The global market for Semi-Automatic Wafer Bonding Equipment was valued at US$ 126 million in the year 2024 and is projected to reach a revised size of US$ 174 million by 2031, growing at a CAGR of 4.8% during the forecast period.

Semi-Automatic Wafer Bonding Equipment Market

Wafer bonding equipment is used in the microelectronics industry to bond two or more wafers or substrates together. This process is commonly used in the fabrication of microelectronic devices such as microelectromechanical systems (MEMS), integrated circuits (ICs), and optoelectronic devices.

North American market for Semi-Automatic Wafer Bonding Equipment is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

Asia-Pacific market for Semi-Automatic Wafer Bonding Equipment is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.

The major global manufacturers of Semi-Automatic Wafer Bonding Equipment include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, TAZMO, Hutem, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Semi-Automatic Wafer Bonding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semi-Automatic Wafer Bonding Equipment.

The Semi-Automatic Wafer Bonding Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Semi-Automatic Wafer Bonding Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Semi-Automatic Wafer Bonding Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of Semi-Automatic Wafer Bonding Equipment Market Report

Report Metric	Details
Report Name	Semi-Automatic Wafer Bonding Equipment Market
Accounted market size in year	US$ 126 million
Forecasted market size in 2031	US$ 174 million
CAGR	4.8%
Base Year	year
Forecasted years	2025 - 2031
by Type	6-Inch 8-Inch Others
by Application	MEMS Advanced Packaging CIS Others
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, TAZMO, Hutem, Shanghai Micro Electronics, Canon, Suzhou iWISEETEC
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Semi-Automatic Wafer Bonding Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Semi-Automatic Wafer Bonding Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Semi-Automatic Wafer Bonding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Semi-Automatic Wafer Bonding Equipment Market growing?

Ans: The Semi-Automatic Wafer Bonding Equipment Market witnessing a CAGR of 4.8% during the forecast period 2025-2031.

What is the Semi-Automatic Wafer Bonding Equipment Market size in 2031?

Ans: The Semi-Automatic Wafer Bonding Equipment Market size in 2031 will be US$ 174 million.

Who are the main players in the Semi-Automatic Wafer Bonding Equipment Market report?

Ans: The main players in the Semi-Automatic Wafer Bonding Equipment Market are EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Bondtech, Aimechatec, TAZMO, Hutem, Shanghai Micro Electronics, Canon, Suzhou iWISEETEC

What are the Application segmentation covered in the Semi-Automatic Wafer Bonding Equipment Market report?

Ans: The Applications covered in the Semi-Automatic Wafer Bonding Equipment Market report are MEMS, Advanced Packaging, CIS, Others

What are the Type segmentation covered in the Semi-Automatic Wafer Bonding Equipment Market report?

Ans: The Types covered in the Semi-Automatic Wafer Bonding Equipment Market report are 6-Inch, 8-Inch, Others

1 Semi-Automatic Wafer Bonding Equipment Market Overview

1.1 Product Definition

1.2 Semi-Automatic Wafer Bonding Equipment by Type

1.2.1 Global Semi-Automatic Wafer Bonding Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 6-Inch

1.2.3 8-Inch

1.2.4 Others

1.3 Semi-Automatic Wafer Bonding Equipment by Application

1.3.1 Global Semi-Automatic Wafer Bonding Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 MEMS

1.3.3 Advanced Packaging

1.3.4 CIS

1.3.5 Others

1.4 Global Market Growth Prospects

1.4.1 Global Semi-Automatic Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global Semi-Automatic Wafer Bonding Equipment Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global Semi-Automatic Wafer Bonding Equipment Production Estimates and Forecasts (2020-2031)

1.4.4 Global Semi-Automatic Wafer Bonding Equipment Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Manufacturers (2020-2025)

2.2 Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of Semi-Automatic Wafer Bonding Equipment, Industry Ranking, 2023 VS 2024

2.4 Global Semi-Automatic Wafer Bonding Equipment Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global Semi-Automatic Wafer Bonding Equipment Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of Semi-Automatic Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of Semi-Automatic Wafer Bonding Equipment, Product Offered and Application

2.8 Global Key Manufacturers of Semi-Automatic Wafer Bonding Equipment, Date of Enter into This Industry

2.9 Semi-Automatic Wafer Bonding Equipment Market Competitive Situation and Trends

2.9.1 Semi-Automatic Wafer Bonding Equipment Market Concentration Rate

2.9.2 Global 5 and 10 Largest Semi-Automatic Wafer Bonding Equipment Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 Semi-Automatic Wafer Bonding Equipment Production by Region

3.1 Global Semi-Automatic Wafer Bonding Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global Semi-Automatic Wafer Bonding Equipment Production Value by Region (2020-2031)

3.2.1 Global Semi-Automatic Wafer Bonding Equipment Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of Semi-Automatic Wafer Bonding Equipment by Region (2026-2031)

3.3 Global Semi-Automatic Wafer Bonding Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global Semi-Automatic Wafer Bonding Equipment Production Volume by Region (2020-2031)

3.4.1 Global Semi-Automatic Wafer Bonding Equipment Production by Region (2020-2025)

3.4.2 Global Forecasted Production of Semi-Automatic Wafer Bonding Equipment by Region (2026-2031)

3.5 Global Semi-Automatic Wafer Bonding Equipment Market Price Analysis by Region (2020-2025)

3.6 Global Semi-Automatic Wafer Bonding Equipment Production and Value, Year-over-Year Growth

3.6.1 North America Semi-Automatic Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe Semi-Automatic Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.3 China Semi-Automatic Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan Semi-Automatic Wafer Bonding Equipment Production Value Estimates and Forecasts (2020-2031)

4 Semi-Automatic Wafer Bonding Equipment Consumption by Region

4.1 Global Semi-Automatic Wafer Bonding Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global Semi-Automatic Wafer Bonding Equipment Consumption by Region (2020-2031)

4.2.1 Global Semi-Automatic Wafer Bonding Equipment Consumption by Region (2020-2025)

4.2.2 Global Semi-Automatic Wafer Bonding Equipment Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America Semi-Automatic Wafer Bonding Equipment Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe Semi-Automatic Wafer Bonding Equipment Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific Semi-Automatic Wafer Bonding Equipment Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa Semi-Automatic Wafer Bonding Equipment Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global Semi-Automatic Wafer Bonding Equipment Production by Type (2020-2031)

5.1.1 Global Semi-Automatic Wafer Bonding Equipment Production by Type (2020-2025)

5.1.2 Global Semi-Automatic Wafer Bonding Equipment Production by Type (2026-2031)

5.1.3 Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Type (2020-2031)

5.2 Global Semi-Automatic Wafer Bonding Equipment Production Value by Type (2020-2031)

5.2.1 Global Semi-Automatic Wafer Bonding Equipment Production Value by Type (2020-2025)

5.2.2 Global Semi-Automatic Wafer Bonding Equipment Production Value by Type (2026-2031)

5.2.3 Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Type (2020-2031)

5.3 Global Semi-Automatic Wafer Bonding Equipment Price by Type (2020-2031)

6 Segment by Application

6.1 Global Semi-Automatic Wafer Bonding Equipment Production by Application (2020-2031)

6.1.1 Global Semi-Automatic Wafer Bonding Equipment Production by Application (2020-2025)

6.1.2 Global Semi-Automatic Wafer Bonding Equipment Production by Application (2026-2031)

6.1.3 Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Application (2020-2031)

6.2 Global Semi-Automatic Wafer Bonding Equipment Production Value by Application (2020-2031)

6.2.1 Global Semi-Automatic Wafer Bonding Equipment Production Value by Application (2020-2025)

6.2.2 Global Semi-Automatic Wafer Bonding Equipment Production Value by Application (2026-2031)

6.2.3 Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Application (2020-2031)

6.3 Global Semi-Automatic Wafer Bonding Equipment Price by Application (2020-2031)

7 Key Companies Profiled

7.1 EV Group

7.1.1 EV Group Semi-Automatic Wafer Bonding Equipment Company Information

7.1.2 EV Group Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.1.3 EV Group Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.1.4 EV Group Main Business and Markets Served

7.1.5 EV Group Recent Developments/Updates

7.2 SUSS MicroTec

7.2.1 SUSS MicroTec Semi-Automatic Wafer Bonding Equipment Company Information

7.2.2 SUSS MicroTec Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.2.3 SUSS MicroTec Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.2.4 SUSS MicroTec Main Business and Markets Served

7.2.5 SUSS MicroTec Recent Developments/Updates

7.3 Tokyo Electron

7.3.1 Tokyo Electron Semi-Automatic Wafer Bonding Equipment Company Information

7.3.2 Tokyo Electron Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.3.3 Tokyo Electron Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.3.4 Tokyo Electron Main Business and Markets Served

7.3.5 Tokyo Electron Recent Developments/Updates

7.4 Applied Microengineering

7.4.1 Applied Microengineering Semi-Automatic Wafer Bonding Equipment Company Information

7.4.2 Applied Microengineering Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.4.3 Applied Microengineering Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Applied Microengineering Main Business and Markets Served

7.4.5 Applied Microengineering Recent Developments/Updates

7.5 Nidec Machine Tool

7.5.1 Nidec Machine Tool Semi-Automatic Wafer Bonding Equipment Company Information

7.5.2 Nidec Machine Tool Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.5.3 Nidec Machine Tool Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Nidec Machine Tool Main Business and Markets Served

7.5.5 Nidec Machine Tool Recent Developments/Updates

7.6 Ayumi Industry

7.6.1 Ayumi Industry Semi-Automatic Wafer Bonding Equipment Company Information

7.6.2 Ayumi Industry Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.6.3 Ayumi Industry Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Ayumi Industry Main Business and Markets Served

7.6.5 Ayumi Industry Recent Developments/Updates

7.7 Bondtech

7.7.1 Bondtech Semi-Automatic Wafer Bonding Equipment Company Information

7.7.2 Bondtech Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.7.3 Bondtech Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Bondtech Main Business and Markets Served

7.7.5 Bondtech Recent Developments/Updates

7.8 Aimechatec

7.8.1 Aimechatec Semi-Automatic Wafer Bonding Equipment Company Information

7.8.2 Aimechatec Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.8.3 Aimechatec Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.8.4 Aimechatec Main Business and Markets Served

7.8.5 Aimechatec Recent Developments/Updates

7.9 TAZMO

7.9.1 TAZMO Semi-Automatic Wafer Bonding Equipment Company Information

7.9.2 TAZMO Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.9.3 TAZMO Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.9.4 TAZMO Main Business and Markets Served

7.9.5 TAZMO Recent Developments/Updates

7.10 Hutem

7.10.1 Hutem Semi-Automatic Wafer Bonding Equipment Company Information

7.10.2 Hutem Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.10.3 Hutem Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.10.4 Hutem Main Business and Markets Served

7.10.5 Hutem Recent Developments/Updates

7.11 Shanghai Micro Electronics

7.11.1 Shanghai Micro Electronics Semi-Automatic Wafer Bonding Equipment Company Information

7.11.2 Shanghai Micro Electronics Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.11.3 Shanghai Micro Electronics Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.11.4 Shanghai Micro Electronics Main Business and Markets Served

7.11.5 Shanghai Micro Electronics Recent Developments/Updates

7.12 Canon

7.12.1 Canon Semi-Automatic Wafer Bonding Equipment Company Information

7.12.2 Canon Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.12.3 Canon Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.12.4 Canon Main Business and Markets Served

7.12.5 Canon Recent Developments/Updates

7.13 Suzhou iWISEETEC

7.13.1 Suzhou iWISEETEC Semi-Automatic Wafer Bonding Equipment Company Information

7.13.2 Suzhou iWISEETEC Semi-Automatic Wafer Bonding Equipment Product Portfolio

7.13.3 Suzhou iWISEETEC Semi-Automatic Wafer Bonding Equipment Production, Value, Price and Gross Margin (2020-2025)

7.13.4 Suzhou iWISEETEC Main Business and Markets Served

7.13.5 Suzhou iWISEETEC Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 Semi-Automatic Wafer Bonding Equipment Industry Chain Analysis

8.2 Semi-Automatic Wafer Bonding Equipment Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 Semi-Automatic Wafer Bonding Equipment Production Mode & Process Analysis

8.4 Semi-Automatic Wafer Bonding Equipment Sales and Marketing

8.4.1 Semi-Automatic Wafer Bonding Equipment Sales Channels

8.4.2 Semi-Automatic Wafer Bonding Equipment Distributors

8.5 Semi-Automatic Wafer Bonding Equipment Customer Analysis

9 Semi-Automatic Wafer Bonding Equipment Market Dynamics

9.1 Semi-Automatic Wafer Bonding Equipment Industry Trends

9.2 Semi-Automatic Wafer Bonding Equipment Market Drivers

9.3 Semi-Automatic Wafer Bonding Equipment Market Challenges

9.4 Semi-Automatic Wafer Bonding Equipment Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

EV Group

Suss Microtec

Tokyo Electron

Applied Microengineering

Shanghai Micro Electronics

Canon Inc

Suzhou iWISEETEC

List of Tables

Table 1. Global Semi-Automatic Wafer Bonding Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global Semi-Automatic Wafer Bonding Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global Semi-Automatic Wafer Bonding Equipment Production Capacity (Units) by Manufacturers in 2024

Table 4. Global Semi-Automatic Wafer Bonding Equipment Production by Manufacturers (2020-2025) & (Units)

Table 5. Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Manufacturers (2020-2025)

Table 6. Global Semi-Automatic Wafer Bonding Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global Semi-Automatic Wafer Bonding Equipment Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of Semi-Automatic Wafer Bonding Equipment, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Semi-Automatic Wafer Bonding Equipment as of 2024)

Table 10. Global Market Semi-Automatic Wafer Bonding Equipment Average Price by Manufacturers (US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of Semi-Automatic Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of Semi-Automatic Wafer Bonding Equipment, Product Offered and Application

Table 13. Global Key Manufacturers of Semi-Automatic Wafer Bonding Equipment, Date of Enter into This Industry

Table 14. Global Semi-Automatic Wafer Bonding Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global Semi-Automatic Wafer Bonding Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) by Region (2020-2025)

Table 18. Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Region (2020-2025)

Table 19. Global Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global Semi-Automatic Wafer Bonding Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global Semi-Automatic Wafer Bonding Equipment Production (Units) by Region (2020-2025)

Table 23. Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Region (2020-2025)

Table 24. Global Semi-Automatic Wafer Bonding Equipment Production (Units) Forecast by Region (2026-2031)

Table 25. Global Semi-Automatic Wafer Bonding Equipment Production Market Share Forecast by Region (2026-2031)

Table 26. Global Semi-Automatic Wafer Bonding Equipment Market Average Price (US$/Unit) by Region (2020-2025)

Table 27. Global Semi-Automatic Wafer Bonding Equipment Market Average Price (US$/Unit) by Region (2026-2031)

Table 28. Global Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global Semi-Automatic Wafer Bonding Equipment Consumption by Region (2020-2025) & (Units)

Table 30. Global Semi-Automatic Wafer Bonding Equipment Consumption Market Share by Region (2020-2025)

Table 31. Global Semi-Automatic Wafer Bonding Equipment Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global Semi-Automatic Wafer Bonding Equipment Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America Semi-Automatic Wafer Bonding Equipment Consumption by Country (2020-2025) & (Units)

Table 35. North America Semi-Automatic Wafer Bonding Equipment Consumption by Country (2026-2031) & (Units)

Table 36. Europe Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe Semi-Automatic Wafer Bonding Equipment Consumption by Country (2020-2025) & (Units)

Table 38. Europe Semi-Automatic Wafer Bonding Equipment Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific Semi-Automatic Wafer Bonding Equipment Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific Semi-Automatic Wafer Bonding Equipment Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa Semi-Automatic Wafer Bonding Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa Semi-Automatic Wafer Bonding Equipment Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa Semi-Automatic Wafer Bonding Equipment Consumption by Country (2026-2031) & (Units)

Table 45. Global Semi-Automatic Wafer Bonding Equipment Production (Units) by Type (2020-2025)

Table 46. Global Semi-Automatic Wafer Bonding Equipment Production (Units) by Type (2026-2031)

Table 47. Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Type (2020-2025)

Table 48. Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Type (2026-2031)

Table 49. Global Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) by Type (2020-2025)

Table 50. Global Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) by Type (2026-2031)

Table 51. Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Type (2020-2025)

Table 52. Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Type (2026-2031)

Table 53. Global Semi-Automatic Wafer Bonding Equipment Price (US$/Unit) by Type (2020-2025)

Table 54. Global Semi-Automatic Wafer Bonding Equipment Price (US$/Unit) by Type (2026-2031)

Table 55. Global Semi-Automatic Wafer Bonding Equipment Production (Units) by Application (2020-2025)

Table 56. Global Semi-Automatic Wafer Bonding Equipment Production (Units) by Application (2026-2031)

Table 57. Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Application (2020-2025)

Table 58. Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Application (2026-2031)

Table 59. Global Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) by Application (2020-2025)

Table 60. Global Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) by Application (2026-2031)

Table 61. Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Application (2020-2025)

Table 62. Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Application (2026-2031)

Table 63. Global Semi-Automatic Wafer Bonding Equipment Price (US$/Unit) by Application (2020-2025)

Table 64. Global Semi-Automatic Wafer Bonding Equipment Price (US$/Unit) by Application (2026-2031)

Table 65. EV Group Semi-Automatic Wafer Bonding Equipment Company Information

Table 66. EV Group Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 67. EV Group Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 68. EV Group Main Business and Markets Served

Table 69. EV Group Recent Developments/Updates

Table 70. SUSS MicroTec Semi-Automatic Wafer Bonding Equipment Company Information

Table 71. SUSS MicroTec Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 72. SUSS MicroTec Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 73. SUSS MicroTec Main Business and Markets Served

Table 74. SUSS MicroTec Recent Developments/Updates

Table 75. Tokyo Electron Semi-Automatic Wafer Bonding Equipment Company Information

Table 76. Tokyo Electron Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 77. Tokyo Electron Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 78. Tokyo Electron Main Business and Markets Served

Table 79. Tokyo Electron Recent Developments/Updates

Table 80. Applied Microengineering Semi-Automatic Wafer Bonding Equipment Company Information

Table 81. Applied Microengineering Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 82. Applied Microengineering Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 83. Applied Microengineering Main Business and Markets Served

Table 84. Applied Microengineering Recent Developments/Updates

Table 85. Nidec Machine Tool Semi-Automatic Wafer Bonding Equipment Company Information

Table 86. Nidec Machine Tool Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 87. Nidec Machine Tool Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 88. Nidec Machine Tool Main Business and Markets Served

Table 89. Nidec Machine Tool Recent Developments/Updates

Table 90. Ayumi Industry Semi-Automatic Wafer Bonding Equipment Company Information

Table 91. Ayumi Industry Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 92. Ayumi Industry Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 93. Ayumi Industry Main Business and Markets Served

Table 94. Ayumi Industry Recent Developments/Updates

Table 95. Bondtech Semi-Automatic Wafer Bonding Equipment Company Information

Table 96. Bondtech Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 97. Bondtech Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 98. Bondtech Main Business and Markets Served

Table 99. Bondtech Recent Developments/Updates

Table 100. Aimechatec Semi-Automatic Wafer Bonding Equipment Company Information

Table 101. Aimechatec Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 102. Aimechatec Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 103. Aimechatec Main Business and Markets Served

Table 104. Aimechatec Recent Developments/Updates

Table 105. TAZMO Semi-Automatic Wafer Bonding Equipment Company Information

Table 106. TAZMO Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 107. TAZMO Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 108. TAZMO Main Business and Markets Served

Table 109. TAZMO Recent Developments/Updates

Table 110. Hutem Semi-Automatic Wafer Bonding Equipment Company Information

Table 111. Hutem Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 112. Hutem Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 113. Hutem Main Business and Markets Served

Table 114. Hutem Recent Developments/Updates

Table 115. Shanghai Micro Electronics Semi-Automatic Wafer Bonding Equipment Company Information

Table 116. Shanghai Micro Electronics Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 117. Shanghai Micro Electronics Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 118. Shanghai Micro Electronics Main Business and Markets Served

Table 119. Shanghai Micro Electronics Recent Developments/Updates

Table 120. Canon Semi-Automatic Wafer Bonding Equipment Company Information

Table 121. Canon Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 122. Canon Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 123. Canon Main Business and Markets Served

Table 124. Canon Recent Developments/Updates

Table 125. Suzhou iWISEETEC Semi-Automatic Wafer Bonding Equipment Company Information

Table 126. Suzhou iWISEETEC Semi-Automatic Wafer Bonding Equipment Specification and Application

Table 127. Suzhou iWISEETEC Semi-Automatic Wafer Bonding Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 128. Suzhou iWISEETEC Main Business and Markets Served

Table 129. Suzhou iWISEETEC Recent Developments/Updates

Table 130. Key Raw Materials Lists

Table 131. Raw Materials Key Suppliers Lists

Table 132. Semi-Automatic Wafer Bonding Equipment Distributors List

Table 133. Semi-Automatic Wafer Bonding Equipment Customers List

Table 134. Semi-Automatic Wafer Bonding Equipment Market Trends

Table 135. Semi-Automatic Wafer Bonding Equipment Market Drivers

Table 136. Semi-Automatic Wafer Bonding Equipment Market Challenges

Table 137. Semi-Automatic Wafer Bonding Equipment Market Restraints

Table 138. Research Programs/Design for This Report

Table 139. Key Data Information from Secondary Sources

Table 140. Key Data Information from Primary Sources

Table 141. Authors List of This Report

List of Figures

Figure 1. Product Picture of Semi-Automatic Wafer Bonding Equipment

Figure 2. Global Semi-Automatic Wafer Bonding Equipment Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global Semi-Automatic Wafer Bonding Equipment Market Share by Type: 2024 VS 2031

Figure 4. 6-Inch Product Picture

Figure 5. 8-Inch Product Picture

Figure 6. Others Product Picture

Figure 7. Global Semi-Automatic Wafer Bonding Equipment Market Value by Application, (US$ Million) & (2020-2031)

Figure 8. Global Semi-Automatic Wafer Bonding Equipment Market Share by Application: 2024 VS 2031

Figure 9. MEMS

Figure 10. Advanced Packaging

Figure 11. CIS

Figure 12. Others

Figure 13. Global Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 14. Global Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) & (2020-2031)

Figure 15. Global Semi-Automatic Wafer Bonding Equipment Production Capacity (Units) & (2020-2031)

Figure 16. Global Semi-Automatic Wafer Bonding Equipment Production (Units) & (2020-2031)

Figure 17. Global Semi-Automatic Wafer Bonding Equipment Average Price (US$/Unit) & (2020-2031)

Figure 18. Semi-Automatic Wafer Bonding Equipment Report Years Considered

Figure 19. Semi-Automatic Wafer Bonding Equipment Production Share by Manufacturers in 2024

Figure 20. Global Semi-Automatic Wafer Bonding Equipment Production Value Share by Manufacturers (2024)

Figure 21. Semi-Automatic Wafer Bonding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 22. The Global 5 and 10 Largest Players: Market Share by Semi-Automatic Wafer Bonding Equipment Revenue in 2024

Figure 23. Global Semi-Automatic Wafer Bonding Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 24. Global Semi-Automatic Wafer Bonding Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 25. Global Semi-Automatic Wafer Bonding Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 26. Global Semi-Automatic Wafer Bonding Equipment Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 27. North America Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Europe Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 29. China Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 30. Japan Semi-Automatic Wafer Bonding Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 31. Global Semi-Automatic Wafer Bonding Equipment Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 32. Global Semi-Automatic Wafer Bonding Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 33. North America Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 34. North America Semi-Automatic Wafer Bonding Equipment Consumption Market Share by Country (2020-2031)

Figure 35. U.S. Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 36. Canada Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 37. Europe Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 38. Europe Semi-Automatic Wafer Bonding Equipment Consumption Market Share by Country (2020-2031)

Figure 39. Germany Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. France Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. U.K. Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 42. Italy Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 43. Netherlands Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 44. Asia Pacific Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 45. Asia Pacific Semi-Automatic Wafer Bonding Equipment Consumption Market Share by Region (2020-2031)

Figure 46. China Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. Japan Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. South Korea Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. China Taiwan Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 50. Southeast Asia Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 51. India Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 52. Latin America, Middle East & Africa Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 53. Latin America, Middle East & Africa Semi-Automatic Wafer Bonding Equipment Consumption Market Share by Country (2020-2031)

Figure 54. Mexico Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 55. Brazil Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 56. Turkey Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 57. GCC Countries Semi-Automatic Wafer Bonding Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 58. Global Production Market Share of Semi-Automatic Wafer Bonding Equipment by Type (2020-2031)

Figure 59. Global Production Value Market Share of Semi-Automatic Wafer Bonding Equipment by Type (2020-2031)

Figure 60. Global Semi-Automatic Wafer Bonding Equipment Price (US$/Unit) by Type (2020-2031)

Figure 61. Global Production Market Share of Semi-Automatic Wafer Bonding Equipment by Application (2020-2031)

Figure 62. Global Production Value Market Share of Semi-Automatic Wafer Bonding Equipment by Application (2020-2031)

Figure 63. Global Semi-Automatic Wafer Bonding Equipment Price (US$/Unit) by Application (2020-2031)

Figure 64. Semi-Automatic Wafer Bonding Equipment Value Chain

Figure 65. Channels of Distribution (Direct Vs Distribution)

Figure 66. Bottom-up and Top-down Approaches for This Report

Figure 67. Data Triangulation

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Global Wafer Bonding Equipment Market Research Report 2025

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