ABOUT US
CONTACT US
FAQ
PRIVACY POLICY
REFUND AND CANCELLATION
BLOGS
COMPANIES
REPORTS
0
U.S. (TOLL FREE)
+1 (315) 215-3225
Automative
0
U.S. (TOLL FREE)
+1 (315) 215-3225
Global Automotive IC Package Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-38V16106
Home | Market Reports | Business & Industrial| Automotive Industry
Global Automotive IC Package Market Research Report 2023
BUY CHAPTERS

Global Automotive IC Package Market Research Report 2025

Code: QYRE-Auto-38V16106
Report
March 2025
Pages:128
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
ASE(SPIL)
NXP Semiconductors
Infineon (Cypress)
Renesas
TI (Texas Instruments)
STMicroelectronics
Onsemi
UTAC
Bosch
ROHM CO LTD
ADI (Analog Devices, Inc)
JCET (STATS ChipPAC)
Mitsubishi Electric
Carsem
Tongfu Microelectronics (TFME)
King Yuan Electronics Corp. (KYEC)
Powertech Technology Inc. (PTI)
Microchip (Microsemi)
Unisem Group
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Toshiba
BYD
Zhuzhou Crrc Times Electric
China Resources Microelectronics Limited
Hangzhou Silan microelectronics
Rapidus
Amkor

Automotive IC Package Market Size

The global market for Automotive IC Package was valued at US$ 11190 million in the year 2024 and is projected to reach a revised size of US$ 25340 million by 2031, growing at a CAGR of 12.6% during the forecast period.

Automotive IC Package Market

Automotive IC Package Market

Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components.
The automotive industry is going through a revolution, and with this growth comes opportunities for stakeholders to add economic value to end users. Several environmental, economic and social factors are influencing future electric vehicle designs, safety and powertrain choices. Whether it’s ADAS, infotainment or electrification applications, performance and reliability aspects shape each player’s strategy.
Semiconductor suppliers, including OSATs, offer packaging technologies that are cutting edge, reliable and cost effective to realize various functional ability for evolving automotive applications. Amkor is the leading automotive OSAT for providing turnkey solutions, including wafer sort, bump services, packaging, test and burn-in, to meet aggressive go-to-market plans.
Global key players of Automotive OSAT include Amkor and ASE (SPIL), etc. The top two players hold a share over 60%. North America is the largest market, has a share about 46%. In terms of product type, Leadframe is the largest segment, occupied for a share of about 35%.
Global key players of Automotive IC Substrate include Unimicron, Ibiden and Nan Ya PCB, etc. The top three players hold a share over 50%. North America is the largest market, has a share about 62%. In terms of product type, Automotive IDM is the largest segment, occupied for a share of about 60%.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Automotive IC Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Automotive IC Package.
The Automotive IC Package market size, estimations, and forecasts are provided in terms of output/shipments (Million Pieces) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Automotive IC Package market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Automotive IC Package manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Automotive IC Package Market Report

Report Metric Details
Report Name Automotive IC Package Market
Accounted market size in year US$ 11190 million
Forecasted market size in 2031 US$ 25340 million
CAGR 12.6%
Base Year year
Forecasted years 2025 - 2031
by Type
  • Automotive OSAT
  • Automotive IDM
by Application
  • Advanced Packaging
  • Mainstream Packaging
Production by Region
  • North America
  • Europe
  • South Korea
  • China Taiwan
  • China
  • Japan
  • Southeast Asia
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Amkor, ASE (SPIL), NXP Semiconductors, Infineon (Cypress), Renesas, TI (Texas Instruments), STMicroelectronics, onsemi, UTAC, Bosch, Rohm, ADI (Analog Devices, Inc), JCET (STATS ChipPAC), Mitsubishi Electric, Carsem, Tongfu Microelectronics (TFME), King Yuan Electronics Corp. (KYEC), Powertech Technology Inc. (PTI), Microchip (Microsemi), Unisem Group, SFA Semicon, Forehope Electronic (Ningbo) Co.,Ltd., Toshiba, BYD, Zhuzhou CRRC Times Electric, China Resources Microelectronics Limited, Hangzhou Silan Microelectronics, Rapidus
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Automotive IC Package manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Automotive IC Package by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Automotive IC Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is Automotive IC Package Market growing?

Ans: The Automotive IC Package Market witnessing a CAGR of 12.6% during the forecast period 2025-2031.

What is the Automotive IC Package Market size in 2031?

Ans: The Automotive IC Package Market size in 2031 will be US$ 25340 million.

What is the market share of major companies in Automotive IC Package Market?

Ans: The top two players hold a share over 60%. The top three players hold a share over 50%.

What is the Automotive IC Package Market share by region?

Ans: North America is the largest market, has a share about 46%.

What is the Automotive IC Package Market share by type?

Ans: In terms of product type, Automotive IDM is the largest segment, occupied for a share of about 60%.

Who are the main players in the Automotive IC Package Market report?

Ans: The main players in the Automotive IC Package Market are Amkor, ASE (SPIL), NXP Semiconductors, Infineon (Cypress), Renesas, TI (Texas Instruments), STMicroelectronics, onsemi, UTAC, Bosch, Rohm, ADI (Analog Devices, Inc), JCET (STATS ChipPAC), Mitsubishi Electric, Carsem, Tongfu Microelectronics (TFME), King Yuan Electronics Corp. (KYEC), Powertech Technology Inc. (PTI), Microchip (Microsemi), Unisem Group, SFA Semicon, Forehope Electronic (Ningbo) Co.,Ltd., Toshiba, BYD, Zhuzhou CRRC Times Electric, China Resources Microelectronics Limited, Hangzhou Silan Microelectronics, Rapidus

What are the Application segmentation covered in the Automotive IC Package Market report?

Ans: The Applications covered in the Automotive IC Package Market report are Advanced Packaging, Mainstream Packaging

What are the Type segmentation covered in the Automotive IC Package Market report?

Ans: The Types covered in the Automotive IC Package Market report are Automotive OSAT, Automotive IDM

Recommended Reports

Automotive IC Chips

IC Packaging Market

Automotive IC Components

1 Automotive IC Package Market Overview
1.1 Product Definition
1.2 Automotive IC Package by Type
1.2.1 Global Automotive IC Package Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Automotive OSAT
1.2.3 Automotive IDM
1.3 Automotive IC Package by Application
1.3.1 Global Automotive IC Package Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Advanced Packaging
1.3.3 Mainstream Packaging
1.4 Global Market Growth Prospects
1.4.1 Global Automotive IC Package Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Automotive IC Package Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Automotive IC Package Production Estimates and Forecasts (2020-2031)
1.4.4 Global Automotive IC Package Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Automotive IC Package Production Market Share by Manufacturers (2020-2025)
2.2 Global Automotive IC Package Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Automotive IC Package, Industry Ranking, 2023 VS 2024
2.4 Global Automotive IC Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Automotive IC Package Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Automotive IC Package, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Automotive IC Package, Product Offered and Application
2.8 Global Key Manufacturers of Automotive IC Package, Date of Enter into This Industry
2.9 Automotive IC Package Market Competitive Situation and Trends
2.9.1 Automotive IC Package Market Concentration Rate
2.9.2 Global 5 and 10 Largest Automotive IC Package Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Automotive IC Package Production by Region
3.1 Global Automotive IC Package Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Automotive IC Package Production Value by Region (2020-2031)
3.2.1 Global Automotive IC Package Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Automotive IC Package by Region (2026-2031)
3.3 Global Automotive IC Package Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Automotive IC Package Production Volume by Region (2020-2031)
3.4.1 Global Automotive IC Package Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Automotive IC Package by Region (2026-2031)
3.5 Global Automotive IC Package Market Price Analysis by Region (2020-2025)
3.6 Global Automotive IC Package Production and Value, Year-over-Year Growth
3.6.1 North America Automotive IC Package Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Automotive IC Package Production Value Estimates and Forecasts (2020-2031)
3.6.3 South Korea Automotive IC Package Production Value Estimates and Forecasts (2020-2031)
3.6.4 China Taiwan Automotive IC Package Production Value Estimates and Forecasts (2020-2031)
3.6.5 China Automotive IC Package Production Value Estimates and Forecasts (2020-2031)
3.6.6 Japan Automotive IC Package Production Value Estimates and Forecasts (2020-2031)
3.6.7 Southeast Asia Automotive IC Package Production Value Estimates and Forecasts (2020-2031)
4 Automotive IC Package Consumption by Region
4.1 Global Automotive IC Package Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Automotive IC Package Consumption by Region (2020-2031)
4.2.1 Global Automotive IC Package Consumption by Region (2020-2025)
4.2.2 Global Automotive IC Package Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Automotive IC Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Automotive IC Package Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Automotive IC Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Automotive IC Package Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Automotive IC Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Automotive IC Package Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Automotive IC Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Automotive IC Package Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Automotive IC Package Production by Type (2020-2031)
5.1.1 Global Automotive IC Package Production by Type (2020-2025)
5.1.2 Global Automotive IC Package Production by Type (2026-2031)
5.1.3 Global Automotive IC Package Production Market Share by Type (2020-2031)
5.2 Global Automotive IC Package Production Value by Type (2020-2031)
5.2.1 Global Automotive IC Package Production Value by Type (2020-2025)
5.2.2 Global Automotive IC Package Production Value by Type (2026-2031)
5.2.3 Global Automotive IC Package Production Value Market Share by Type (2020-2031)
5.3 Global Automotive IC Package Price by Type (2020-2031)
6 Segment by Application
6.1 Global Automotive IC Package Production by Application (2020-2031)
6.1.1 Global Automotive IC Package Production by Application (2020-2025)
6.1.2 Global Automotive IC Package Production by Application (2026-2031)
6.1.3 Global Automotive IC Package Production Market Share by Application (2020-2031)
6.2 Global Automotive IC Package Production Value by Application (2020-2031)
6.2.1 Global Automotive IC Package Production Value by Application (2020-2025)
6.2.2 Global Automotive IC Package Production Value by Application (2026-2031)
6.2.3 Global Automotive IC Package Production Value Market Share by Application (2020-2031)
6.3 Global Automotive IC Package Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Amkor
7.1.1 Amkor Automotive IC Package Company Information
7.1.2 Amkor Automotive IC Package Product Portfolio
7.1.3 Amkor Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Amkor Main Business and Markets Served
7.1.5 Amkor Recent Developments/Updates
7.2 ASE (SPIL)
7.2.1 ASE (SPIL) Automotive IC Package Company Information
7.2.2 ASE (SPIL) Automotive IC Package Product Portfolio
7.2.3 ASE (SPIL) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.2.4 ASE (SPIL) Main Business and Markets Served
7.2.5 ASE (SPIL) Recent Developments/Updates
7.3 NXP Semiconductors
7.3.1 NXP Semiconductors Automotive IC Package Company Information
7.3.2 NXP Semiconductors Automotive IC Package Product Portfolio
7.3.3 NXP Semiconductors Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.3.4 NXP Semiconductors Main Business and Markets Served
7.3.5 NXP Semiconductors Recent Developments/Updates
7.4 Infineon (Cypress)
7.4.1 Infineon (Cypress) Automotive IC Package Company Information
7.4.2 Infineon (Cypress) Automotive IC Package Product Portfolio
7.4.3 Infineon (Cypress) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Infineon (Cypress) Main Business and Markets Served
7.4.5 Infineon (Cypress) Recent Developments/Updates
7.5 Renesas
7.5.1 Renesas Automotive IC Package Company Information
7.5.2 Renesas Automotive IC Package Product Portfolio
7.5.3 Renesas Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Renesas Main Business and Markets Served
7.5.5 Renesas Recent Developments/Updates
7.6 TI (Texas Instruments)
7.6.1 TI (Texas Instruments) Automotive IC Package Company Information
7.6.2 TI (Texas Instruments) Automotive IC Package Product Portfolio
7.6.3 TI (Texas Instruments) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.6.4 TI (Texas Instruments) Main Business and Markets Served
7.6.5 TI (Texas Instruments) Recent Developments/Updates
7.7 STMicroelectronics
7.7.1 STMicroelectronics Automotive IC Package Company Information
7.7.2 STMicroelectronics Automotive IC Package Product Portfolio
7.7.3 STMicroelectronics Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.7.4 STMicroelectronics Main Business and Markets Served
7.7.5 STMicroelectronics Recent Developments/Updates
7.8 onsemi
7.8.1 onsemi Automotive IC Package Company Information
7.8.2 onsemi Automotive IC Package Product Portfolio
7.8.3 onsemi Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.8.4 onsemi Main Business and Markets Served
7.8.5 onsemi Recent Developments/Updates
7.9 UTAC
7.9.1 UTAC Automotive IC Package Company Information
7.9.2 UTAC Automotive IC Package Product Portfolio
7.9.3 UTAC Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.9.4 UTAC Main Business and Markets Served
7.9.5 UTAC Recent Developments/Updates
7.10 Bosch
7.10.1 Bosch Automotive IC Package Company Information
7.10.2 Bosch Automotive IC Package Product Portfolio
7.10.3 Bosch Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Bosch Main Business and Markets Served
7.10.5 Bosch Recent Developments/Updates
7.11 Rohm
7.11.1 Rohm Automotive IC Package Company Information
7.11.2 Rohm Automotive IC Package Product Portfolio
7.11.3 Rohm Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Rohm Main Business and Markets Served
7.11.5 Rohm Recent Developments/Updates
7.12 ADI (Analog Devices, Inc)
7.12.1 ADI (Analog Devices, Inc) Automotive IC Package Company Information
7.12.2 ADI (Analog Devices, Inc) Automotive IC Package Product Portfolio
7.12.3 ADI (Analog Devices, Inc) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.12.4 ADI (Analog Devices, Inc) Main Business and Markets Served
7.12.5 ADI (Analog Devices, Inc) Recent Developments/Updates
7.13 JCET (STATS ChipPAC)
7.13.1 JCET (STATS ChipPAC) Automotive IC Package Company Information
7.13.2 JCET (STATS ChipPAC) Automotive IC Package Product Portfolio
7.13.3 JCET (STATS ChipPAC) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.13.4 JCET (STATS ChipPAC) Main Business and Markets Served
7.13.5 JCET (STATS ChipPAC) Recent Developments/Updates
7.14 Mitsubishi Electric
7.14.1 Mitsubishi Electric Automotive IC Package Company Information
7.14.2 Mitsubishi Electric Automotive IC Package Product Portfolio
7.14.3 Mitsubishi Electric Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Mitsubishi Electric Main Business and Markets Served
7.14.5 Mitsubishi Electric Recent Developments/Updates
7.15 Carsem
7.15.1 Carsem Automotive IC Package Company Information
7.15.2 Carsem Automotive IC Package Product Portfolio
7.15.3 Carsem Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Carsem Main Business and Markets Served
7.15.5 Carsem Recent Developments/Updates
7.16 Tongfu Microelectronics (TFME)
7.16.1 Tongfu Microelectronics (TFME) Automotive IC Package Company Information
7.16.2 Tongfu Microelectronics (TFME) Automotive IC Package Product Portfolio
7.16.3 Tongfu Microelectronics (TFME) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Tongfu Microelectronics (TFME) Main Business and Markets Served
7.16.5 Tongfu Microelectronics (TFME) Recent Developments/Updates
7.17 King Yuan Electronics Corp. (KYEC)
7.17.1 King Yuan Electronics Corp. (KYEC) Automotive IC Package Company Information
7.17.2 King Yuan Electronics Corp. (KYEC) Automotive IC Package Product Portfolio
7.17.3 King Yuan Electronics Corp. (KYEC) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.17.4 King Yuan Electronics Corp. (KYEC) Main Business and Markets Served
7.17.5 King Yuan Electronics Corp. (KYEC) Recent Developments/Updates
7.18 Powertech Technology Inc. (PTI)
7.18.1 Powertech Technology Inc. (PTI) Automotive IC Package Company Information
7.18.2 Powertech Technology Inc. (PTI) Automotive IC Package Product Portfolio
7.18.3 Powertech Technology Inc. (PTI) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Powertech Technology Inc. (PTI) Main Business and Markets Served
7.18.5 Powertech Technology Inc. (PTI) Recent Developments/Updates
7.19 Microchip (Microsemi)
7.19.1 Microchip (Microsemi) Automotive IC Package Company Information
7.19.2 Microchip (Microsemi) Automotive IC Package Product Portfolio
7.19.3 Microchip (Microsemi) Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Microchip (Microsemi) Main Business and Markets Served
7.19.5 Microchip (Microsemi) Recent Developments/Updates
7.20 Unisem Group
7.20.1 Unisem Group Automotive IC Package Company Information
7.20.2 Unisem Group Automotive IC Package Product Portfolio
7.20.3 Unisem Group Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.20.4 Unisem Group Main Business and Markets Served
7.20.5 Unisem Group Recent Developments/Updates
7.21 SFA Semicon
7.21.1 SFA Semicon Automotive IC Package Company Information
7.21.2 SFA Semicon Automotive IC Package Product Portfolio
7.21.3 SFA Semicon Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.21.4 SFA Semicon Main Business and Markets Served
7.21.5 SFA Semicon Recent Developments/Updates
7.22 Forehope Electronic (Ningbo) Co.,Ltd.
7.22.1 Forehope Electronic (Ningbo) Co.,Ltd. Automotive IC Package Company Information
7.22.2 Forehope Electronic (Ningbo) Co.,Ltd. Automotive IC Package Product Portfolio
7.22.3 Forehope Electronic (Ningbo) Co.,Ltd. Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.22.4 Forehope Electronic (Ningbo) Co.,Ltd. Main Business and Markets Served
7.22.5 Forehope Electronic (Ningbo) Co.,Ltd. Recent Developments/Updates
7.23 Toshiba
7.23.1 Toshiba Automotive IC Package Company Information
7.23.2 Toshiba Automotive IC Package Product Portfolio
7.23.3 Toshiba Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.23.4 Toshiba Main Business and Markets Served
7.23.5 Toshiba Recent Developments/Updates
7.24 BYD
7.24.1 BYD Automotive IC Package Company Information
7.24.2 BYD Automotive IC Package Product Portfolio
7.24.3 BYD Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.24.4 BYD Main Business and Markets Served
7.24.5 BYD Recent Developments/Updates
7.25 Zhuzhou CRRC Times Electric
7.25.1 Zhuzhou CRRC Times Electric Automotive IC Package Company Information
7.25.2 Zhuzhou CRRC Times Electric Automotive IC Package Product Portfolio
7.25.3 Zhuzhou CRRC Times Electric Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.25.4 Zhuzhou CRRC Times Electric Main Business and Markets Served
7.25.5 Zhuzhou CRRC Times Electric Recent Developments/Updates
7.26 China Resources Microelectronics Limited
7.26.1 China Resources Microelectronics Limited Automotive IC Package Company Information
7.26.2 China Resources Microelectronics Limited Automotive IC Package Product Portfolio
7.26.3 China Resources Microelectronics Limited Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.26.4 China Resources Microelectronics Limited Main Business and Markets Served
7.26.5 China Resources Microelectronics Limited Recent Developments/Updates
7.27 Hangzhou Silan Microelectronics
7.27.1 Hangzhou Silan Microelectronics Automotive IC Package Company Information
7.27.2 Hangzhou Silan Microelectronics Automotive IC Package Product Portfolio
7.27.3 Hangzhou Silan Microelectronics Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.27.4 Hangzhou Silan Microelectronics Main Business and Markets Served
7.27.5 Hangzhou Silan Microelectronics Recent Developments/Updates
7.28 Rapidus
7.28.1 Rapidus Automotive IC Package Company Information
7.28.2 Rapidus Automotive IC Package Product Portfolio
7.28.3 Rapidus Automotive IC Package Production, Value, Price and Gross Margin (2020-2025)
7.28.4 Rapidus Main Business and Markets Served
7.28.5 Rapidus Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Automotive IC Package Industry Chain Analysis
8.2 Automotive IC Package Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Automotive IC Package Production Mode & Process Analysis
8.4 Automotive IC Package Sales and Marketing
8.4.1 Automotive IC Package Sales Channels
8.4.2 Automotive IC Package Distributors
8.5 Automotive IC Package Customer Analysis
9 Automotive IC Package Market Dynamics
9.1 Automotive IC Package Industry Trends
9.2 Automotive IC Package Market Drivers
9.3 Automotive IC Package Market Challenges
9.4 Automotive IC Package Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
ASE(SPIL)
NXP Semiconductors
Infineon (Cypress)
Renesas
TI (Texas Instruments)
STMicroelectronics
Onsemi
UTAC
Bosch
ROHM CO LTD
ADI (Analog Devices, Inc)
JCET (STATS ChipPAC)
Mitsubishi Electric
Carsem
Tongfu Microelectronics (TFME)
King Yuan Electronics Corp. (KYEC)
Powertech Technology Inc. (PTI)
Microchip (Microsemi)
Unisem Group
SFA Semicon
Forehope Electronic (Ningbo) Co.,Ltd.
Toshiba
BYD
Zhuzhou Crrc Times Electric
China Resources Microelectronics Limited
Hangzhou Silan microelectronics
Rapidus
Amkor
List of Tables
 Table 1. Global Automotive IC Package Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Automotive IC Package Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Automotive IC Package Production Capacity (Million Pieces) by Manufacturers in 2024
 Table 4. Global Automotive IC Package Production by Manufacturers (2020-2025) & (Million Pieces)
 Table 5. Global Automotive IC Package Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Automotive IC Package Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Automotive IC Package Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Automotive IC Package, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Automotive IC Package as of 2024)
 Table 10. Global Market Automotive IC Package Average Price by Manufacturers (US$/K Pieces) & (2020-2025)
 Table 11. Global Key Manufacturers of Automotive IC Package, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Automotive IC Package, Product Offered and Application
 Table 13. Global Key Manufacturers of Automotive IC Package, Date of Enter into This Industry
 Table 14. Global Automotive IC Package Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Automotive IC Package Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Automotive IC Package Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Automotive IC Package Production Value Market Share by Region (2020-2025)
 Table 19. Global Automotive IC Package Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Automotive IC Package Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Automotive IC Package Production Comparison by Region: 2020 VS 2024 VS 2031 (Million Pieces)
 Table 22. Global Automotive IC Package Production (Million Pieces) by Region (2020-2025)
 Table 23. Global Automotive IC Package Production Market Share by Region (2020-2025)
 Table 24. Global Automotive IC Package Production (Million Pieces) Forecast by Region (2026-2031)
 Table 25. Global Automotive IC Package Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Automotive IC Package Market Average Price (US$/K Pieces) by Region (2020-2025)
 Table 27. Global Automotive IC Package Market Average Price (US$/K Pieces) by Region (2026-2031)
 Table 28. Global Automotive IC Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Million Pieces)
 Table 29. Global Automotive IC Package Consumption by Region (2020-2025) & (Million Pieces)
 Table 30. Global Automotive IC Package Consumption Market Share by Region (2020-2025)
 Table 31. Global Automotive IC Package Forecasted Consumption by Region (2026-2031) & (Million Pieces)
 Table 32. Global Automotive IC Package Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Automotive IC Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Pieces)
 Table 34. North America Automotive IC Package Consumption by Country (2020-2025) & (Million Pieces)
 Table 35. North America Automotive IC Package Consumption by Country (2026-2031) & (Million Pieces)
 Table 36. Europe Automotive IC Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Pieces)
 Table 37. Europe Automotive IC Package Consumption by Country (2020-2025) & (Million Pieces)
 Table 38. Europe Automotive IC Package Consumption by Country (2026-2031) & (Million Pieces)
 Table 39. Asia Pacific Automotive IC Package Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Million Pieces)
 Table 40. Asia Pacific Automotive IC Package Consumption by Region (2020-2025) & (Million Pieces)
 Table 41. Asia Pacific Automotive IC Package Consumption by Region (2026-2031) & (Million Pieces)
 Table 42. Latin America, Middle East & Africa Automotive IC Package Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Million Pieces)
 Table 43. Latin America, Middle East & Africa Automotive IC Package Consumption by Country (2020-2025) & (Million Pieces)
 Table 44. Latin America, Middle East & Africa Automotive IC Package Consumption by Country (2026-2031) & (Million Pieces)
 Table 45. Global Automotive IC Package Production (Million Pieces) by Type (2020-2025)
 Table 46. Global Automotive IC Package Production (Million Pieces) by Type (2026-2031)
 Table 47. Global Automotive IC Package Production Market Share by Type (2020-2025)
 Table 48. Global Automotive IC Package Production Market Share by Type (2026-2031)
 Table 49. Global Automotive IC Package Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Automotive IC Package Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Automotive IC Package Production Value Market Share by Type (2020-2025)
 Table 52. Global Automotive IC Package Production Value Market Share by Type (2026-2031)
 Table 53. Global Automotive IC Package Price (US$/K Pieces) by Type (2020-2025)
 Table 54. Global Automotive IC Package Price (US$/K Pieces) by Type (2026-2031)
 Table 55. Global Automotive IC Package Production (Million Pieces) by Application (2020-2025)
 Table 56. Global Automotive IC Package Production (Million Pieces) by Application (2026-2031)
 Table 57. Global Automotive IC Package Production Market Share by Application (2020-2025)
 Table 58. Global Automotive IC Package Production Market Share by Application (2026-2031)
 Table 59. Global Automotive IC Package Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Automotive IC Package Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Automotive IC Package Production Value Market Share by Application (2020-2025)
 Table 62. Global Automotive IC Package Production Value Market Share by Application (2026-2031)
 Table 63. Global Automotive IC Package Price (US$/K Pieces) by Application (2020-2025)
 Table 64. Global Automotive IC Package Price (US$/K Pieces) by Application (2026-2031)
 Table 65. Amkor Automotive IC Package Company Information
 Table 66. Amkor Automotive IC Package Specification and Application
 Table 67. Amkor Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 68. Amkor Main Business and Markets Served
 Table 69. Amkor Recent Developments/Updates
 Table 70. ASE (SPIL) Automotive IC Package Company Information
 Table 71. ASE (SPIL) Automotive IC Package Specification and Application
 Table 72. ASE (SPIL) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 73. ASE (SPIL) Main Business and Markets Served
 Table 74. ASE (SPIL) Recent Developments/Updates
 Table 75. NXP Semiconductors Automotive IC Package Company Information
 Table 76. NXP Semiconductors Automotive IC Package Specification and Application
 Table 77. NXP Semiconductors Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 78. NXP Semiconductors Main Business and Markets Served
 Table 79. NXP Semiconductors Recent Developments/Updates
 Table 80. Infineon (Cypress) Automotive IC Package Company Information
 Table 81. Infineon (Cypress) Automotive IC Package Specification and Application
 Table 82. Infineon (Cypress) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 83. Infineon (Cypress) Main Business and Markets Served
 Table 84. Infineon (Cypress) Recent Developments/Updates
 Table 85. Renesas Automotive IC Package Company Information
 Table 86. Renesas Automotive IC Package Specification and Application
 Table 87. Renesas Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 88. Renesas Main Business and Markets Served
 Table 89. Renesas Recent Developments/Updates
 Table 90. TI (Texas Instruments) Automotive IC Package Company Information
 Table 91. TI (Texas Instruments) Automotive IC Package Specification and Application
 Table 92. TI (Texas Instruments) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 93. TI (Texas Instruments) Main Business and Markets Served
 Table 94. TI (Texas Instruments) Recent Developments/Updates
 Table 95. STMicroelectronics Automotive IC Package Company Information
 Table 96. STMicroelectronics Automotive IC Package Specification and Application
 Table 97. STMicroelectronics Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 98. STMicroelectronics Main Business and Markets Served
 Table 99. STMicroelectronics Recent Developments/Updates
 Table 100. onsemi Automotive IC Package Company Information
 Table 101. onsemi Automotive IC Package Specification and Application
 Table 102. onsemi Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 103. onsemi Main Business and Markets Served
 Table 104. onsemi Recent Developments/Updates
 Table 105. UTAC Automotive IC Package Company Information
 Table 106. UTAC Automotive IC Package Specification and Application
 Table 107. UTAC Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 108. UTAC Main Business and Markets Served
 Table 109. UTAC Recent Developments/Updates
 Table 110. Bosch Automotive IC Package Company Information
 Table 111. Bosch Automotive IC Package Specification and Application
 Table 112. Bosch Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 113. Bosch Main Business and Markets Served
 Table 114. Bosch Recent Developments/Updates
 Table 115. Rohm Automotive IC Package Company Information
 Table 116. Rohm Automotive IC Package Specification and Application
 Table 117. Rohm Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 118. Rohm Main Business and Markets Served
 Table 119. Rohm Recent Developments/Updates
 Table 120. ADI (Analog Devices, Inc) Automotive IC Package Company Information
 Table 121. ADI (Analog Devices, Inc) Automotive IC Package Specification and Application
 Table 122. ADI (Analog Devices, Inc) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 123. ADI (Analog Devices, Inc) Main Business and Markets Served
 Table 124. ADI (Analog Devices, Inc) Recent Developments/Updates
 Table 125. JCET (STATS ChipPAC) Automotive IC Package Company Information
 Table 126. JCET (STATS ChipPAC) Automotive IC Package Specification and Application
 Table 127. JCET (STATS ChipPAC) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 128. JCET (STATS ChipPAC) Main Business and Markets Served
 Table 129. JCET (STATS ChipPAC) Recent Developments/Updates
 Table 130. Mitsubishi Electric Automotive IC Package Company Information
 Table 131. Mitsubishi Electric Automotive IC Package Specification and Application
 Table 132. Mitsubishi Electric Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 133. Mitsubishi Electric Main Business and Markets Served
 Table 134. Mitsubishi Electric Recent Developments/Updates
 Table 135. Carsem Automotive IC Package Company Information
 Table 136. Carsem Automotive IC Package Specification and Application
 Table 137. Carsem Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 138. Carsem Main Business and Markets Served
 Table 139. Carsem Recent Developments/Updates
 Table 140. Tongfu Microelectronics (TFME) Automotive IC Package Company Information
 Table 141. Tongfu Microelectronics (TFME) Automotive IC Package Specification and Application
 Table 142. Tongfu Microelectronics (TFME) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 143. Tongfu Microelectronics (TFME) Main Business and Markets Served
 Table 144. Tongfu Microelectronics (TFME) Recent Developments/Updates
 Table 145. King Yuan Electronics Corp. (KYEC) Automotive IC Package Company Information
 Table 146. King Yuan Electronics Corp. (KYEC) Automotive IC Package Specification and Application
 Table 147. King Yuan Electronics Corp. (KYEC) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 148. King Yuan Electronics Corp. (KYEC) Main Business and Markets Served
 Table 149. King Yuan Electronics Corp. (KYEC) Recent Developments/Updates
 Table 150. Powertech Technology Inc. (PTI) Automotive IC Package Company Information
 Table 151. Powertech Technology Inc. (PTI) Automotive IC Package Specification and Application
 Table 152. Powertech Technology Inc. (PTI) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 153. Powertech Technology Inc. (PTI) Main Business and Markets Served
 Table 154. Powertech Technology Inc. (PTI) Recent Developments/Updates
 Table 155. Microchip (Microsemi) Automotive IC Package Company Information
 Table 156. Microchip (Microsemi) Automotive IC Package Specification and Application
 Table 157. Microchip (Microsemi) Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 158. Microchip (Microsemi) Main Business and Markets Served
 Table 159. Microchip (Microsemi) Recent Developments/Updates
 Table 160. Unisem Group Automotive IC Package Company Information
 Table 161. Unisem Group Automotive IC Package Specification and Application
 Table 162. Unisem Group Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 163. Unisem Group Main Business and Markets Served
 Table 164. Unisem Group Recent Developments/Updates
 Table 165. SFA Semicon Automotive IC Package Company Information
 Table 166. SFA Semicon Automotive IC Package Specification and Application
 Table 167. SFA Semicon Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 168. SFA Semicon Main Business and Markets Served
 Table 169. SFA Semicon Recent Developments/Updates
 Table 170. Forehope Electronic (Ningbo) Co.,Ltd. Automotive IC Package Company Information
 Table 171. Forehope Electronic (Ningbo) Co.,Ltd. Automotive IC Package Specification and Application
 Table 172. Forehope Electronic (Ningbo) Co.,Ltd. Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 173. Forehope Electronic (Ningbo) Co.,Ltd. Main Business and Markets Served
 Table 174. Forehope Electronic (Ningbo) Co.,Ltd. Recent Developments/Updates
 Table 175. Toshiba Automotive IC Package Company Information
 Table 176. Toshiba Automotive IC Package Specification and Application
 Table 177. Toshiba Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 178. Toshiba Main Business and Markets Served
 Table 179. Toshiba Recent Developments/Updates
 Table 180. BYD Automotive IC Package Company Information
 Table 181. BYD Automotive IC Package Specification and Application
 Table 182. BYD Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 183. BYD Main Business and Markets Served
 Table 184. BYD Recent Developments/Updates
 Table 185. Zhuzhou CRRC Times Electric Automotive IC Package Company Information
 Table 186. Zhuzhou CRRC Times Electric Automotive IC Package Specification and Application
 Table 187. Zhuzhou CRRC Times Electric Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 188. Zhuzhou CRRC Times Electric Main Business and Markets Served
 Table 189. Zhuzhou CRRC Times Electric Recent Developments/Updates
 Table 190. China Resources Microelectronics Limited Automotive IC Package Company Information
 Table 191. China Resources Microelectronics Limited Automotive IC Package Specification and Application
 Table 192. China Resources Microelectronics Limited Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 193. China Resources Microelectronics Limited Main Business and Markets Served
 Table 194. China Resources Microelectronics Limited Recent Developments/Updates
 Table 195. Hangzhou Silan Microelectronics Automotive IC Package Company Information
 Table 196. Hangzhou Silan Microelectronics Automotive IC Package Specification and Application
 Table 197. Hangzhou Silan Microelectronics Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 198. Hangzhou Silan Microelectronics Main Business and Markets Served
 Table 199. Hangzhou Silan Microelectronics Recent Developments/Updates
 Table 200. Rapidus Automotive IC Package Company Information
 Table 201. Rapidus Automotive IC Package Specification and Application
 Table 202. Rapidus Automotive IC Package Production (Million Pieces), Value (US$ Million), Price (US$/K Pieces) and Gross Margin (2020-2025)
 Table 203. Rapidus Main Business and Markets Served
 Table 204. Rapidus Recent Developments/Updates
 Table 205. Key Raw Materials Lists
 Table 206. Raw Materials Key Suppliers Lists
 Table 207. Automotive IC Package Distributors List
 Table 208. Automotive IC Package Customers List
 Table 209. Automotive IC Package Market Trends
 Table 210. Automotive IC Package Market Drivers
 Table 211. Automotive IC Package Market Challenges
 Table 212. Automotive IC Package Market Restraints
 Table 213. Research Programs/Design for This Report
 Table 214. Key Data Information from Secondary Sources
 Table 215. Key Data Information from Primary Sources
 Table 216. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Automotive IC Package
 Figure 2. Global Automotive IC Package Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Automotive IC Package Market Share by Type: 2024 VS 2031
 Figure 4. Automotive OSAT Product Picture
 Figure 5. Automotive IDM Product Picture
 Figure 6. Global Automotive IC Package Market Value by Application, (US$ Million) & (2020-2031)
 Figure 7. Global Automotive IC Package Market Share by Application: 2024 VS 2031
 Figure 8. Advanced Packaging
 Figure 9. Mainstream Packaging
 Figure 10. Global Automotive IC Package Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 11. Global Automotive IC Package Production Value (US$ Million) & (2020-2031)
 Figure 12. Global Automotive IC Package Production Capacity (Million Pieces) & (2020-2031)
 Figure 13. Global Automotive IC Package Production (Million Pieces) & (2020-2031)
 Figure 14. Global Automotive IC Package Average Price (US$/K Pieces) & (2020-2031)
 Figure 15. Automotive IC Package Report Years Considered
 Figure 16. Automotive IC Package Production Share by Manufacturers in 2024
 Figure 17. Global Automotive IC Package Production Value Share by Manufacturers (2024)
 Figure 18. Automotive IC Package Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 19. The Global 5 and 10 Largest Players: Market Share by Automotive IC Package Revenue in 2024
 Figure 20. Global Automotive IC Package Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 21. Global Automotive IC Package Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 22. Global Automotive IC Package Production Comparison by Region: 2020 VS 2024 VS 2031 (Million Pieces)
 Figure 23. Global Automotive IC Package Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 24. North America Automotive IC Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 25. Europe Automotive IC Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 26. South Korea Automotive IC Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 27. China Taiwan Automotive IC Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. China Automotive IC Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Japan Automotive IC Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Southeast Asia Automotive IC Package Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. Global Automotive IC Package Consumption by Region: 2020 VS 2024 VS 2031 (Million Pieces)
 Figure 32. Global Automotive IC Package Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 33. North America Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 34. North America Automotive IC Package Consumption Market Share by Country (2020-2031)
 Figure 35. U.S. Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 36. Canada Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 37. Europe Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 38. Europe Automotive IC Package Consumption Market Share by Country (2020-2031)
 Figure 39. Germany Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 40. France Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 41. U.K. Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 42. Italy Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 43. Netherlands Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 44. Asia Pacific Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 45. Asia Pacific Automotive IC Package Consumption Market Share by Region (2020-2031)
 Figure 46. China Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 47. Japan Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 48. South Korea Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 49. China Taiwan Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 50. Southeast Asia Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 51. India Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 52. Latin America, Middle East & Africa Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 53. Latin America, Middle East & Africa Automotive IC Package Consumption Market Share by Country (2020-2031)
 Figure 54. Mexico Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 55. Brazil Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 56. Turkey Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 57. GCC Countries Automotive IC Package Consumption and Growth Rate (2020-2031) & (Million Pieces)
 Figure 58. Global Production Market Share of Automotive IC Package by Type (2020-2031)
 Figure 59. Global Production Value Market Share of Automotive IC Package by Type (2020-2031)
 Figure 60. Global Automotive IC Package Price (US$/K Pieces) by Type (2020-2031)
 Figure 61. Global Production Market Share of Automotive IC Package by Application (2020-2031)
 Figure 62. Global Production Value Market Share of Automotive IC Package by Application (2020-2031)
 Figure 63. Global Automotive IC Package Price (US$/K Pieces) by Application (2020-2031)
 Figure 64. Automotive IC Package Value Chain
 Figure 65. Channels of Distribution (Direct Vs Distribution)
 Figure 66. Bottom-up and Top-down Approaches for This Report
 Figure 67. Data Triangulation
SELECT A FORMAT
Added to Cart
Electronic (PDF)

$2900

This license allows only one user to access the PDF.
Electronic (PDF)

$4350

This license allows 1 - 5 user to access the PDF, license is suitable for small groups of 5 users working together
Electronic (PDF)

$5800

This license allows users/teams in a same Enterprise to use this report, various departments within an enterpise can use this report
Add to Cart
Buy Now (15% Discount)
INQUIRE FOR DISCOUNT

HAVE A QUERY?

INQUIRE ABOUT REPORT EMAIL US

OUR CUSTOMER

Nano Dimension

SIMILAR REPORTS

Global Automotive Chip Packaging Market Research Report 2024
Global Advanced Packaging for Automotive Chips Market Research Report 2024
Global Automotive Semiconductor Packaging Market Research Report 2024
Global Power Packaging for Automotive Semiconductors Market Research Report 2024
Global Automotive IDM Market Research Report 2025
Automotive IC Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030
Automotive Integrated Circuit ICs Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030
Automotive Electronics Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030
Global Automotive OSAT Market Research Report 2025
Global Automotive Body Electronics Market Research Report 2024
Global Automotive Electronic Accessories Market Insights Forecast to 2030
Automotive Electronics Chips Global Market Share and Ranking Overall Sales and Demand Forecast 2024 2030
Global Automotive Electronic Parts Market Research Report 2024
Global Automobile Electronics Market Research Report 2024
Global Automotive Semiconductors Market Research Report 2024
Global Automotive Driver ICs Market Research Report 2024
Global Automotive IC System Market Research Report 2024
Global Electronics Components in Vehicles Market Research Report 2024
Global Automotive Passive Components Market Research Report 2024
Global Automotive PCB Market Insights Forecast to 2030
Call
Buy Now
REQUEST FREE SAMPLE REPORT
Support Contacts
U.S. (TOLL FREE)
+1 (425) 388-2538
THE COMPANY
OUR PRODUCTS
CUSTOMER SUPPORT
POLICES
THE COMPANY
CUSTOMER SUPPORT
OUR PRODUCTS
POLICES
Copyright © 2018 Valuates.com. All Rights Reserved.
Sitemap - Privacy Policy - Terms & Conditions