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Global Power Packaging for Automotive Semiconductors Market Research Report 2024
Published Date: August 2024
|
Report Code: QYRE-Auto-20T15790
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Global Power Packaging for Automotive Semiconductors Market Research Report 2023
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Global Power Packaging for Automotive Semiconductors Market Research Report 2024

Code: QYRE-Auto-20T15790
Report
August 2024
Pages:104
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
Onsemi
Mitsubishi Electric
ROHM CO LTD
Microchip (Microsemi)
Amkor
ASE(SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Tongfu Microelectronics (TFME)
HT-tech
China Wafer Level CSP Co. Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)

Power Packaging for Automotive Semiconductors Market Size

The global Power Packaging for Automotive Semiconductors market was valued at US$ 1233 million in 2023 and is anticipated to reach US$ 2120 million by 2030, witnessing a CAGR of 8.7% during the forecast period 2024-2030.

Power Packaging for Automotive Semiconductors Market

Power Packaging for Automotive Semiconductors Market

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. This report studies the Power Packaging for Automotive Semiconductors.
Currently the key players of Automotive OSAT are Amkor, ASE Group and UTAC, Others Automotive OSAT players are mainly located in China Taiwan, South Korea, China mainland, Southeast Asia (Singapore and Malaysia), including Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, Powertech Technology Inc. (PTI), King Yuan Electronics Corp. (KYEC), OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, SFA Semicon, Unisem Group, Carsem, Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), Hefei Chipmore Technology Co.,Ltd., JCET Group and HT-tech, etc.
This report aims to provide a comprehensive presentation of the global market for Power Packaging for Automotive Semiconductors, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Power Packaging for Automotive Semiconductors.

Report Scope

The Power Packaging for Automotive Semiconductors market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Power Packaging for Automotive Semiconductors market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Power Packaging for Automotive Semiconductors companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Power Packaging for Automotive Semiconductors Market Report

Report Metric Details
Report Name Power Packaging for Automotive Semiconductors Market
Accounted market size in 2023 US$ 1233 million
Forecasted market size in 2030 US$ 2120 million
CAGR 8.7%
Base Year 2023
Forecasted years 2024 - 2030
Segment by Type
  • Diodes
  • IGBT
  • MOSFET
  • Power Management IC
  • Others
Segment by Application
  • Automotive OSAT
  • Automotive IDM
By Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia) Rest of Europe
  • Nordic Countries
  • Asia-Pacific (China, Japan, South Korea)
  • Southeast Asia (India, Australia)
  • Rest of Asia
  • Latin America (Mexico, Brazil)
  • Rest of Latin America
  • Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company NXP, Infineon (Cypress), Renesas, Texas Instrument, STMicroelectronics, Bosch, onsemi, Mitsubishi Electric, Rohm, Microchip (Microsemi), Amkor, ASE (SPIL), UTAC, JCET (STATS ChipPAC), Carsem, King Yuan Electronics Corp. (KYEC), KINGPAK Technology Inc, Powertech Technology Inc. (PTI), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, KESM Industries Berhad, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), HT-tech, China Wafer Level CSP Co., Ltd, Ningbo ChipEx Semiconductor Co., Ltd, Guangdong Leadyo IC Testing, Unimos Microelectronics (Shanghai), Sino Technology, Taiji Semiconductor (Suzhou)
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
  • Chapter 3: Detailed analysis of Power Packaging for Automotive Semiconductors companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
  • Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
  • Chapter 12: The main points and conclusions of the report.

FAQ for this report

How fast is Power Packaging for Automotive Semiconductors Market growing?

Ans: The Power Packaging for Automotive Semiconductors Market witnessing a CAGR of 8.7% during the forecast period 2024-2030.

What is the Power Packaging for Automotive Semiconductors Market size in 2030?

Ans: The Power Packaging for Automotive Semiconductors Market size in 2030 will be US$ 2120 million.

Who are the main players in the Power Packaging for Automotive Semiconductors Market report?

Ans: The main players in the Power Packaging for Automotive Semiconductors Market are NXP, Infineon (Cypress), Renesas, Texas Instrument, STMicroelectronics, Bosch, onsemi, Mitsubishi Electric, Rohm, Microchip (Microsemi), Amkor, ASE (SPIL), UTAC, JCET (STATS ChipPAC), Carsem, King Yuan Electronics Corp. (KYEC), KINGPAK Technology Inc, Powertech Technology Inc. (PTI), SFA Semicon, Unisem Group, Chipbond Technology Corporation, ChipMOS TECHNOLOGIES, OSE CORP., Sigurd Microelectronics, Natronix Semiconductor Technology, Nepes, KESM Industries Berhad, Forehope Electronic (Ningbo) Co.,Ltd., Union Semiconductor（Hefei）Co., Ltd., Tongfu Microelectronics (TFME), HT-tech, China Wafer Level CSP Co., Ltd, Ningbo ChipEx Semiconductor Co., Ltd, Guangdong Leadyo IC Testing, Unimos Microelectronics (Shanghai), Sino Technology, Taiji Semiconductor (Suzhou)

What are the Application segmentation covered in the Power Packaging for Automotive Semiconductors Market report?

Ans: The Applications covered in the Power Packaging for Automotive Semiconductors Market report are Automotive OSAT, Automotive IDM

What are the Type segmentation covered in the Power Packaging for Automotive Semiconductors Market report?

Ans: The Types covered in the Power Packaging for Automotive Semiconductors Market report are Diodes, IGBT, MOSFET, Power Management IC, Others

1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Power Packaging for Automotive Semiconductors Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Diodes
1.2.3 IGBT
1.2.4 MOSFET
1.2.5 Power Management IC
1.2.6 Others
1.3 Market by Application
1.3.1 Global Power Packaging for Automotive Semiconductors Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive OSAT
1.3.3 Automotive IDM
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Power Packaging for Automotive Semiconductors Market Perspective (2019-2030)
2.2 Power Packaging for Automotive Semiconductors Growth Trends by Region
2.2.1 Global Power Packaging for Automotive Semiconductors Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Power Packaging for Automotive Semiconductors Historic Market Size by Region (2019-2024)
2.2.3 Power Packaging for Automotive Semiconductors Forecasted Market Size by Region (2025-2030)
2.3 Power Packaging for Automotive Semiconductors Market Dynamics
2.3.1 Power Packaging for Automotive Semiconductors Industry Trends
2.3.2 Power Packaging for Automotive Semiconductors Market Drivers
2.3.3 Power Packaging for Automotive Semiconductors Market Challenges
2.3.4 Power Packaging for Automotive Semiconductors Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Power Packaging for Automotive Semiconductors Players by Revenue
3.1.1 Global Top Power Packaging for Automotive Semiconductors Players by Revenue (2019-2024)
3.1.2 Global Power Packaging for Automotive Semiconductors Revenue Market Share by Players (2019-2024)
3.2 Global Power Packaging for Automotive Semiconductors Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Power Packaging for Automotive Semiconductors Revenue
3.4 Global Power Packaging for Automotive Semiconductors Market Concentration Ratio
3.4.1 Global Power Packaging for Automotive Semiconductors Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Power Packaging for Automotive Semiconductors Revenue in 2023
3.5 Power Packaging for Automotive Semiconductors Key Players Head office and Area Served
3.6 Key Players Power Packaging for Automotive Semiconductors Product Solution and Service
3.7 Date of Enter into Power Packaging for Automotive Semiconductors Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Power Packaging for Automotive Semiconductors Breakdown Data by Type
4.1 Global Power Packaging for Automotive Semiconductors Historic Market Size by Type (2019-2024)
4.2 Global Power Packaging for Automotive Semiconductors Forecasted Market Size by Type (2025-2030)
5 Power Packaging for Automotive Semiconductors Breakdown Data by Application
5.1 Global Power Packaging for Automotive Semiconductors Historic Market Size by Application (2019-2024)
5.2 Global Power Packaging for Automotive Semiconductors Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Power Packaging for Automotive Semiconductors Market Size (2019-2030)
6.2 North America Power Packaging for Automotive Semiconductors Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Power Packaging for Automotive Semiconductors Market Size by Country (2019-2024)
6.4 North America Power Packaging for Automotive Semiconductors Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Power Packaging for Automotive Semiconductors Market Size (2019-2030)
7.2 Europe Power Packaging for Automotive Semiconductors Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Power Packaging for Automotive Semiconductors Market Size by Country (2019-2024)
7.4 Europe Power Packaging for Automotive Semiconductors Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Power Packaging for Automotive Semiconductors Market Size (2019-2030)
8.2 Asia-Pacific Power Packaging for Automotive Semiconductors Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Power Packaging for Automotive Semiconductors Market Size by Region (2019-2024)
8.4 Asia-Pacific Power Packaging for Automotive Semiconductors Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Power Packaging for Automotive Semiconductors Market Size (2019-2030)
9.2 Latin America Power Packaging for Automotive Semiconductors Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Power Packaging for Automotive Semiconductors Market Size by Country (2019-2024)
9.4 Latin America Power Packaging for Automotive Semiconductors Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Power Packaging for Automotive Semiconductors Market Size (2019-2030)
10.2 Middle East & Africa Power Packaging for Automotive Semiconductors Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Power Packaging for Automotive Semiconductors Market Size by Country (2019-2024)
10.4 Middle East & Africa Power Packaging for Automotive Semiconductors Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 NXP
11.1.1 NXP Company Detail
11.1.2 NXP Business Overview
11.1.3 NXP Power Packaging for Automotive Semiconductors Introduction
11.1.4 NXP Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.1.5 NXP Recent Development
11.2 Infineon (Cypress)
11.2.1 Infineon (Cypress) Company Detail
11.2.2 Infineon (Cypress) Business Overview
11.2.3 Infineon (Cypress) Power Packaging for Automotive Semiconductors Introduction
11.2.4 Infineon (Cypress) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.2.5 Infineon (Cypress) Recent Development
11.3 Renesas
11.3.1 Renesas Company Detail
11.3.2 Renesas Business Overview
11.3.3 Renesas Power Packaging for Automotive Semiconductors Introduction
11.3.4 Renesas Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.3.5 Renesas Recent Development
11.4 Texas Instrument
11.4.1 Texas Instrument Company Detail
11.4.2 Texas Instrument Business Overview
11.4.3 Texas Instrument Power Packaging for Automotive Semiconductors Introduction
11.4.4 Texas Instrument Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.4.5 Texas Instrument Recent Development
11.5 STMicroelectronics
11.5.1 STMicroelectronics Company Detail
11.5.2 STMicroelectronics Business Overview
11.5.3 STMicroelectronics Power Packaging for Automotive Semiconductors Introduction
11.5.4 STMicroelectronics Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.5.5 STMicroelectronics Recent Development
11.6 Bosch
11.6.1 Bosch Company Detail
11.6.2 Bosch Business Overview
11.6.3 Bosch Power Packaging for Automotive Semiconductors Introduction
11.6.4 Bosch Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.6.5 Bosch Recent Development
11.7 onsemi
11.7.1 onsemi Company Detail
11.7.2 onsemi Business Overview
11.7.3 onsemi Power Packaging for Automotive Semiconductors Introduction
11.7.4 onsemi Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.7.5 onsemi Recent Development
11.8 Mitsubishi Electric
11.8.1 Mitsubishi Electric Company Detail
11.8.2 Mitsubishi Electric Business Overview
11.8.3 Mitsubishi Electric Power Packaging for Automotive Semiconductors Introduction
11.8.4 Mitsubishi Electric Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.8.5 Mitsubishi Electric Recent Development
11.9 Rohm
11.9.1 Rohm Company Detail
11.9.2 Rohm Business Overview
11.9.3 Rohm Power Packaging for Automotive Semiconductors Introduction
11.9.4 Rohm Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.9.5 Rohm Recent Development
11.10 Microchip (Microsemi)
11.10.1 Microchip (Microsemi) Company Detail
11.10.2 Microchip (Microsemi) Business Overview
11.10.3 Microchip (Microsemi) Power Packaging for Automotive Semiconductors Introduction
11.10.4 Microchip (Microsemi) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.10.5 Microchip (Microsemi) Recent Development
11.11 Amkor
11.11.1 Amkor Company Detail
11.11.2 Amkor Business Overview
11.11.3 Amkor Power Packaging for Automotive Semiconductors Introduction
11.11.4 Amkor Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.11.5 Amkor Recent Development
11.12 ASE (SPIL)
11.12.1 ASE (SPIL) Company Detail
11.12.2 ASE (SPIL) Business Overview
11.12.3 ASE (SPIL) Power Packaging for Automotive Semiconductors Introduction
11.12.4 ASE (SPIL) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.12.5 ASE (SPIL) Recent Development
11.13 UTAC
11.13.1 UTAC Company Detail
11.13.2 UTAC Business Overview
11.13.3 UTAC Power Packaging for Automotive Semiconductors Introduction
11.13.4 UTAC Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.13.5 UTAC Recent Development
11.14 JCET (STATS ChipPAC)
11.14.1 JCET (STATS ChipPAC) Company Detail
11.14.2 JCET (STATS ChipPAC) Business Overview
11.14.3 JCET (STATS ChipPAC) Power Packaging for Automotive Semiconductors Introduction
11.14.4 JCET (STATS ChipPAC) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.14.5 JCET (STATS ChipPAC) Recent Development
11.15 Carsem
11.15.1 Carsem Company Detail
11.15.2 Carsem Business Overview
11.15.3 Carsem Power Packaging for Automotive Semiconductors Introduction
11.15.4 Carsem Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.15.5 Carsem Recent Development
11.16 King Yuan Electronics Corp. (KYEC)
11.16.1 King Yuan Electronics Corp. (KYEC) Company Detail
11.16.2 King Yuan Electronics Corp. (KYEC) Business Overview
11.16.3 King Yuan Electronics Corp. (KYEC) Power Packaging for Automotive Semiconductors Introduction
11.16.4 King Yuan Electronics Corp. (KYEC) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.16.5 King Yuan Electronics Corp. (KYEC) Recent Development
11.17 KINGPAK Technology Inc
11.17.1 KINGPAK Technology Inc Company Detail
11.17.2 KINGPAK Technology Inc Business Overview
11.17.3 KINGPAK Technology Inc Power Packaging for Automotive Semiconductors Introduction
11.17.4 KINGPAK Technology Inc Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.17.5 KINGPAK Technology Inc Recent Development
11.18 Powertech Technology Inc. (PTI)
11.18.1 Powertech Technology Inc. (PTI) Company Detail
11.18.2 Powertech Technology Inc. (PTI) Business Overview
11.18.3 Powertech Technology Inc. (PTI) Power Packaging for Automotive Semiconductors Introduction
11.18.4 Powertech Technology Inc. (PTI) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.18.5 Powertech Technology Inc. (PTI) Recent Development
11.19 SFA Semicon
11.19.1 SFA Semicon Company Detail
11.19.2 SFA Semicon Business Overview
11.19.3 SFA Semicon Power Packaging for Automotive Semiconductors Introduction
11.19.4 SFA Semicon Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.19.5 SFA Semicon Recent Development
11.20 Unisem Group
11.20.1 Unisem Group Company Detail
11.20.2 Unisem Group Business Overview
11.20.3 Unisem Group Power Packaging for Automotive Semiconductors Introduction
11.20.4 Unisem Group Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.20.5 Unisem Group Recent Development
11.21 Chipbond Technology Corporation
11.21.1 Chipbond Technology Corporation Company Detail
11.21.2 Chipbond Technology Corporation Business Overview
11.21.3 Chipbond Technology Corporation Power Packaging for Automotive Semiconductors Introduction
11.21.4 Chipbond Technology Corporation Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.21.5 Chipbond Technology Corporation Recent Development
11.22 ChipMOS TECHNOLOGIES
11.22.1 ChipMOS TECHNOLOGIES Company Detail
11.22.2 ChipMOS TECHNOLOGIES Business Overview
11.22.3 ChipMOS TECHNOLOGIES Power Packaging for Automotive Semiconductors Introduction
11.22.4 ChipMOS TECHNOLOGIES Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.22.5 ChipMOS TECHNOLOGIES Recent Development
11.23 OSE CORP.
11.23.1 OSE CORP. Company Detail
11.23.2 OSE CORP. Business Overview
11.23.3 OSE CORP. Power Packaging for Automotive Semiconductors Introduction
11.23.4 OSE CORP. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.23.5 OSE CORP. Recent Development
11.24 Sigurd Microelectronics
11.24.1 Sigurd Microelectronics Company Detail
11.24.2 Sigurd Microelectronics Business Overview
11.24.3 Sigurd Microelectronics Power Packaging for Automotive Semiconductors Introduction
11.24.4 Sigurd Microelectronics Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.24.5 Sigurd Microelectronics Recent Development
11.25 Natronix Semiconductor Technology
11.25.1 Natronix Semiconductor Technology Company Detail
11.25.2 Natronix Semiconductor Technology Business Overview
11.25.3 Natronix Semiconductor Technology Power Packaging for Automotive Semiconductors Introduction
11.25.4 Natronix Semiconductor Technology Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.25.5 Natronix Semiconductor Technology Recent Development
11.26 Nepes
11.26.1 Nepes Company Detail
11.26.2 Nepes Business Overview
11.26.3 Nepes Power Packaging for Automotive Semiconductors Introduction
11.26.4 Nepes Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.26.5 Nepes Recent Development
11.27 KESM Industries Berhad
11.27.1 KESM Industries Berhad Company Detail
11.27.2 KESM Industries Berhad Business Overview
11.27.3 KESM Industries Berhad Power Packaging for Automotive Semiconductors Introduction
11.27.4 KESM Industries Berhad Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.27.5 KESM Industries Berhad Recent Development
11.28 Forehope Electronic (Ningbo) Co.,Ltd.
11.28.1 Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
11.28.2 Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
11.28.3 Forehope Electronic (Ningbo) Co.,Ltd. Power Packaging for Automotive Semiconductors Introduction
11.28.4 Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.28.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
11.29 Union Semiconductor（Hefei）Co., Ltd.
11.29.1 Union Semiconductor（Hefei）Co., Ltd. Company Detail
11.29.2 Union Semiconductor（Hefei）Co., Ltd. Business Overview
11.29.3 Union Semiconductor（Hefei）Co., Ltd. Power Packaging for Automotive Semiconductors Introduction
11.29.4 Union Semiconductor（Hefei）Co., Ltd. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.29.5 Union Semiconductor（Hefei）Co., Ltd. Recent Development
11.30 Tongfu Microelectronics (TFME)
11.30.1 Tongfu Microelectronics (TFME) Company Detail
11.30.2 Tongfu Microelectronics (TFME) Business Overview
11.30.3 Tongfu Microelectronics (TFME) Power Packaging for Automotive Semiconductors Introduction
11.30.4 Tongfu Microelectronics (TFME) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.30.5 Tongfu Microelectronics (TFME) Recent Development
11.31 HT-tech
11.31.1 HT-tech Company Detail
11.31.2 HT-tech Business Overview
11.31.3 HT-tech Power Packaging for Automotive Semiconductors Introduction
11.31.4 HT-tech Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.31.5 HT-tech Recent Development
11.32 China Wafer Level CSP Co., Ltd
11.32.1 China Wafer Level CSP Co., Ltd Company Detail
11.32.2 China Wafer Level CSP Co., Ltd Business Overview
11.32.3 China Wafer Level CSP Co., Ltd Power Packaging for Automotive Semiconductors Introduction
11.32.4 China Wafer Level CSP Co., Ltd Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.32.5 China Wafer Level CSP Co., Ltd Recent Development
11.33 Ningbo ChipEx Semiconductor Co., Ltd
11.33.1 Ningbo ChipEx Semiconductor Co., Ltd Company Detail
11.33.2 Ningbo ChipEx Semiconductor Co., Ltd Business Overview
11.33.3 Ningbo ChipEx Semiconductor Co., Ltd Power Packaging for Automotive Semiconductors Introduction
11.33.4 Ningbo ChipEx Semiconductor Co., Ltd Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.33.5 Ningbo ChipEx Semiconductor Co., Ltd Recent Development
11.34 Guangdong Leadyo IC Testing
11.34.1 Guangdong Leadyo IC Testing Company Detail
11.34.2 Guangdong Leadyo IC Testing Business Overview
11.34.3 Guangdong Leadyo IC Testing Power Packaging for Automotive Semiconductors Introduction
11.34.4 Guangdong Leadyo IC Testing Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.34.5 Guangdong Leadyo IC Testing Recent Development
11.35 Unimos Microelectronics (Shanghai)
11.35.1 Unimos Microelectronics (Shanghai) Company Detail
11.35.2 Unimos Microelectronics (Shanghai) Business Overview
11.35.3 Unimos Microelectronics (Shanghai) Power Packaging for Automotive Semiconductors Introduction
11.35.4 Unimos Microelectronics (Shanghai) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.35.5 Unimos Microelectronics (Shanghai) Recent Development
11.36 Sino Technology
11.36.1 Sino Technology Company Detail
11.36.2 Sino Technology Business Overview
11.36.3 Sino Technology Power Packaging for Automotive Semiconductors Introduction
11.36.4 Sino Technology Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.36.5 Sino Technology Recent Development
11.37 Taiji Semiconductor (Suzhou)
11.37.1 Taiji Semiconductor (Suzhou) Company Detail
11.37.2 Taiji Semiconductor (Suzhou) Business Overview
11.37.3 Taiji Semiconductor (Suzhou) Power Packaging for Automotive Semiconductors Introduction
11.37.4 Taiji Semiconductor (Suzhou) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024)
11.37.5 Taiji Semiconductor (Suzhou) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
FEATURED COMPANIES
NXP
Infineon (Cypress)
Renesas
Texas Instrument
STMicroelectronics
Bosch
Onsemi
Mitsubishi Electric
ROHM CO LTD
Microchip (Microsemi)
Amkor
ASE(SPIL)
UTAC
JCET (STATS ChipPAC)
Carsem
King Yuan Electronics Corp. (KYEC)
KINGPAK Technology Inc
Powertech Technology Inc. (PTI)
SFA Semicon
Unisem Group
Chipbond Technology Corporation
ChipMOS TECHNOLOGIES
OSE CORP
Sigurd Microelectronics
Natronix Semiconductor Technology
Nepes
KESM Industries Berhad
Forehope Electronic (Ningbo) Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Tongfu Microelectronics (TFME)
HT-tech
China Wafer Level CSP Co. Ltd
Ningbo ChipEx Semiconductor Co., Ltd
Guangdong Leadyo IC Testing
Unimos Microelectronics (Shanghai)
Sino Technology
Taiji Semiconductor (Suzhou)
List of Tables
    Table 1. Global Power Packaging for Automotive Semiconductors Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
    Table 2. Key Players of Diodes
    Table 3. Key Players of IGBT
    Table 4. Key Players of MOSFET
    Table 5. Key Players of Power Management IC
    Table 6. Key Players of Others
    Table 7. Global Power Packaging for Automotive Semiconductors Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
    Table 8. Global Power Packaging for Automotive Semiconductors Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 9. Global Power Packaging for Automotive Semiconductors Market Size by Region (2019-2024) & (US$ Million)
    Table 10. Global Power Packaging for Automotive Semiconductors Market Share by Region (2019-2024)
    Table 11. Global Power Packaging for Automotive Semiconductors Forecasted Market Size by Region (2025-2030) & (US$ Million)
    Table 12. Global Power Packaging for Automotive Semiconductors Market Share by Region (2025-2030)
    Table 13. Power Packaging for Automotive Semiconductors Market Trends
    Table 14. Power Packaging for Automotive Semiconductors Market Drivers
    Table 15. Power Packaging for Automotive Semiconductors Market Challenges
    Table 16. Power Packaging for Automotive Semiconductors Market Restraints
    Table 17. Global Power Packaging for Automotive Semiconductors Revenue by Players (2019-2024) & (US$ Million)
    Table 18. Global Power Packaging for Automotive Semiconductors Market Share by Players (2019-2024)
    Table 19. Global Top Power Packaging for Automotive Semiconductors Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Power Packaging for Automotive Semiconductors as of 2023)
    Table 20. Ranking of Global Top Power Packaging for Automotive Semiconductors Companies by Revenue (US$ Million) in 2023
    Table 21. Global 5 Largest Players Market Share by Power Packaging for Automotive Semiconductors Revenue (CR5 and HHI) & (2019-2024)
    Table 22. Key Players Headquarters and Area Served
    Table 23. Key Players Power Packaging for Automotive Semiconductors Product Solution and Service
    Table 24. Date of Enter into Power Packaging for Automotive Semiconductors Market
    Table 25. Mergers & Acquisitions, Expansion Plans
    Table 26. Global Power Packaging for Automotive Semiconductors Market Size by Type (2019-2024) & (US$ Million)
    Table 27. Global Power Packaging for Automotive Semiconductors Revenue Market Share by Type (2019-2024)
    Table 28. Global Power Packaging for Automotive Semiconductors Forecasted Market Size by Type (2025-2030) & (US$ Million)
    Table 29. Global Power Packaging for Automotive Semiconductors Revenue Market Share by Type (2025-2030)
    Table 30. Global Power Packaging for Automotive Semiconductors Market Size by Application (2019-2024) & (US$ Million)
    Table 31. Global Power Packaging for Automotive Semiconductors Revenue Market Share by Application (2019-2024)
    Table 32. Global Power Packaging for Automotive Semiconductors Forecasted Market Size by Application (2025-2030) & (US$ Million)
    Table 33. Global Power Packaging for Automotive Semiconductors Revenue Market Share by Application (2025-2030)
    Table 34. North America Power Packaging for Automotive Semiconductors Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 35. North America Power Packaging for Automotive Semiconductors Market Size by Country (2019-2024) & (US$ Million)
    Table 36. North America Power Packaging for Automotive Semiconductors Market Size by Country (2025-2030) & (US$ Million)
    Table 37. Europe Power Packaging for Automotive Semiconductors Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 38. Europe Power Packaging for Automotive Semiconductors Market Size by Country (2019-2024) & (US$ Million)
    Table 39. Europe Power Packaging for Automotive Semiconductors Market Size by Country (2025-2030) & (US$ Million)
    Table 40. Asia-Pacific Power Packaging for Automotive Semiconductors Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
    Table 41. Asia-Pacific Power Packaging for Automotive Semiconductors Market Size by Region (2019-2024) & (US$ Million)
    Table 42. Asia-Pacific Power Packaging for Automotive Semiconductors Market Size by Region (2025-2030) & (US$ Million)
    Table 43. Latin America Power Packaging for Automotive Semiconductors Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 44. Latin America Power Packaging for Automotive Semiconductors Market Size by Country (2019-2024) & (US$ Million)
    Table 45. Latin America Power Packaging for Automotive Semiconductors Market Size by Country (2025-2030) & (US$ Million)
    Table 46. Middle East & Africa Power Packaging for Automotive Semiconductors Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
    Table 47. Middle East & Africa Power Packaging for Automotive Semiconductors Market Size by Country (2019-2024) & (US$ Million)
    Table 48. Middle East & Africa Power Packaging for Automotive Semiconductors Market Size by Country (2025-2030) & (US$ Million)
    Table 49. NXP Company Detail
    Table 50. NXP Business Overview
    Table 51. NXP Power Packaging for Automotive Semiconductors Product
    Table 52. NXP Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 53. NXP Recent Development
    Table 54. Infineon (Cypress) Company Detail
    Table 55. Infineon (Cypress) Business Overview
    Table 56. Infineon (Cypress) Power Packaging for Automotive Semiconductors Product
    Table 57. Infineon (Cypress) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 58. Infineon (Cypress) Recent Development
    Table 59. Renesas Company Detail
    Table 60. Renesas Business Overview
    Table 61. Renesas Power Packaging for Automotive Semiconductors Product
    Table 62. Renesas Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 63. Renesas Recent Development
    Table 64. Texas Instrument Company Detail
    Table 65. Texas Instrument Business Overview
    Table 66. Texas Instrument Power Packaging for Automotive Semiconductors Product
    Table 67. Texas Instrument Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 68. Texas Instrument Recent Development
    Table 69. STMicroelectronics Company Detail
    Table 70. STMicroelectronics Business Overview
    Table 71. STMicroelectronics Power Packaging for Automotive Semiconductors Product
    Table 72. STMicroelectronics Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 73. STMicroelectronics Recent Development
    Table 74. Bosch Company Detail
    Table 75. Bosch Business Overview
    Table 76. Bosch Power Packaging for Automotive Semiconductors Product
    Table 77. Bosch Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 78. Bosch Recent Development
    Table 79. onsemi Company Detail
    Table 80. onsemi Business Overview
    Table 81. onsemi Power Packaging for Automotive Semiconductors Product
    Table 82. onsemi Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 83. onsemi Recent Development
    Table 84. Mitsubishi Electric Company Detail
    Table 85. Mitsubishi Electric Business Overview
    Table 86. Mitsubishi Electric Power Packaging for Automotive Semiconductors Product
    Table 87. Mitsubishi Electric Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 88. Mitsubishi Electric Recent Development
    Table 89. Rohm Company Detail
    Table 90. Rohm Business Overview
    Table 91. Rohm Power Packaging for Automotive Semiconductors Product
    Table 92. Rohm Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 93. Rohm Recent Development
    Table 94. Microchip (Microsemi) Company Detail
    Table 95. Microchip (Microsemi) Business Overview
    Table 96. Microchip (Microsemi) Power Packaging for Automotive Semiconductors Product
    Table 97. Microchip (Microsemi) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 98. Microchip (Microsemi) Recent Development
    Table 99. Amkor Company Detail
    Table 100. Amkor Business Overview
    Table 101. Amkor Power Packaging for Automotive Semiconductors Product
    Table 102. Amkor Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 103. Amkor Recent Development
    Table 104. ASE (SPIL) Company Detail
    Table 105. ASE (SPIL) Business Overview
    Table 106. ASE (SPIL) Power Packaging for Automotive Semiconductors Product
    Table 107. ASE (SPIL) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 108. ASE (SPIL) Recent Development
    Table 109. UTAC Company Detail
    Table 110. UTAC Business Overview
    Table 111. UTAC Power Packaging for Automotive Semiconductors Product
    Table 112. UTAC Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 113. UTAC Recent Development
    Table 114. JCET (STATS ChipPAC) Company Detail
    Table 115. JCET (STATS ChipPAC) Business Overview
    Table 116. JCET (STATS ChipPAC) Power Packaging for Automotive Semiconductors Product
    Table 117. JCET (STATS ChipPAC) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 118. JCET (STATS ChipPAC) Recent Development
    Table 119. Carsem Company Detail
    Table 120. Carsem Business Overview
    Table 121. Carsem Power Packaging for Automotive Semiconductors Product
    Table 122. Carsem Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 123. Carsem Recent Development
    Table 124. King Yuan Electronics Corp. (KYEC) Company Detail
    Table 125. King Yuan Electronics Corp. (KYEC) Business Overview
    Table 126. King Yuan Electronics Corp. (KYEC) Power Packaging for Automotive Semiconductors Product
    Table 127. King Yuan Electronics Corp. (KYEC) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 128. King Yuan Electronics Corp. (KYEC) Recent Development
    Table 129. KINGPAK Technology Inc Company Detail
    Table 130. KINGPAK Technology Inc Business Overview
    Table 131. KINGPAK Technology Inc Power Packaging for Automotive Semiconductors Product
    Table 132. KINGPAK Technology Inc Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 133. KINGPAK Technology Inc Recent Development
    Table 134. Powertech Technology Inc. (PTI) Company Detail
    Table 135. Powertech Technology Inc. (PTI) Business Overview
    Table 136. Powertech Technology Inc. (PTI) Power Packaging for Automotive Semiconductors Product
    Table 137. Powertech Technology Inc. (PTI) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 138. Powertech Technology Inc. (PTI) Recent Development
    Table 139. SFA Semicon Company Detail
    Table 140. SFA Semicon Business Overview
    Table 141. SFA Semicon Power Packaging for Automotive Semiconductors Product
    Table 142. SFA Semicon Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 143. SFA Semicon Recent Development
    Table 144. Unisem Group Company Detail
    Table 145. Unisem Group Business Overview
    Table 146. Unisem Group Power Packaging for Automotive Semiconductors Product
    Table 147. Unisem Group Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 148. Unisem Group Recent Development
    Table 149. Chipbond Technology Corporation Company Detail
    Table 150. Chipbond Technology Corporation Business Overview
    Table 151. Chipbond Technology Corporation Power Packaging for Automotive Semiconductors Product
    Table 152. Chipbond Technology Corporation Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 153. Chipbond Technology Corporation Recent Development
    Table 154. ChipMOS TECHNOLOGIES Company Detail
    Table 155. ChipMOS TECHNOLOGIES Business Overview
    Table 156. ChipMOS TECHNOLOGIES Power Packaging for Automotive Semiconductors Product
    Table 157. ChipMOS TECHNOLOGIES Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 158. ChipMOS TECHNOLOGIES Recent Development
    Table 159. OSE CORP. Company Detail
    Table 160. OSE CORP. Business Overview
    Table 161. OSE CORP. Power Packaging for Automotive Semiconductors Product
    Table 162. OSE CORP. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 163. OSE CORP. Recent Development
    Table 164. Sigurd Microelectronics Company Detail
    Table 165. Sigurd Microelectronics Business Overview
    Table 166. Sigurd Microelectronics Power Packaging for Automotive Semiconductors Product
    Table 167. Sigurd Microelectronics Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 168. Sigurd Microelectronics Recent Development
    Table 169. Natronix Semiconductor Technology Company Detail
    Table 170. Natronix Semiconductor Technology Business Overview
    Table 171. Natronix Semiconductor Technology Power Packaging for Automotive Semiconductors Product
    Table 172. Natronix Semiconductor Technology Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 173. Natronix Semiconductor Technology Recent Development
    Table 174. Nepes Company Detail
    Table 175. Nepes Business Overview
    Table 176. Nepes Power Packaging for Automotive Semiconductors Product
    Table 177. Nepes Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 178. Nepes Recent Development
    Table 179. KESM Industries Berhad Company Detail
    Table 180. KESM Industries Berhad Business Overview
    Table 181. KESM Industries Berhad Power Packaging for Automotive Semiconductors Product
    Table 182. KESM Industries Berhad Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 183. KESM Industries Berhad Recent Development
    Table 184. Forehope Electronic (Ningbo) Co.,Ltd. Company Detail
    Table 185. Forehope Electronic (Ningbo) Co.,Ltd. Business Overview
    Table 186. Forehope Electronic (Ningbo) Co.,Ltd. Power Packaging for Automotive Semiconductors Product
    Table 187. Forehope Electronic (Ningbo) Co.,Ltd. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 188. Forehope Electronic (Ningbo) Co.,Ltd. Recent Development
    Table 189. Union Semiconductor（Hefei）Co., Ltd. Company Detail
    Table 190. Union Semiconductor（Hefei）Co., Ltd. Business Overview
    Table 191. Union Semiconductor（Hefei）Co., Ltd. Power Packaging for Automotive Semiconductors Product
    Table 192. Union Semiconductor（Hefei）Co., Ltd. Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 193. Union Semiconductor（Hefei）Co., Ltd. Recent Development
    Table 194. Tongfu Microelectronics (TFME) Company Detail
    Table 195. Tongfu Microelectronics (TFME) Business Overview
    Table 196. Tongfu Microelectronics (TFME) Power Packaging for Automotive Semiconductors Product
    Table 197. Tongfu Microelectronics (TFME) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 198. Tongfu Microelectronics (TFME) Recent Development
    Table 199. HT-tech Company Detail
    Table 200. HT-tech Business Overview
    Table 201. HT-tech Power Packaging for Automotive Semiconductors Product
    Table 202. HT-tech Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 203. HT-tech Recent Development
    Table 204. China Wafer Level CSP Co., Ltd Company Detail
    Table 205. China Wafer Level CSP Co., Ltd Business Overview
    Table 206. China Wafer Level CSP Co., Ltd Power Packaging for Automotive Semiconductors Product
    Table 207. China Wafer Level CSP Co., Ltd Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 208. China Wafer Level CSP Co., Ltd Recent Development
    Table 209. Ningbo ChipEx Semiconductor Co., Ltd Company Detail
    Table 210. Ningbo ChipEx Semiconductor Co., Ltd Business Overview
    Table 211. Ningbo ChipEx Semiconductor Co., Ltd Power Packaging for Automotive Semiconductors Product
    Table 212. Ningbo ChipEx Semiconductor Co., Ltd Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 213. Ningbo ChipEx Semiconductor Co., Ltd Recent Development
    Table 214. Guangdong Leadyo IC Testing Company Detail
    Table 215. Guangdong Leadyo IC Testing Business Overview
    Table 216. Guangdong Leadyo IC Testing Power Packaging for Automotive Semiconductors Product
    Table 217. Guangdong Leadyo IC Testing Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 218. Guangdong Leadyo IC Testing Recent Development
    Table 219. Unimos Microelectronics (Shanghai) Company Detail
    Table 220. Unimos Microelectronics (Shanghai) Business Overview
    Table 221. Unimos Microelectronics (Shanghai) Power Packaging for Automotive Semiconductors Product
    Table 222. Unimos Microelectronics (Shanghai) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 223. Unimos Microelectronics (Shanghai) Recent Development
    Table 224. Sino Technology Company Detail
    Table 225. Sino Technology Business Overview
    Table 226. Sino Technology Power Packaging for Automotive Semiconductors Product
    Table 227. Sino Technology Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 228. Sino Technology Recent Development
    Table 229. Taiji Semiconductor (Suzhou) Company Detail
    Table 230. Taiji Semiconductor (Suzhou) Business Overview
    Table 231. Taiji Semiconductor (Suzhou) Power Packaging for Automotive Semiconductors Product
    Table 232. Taiji Semiconductor (Suzhou) Revenue in Power Packaging for Automotive Semiconductors Business (2019-2024) & (US$ Million)
    Table 233. Taiji Semiconductor (Suzhou) Recent Development
    Table 234. Research Programs/Design for This Report
    Table 235. Key Data Information from Secondary Sources
    Table 236. Key Data Information from Primary Sources
List of Figures
    Figure 1. Global Power Packaging for Automotive Semiconductors Market Size Comparison by Type (2024-2030) & (US$ Million)
    Figure 2. Global Power Packaging for Automotive Semiconductors Market Share by Type: 2023 VS 2030
    Figure 3. Diodes Features
    Figure 4. IGBT Features
    Figure 5. MOSFET Features
    Figure 6. Power Management IC Features
    Figure 7. Others Features
    Figure 8. Global Power Packaging for Automotive Semiconductors Market Size Comparison by Application (2024-2030) & (US$ Million)
    Figure 9. Global Power Packaging for Automotive Semiconductors Market Share by Application: 2023 VS 2030
    Figure 10. Automotive OSAT Case Studies
    Figure 11. Automotive IDM Case Studies
    Figure 12. Power Packaging for Automotive Semiconductors Report Years Considered
    Figure 13. Global Power Packaging for Automotive Semiconductors Market Size (US$ Million), Year-over-Year: 2019-2030
    Figure 14. Global Power Packaging for Automotive Semiconductors Market Size, (US$ Million), 2019 VS 2023 VS 2030
    Figure 15. Global Power Packaging for Automotive Semiconductors Market Share by Region: 2023 VS 2030
    Figure 16. Global Power Packaging for Automotive Semiconductors Market Share by Players in 2023
    Figure 17. Global Top Power Packaging for Automotive Semiconductors Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Power Packaging for Automotive Semiconductors as of 2023)
    Figure 18. The Top 10 and 5 Players Market Share by Power Packaging for Automotive Semiconductors Revenue in 2023
    Figure 19. North America Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 20. North America Power Packaging for Automotive Semiconductors Market Share by Country (2019-2030)
    Figure 21. United States Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 22. Canada Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 23. Europe Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 24. Europe Power Packaging for Automotive Semiconductors Market Share by Country (2019-2030)
    Figure 25. Germany Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 26. France Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 27. U.K. Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 28. Italy Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 29. Russia Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 30. Nordic Countries Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 31. Asia-Pacific Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 32. Asia-Pacific Power Packaging for Automotive Semiconductors Market Share by Region (2019-2030)
    Figure 33. China Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 34. Japan Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 35. South Korea Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 36. Southeast Asia Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 37. India Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 38. Australia Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 39. Latin America Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 40. Latin America Power Packaging for Automotive Semiconductors Market Share by Country (2019-2030)
    Figure 41. Mexico Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 42. Brazil Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 43. Middle East & Africa Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 44. Middle East & Africa Power Packaging for Automotive Semiconductors Market Share by Country (2019-2030)
    Figure 45. Turkey Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 46. Saudi Arabia Power Packaging for Automotive Semiconductors Market Size YoY Growth (2019-2030) & (US$ Million)
    Figure 47. NXP Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 48. Infineon (Cypress) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 49. Renesas Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 50. Texas Instrument Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 51. STMicroelectronics Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 52. Bosch Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 53. onsemi Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 54. Mitsubishi Electric Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 55. Rohm Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 56. Microchip (Microsemi) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 57. Amkor Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 58. ASE (SPIL) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 59. UTAC Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 60. JCET (STATS ChipPAC) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 61. Carsem Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 62. King Yuan Electronics Corp. (KYEC) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 63. KINGPAK Technology Inc Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 64. Powertech Technology Inc. (PTI) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 65. SFA Semicon Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 66. Unisem Group Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 67. Chipbond Technology Corporation Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 68. ChipMOS TECHNOLOGIES Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 69. OSE CORP. Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 70. Sigurd Microelectronics Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 71. Natronix Semiconductor Technology Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 72. Nepes Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 73. KESM Industries Berhad Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 74. Forehope Electronic (Ningbo) Co.,Ltd. Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 75. Union Semiconductor（Hefei）Co., Ltd. Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 76. Tongfu Microelectronics (TFME) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 77. HT-tech Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 78. China Wafer Level CSP Co., Ltd Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 79. Ningbo ChipEx Semiconductor Co., Ltd Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 80. Guangdong Leadyo IC Testing Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 81. Unimos Microelectronics (Shanghai) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 82. Sino Technology Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 83. Taiji Semiconductor (Suzhou) Revenue Growth Rate in Power Packaging for Automotive Semiconductors Business (2019-2024)
    Figure 84. Bottom-up and Top-down Approaches for This Report
    Figure 85. Data Triangulation
    Figure 86. Key Executives Interviewed
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