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Global Coreless Packaging Substrate Market Research Report 2025
Published Date: February 2025
|
Report Code: QYRE-Auto-24T12184
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Global Coreless Packaging Substrate Market Research Report 2022
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Global Coreless Packaging Substrate Market Research Report 2025

Code: QYRE-Auto-24T12184
Report
February 2025
Pages:114
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Coreless Packaging Substrate Market

The global market for Coreless Packaging Substrate was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
North American market for Coreless Packaging Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Coreless Packaging Substrate is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Coreless Packaging Substrate include SHINKO ELECTRIC INDUSTRIES CO., LTD., Samsung, Panasonic Group, Sony, HITACHI CHEMICAL COMPANY, LTD., TCI, Korea Circuit, Founder, Unimicron, National Center for Advanced Packaging Co., Ltd.(NCAP China), etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Coreless Packaging Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Coreless Packaging Substrate.
The Coreless Packaging Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Coreless Packaging Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Coreless Packaging Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Coreless Packaging Substrate Market Report

Report Metric Details
Report Name Coreless Packaging Substrate Market
by Type
  • 20 - 100 µm
  • 100 - 225 µm
  • Other
by Application
  • Communication
  • Automotive Electronics
  • Industrial
  • Consumer Electronics
  • Computing and Networking
  • Other
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company SHINKO ELECTRIC INDUSTRIES CO., LTD., Samsung, Panasonic Group, Sony, HITACHI CHEMICAL COMPANY, LTD., TCI, Korea Circuit, Founder, Unimicron, National Center for Advanced Packaging Co., Ltd.(NCAP China), Zhuhai ACCESS, AKM Meadville, Xpeedic, ASE Group, Simmtech Holdings, TTM
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Coreless Packaging Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Coreless Packaging Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Coreless Packaging Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Coreless Packaging Substrate Market report?

Ans: The main players in the Coreless Packaging Substrate Market are SHINKO ELECTRIC INDUSTRIES CO., LTD., Samsung, Panasonic Group, Sony, HITACHI CHEMICAL COMPANY, LTD., TCI, Korea Circuit, Founder, Unimicron, National Center for Advanced Packaging Co., Ltd.(NCAP China), Zhuhai ACCESS, AKM Meadville, Xpeedic, ASE Group, Simmtech Holdings, TTM

What are the Application segmentation covered in the Coreless Packaging Substrate Market report?

Ans: The Applications covered in the Coreless Packaging Substrate Market report are Communication, Automotive Electronics, Industrial, Consumer Electronics, Computing and Networking, Other

What are the Type segmentation covered in the Coreless Packaging Substrate Market report?

Ans: The Types covered in the Coreless Packaging Substrate Market report are 20 - 100 µm, 100 - 225 µm, Other

1 Coreless Packaging Substrate Market Overview
1.1 Product Definition
1.2 Coreless Packaging Substrate by Type
1.2.1 Global Coreless Packaging Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 20 - 100 µm
1.2.3 100 - 225 µm
1.2.4 Other
1.3 Coreless Packaging Substrate by Application
1.3.1 Global Coreless Packaging Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Communication
1.3.3 Automotive Electronics
1.3.4 Industrial
1.3.5 Consumer Electronics
1.3.6 Computing and Networking
1.3.7 Other
1.4 Global Market Growth Prospects
1.4.1 Global Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Coreless Packaging Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Coreless Packaging Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global Coreless Packaging Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Coreless Packaging Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global Coreless Packaging Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Coreless Packaging Substrate, Industry Ranking, 2023 VS 2024
2.4 Global Coreless Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Coreless Packaging Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Coreless Packaging Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Coreless Packaging Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Coreless Packaging Substrate, Date of Enter into This Industry
2.9 Coreless Packaging Substrate Market Competitive Situation and Trends
2.9.1 Coreless Packaging Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Coreless Packaging Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Coreless Packaging Substrate Production by Region
3.1 Global Coreless Packaging Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Coreless Packaging Substrate Production Value by Region (2020-2031)
3.2.1 Global Coreless Packaging Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Coreless Packaging Substrate by Region (2026-2031)
3.3 Global Coreless Packaging Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Coreless Packaging Substrate Production Volume by Region (2020-2031)
3.4.1 Global Coreless Packaging Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Coreless Packaging Substrate by Region (2026-2031)
3.5 Global Coreless Packaging Substrate Market Price Analysis by Region (2020-2025)
3.6 Global Coreless Packaging Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Coreless Packaging Substrate Production Value Estimates and Forecasts (2020-2031)
4 Coreless Packaging Substrate Consumption by Region
4.1 Global Coreless Packaging Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Coreless Packaging Substrate Consumption by Region (2020-2031)
4.2.1 Global Coreless Packaging Substrate Consumption by Region (2020-2025)
4.2.2 Global Coreless Packaging Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Coreless Packaging Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Coreless Packaging Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Coreless Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Coreless Packaging Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Coreless Packaging Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Coreless Packaging Substrate Production by Type (2020-2031)
5.1.1 Global Coreless Packaging Substrate Production by Type (2020-2025)
5.1.2 Global Coreless Packaging Substrate Production by Type (2026-2031)
5.1.3 Global Coreless Packaging Substrate Production Market Share by Type (2020-2031)
5.2 Global Coreless Packaging Substrate Production Value by Type (2020-2031)
5.2.1 Global Coreless Packaging Substrate Production Value by Type (2020-2025)
5.2.2 Global Coreless Packaging Substrate Production Value by Type (2026-2031)
5.2.3 Global Coreless Packaging Substrate Production Value Market Share by Type (2020-2031)
5.3 Global Coreless Packaging Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global Coreless Packaging Substrate Production by Application (2020-2031)
6.1.1 Global Coreless Packaging Substrate Production by Application (2020-2025)
6.1.2 Global Coreless Packaging Substrate Production by Application (2026-2031)
6.1.3 Global Coreless Packaging Substrate Production Market Share by Application (2020-2031)
6.2 Global Coreless Packaging Substrate Production Value by Application (2020-2031)
6.2.1 Global Coreless Packaging Substrate Production Value by Application (2020-2025)
6.2.2 Global Coreless Packaging Substrate Production Value by Application (2026-2031)
6.2.3 Global Coreless Packaging Substrate Production Value Market Share by Application (2020-2031)
6.3 Global Coreless Packaging Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 SHINKO ELECTRIC INDUSTRIES CO., LTD.
7.1.1 SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Company Information
7.1.2 SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Product Portfolio
7.1.3 SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 SHINKO ELECTRIC INDUSTRIES CO., LTD. Main Business and Markets Served
7.1.5 SHINKO ELECTRIC INDUSTRIES CO., LTD. Recent Developments/Updates
7.2 Samsung
7.2.1 Samsung Coreless Packaging Substrate Company Information
7.2.2 Samsung Coreless Packaging Substrate Product Portfolio
7.2.3 Samsung Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Samsung Main Business and Markets Served
7.2.5 Samsung Recent Developments/Updates
7.3 Panasonic Group
7.3.1 Panasonic Group Coreless Packaging Substrate Company Information
7.3.2 Panasonic Group Coreless Packaging Substrate Product Portfolio
7.3.3 Panasonic Group Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Panasonic Group Main Business and Markets Served
7.3.5 Panasonic Group Recent Developments/Updates
7.4 Sony
7.4.1 Sony Coreless Packaging Substrate Company Information
7.4.2 Sony Coreless Packaging Substrate Product Portfolio
7.4.3 Sony Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Sony Main Business and Markets Served
7.4.5 Sony Recent Developments/Updates
7.5 HITACHI CHEMICAL COMPANY, LTD.
7.5.1 HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Company Information
7.5.2 HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Product Portfolio
7.5.3 HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 HITACHI CHEMICAL COMPANY, LTD. Main Business and Markets Served
7.5.5 HITACHI CHEMICAL COMPANY, LTD. Recent Developments/Updates
7.6 TCI
7.6.1 TCI Coreless Packaging Substrate Company Information
7.6.2 TCI Coreless Packaging Substrate Product Portfolio
7.6.3 TCI Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 TCI Main Business and Markets Served
7.6.5 TCI Recent Developments/Updates
7.7 Korea Circuit
7.7.1 Korea Circuit Coreless Packaging Substrate Company Information
7.7.2 Korea Circuit Coreless Packaging Substrate Product Portfolio
7.7.3 Korea Circuit Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Korea Circuit Main Business and Markets Served
7.7.5 Korea Circuit Recent Developments/Updates
7.8 Founder
7.8.1 Founder Coreless Packaging Substrate Company Information
7.8.2 Founder Coreless Packaging Substrate Product Portfolio
7.8.3 Founder Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Founder Main Business and Markets Served
7.8.5 Founder Recent Developments/Updates
7.9 Unimicron
7.9.1 Unimicron Coreless Packaging Substrate Company Information
7.9.2 Unimicron Coreless Packaging Substrate Product Portfolio
7.9.3 Unimicron Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Unimicron Main Business and Markets Served
7.9.5 Unimicron Recent Developments/Updates
7.10 National Center for Advanced Packaging Co., Ltd.(NCAP China)
7.10.1 National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Company Information
7.10.2 National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Product Portfolio
7.10.3 National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 National Center for Advanced Packaging Co., Ltd.(NCAP China) Main Business and Markets Served
7.10.5 National Center for Advanced Packaging Co., Ltd.(NCAP China) Recent Developments/Updates
7.11 Zhuhai ACCESS
7.11.1 Zhuhai ACCESS Coreless Packaging Substrate Company Information
7.11.2 Zhuhai ACCESS Coreless Packaging Substrate Product Portfolio
7.11.3 Zhuhai ACCESS Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Zhuhai ACCESS Main Business and Markets Served
7.11.5 Zhuhai ACCESS Recent Developments/Updates
7.12 AKM Meadville
7.12.1 AKM Meadville Coreless Packaging Substrate Company Information
7.12.2 AKM Meadville Coreless Packaging Substrate Product Portfolio
7.12.3 AKM Meadville Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 AKM Meadville Main Business and Markets Served
7.12.5 AKM Meadville Recent Developments/Updates
7.13 Xpeedic
7.13.1 Xpeedic Coreless Packaging Substrate Company Information
7.13.2 Xpeedic Coreless Packaging Substrate Product Portfolio
7.13.3 Xpeedic Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Xpeedic Main Business and Markets Served
7.13.5 Xpeedic Recent Developments/Updates
7.14 ASE Group
7.14.1 ASE Group Coreless Packaging Substrate Company Information
7.14.2 ASE Group Coreless Packaging Substrate Product Portfolio
7.14.3 ASE Group Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.14.4 ASE Group Main Business and Markets Served
7.14.5 ASE Group Recent Developments/Updates
7.15 Simmtech Holdings
7.15.1 Simmtech Holdings Coreless Packaging Substrate Company Information
7.15.2 Simmtech Holdings Coreless Packaging Substrate Product Portfolio
7.15.3 Simmtech Holdings Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Simmtech Holdings Main Business and Markets Served
7.15.5 Simmtech Holdings Recent Developments/Updates
7.16 TTM
7.16.1 TTM Coreless Packaging Substrate Company Information
7.16.2 TTM Coreless Packaging Substrate Product Portfolio
7.16.3 TTM Coreless Packaging Substrate Production, Value, Price and Gross Margin (2020-2025)
7.16.4 TTM Main Business and Markets Served
7.16.5 TTM Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Coreless Packaging Substrate Industry Chain Analysis
8.2 Coreless Packaging Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Coreless Packaging Substrate Production Mode & Process Analysis
8.4 Coreless Packaging Substrate Sales and Marketing
8.4.1 Coreless Packaging Substrate Sales Channels
8.4.2 Coreless Packaging Substrate Distributors
8.5 Coreless Packaging Substrate Customer Analysis
9 Coreless Packaging Substrate Market Dynamics
9.1 Coreless Packaging Substrate Industry Trends
9.2 Coreless Packaging Substrate Market Drivers
9.3 Coreless Packaging Substrate Market Challenges
9.4 Coreless Packaging Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Coreless Packaging Substrate Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Coreless Packaging Substrate Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Coreless Packaging Substrate Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Coreless Packaging Substrate Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Coreless Packaging Substrate Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Coreless Packaging Substrate Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Coreless Packaging Substrate Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Coreless Packaging Substrate, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Coreless Packaging Substrate as of 2024)
 Table 10. Global Market Coreless Packaging Substrate Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Coreless Packaging Substrate, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Coreless Packaging Substrate, Product Offered and Application
 Table 13. Global Key Manufacturers of Coreless Packaging Substrate, Date of Enter into This Industry
 Table 14. Global Coreless Packaging Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Coreless Packaging Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Coreless Packaging Substrate Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Coreless Packaging Substrate Production Value Market Share by Region (2020-2025)
 Table 19. Global Coreless Packaging Substrate Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Coreless Packaging Substrate Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Coreless Packaging Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Coreless Packaging Substrate Production (K Units) by Region (2020-2025)
 Table 23. Global Coreless Packaging Substrate Production Market Share by Region (2020-2025)
 Table 24. Global Coreless Packaging Substrate Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Coreless Packaging Substrate Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Coreless Packaging Substrate Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Coreless Packaging Substrate Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Coreless Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Coreless Packaging Substrate Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Coreless Packaging Substrate Consumption Market Share by Region (2020-2025)
 Table 31. Global Coreless Packaging Substrate Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Coreless Packaging Substrate Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Coreless Packaging Substrate Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Coreless Packaging Substrate Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Coreless Packaging Substrate Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Coreless Packaging Substrate Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Coreless Packaging Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Coreless Packaging Substrate Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Coreless Packaging Substrate Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Coreless Packaging Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Coreless Packaging Substrate Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Coreless Packaging Substrate Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Coreless Packaging Substrate Production (K Units) by Type (2020-2025)
 Table 46. Global Coreless Packaging Substrate Production (K Units) by Type (2026-2031)
 Table 47. Global Coreless Packaging Substrate Production Market Share by Type (2020-2025)
 Table 48. Global Coreless Packaging Substrate Production Market Share by Type (2026-2031)
 Table 49. Global Coreless Packaging Substrate Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Coreless Packaging Substrate Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Coreless Packaging Substrate Production Value Market Share by Type (2020-2025)
 Table 52. Global Coreless Packaging Substrate Production Value Market Share by Type (2026-2031)
 Table 53. Global Coreless Packaging Substrate Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Coreless Packaging Substrate Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Coreless Packaging Substrate Production (K Units) by Application (2020-2025)
 Table 56. Global Coreless Packaging Substrate Production (K Units) by Application (2026-2031)
 Table 57. Global Coreless Packaging Substrate Production Market Share by Application (2020-2025)
 Table 58. Global Coreless Packaging Substrate Production Market Share by Application (2026-2031)
 Table 59. Global Coreless Packaging Substrate Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Coreless Packaging Substrate Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Coreless Packaging Substrate Production Value Market Share by Application (2020-2025)
 Table 62. Global Coreless Packaging Substrate Production Value Market Share by Application (2026-2031)
 Table 63. Global Coreless Packaging Substrate Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Coreless Packaging Substrate Price (US$/Unit) by Application (2026-2031)
 Table 65. SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Company Information
 Table 66. SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Specification and Application
 Table 67. SHINKO ELECTRIC INDUSTRIES CO., LTD. Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. SHINKO ELECTRIC INDUSTRIES CO., LTD. Main Business and Markets Served
 Table 69. SHINKO ELECTRIC INDUSTRIES CO., LTD. Recent Developments/Updates
 Table 70. Samsung Coreless Packaging Substrate Company Information
 Table 71. Samsung Coreless Packaging Substrate Specification and Application
 Table 72. Samsung Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Samsung Main Business and Markets Served
 Table 74. Samsung Recent Developments/Updates
 Table 75. Panasonic Group Coreless Packaging Substrate Company Information
 Table 76. Panasonic Group Coreless Packaging Substrate Specification and Application
 Table 77. Panasonic Group Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. Panasonic Group Main Business and Markets Served
 Table 79. Panasonic Group Recent Developments/Updates
 Table 80. Sony Coreless Packaging Substrate Company Information
 Table 81. Sony Coreless Packaging Substrate Specification and Application
 Table 82. Sony Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. Sony Main Business and Markets Served
 Table 84. Sony Recent Developments/Updates
 Table 85. HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Company Information
 Table 86. HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Specification and Application
 Table 87. HITACHI CHEMICAL COMPANY, LTD. Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. HITACHI CHEMICAL COMPANY, LTD. Main Business and Markets Served
 Table 89. HITACHI CHEMICAL COMPANY, LTD. Recent Developments/Updates
 Table 90. TCI Coreless Packaging Substrate Company Information
 Table 91. TCI Coreless Packaging Substrate Specification and Application
 Table 92. TCI Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. TCI Main Business and Markets Served
 Table 94. TCI Recent Developments/Updates
 Table 95. Korea Circuit Coreless Packaging Substrate Company Information
 Table 96. Korea Circuit Coreless Packaging Substrate Specification and Application
 Table 97. Korea Circuit Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. Korea Circuit Main Business and Markets Served
 Table 99. Korea Circuit Recent Developments/Updates
 Table 100. Founder Coreless Packaging Substrate Company Information
 Table 101. Founder Coreless Packaging Substrate Specification and Application
 Table 102. Founder Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Founder Main Business and Markets Served
 Table 104. Founder Recent Developments/Updates
 Table 105. Unimicron Coreless Packaging Substrate Company Information
 Table 106. Unimicron Coreless Packaging Substrate Specification and Application
 Table 107. Unimicron Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. Unimicron Main Business and Markets Served
 Table 109. Unimicron Recent Developments/Updates
 Table 110. National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Company Information
 Table 111. National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Specification and Application
 Table 112. National Center for Advanced Packaging Co., Ltd.(NCAP China) Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. National Center for Advanced Packaging Co., Ltd.(NCAP China) Main Business and Markets Served
 Table 114. National Center for Advanced Packaging Co., Ltd.(NCAP China) Recent Developments/Updates
 Table 115. Zhuhai ACCESS Coreless Packaging Substrate Company Information
 Table 116. Zhuhai ACCESS Coreless Packaging Substrate Specification and Application
 Table 117. Zhuhai ACCESS Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 118. Zhuhai ACCESS Main Business and Markets Served
 Table 119. Zhuhai ACCESS Recent Developments/Updates
 Table 120. AKM Meadville Coreless Packaging Substrate Company Information
 Table 121. AKM Meadville Coreless Packaging Substrate Specification and Application
 Table 122. AKM Meadville Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 123. AKM Meadville Main Business and Markets Served
 Table 124. AKM Meadville Recent Developments/Updates
 Table 125. Xpeedic Coreless Packaging Substrate Company Information
 Table 126. Xpeedic Coreless Packaging Substrate Specification and Application
 Table 127. Xpeedic Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 128. Xpeedic Main Business and Markets Served
 Table 129. Xpeedic Recent Developments/Updates
 Table 130. ASE Group Coreless Packaging Substrate Company Information
 Table 131. ASE Group Coreless Packaging Substrate Specification and Application
 Table 132. ASE Group Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 133. ASE Group Main Business and Markets Served
 Table 134. ASE Group Recent Developments/Updates
 Table 135. Simmtech Holdings Coreless Packaging Substrate Company Information
 Table 136. Simmtech Holdings Coreless Packaging Substrate Specification and Application
 Table 137. Simmtech Holdings Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 138. Simmtech Holdings Main Business and Markets Served
 Table 139. Simmtech Holdings Recent Developments/Updates
 Table 140. TTM Coreless Packaging Substrate Company Information
 Table 141. TTM Coreless Packaging Substrate Specification and Application
 Table 142. TTM Coreless Packaging Substrate Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 143. TTM Main Business and Markets Served
 Table 144. TTM Recent Developments/Updates
 Table 145. Key Raw Materials Lists
 Table 146. Raw Materials Key Suppliers Lists
 Table 147. Coreless Packaging Substrate Distributors List
 Table 148. Coreless Packaging Substrate Customers List
 Table 149. Coreless Packaging Substrate Market Trends
 Table 150. Coreless Packaging Substrate Market Drivers
 Table 151. Coreless Packaging Substrate Market Challenges
 Table 152. Coreless Packaging Substrate Market Restraints
 Table 153. Research Programs/Design for This Report
 Table 154. Key Data Information from Secondary Sources
 Table 155. Key Data Information from Primary Sources
 Table 156. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Coreless Packaging Substrate
 Figure 2. Global Coreless Packaging Substrate Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Coreless Packaging Substrate Market Share by Type: 2024 VS 2031
 Figure 4. 20 - 100 µm Product Picture
 Figure 5. 100 - 225 µm Product Picture
 Figure 6. Other Product Picture
 Figure 7. Global Coreless Packaging Substrate Market Value by Application, (US$ Million) & (2020-2031)
 Figure 8. Global Coreless Packaging Substrate Market Share by Application: 2024 VS 2031
 Figure 9. Communication
 Figure 10. Automotive Electronics
 Figure 11. Industrial
 Figure 12. Consumer Electronics
 Figure 13. Computing and Networking
 Figure 14. Other
 Figure 15. Global Coreless Packaging Substrate Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 16. Global Coreless Packaging Substrate Production Value (US$ Million) & (2020-2031)
 Figure 17. Global Coreless Packaging Substrate Production Capacity (K Units) & (2020-2031)
 Figure 18. Global Coreless Packaging Substrate Production (K Units) & (2020-2031)
 Figure 19. Global Coreless Packaging Substrate Average Price (US$/Unit) & (2020-2031)
 Figure 20. Coreless Packaging Substrate Report Years Considered
 Figure 21. Coreless Packaging Substrate Production Share by Manufacturers in 2024
 Figure 22. Global Coreless Packaging Substrate Production Value Share by Manufacturers (2024)
 Figure 23. Coreless Packaging Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 24. The Global 5 and 10 Largest Players: Market Share by Coreless Packaging Substrate Revenue in 2024
 Figure 25. Global Coreless Packaging Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 26. Global Coreless Packaging Substrate Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 27. Global Coreless Packaging Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 28. Global Coreless Packaging Substrate Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 29. North America Coreless Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Europe Coreless Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. China Coreless Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Japan Coreless Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. South Korea Coreless Packaging Substrate Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 34. Global Coreless Packaging Substrate Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 35. Global Coreless Packaging Substrate Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 36. North America Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 37. North America Coreless Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 38. U.S. Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Canada Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. Europe Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 41. Europe Coreless Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 42. Germany Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. France Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. U.K. Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Italy Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. Netherlands Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Asia Pacific Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 48. Asia Pacific Coreless Packaging Substrate Consumption Market Share by Region (2020-2031)
 Figure 49. China Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. Japan Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. South Korea Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. China Taiwan Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. Southeast Asia Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. India Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Latin America, Middle East & Africa Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 56. Latin America, Middle East & Africa Coreless Packaging Substrate Consumption Market Share by Country (2020-2031)
 Figure 57. Mexico Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Brazil Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 59. Israel Coreless Packaging Substrate Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 60. Global Production Market Share of Coreless Packaging Substrate by Type (2020-2031)
 Figure 61. Global Production Value Market Share of Coreless Packaging Substrate by Type (2020-2031)
 Figure 62. Global Coreless Packaging Substrate Price (US$/Unit) by Type (2020-2031)
 Figure 63. Global Production Market Share of Coreless Packaging Substrate by Application (2020-2031)
 Figure 64. Global Production Value Market Share of Coreless Packaging Substrate by Application (2020-2031)
 Figure 65. Global Coreless Packaging Substrate Price (US$/Unit) by Application (2020-2031)
 Figure 66. Coreless Packaging Substrate Value Chain
 Figure 67. Channels of Distribution (Direct Vs Distribution)
 Figure 68. Bottom-up and Top-down Approaches for This Report
 Figure 69. Data Triangulation
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