine
1.3 Wafer Back-Grinding Machine by Application
1.3.1 Global Wafer Back-Grinding Machine Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Silicon Wafer
1.3.3 SiC Wafer
1.3.4 Sapphire Wafer
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Back-Grinding Machine Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Wafer Back-Grinding Machine Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Wafer Back-Grinding Machine Production Estimates and Forecasts (2020-2031)
1.4.4 Global Wafer Back-Grinding Machine Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Back-Grinding Machine Production Market Share by Manufacturers (2020-2025)
2.2 Global Wafer Back-Grinding Machine Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Wafer Back-Grinding Machine, Industry Ranking, 2023 VS 2024
2.4 Global Wafer Back-Grinding Machine Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Wafer Back-Grinding Machine Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Wafer Back-Grinding Machine, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Back-Grinding Machine, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Back-Grinding Machine, Date of Enter into This Industry
2.9 Wafer Back-Grinding Machine Market Competitive Situation and Trends
2.9.1 Wafer Back-Grinding Machine Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Back-Grinding Machine Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Back-Grinding Machine Production by Region
3.1 Global Wafer Back-Grinding Machine Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Wafer Back-Grinding Machine Production Value by Region (2020-2031)
3.2.1 Global Wafer Back-Grinding Machine Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Wafer Back-Grinding Machine by Region (2026-2031)
3.3 Global Wafer Back-Grinding Machine Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Wafer Back-Grinding Machine Production Volume by Region (2020-2031)
3.4.1 Global Wafer Back-Grinding Machine Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Wafer Back-Grinding Machine by Region (2026-2031)
3.5 Global Wafer Back-Grinding Machine Market Price Analysis by Region (2020-2025)
3.6 Global Wafer Back-Grinding Machine Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Back-Grinding Machine Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Wafer Back-Grinding Machine Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Wafer Back-Grinding Machine Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Wafer Back-Grinding Machine Production Value Estimates and Forecasts (2020-2031)
4 Wafer Back-Grinding Machine Consumption by Region
4.1 Global Wafer Back-Grinding Machine Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Wafer Back-Grinding Machine Consumption by Region (2020-2031)
4.2.1 Global Wafer Back-Grinding Machine Consumption by Region (2020-2025)
4.2.2 Global Wafer Back-Grinding Machine Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Wafer Back-Grinding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Wafer Back-Grinding Machine Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Back-Grinding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Wafer Back-Grinding Machine Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Back-Grinding Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Wafer Back-Grinding Machine Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Back-Grinding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Wafer Back-Grinding Machine Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Wafer Back-Grinding Machine Production by Type (2020-2031)
5.1.1 Global Wafer Back-Grinding Machine Production by Type (2020-2025)
5.1.2 Global Wafer Back-Grinding Machine Production by Type (2026-2031)
5.1.3 Global Wafer Back-Grinding Machine Production Market Share by Type (2020-2031)
5.2 Global Wafer Back-Grinding Machine Production Value by Type (2020-2031)
5.2.1 Global Wafer Back-Grinding Machine Production Value by Type (2020-2025)
5.2.2 Global Wafer Back-Grinding Machine Production Value by Type (2026-2031)
5.2.3 Global Wafer Back-Grinding Machine Production Value Market Share by Type (2020-2031)
5.3 Global Wafer Back-Grinding Machine Price by Type (2020-2031)
6 Segment by Application
6.1 Global Wafer Back-Grinding Machine Production by Application (2020-2031)
6.1.1 Global Wafer Back-Grinding Machine Production by Application (2020-2025)
6.1.2 Global Wafer Back-Grinding Machine Production by Application (2026-2031)
6.1.3 Global Wafer Back-Grinding Machine Production Market Share by Application (2020-2031)
6.2 Global Wafer Back-Grinding Machine Production Value by Application (2020-2031)
6.2.1 Global Wafer Back-Grinding Machine Production Value by Application (2020-2025)
6.2.2 Global Wafer Back-Grinding Machine Production Value by Application (2026-2031)
6.2.3 Global Wafer Back-Grinding Machine Production Value Market Share by Application (2020-2031)
6.3 Global Wafer Back-Grinding Machine Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Disco
7.1.1 Disco Wafer Back-Grinding Machine Company Information
7.1.2 Disco Wafer Back-Grinding Machine Product Portfolio
7.1.3 Disco Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Disco Main Business and Markets Served
7.1.5 Disco Recent Developments/Updates
7.2 TOKYO SEIMITSU
7.2.1 TOKYO SEIMITSU Wafer Back-Grinding Machine Company Information
7.2.2 TOKYO SEIMITSU Wafer Back-Grinding Machine Product Portfolio
7.2.3 TOKYO SEIMITSU Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.2.4 TOKYO SEIMITSU Main Business and Markets Served
7.2.5 TOKYO SEIMITSU Recent Developments/Updates
7.3 G&N
7.3.1 G&N Wafer Back-Grinding Machine Company Information
7.3.2 G&N Wafer Back-Grinding Machine Product Portfolio
7.3.3 G&N Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.3.4 G&N Main Business and Markets Served
7.3.5 G&N Recent Developments/Updates
7.4 Okamoto Semiconductor Equipment Division
7.4.1 Okamoto Semiconductor Equipment Division Wafer Back-Grinding Machine Company Information
7.4.2 Okamoto Semiconductor Equipment Division Wafer Back-Grinding Machine Product Portfolio
7.4.3 Okamoto Semiconductor Equipment Division Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Okamoto Semiconductor Equipment Division Main Business and Markets Served
7.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
7.5 CETC
7.5.1 CETC Wafer Back-Grinding Machine Company Information
7.5.2 CETC Wafer Back-Grinding Machine Product Portfolio
7.5.3 CETC Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.5.4 CETC Main Business and Markets Served
7.5.5 CETC Recent Developments/Updates
7.6 Koyo Machinery
7.6.1 Koyo Machinery Wafer Back-Grinding Machine Company Information
7.6.2 Koyo Machinery Wafer Back-Grinding Machine Product Portfolio
7.6.3 Koyo Machinery Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Koyo Machinery Main Business and Markets Served
7.6.5 Koyo Machinery Recent Developments/Updates
7.7 Revasum
7.7.1 Revasum Wafer Back-Grinding Machine Company Information
7.7.2 Revasum Wafer Back-Grinding Machine Product Portfolio
7.7.3 Revasum Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Revasum Main Business and Markets Served
7.7.5 Revasum Recent Developments/Updates
7.8 Daitron
7.8.1 Daitron Wafer Back-Grinding Machine Company Information
7.8.2 Daitron Wafer Back-Grinding Machine Product Portfolio
7.8.3 Daitron Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Daitron Main Business and Markets Served
7.8.5 Daitron Recent Developments/Updates
7.9 WAIDA MFG
7.9.1 WAIDA MFG Wafer Back-Grinding Machine Company Information
7.9.2 WAIDA MFG Wafer Back-Grinding Machine Product Portfolio
7.9.3 WAIDA MFG Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.9.4 WAIDA MFG Main Business and Markets Served
7.9.5 WAIDA MFG Recent Developments/Updates
7.10 Hunan Yujing Machine Industrial
7.10.1 Hunan Yujing Machine Industrial Wafer Back-Grinding Machine Company Information
7.10.2 Hunan Yujing Machine Industrial Wafer Back-Grinding Machine Product Portfolio
7.10.3 Hunan Yujing Machine Industrial Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Hunan Yujing Machine Industrial Main Business and Markets Served
7.10.5 Hunan Yujing Machine Industrial Recent Developments/Updates
7.11 SpeedFam
7.11.1 SpeedFam Wafer Back-Grinding Machine Company Information
7.11.2 SpeedFam Wafer Back-Grinding Machine Product Portfolio
7.11.3 SpeedFam Wafer Back-Grinding Machine Production, Value, Price and Gross Margin (2020-2025)
7.11.4 SpeedFam Main Business and Markets Served
7.11.5 SpeedFam Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Back-Grinding Machine Industry Chain Analysis
8.2 Wafer Back-Grinding Machine Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Back-Grinding Machine Production Mode & Process Analysis
8.4 Wafer Back-Grinding Machine Sales and Marketing
8.4.1 Wafer Back-Grinding Machine Sales Channels
8.4.2 Wafer Back-Grinding Machine Distributors
8.5 Wafer Back-Grinding Machine Customer Analysis
9 Wafer Back-Grinding Machine Market Dynamics
9.1 Wafer Back-Grinding Machine Industry Trends
9.2 Wafer Back-Grinding Machine Market Drivers
9.3 Wafer Back-Grinding Machine Market Challenges
9.4 Wafer Back-Grinding Machine Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
Disco
Tokyo Seimitsu
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
List of Tables
 Table 1. Global Wafer Back-Grinding Machine Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Wafer Back-Grinding Machine Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Wafer Back-Grinding Machine Production Capacity (Units) by Manufacturers in 2024
 Table 4. Global Wafer Back-Grinding Machine Production by Manufacturers (2020-2025) & (Units)
 Table 5. Global Wafer Back-Grinding Machine Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Wafer Back-Grinding Machine Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Wafer Back-Grinding Machine Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Wafer Back-Grinding Machine, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Wafer Back-Grinding Machine as of 2024)
 Table 10. Global Market Wafer Back-Grinding Machine Average Price by Manufacturers (K US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Wafer Back-Grinding Machine, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Wafer Back-Grinding Machine, Product Offered and Application
 Table 13. Global Key Manufacturers of Wafer Back-Grinding Machine, Date of Enter into This Industry
 Table 14. Global Wafer Back-Grinding Machine Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Wafer Back-Grinding Machine Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Wafer Back-Grinding Machine Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Wafer Back-Grinding Machine Production Value Market Share by Region (2020-2025)
 Table 19. Global Wafer Back-Grinding Machine Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Wafer Back-Grinding Machine Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Wafer Back-Grinding Machine Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)
 Table 22. Global Wafer Back-Grinding Machine Production (Units) by Region (2020-2025)
 Table 23. Global Wafer Back-Grinding Machine Production Market Share by Region (2020-2025)
 Table 24. Global Wafer Back-Grinding Machine Production (Units) Forecast by Region (2026-2031)
 Table 25. Global Wafer Back-Grinding Machine Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Wafer Back-Grinding Machine Market Average Price (K US$/Unit) by Region (2020-2025)
 Table 27. Global Wafer Back-Grinding Machine Market Average Price (K US$/Unit) by Region (2026-2031)
 Table 28. Global Wafer Back-Grinding Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)
 Table 29. Global Wafer Back-Grinding Machine Consumption by Region (2020-2025) & (Units)
 Table 30. Global Wafer Back-Grinding Machine Consumption Market Share by Region (2020-2025)
 Table 31. Global Wafer Back-Grinding Machine Forecasted Consumption by Region (2026-2031) & (Units)
 Table 32. Global Wafer Back-Grinding Machine Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Wafer Back-Grinding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 34. North America Wafer Back-Grinding Machine Consumption by Country (2020-2025) & (Units)
 Table 35. North America Wafer Back-Grinding Machine Consumption by Country (2026-2031) & (Units)
 Table 36. Europe Wafer Back-Grinding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 37. Europe Wafer Back-Grinding Machine Consumption by Country (2020-2025) & (Units)
 Table 38. Europe Wafer Back-Grinding Machine Consumption by Country (2026-2031) & (Units)
 Table 39. Asia Pacific Wafer Back-Grinding Machine Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)
 Table 40. Asia Pacific Wafer Back-Grinding Machine Consumption by Region (2020-2025) & (Units)
 Table 41. Asia Pacific Wafer Back-Grinding Machine Consumption by Region (2026-2031) & (Units)
 Table 42. Latin America, Middle East & Africa Wafer Back-Grinding Machine Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)
 Table 43. Latin America, Middle East & Africa Wafer Back-Grinding Machine Consumption by Country (2020-2025) & (Units)
 Table 44. Latin America, Middle East & Africa Wafer Back-Grinding Machine Consumption by Country (2026-2031) & (Units)
 Table 45. Global Wafer Back-Grinding Machine Production (Units) by Type (2020-2025)
 Table 46. Global Wafer Back-Grinding Machine Production (Units) by Type (2026-2031)
 Table 47. Global Wafer Back-Grinding Machine Production Market Share by Type (2020-2025)
 Table 48. Global Wafer Back-Grinding Machine Production Market Share by Type (2026-2031)
 Table 49. Global Wafer Back-Grinding Machine Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Wafer Back-Grinding Machine Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Wafer Back-Grinding Machine Production Value Market Share by Type (2020-2025)
 Table 52. Global Wafer Back-Grinding Machine Production Value Market Share by Type (2026-2031)
 Table 53. Global Wafer Back-Grinding Machine Price (K US$/Unit) by Type (2020-2025)
 Table 54. Global Wafer Back-Grinding Machine Price (K US$/Unit) by Type (2026-2031)
 Table 55. Global Wafer Back-Grinding Machine Production (Units) by Application (2020-2025)
 Table 56. Global Wafer Back-Grinding Machine Production (Units) by Application (2026-2031)
 Table 57. Global Wafer Back-Grinding Machine Production Market Share by Application (2020-2025)
 Table 58. Global Wafer Back-Grinding Machine Production Market Share by Application (2026-2031)
 Table 59. Global Wafer Back-Grinding Machine Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Wafer Back-Grinding Machine Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Wafer Back-Grinding Machine Production Value Market Share by Application (2020-2025)
 Table 62. Global Wafer Back-Grinding Machine Production Value Market Share by Application (2026-2031)
 Table 63. Global Wafer Back-Grinding Machine Price (K US$/Unit) by Application (2020-2025)
 Table 64. Global Wafer Back-Grinding Machine Price (K US$/Unit) by Application (2026-2031)
 Table 65. Disco Wafer Back-Grinding Machine Company Information
 Table 66. Disco Wafer Back-Grinding Machine Specification and Application
 Table 67. Disco Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 68. Disco Main Business and Markets Served
 Table 69. Disco Recent Developments/Updates
 Table 70. TOKYO SEIMITSU Wafer Back-Grinding Machine Company Information
 Table 71. TOKYO SEIMITSU Wafer Back-Grinding Machine Specification and Application
 Table 72. TOKYO SEIMITSU Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 73. TOKYO SEIMITSU Main Business and Markets Served
 Table 74. TOKYO SEIMITSU Recent Developments/Updates
 Table 75. G&N Wafer Back-Grinding Machine Company Information
 Table 76. G&N Wafer Back-Grinding Machine Specification and Application
 Table 77. G&N Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 78. G&N Main Business and Markets Served
 Table 79. G&N Recent Developments/Updates
 Table 80. Okamoto Semiconductor Equipment Division Wafer Back-Grinding Machine Company Information
 Table 81. Okamoto Semiconductor Equipment Division Wafer Back-Grinding Machine Specification and Application
 Table 82. Okamoto Semiconductor Equipment Division Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 83. Okamoto Semiconductor Equipment Division Main Business and Markets Served
 Table 84. Okamoto Semiconductor Equipment Division Recent Developments/Updates
 Table 85. CETC Wafer Back-Grinding Machine Company Information
 Table 86. CETC Wafer Back-Grinding Machine Specification and Application
 Table 87. CETC Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 88. CETC Main Business and Markets Served
 Table 89. CETC Recent Developments/Updates
 Table 90. Koyo Machinery Wafer Back-Grinding Machine Company Information
 Table 91. Koyo Machinery Wafer Back-Grinding Machine Specification and Application
 Table 92. Koyo Machinery Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 93. Koyo Machinery Main Business and Markets Served
 Table 94. Koyo Machinery Recent Developments/Updates
 Table 95. Revasum Wafer Back-Grinding Machine Company Information
 Table 96. Revasum Wafer Back-Grinding Machine Specification and Application
 Table 97. Revasum Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 98. Revasum Main Business and Markets Served
 Table 99. Revasum Recent Developments/Updates
 Table 100. Daitron Wafer Back-Grinding Machine Company Information
 Table 101. Daitron Wafer Back-Grinding Machine Specification and Application
 Table 102. Daitron Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 103. Daitron Main Business and Markets Served
 Table 104. Daitron Recent Developments/Updates
 Table 105. WAIDA MFG Wafer Back-Grinding Machine Company Information
 Table 106. WAIDA MFG Wafer Back-Grinding Machine Specification and Application
 Table 107. WAIDA MFG Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 108. WAIDA MFG Main Business and Markets Served
 Table 109. WAIDA MFG Recent Developments/Updates
 Table 110. Hunan Yujing Machine Industrial Wafer Back-Grinding Machine Company Information
 Table 111. Hunan Yujing Machine Industrial Wafer Back-Grinding Machine Specification and Application
 Table 112. Hunan Yujing Machine Industrial Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 113. Hunan Yujing Machine Industrial Main Business and Markets Served
 Table 114. Hunan Yujing Machine Industrial Recent Developments/Updates
 Table 115. SpeedFam Wafer Back-Grinding Machine Company Information
 Table 116. SpeedFam Wafer Back-Grinding Machine Specification and Application
 Table 117. SpeedFam Wafer Back-Grinding Machine Production (Units), Value (US$ Million), Price (K US$/Unit) and Gross Margin (2020-2025)
 Table 118. SpeedFam Main Business and Markets Served
 Table 119. SpeedFam Recent Developments/Updates
 Table 120. Key Raw Materials Lists
 Table 121. Raw Materials Key Suppliers Lists
 Table 122. Wafer Back-Grinding Machine Distributors List
 Table 123. Wafer Back-Grinding Machine Customers List
 Table 124. Wafer Back-Grinding Machine Market Trends
 Table 125. Wafer Back-Grinding Machine Market Drivers
 Table 126. Wafer Back-Grinding Machine Market Challenges
 Table 127. Wafer Back-Grinding Machine Market Restraints
 Table 128. Research Programs/Design for This Report
 Table 129. Key Data Information from Secondary Sources
 Table 130. Key Data Information from Primary Sources
 Table 131. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Wafer Back-Grinding Machine
 Figure 2. Global Wafer Back-Grinding Machine Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Wafer Back-Grinding Machine Market Share by Type: 2024 VS 2031
 Figure 4. Wafer Edge Grinding Machine Product Picture
 Figure 5. Wafer Surface Grinding Machine Product Picture
 Figure 6. Global Wafer Back-Grinding Machine Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global Wafer Back-Grinding Machine Market Share by Application: 2024 VS 2031
 Figure 8. Silicon Wafer
 Figure 9. SiC Wafer
 Figure 10. Sapphire Wafer
 Figure 11. Global Wafer Back-Grinding Machine Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 12. Global Wafer Back-Grinding Machine Production Value (US$ Million) & (2020-2031)
 Figure 13. Global Wafer Back-Grinding Machine Production Capacity (Units) & (2020-2031)
 Figure 14. Global Wafer Back-Grinding Machine Production (Units) & (2020-2031)
 Figure 15. Global Wafer Back-Grinding Machine Average Price (K US$/Unit) & (2020-2031)
 Figure 16. Wafer Back-Grinding Machine Report Years Considered
 Figure 17. Wafer Back-Grinding Machine Production Share by Manufacturers in 2024
 Figure 18. Global Wafer Back-Grinding Machine Production Value Share by Manufacturers (2024)
 Figure 19. Wafer Back-Grinding Machine Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 20. The Global 5 and 10 Largest Players: Market Share by Wafer Back-Grinding Machine Revenue in 2024
 Figure 21. Global Wafer Back-Grinding Machine Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 22. Global Wafer Back-Grinding Machine Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 23. Global Wafer Back-Grinding Machine Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)
 Figure 24. Global Wafer Back-Grinding Machine Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 25. North America Wafer Back-Grinding Machine Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 26. Europe Wafer Back-Grinding Machine Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. China Wafer Back-Grinding Machine Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Japan Wafer Back-Grinding Machine Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Global Wafer Back-Grinding Machine Consumption by Region: 2020 VS 2024 VS 2031 (Units)
 Figure 30. Global Wafer Back-Grinding Machine Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 31. North America Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 32. North America Wafer Back-Grinding Machine Consumption Market Share by Country (2020-2031)
 Figure 33. U.S. Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 34. Canada Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 35. Europe Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 36. Europe Wafer Back-Grinding Machine Consumption Market Share by Country (2020-2031)
 Figure 37. Germany Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 38. France Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 39. U.K. Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 40. Italy Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 41. Netherlands Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 42. Asia Pacific Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 43. Asia Pacific Wafer Back-Grinding Machine Consumption Market Share by Region (2020-2031)
 Figure 44. China Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 45. Japan Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 46. South Korea Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 47. China Taiwan Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 48. Southeast Asia Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 49. India Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 50. Latin America, Middle East & Africa Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 51. Latin America, Middle East & Africa Wafer Back-Grinding Machine Consumption Market Share by Country (2020-2031)
 Figure 52. Mexico Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 53. Brazil Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 54. Turkey Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 55. GCC Countries Wafer Back-Grinding Machine Consumption and Growth Rate (2020-2031) & (Units)
 Figure 56. Global Production Market Share of Wafer Back-Grinding Machine by Type (2020-2031)
 Figure 57. Global Production Value Market Share of Wafer Back-Grinding Machine by Type (2020-2031)
 Figure 58. Global Wafer Back-Grinding Machine Price (K US$/Unit) by Type (2020-2031)
 Figure 59. Global Production Market Share of Wafer Back-Grinding Machine by Application (2020-2031)
 Figure 60. Global Production Value Market Share of Wafer Back-Grinding Machine by Application (2020-2031)
 Figure 61. Global Wafer Back-Grinding Machine Price (K US$/Unit) by Application (2020-2031)
 Figure 62. Wafer Back-Grinding Machine Value Chain
 Figure 63. Channels of Distribution (Direct Vs Distribution)
 Figure 64. Bottom-up and Top-down Approaches for This Report
 Figure 65. Data Triangulation
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