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Global IC Packaging Substrate (SUB) Market Research Report 2025
Published Date: March 2025
|
Report Code: QYRE-Auto-7P10163
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Global IC Packaging Substrate SUB Market Research Report 2022
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Global IC Packaging Substrate (SUB) Market Research Report 2025

Code: QYRE-Auto-7P10163
Report
March 2025
Pages:116
QYResearch
Buy Now with 15% Discount
DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES
FEATURED COMPANIES
Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
IBIDEN
Shinko Electric Industries
AT&S
LG Innotek
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
KINSUS
SCC
Fastprint Circuit Tech

IC Packaging Substrate (SUB) Market

The global market for IC Packaging Substrate (SUB) was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

Report Scope

This report aims to provide a comprehensive presentation of the global market for IC Packaging Substrate (SUB), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging Substrate (SUB).
The IC Packaging Substrate (SUB) market size, estimations, and forecasts are provided in terms of output/shipments (M Pcs) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global IC Packaging Substrate (SUB) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the IC Packaging Substrate (SUB) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of IC Packaging Substrate (SUB) Market Report

Report Metric Details
Report Name IC Packaging Substrate (SUB) Market
by Type
by Application
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Samsung Electro-Mechanics, MST, NGK, KLA Corporation, Panasonic, Simmtech, Daeduck, ASE Material, Kyocera, Ibiden, Shinko Electric Industries, AT&S, LG InnoTek, Fastprint Circuit Tech, ACCESS, Danbond Technology, TTM Technologies, Unimicron, Nan Ya PCB, Kinsus, SCC
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of IC Packaging Substrate (SUB) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of IC Packaging Substrate (SUB) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of IC Packaging Substrate (SUB) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

What is the IC Packaging Substrate (SUB) Market share by region?

Ans: Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year.

Who are the main players in the IC Packaging Substrate (SUB) Market report?

Ans: The main players in the IC Packaging Substrate (SUB) Market are Samsung Electro-Mechanics, MST, NGK, KLA Corporation, Panasonic, Simmtech, Daeduck, ASE Material, Kyocera, Ibiden, Shinko Electric Industries, AT&S, LG InnoTek, Fastprint Circuit Tech, ACCESS, Danbond Technology, TTM Technologies, Unimicron, Nan Ya PCB, Kinsus, SCC

What are the Application segmentation covered in the IC Packaging Substrate (SUB) Market report?

Ans: The Applications covered in the IC Packaging Substrate (SUB) Market report are Smart Phones, PC (Tablet, Laptop), Wearable Devices, Others

What are the Type segmentation covered in the IC Packaging Substrate (SUB) Market report?

Ans: The Types covered in the IC Packaging Substrate (SUB) Market report are Organic Substrate, Inorganic Substrate, Composite Substrate

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Market trends :

Topic Trends
Global the ic packaging substrate market is experiencing moderated growth due to inflationary pressures and weakened consumer demand, with ongoing innovation in substrate materials and increased focus on advanced packaging for mobile and computing devices.
Region North America - north america has shown robust double-digit growth in ic packaging substrate sales, driven by strong demand in the semiconductor sector.
EMEA - emea continues to see healthy year-on-year growth in ic packaging substrate consumption, supported by expanding electronics manufacturing and innovation.
APAC - the asia pacific region, despite being the largest market, experienced a slight decline in ic packaging substrate sales due to softened demand in consumer electronics.
1 IC Packaging Substrate (SUB) Market Overview
1.1 Product Definition
1.2 IC Packaging Substrate (SUB) by Type
1.2.1 Global IC Packaging Substrate (SUB) Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Organic Substrate
1.2.3 Inorganic Substrate
1.2.4 Composite Substrate
1.3 IC Packaging Substrate (SUB) by Application
1.3.1 Global IC Packaging Substrate (SUB) Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phones
1.3.3 PC (Tablet, Laptop)
1.3.4 Wearable Devices
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global IC Packaging Substrate (SUB) Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global IC Packaging Substrate (SUB) Production Estimates and Forecasts (2020-2031)
1.4.4 Global IC Packaging Substrate (SUB) Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global IC Packaging Substrate (SUB) Production Market Share by Manufacturers (2020-2025)
2.2 Global IC Packaging Substrate (SUB) Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of IC Packaging Substrate (SUB), Industry Ranking, 2023 VS 2024
2.4 Global IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global IC Packaging Substrate (SUB) Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of IC Packaging Substrate (SUB), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of IC Packaging Substrate (SUB), Product Offered and Application
2.8 Global Key Manufacturers of IC Packaging Substrate (SUB), Date of Enter into This Industry
2.9 IC Packaging Substrate (SUB) Market Competitive Situation and Trends
2.9.1 IC Packaging Substrate (SUB) Market Concentration Rate
2.9.2 Global 5 and 10 Largest IC Packaging Substrate (SUB) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 IC Packaging Substrate (SUB) Production by Region
3.1 Global IC Packaging Substrate (SUB) Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global IC Packaging Substrate (SUB) Production Value by Region (2020-2031)
3.2.1 Global IC Packaging Substrate (SUB) Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of IC Packaging Substrate (SUB) by Region (2026-2031)
3.3 Global IC Packaging Substrate (SUB) Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global IC Packaging Substrate (SUB) Production Volume by Region (2020-2031)
3.4.1 Global IC Packaging Substrate (SUB) Production by Region (2020-2025)
3.4.2 Global Forecasted Production of IC Packaging Substrate (SUB) by Region (2026-2031)
3.5 Global IC Packaging Substrate (SUB) Market Price Analysis by Region (2020-2025)
3.6 Global IC Packaging Substrate (SUB) Production and Value, Year-over-Year Growth
3.6.1 North America IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2020-2031)
3.6.3 China IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea IC Packaging Substrate (SUB) Production Value Estimates and Forecasts (2020-2031)
4 IC Packaging Substrate (SUB) Consumption by Region
4.1 Global IC Packaging Substrate (SUB) Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global IC Packaging Substrate (SUB) Consumption by Region (2020-2031)
4.2.1 Global IC Packaging Substrate (SUB) Consumption by Region (2020-2025)
4.2.2 Global IC Packaging Substrate (SUB) Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America IC Packaging Substrate (SUB) Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe IC Packaging Substrate (SUB) Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global IC Packaging Substrate (SUB) Production by Type (2020-2031)
5.1.1 Global IC Packaging Substrate (SUB) Production by Type (2020-2025)
5.1.2 Global IC Packaging Substrate (SUB) Production by Type (2026-2031)
5.1.3 Global IC Packaging Substrate (SUB) Production Market Share by Type (2020-2031)
5.2 Global IC Packaging Substrate (SUB) Production Value by Type (2020-2031)
5.2.1 Global IC Packaging Substrate (SUB) Production Value by Type (2020-2025)
5.2.2 Global IC Packaging Substrate (SUB) Production Value by Type (2026-2031)
5.2.3 Global IC Packaging Substrate (SUB) Production Value Market Share by Type (2020-2031)
5.3 Global IC Packaging Substrate (SUB) Price by Type (2020-2031)
6 Segment by Application
6.1 Global IC Packaging Substrate (SUB) Production by Application (2020-2031)
6.1.1 Global IC Packaging Substrate (SUB) Production by Application (2020-2025)
6.1.2 Global IC Packaging Substrate (SUB) Production by Application (2026-2031)
6.1.3 Global IC Packaging Substrate (SUB) Production Market Share by Application (2020-2031)
6.2 Global IC Packaging Substrate (SUB) Production Value by Application (2020-2031)
6.2.1 Global IC Packaging Substrate (SUB) Production Value by Application (2020-2025)
6.2.2 Global IC Packaging Substrate (SUB) Production Value by Application (2026-2031)
6.2.3 Global IC Packaging Substrate (SUB) Production Value Market Share by Application (2020-2031)
6.3 Global IC Packaging Substrate (SUB) Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Samsung Electro-Mechanics
7.1.1 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Company Information
7.1.2 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Product Portfolio
7.1.3 Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Samsung Electro-Mechanics Main Business and Markets Served
7.1.5 Samsung Electro-Mechanics Recent Developments/Updates
7.2 MST
7.2.1 MST IC Packaging Substrate (SUB) Company Information
7.2.2 MST IC Packaging Substrate (SUB) Product Portfolio
7.2.3 MST IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.2.4 MST Main Business and Markets Served
7.2.5 MST Recent Developments/Updates
7.3 NGK
7.3.1 NGK IC Packaging Substrate (SUB) Company Information
7.3.2 NGK IC Packaging Substrate (SUB) Product Portfolio
7.3.3 NGK IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.3.4 NGK Main Business and Markets Served
7.3.5 NGK Recent Developments/Updates
7.4 KLA Corporation
7.4.1 KLA Corporation IC Packaging Substrate (SUB) Company Information
7.4.2 KLA Corporation IC Packaging Substrate (SUB) Product Portfolio
7.4.3 KLA Corporation IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.4.4 KLA Corporation Main Business and Markets Served
7.4.5 KLA Corporation Recent Developments/Updates
7.5 Panasonic
7.5.1 Panasonic IC Packaging Substrate (SUB) Company Information
7.5.2 Panasonic IC Packaging Substrate (SUB) Product Portfolio
7.5.3 Panasonic IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Panasonic Main Business and Markets Served
7.5.5 Panasonic Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech IC Packaging Substrate (SUB) Company Information
7.6.2 Simmtech IC Packaging Substrate (SUB) Product Portfolio
7.6.3 Simmtech IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Daeduck
7.7.1 Daeduck IC Packaging Substrate (SUB) Company Information
7.7.2 Daeduck IC Packaging Substrate (SUB) Product Portfolio
7.7.3 Daeduck IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Daeduck Main Business and Markets Served
7.7.5 Daeduck Recent Developments/Updates
7.8 ASE Material
7.8.1 ASE Material IC Packaging Substrate (SUB) Company Information
7.8.2 ASE Material IC Packaging Substrate (SUB) Product Portfolio
7.8.3 ASE Material IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.8.4 ASE Material Main Business and Markets Served
7.8.5 ASE Material Recent Developments/Updates
7.9 Kyocera
7.9.1 Kyocera IC Packaging Substrate (SUB) Company Information
7.9.2 Kyocera IC Packaging Substrate (SUB) Product Portfolio
7.9.3 Kyocera IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Kyocera Main Business and Markets Served
7.9.5 Kyocera Recent Developments/Updates
7.10 Ibiden
7.10.1 Ibiden IC Packaging Substrate (SUB) Company Information
7.10.2 Ibiden IC Packaging Substrate (SUB) Product Portfolio
7.10.3 Ibiden IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Ibiden Main Business and Markets Served
7.10.5 Ibiden Recent Developments/Updates
7.11 Shinko Electric Industries
7.11.1 Shinko Electric Industries IC Packaging Substrate (SUB) Company Information
7.11.2 Shinko Electric Industries IC Packaging Substrate (SUB) Product Portfolio
7.11.3 Shinko Electric Industries IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Shinko Electric Industries Main Business and Markets Served
7.11.5 Shinko Electric Industries Recent Developments/Updates
7.12 AT&S
7.12.1 AT&S IC Packaging Substrate (SUB) Company Information
7.12.2 AT&S IC Packaging Substrate (SUB) Product Portfolio
7.12.3 AT&S IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.12.4 AT&S Main Business and Markets Served
7.12.5 AT&S Recent Developments/Updates
7.13 LG InnoTek
7.13.1 LG InnoTek IC Packaging Substrate (SUB) Company Information
7.13.2 LG InnoTek IC Packaging Substrate (SUB) Product Portfolio
7.13.3 LG InnoTek IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.13.4 LG InnoTek Main Business and Markets Served
7.13.5 LG InnoTek Recent Developments/Updates
7.14 Fastprint Circuit Tech
7.14.1 Fastprint Circuit Tech IC Packaging Substrate (SUB) Company Information
7.14.2 Fastprint Circuit Tech IC Packaging Substrate (SUB) Product Portfolio
7.14.3 Fastprint Circuit Tech IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Fastprint Circuit Tech Main Business and Markets Served
7.14.5 Fastprint Circuit Tech Recent Developments/Updates
7.15 ACCESS
7.15.1 ACCESS IC Packaging Substrate (SUB) Company Information
7.15.2 ACCESS IC Packaging Substrate (SUB) Product Portfolio
7.15.3 ACCESS IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.15.4 ACCESS Main Business and Markets Served
7.15.5 ACCESS Recent Developments/Updates
7.16 Danbond Technology
7.16.1 Danbond Technology IC Packaging Substrate (SUB) Company Information
7.16.2 Danbond Technology IC Packaging Substrate (SUB) Product Portfolio
7.16.3 Danbond Technology IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Danbond Technology Main Business and Markets Served
7.16.5 Danbond Technology Recent Developments/Updates
7.17 TTM Technologies
7.17.1 TTM Technologies IC Packaging Substrate (SUB) Company Information
7.17.2 TTM Technologies IC Packaging Substrate (SUB) Product Portfolio
7.17.3 TTM Technologies IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.17.4 TTM Technologies Main Business and Markets Served
7.17.5 TTM Technologies Recent Developments/Updates
7.18 Unimicron
7.18.1 Unimicron IC Packaging Substrate (SUB) Company Information
7.18.2 Unimicron IC Packaging Substrate (SUB) Product Portfolio
7.18.3 Unimicron IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.18.4 Unimicron Main Business and Markets Served
7.18.5 Unimicron Recent Developments/Updates
7.19 Nan Ya PCB
7.19.1 Nan Ya PCB IC Packaging Substrate (SUB) Company Information
7.19.2 Nan Ya PCB IC Packaging Substrate (SUB) Product Portfolio
7.19.3 Nan Ya PCB IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.19.4 Nan Ya PCB Main Business and Markets Served
7.19.5 Nan Ya PCB Recent Developments/Updates
7.20 Kinsus
7.20.1 Kinsus IC Packaging Substrate (SUB) Company Information
7.20.2 Kinsus IC Packaging Substrate (SUB) Product Portfolio
7.20.3 Kinsus IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.20.4 Kinsus Main Business and Markets Served
7.20.5 Kinsus Recent Developments/Updates
7.21 SCC
7.21.1 SCC IC Packaging Substrate (SUB) Company Information
7.21.2 SCC IC Packaging Substrate (SUB) Product Portfolio
7.21.3 SCC IC Packaging Substrate (SUB) Production, Value, Price and Gross Margin (2020-2025)
7.21.4 SCC Main Business and Markets Served
7.21.5 SCC Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 IC Packaging Substrate (SUB) Industry Chain Analysis
8.2 IC Packaging Substrate (SUB) Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 IC Packaging Substrate (SUB) Production Mode & Process Analysis
8.4 IC Packaging Substrate (SUB) Sales and Marketing
8.4.1 IC Packaging Substrate (SUB) Sales Channels
8.4.2 IC Packaging Substrate (SUB) Distributors
8.5 IC Packaging Substrate (SUB) Customer Analysis
9 IC Packaging Substrate (SUB) Market Dynamics
9.1 IC Packaging Substrate (SUB) Industry Trends
9.2 IC Packaging Substrate (SUB) Market Drivers
9.3 IC Packaging Substrate (SUB) Market Challenges
9.4 IC Packaging Substrate (SUB) Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
FEATURED COMPANIES
Samsung Electro-Mechanics
MST
NGK
KLA Corporation
Panasonic
Simmtech
Daeduck
ASE Material
Kyocera
IBIDEN
Shinko Electric Industries
AT&S
LG Innotek
ACCESS
Danbond Technology
TTM Technologies
Unimicron
Nan Ya PCB
KINSUS
SCC
Fastprint Circuit Tech
List of Tables
 Table 1. Global IC Packaging Substrate (SUB) Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global IC Packaging Substrate (SUB) Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global IC Packaging Substrate (SUB) Production Capacity (M Pcs) by Manufacturers in 2024
 Table 4. Global IC Packaging Substrate (SUB) Production by Manufacturers (2020-2025) & (M Pcs)
 Table 5. Global IC Packaging Substrate (SUB) Production Market Share by Manufacturers (2020-2025)
 Table 6. Global IC Packaging Substrate (SUB) Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global IC Packaging Substrate (SUB) Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of IC Packaging Substrate (SUB), Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in IC Packaging Substrate (SUB) as of 2024)
 Table 10. Global Market IC Packaging Substrate (SUB) Average Price by Manufacturers (US$/Pc) & (2020-2025)
 Table 11. Global Key Manufacturers of IC Packaging Substrate (SUB), Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of IC Packaging Substrate (SUB), Product Offered and Application
 Table 13. Global Key Manufacturers of IC Packaging Substrate (SUB), Date of Enter into This Industry
 Table 14. Global IC Packaging Substrate (SUB) Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global IC Packaging Substrate (SUB) Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global IC Packaging Substrate (SUB) Production Value Market Share by Region (2020-2025)
 Table 19. Global IC Packaging Substrate (SUB) Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global IC Packaging Substrate (SUB) Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global IC Packaging Substrate (SUB) Production Comparison by Region: 2020 VS 2024 VS 2031 (M Pcs)
 Table 22. Global IC Packaging Substrate (SUB) Production (M Pcs) by Region (2020-2025)
 Table 23. Global IC Packaging Substrate (SUB) Production Market Share by Region (2020-2025)
 Table 24. Global IC Packaging Substrate (SUB) Production (M Pcs) Forecast by Region (2026-2031)
 Table 25. Global IC Packaging Substrate (SUB) Production Market Share Forecast by Region (2026-2031)
 Table 26. Global IC Packaging Substrate (SUB) Market Average Price (US$/Pc) by Region (2020-2025)
 Table 27. Global IC Packaging Substrate (SUB) Market Average Price (US$/Pc) by Region (2026-2031)
 Table 28. Global IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (M Pcs)
 Table 29. Global IC Packaging Substrate (SUB) Consumption by Region (2020-2025) & (M Pcs)
 Table 30. Global IC Packaging Substrate (SUB) Consumption Market Share by Region (2020-2025)
 Table 31. Global IC Packaging Substrate (SUB) Forecasted Consumption by Region (2026-2031) & (M Pcs)
 Table 32. Global IC Packaging Substrate (SUB) Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (M Pcs)
 Table 34. North America IC Packaging Substrate (SUB) Consumption by Country (2020-2025) & (M Pcs)
 Table 35. North America IC Packaging Substrate (SUB) Consumption by Country (2026-2031) & (M Pcs)
 Table 36. Europe IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (M Pcs)
 Table 37. Europe IC Packaging Substrate (SUB) Consumption by Country (2020-2025) & (M Pcs)
 Table 38. Europe IC Packaging Substrate (SUB) Consumption by Country (2026-2031) & (M Pcs)
 Table 39. Asia Pacific IC Packaging Substrate (SUB) Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (M Pcs)
 Table 40. Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2020-2025) & (M Pcs)
 Table 41. Asia Pacific IC Packaging Substrate (SUB) Consumption by Region (2026-2031) & (M Pcs)
 Table 42. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (M Pcs)
 Table 43. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2020-2025) & (M Pcs)
 Table 44. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption by Country (2026-2031) & (M Pcs)
 Table 45. Global IC Packaging Substrate (SUB) Production (M Pcs) by Type (2020-2025)
 Table 46. Global IC Packaging Substrate (SUB) Production (M Pcs) by Type (2026-2031)
 Table 47. Global IC Packaging Substrate (SUB) Production Market Share by Type (2020-2025)
 Table 48. Global IC Packaging Substrate (SUB) Production Market Share by Type (2026-2031)
 Table 49. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global IC Packaging Substrate (SUB) Production Value Market Share by Type (2020-2025)
 Table 52. Global IC Packaging Substrate (SUB) Production Value Market Share by Type (2026-2031)
 Table 53. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2020-2025)
 Table 54. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2026-2031)
 Table 55. Global IC Packaging Substrate (SUB) Production (M Pcs) by Application (2020-2025)
 Table 56. Global IC Packaging Substrate (SUB) Production (M Pcs) by Application (2026-2031)
 Table 57. Global IC Packaging Substrate (SUB) Production Market Share by Application (2020-2025)
 Table 58. Global IC Packaging Substrate (SUB) Production Market Share by Application (2026-2031)
 Table 59. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global IC Packaging Substrate (SUB) Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global IC Packaging Substrate (SUB) Production Value Market Share by Application (2020-2025)
 Table 62. Global IC Packaging Substrate (SUB) Production Value Market Share by Application (2026-2031)
 Table 63. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2020-2025)
 Table 64. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2026-2031)
 Table 65. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Company Information
 Table 66. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Specification and Application
 Table 67. Samsung Electro-Mechanics IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 68. Samsung Electro-Mechanics Main Business and Markets Served
 Table 69. Samsung Electro-Mechanics Recent Developments/Updates
 Table 70. MST IC Packaging Substrate (SUB) Company Information
 Table 71. MST IC Packaging Substrate (SUB) Specification and Application
 Table 72. MST IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 73. MST Main Business and Markets Served
 Table 74. MST Recent Developments/Updates
 Table 75. NGK IC Packaging Substrate (SUB) Company Information
 Table 76. NGK IC Packaging Substrate (SUB) Specification and Application
 Table 77. NGK IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 78. NGK Main Business and Markets Served
 Table 79. NGK Recent Developments/Updates
 Table 80. KLA Corporation IC Packaging Substrate (SUB) Company Information
 Table 81. KLA Corporation IC Packaging Substrate (SUB) Specification and Application
 Table 82. KLA Corporation IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 83. KLA Corporation Main Business and Markets Served
 Table 84. KLA Corporation Recent Developments/Updates
 Table 85. Panasonic IC Packaging Substrate (SUB) Company Information
 Table 86. Panasonic IC Packaging Substrate (SUB) Specification and Application
 Table 87. Panasonic IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 88. Panasonic Main Business and Markets Served
 Table 89. Panasonic Recent Developments/Updates
 Table 90. Simmtech IC Packaging Substrate (SUB) Company Information
 Table 91. Simmtech IC Packaging Substrate (SUB) Specification and Application
 Table 92. Simmtech IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 93. Simmtech Main Business and Markets Served
 Table 94. Simmtech Recent Developments/Updates
 Table 95. Daeduck IC Packaging Substrate (SUB) Company Information
 Table 96. Daeduck IC Packaging Substrate (SUB) Specification and Application
 Table 97. Daeduck IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 98. Daeduck Main Business and Markets Served
 Table 99. Daeduck Recent Developments/Updates
 Table 100. ASE Material IC Packaging Substrate (SUB) Company Information
 Table 101. ASE Material IC Packaging Substrate (SUB) Specification and Application
 Table 102. ASE Material IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 103. ASE Material Main Business and Markets Served
 Table 104. ASE Material Recent Developments/Updates
 Table 105. Kyocera IC Packaging Substrate (SUB) Company Information
 Table 106. Kyocera IC Packaging Substrate (SUB) Specification and Application
 Table 107. Kyocera IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 108. Kyocera Main Business and Markets Served
 Table 109. Kyocera Recent Developments/Updates
 Table 110. Ibiden IC Packaging Substrate (SUB) Company Information
 Table 111. Ibiden IC Packaging Substrate (SUB) Specification and Application
 Table 112. Ibiden IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 113. Ibiden Main Business and Markets Served
 Table 114. Ibiden Recent Developments/Updates
 Table 115. Shinko Electric Industries IC Packaging Substrate (SUB) Company Information
 Table 116. Shinko Electric Industries IC Packaging Substrate (SUB) Specification and Application
 Table 117. Shinko Electric Industries IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 118. Shinko Electric Industries Main Business and Markets Served
 Table 119. Shinko Electric Industries Recent Developments/Updates
 Table 120. AT&S IC Packaging Substrate (SUB) Company Information
 Table 121. AT&S IC Packaging Substrate (SUB) Specification and Application
 Table 122. AT&S IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 123. AT&S Main Business and Markets Served
 Table 124. AT&S Recent Developments/Updates
 Table 125. LG InnoTek IC Packaging Substrate (SUB) Company Information
 Table 126. LG InnoTek IC Packaging Substrate (SUB) Specification and Application
 Table 127. LG InnoTek IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 128. LG InnoTek Main Business and Markets Served
 Table 129. LG InnoTek Recent Developments/Updates
 Table 130. Fastprint Circuit Tech IC Packaging Substrate (SUB) Company Information
 Table 131. Fastprint Circuit Tech IC Packaging Substrate (SUB) Specification and Application
 Table 132. Fastprint Circuit Tech IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 133. Fastprint Circuit Tech Main Business and Markets Served
 Table 134. Fastprint Circuit Tech Recent Developments/Updates
 Table 135. ACCESS IC Packaging Substrate (SUB) Company Information
 Table 136. ACCESS IC Packaging Substrate (SUB) Specification and Application
 Table 137. ACCESS IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 138. ACCESS Main Business and Markets Served
 Table 139. ACCESS Recent Developments/Updates
 Table 140. Danbond Technology IC Packaging Substrate (SUB) Company Information
 Table 141. Danbond Technology IC Packaging Substrate (SUB) Specification and Application
 Table 142. Danbond Technology IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 143. Danbond Technology Main Business and Markets Served
 Table 144. Danbond Technology Recent Developments/Updates
 Table 145. TTM Technologies IC Packaging Substrate (SUB) Company Information
 Table 146. TTM Technologies IC Packaging Substrate (SUB) Specification and Application
 Table 147. TTM Technologies IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 148. TTM Technologies Main Business and Markets Served
 Table 149. TTM Technologies Recent Developments/Updates
 Table 150. Unimicron IC Packaging Substrate (SUB) Company Information
 Table 151. Unimicron IC Packaging Substrate (SUB) Specification and Application
 Table 152. Unimicron IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 153. Unimicron Main Business and Markets Served
 Table 154. Unimicron Recent Developments/Updates
 Table 155. Nan Ya PCB IC Packaging Substrate (SUB) Company Information
 Table 156. Nan Ya PCB IC Packaging Substrate (SUB) Specification and Application
 Table 157. Nan Ya PCB IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 158. Nan Ya PCB Main Business and Markets Served
 Table 159. Nan Ya PCB Recent Developments/Updates
 Table 160. Kinsus IC Packaging Substrate (SUB) Company Information
 Table 161. Kinsus IC Packaging Substrate (SUB) Specification and Application
 Table 162. Kinsus IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 163. Kinsus Main Business and Markets Served
 Table 164. Kinsus Recent Developments/Updates
 Table 165. SCC IC Packaging Substrate (SUB) Company Information
 Table 166. SCC IC Packaging Substrate (SUB) Specification and Application
 Table 167. SCC IC Packaging Substrate (SUB) Production (M Pcs), Value (US$ Million), Price (US$/Pc) and Gross Margin (2020-2025)
 Table 168. SCC Main Business and Markets Served
 Table 169. SCC Recent Developments/Updates
 Table 170. Key Raw Materials Lists
 Table 171. Raw Materials Key Suppliers Lists
 Table 172. IC Packaging Substrate (SUB) Distributors List
 Table 173. IC Packaging Substrate (SUB) Customers List
 Table 174. IC Packaging Substrate (SUB) Market Trends
 Table 175. IC Packaging Substrate (SUB) Market Drivers
 Table 176. IC Packaging Substrate (SUB) Market Challenges
 Table 177. IC Packaging Substrate (SUB) Market Restraints
 Table 178. Research Programs/Design for This Report
 Table 179. Key Data Information from Secondary Sources
 Table 180. Key Data Information from Primary Sources
 Table 181. Authors List of This Report


List of Figures
 Figure 1. Product Picture of IC Packaging Substrate (SUB)
 Figure 2. Global IC Packaging Substrate (SUB) Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global IC Packaging Substrate (SUB) Market Share by Type: 2024 VS 2031
 Figure 4. Organic Substrate Product Picture
 Figure 5. Inorganic Substrate Product Picture
 Figure 6. Composite Substrate Product Picture
 Figure 7. Global IC Packaging Substrate (SUB) Market Value by Application, (US$ Million) & (2020-2031)
 Figure 8. Global IC Packaging Substrate (SUB) Market Share by Application: 2024 VS 2031
 Figure 9. Smart Phones
 Figure 10. PC (Tablet, Laptop)
 Figure 11. Wearable Devices
 Figure 12. Others
 Figure 13. Global IC Packaging Substrate (SUB) Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 14. Global IC Packaging Substrate (SUB) Production Value (US$ Million) & (2020-2031)
 Figure 15. Global IC Packaging Substrate (SUB) Production Capacity (M Pcs) & (2020-2031)
 Figure 16. Global IC Packaging Substrate (SUB) Production (M Pcs) & (2020-2031)
 Figure 17. Global IC Packaging Substrate (SUB) Average Price (US$/Pc) & (2020-2031)
 Figure 18. IC Packaging Substrate (SUB) Report Years Considered
 Figure 19. IC Packaging Substrate (SUB) Production Share by Manufacturers in 2024
 Figure 20. Global IC Packaging Substrate (SUB) Production Value Share by Manufacturers (2024)
 Figure 21. IC Packaging Substrate (SUB) Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 22. The Global 5 and 10 Largest Players: Market Share by IC Packaging Substrate (SUB) Revenue in 2024
 Figure 23. Global IC Packaging Substrate (SUB) Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 24. Global IC Packaging Substrate (SUB) Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 25. Global IC Packaging Substrate (SUB) Production Comparison by Region: 2020 VS 2024 VS 2031 (M Pcs)
 Figure 26. Global IC Packaging Substrate (SUB) Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 27. North America IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 28. Europe IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. China IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. Japan IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. South Korea IC Packaging Substrate (SUB) Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. Global IC Packaging Substrate (SUB) Consumption by Region: 2020 VS 2024 VS 2031 (M Pcs)
 Figure 33. Global IC Packaging Substrate (SUB) Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 34. North America IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 35. North America IC Packaging Substrate (SUB) Consumption Market Share by Country (2020-2031)
 Figure 36. U.S. IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 37. Canada IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 38. Europe IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 39. Europe IC Packaging Substrate (SUB) Consumption Market Share by Country (2020-2031)
 Figure 40. Germany IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 41. France IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 42. U.K. IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 43. Italy IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 44. Netherlands IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 45. Asia Pacific IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 46. Asia Pacific IC Packaging Substrate (SUB) Consumption Market Share by Region (2020-2031)
 Figure 47. China IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 48. Japan IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 49. South Korea IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 50. China Taiwan IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 51. Southeast Asia IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 52. India IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 53. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 54. Latin America, Middle East & Africa IC Packaging Substrate (SUB) Consumption Market Share by Country (2020-2031)
 Figure 55. Mexico IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 56. Brazil IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 57. Israel IC Packaging Substrate (SUB) Consumption and Growth Rate (2020-2031) & (M Pcs)
 Figure 58. Global Production Market Share of IC Packaging Substrate (SUB) by Type (2020-2031)
 Figure 59. Global Production Value Market Share of IC Packaging Substrate (SUB) by Type (2020-2031)
 Figure 60. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Type (2020-2031)
 Figure 61. Global Production Market Share of IC Packaging Substrate (SUB) by Application (2020-2031)
 Figure 62. Global Production Value Market Share of IC Packaging Substrate (SUB) by Application (2020-2031)
 Figure 63. Global IC Packaging Substrate (SUB) Price (US$/Pc) by Application (2020-2031)
 Figure 64. IC Packaging Substrate (SUB) Value Chain
 Figure 65. Channels of Distribution (Direct Vs Distribution)
 Figure 66. Bottom-up and Top-down Approaches for This Report
 Figure 67. Data Triangulation
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