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Global Rigid IC Package Substrates Market Research Report 2025
Published Date: May 2025
|
Report Code: QYRE-Auto-24J14519
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Global Rigid IC Package Substrates Market Research Report 2023
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Global Rigid IC Package Substrates Market Research Report 2025

Code: QYRE-Auto-24J14519
Report
May 2025
Pages:98
QYResearch
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DESCRIPTION
TABLE OF CONTENT
TABLES & FIGURES

Rigid IC Package Substrates Market

The global market for Rigid IC Package Substrates was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
North American market for Rigid IC Package Substrates is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Rigid IC Package Substrates is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Rigid IC Package Substrates include Unimicron, Ibiden, Semco, Nan Ya PCB Corporation, Shinko, Simmtech, Kinsus, Daeduck, LG Innotek, Kyocera, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Rigid IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Rigid IC Package Substrates.
The Rigid IC Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Rigid IC Package Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Rigid IC Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation

Scope of Rigid IC Package Substrates Market Report

Report Metric Details
Report Name Rigid IC Package Substrates Market
by Type
  • WB CSP
  • FC BGA
  • FC CSP
  • Others
by Application
  • Smart Phone
  • PC
  • Wearable Device
  • Others
Production by Region
  • North America
  • Europe
  • China
  • Japan
  • South Korea
Consumption by Region
  • North America (United States, Canada)
  • Europe (Germany, France, UK, Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, Taiwan)
  • Southeast Asia (India)
  • Latin America (Mexico, Brazil)
By Company Unimicron, Ibiden, Semco, Nan Ya PCB Corporation, Shinko, Simmtech, Kinsus, Daeduck, LG Innotek, Kyocera, ASE Material, Shennan Circuit, AT&S, Korea Circuit
Forecast units USD million in value
Report coverage Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

  • Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
  • Chapter 2: Detailed analysis of Rigid IC Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
  • Chapter 3: Production/output, value of Rigid IC Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
  • Chapter 4: Consumption of Rigid IC Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
  • Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
  • Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
  • Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
  • Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
  • Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
  • Chapter 10: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the Rigid IC Package Substrates Market report?

Ans: The main players in the Rigid IC Package Substrates Market are Unimicron, Ibiden, Semco, Nan Ya PCB Corporation, Shinko, Simmtech, Kinsus, Daeduck, LG Innotek, Kyocera, ASE Material, Shennan Circuit, AT&S, Korea Circuit

What are the Application segmentation covered in the Rigid IC Package Substrates Market report?

Ans: The Applications covered in the Rigid IC Package Substrates Market report are Smart Phone, PC, Wearable Device, Others

What are the Type segmentation covered in the Rigid IC Package Substrates Market report?

Ans: The Types covered in the Rigid IC Package Substrates Market report are WB CSP, FC BGA, FC CSP, Others

1 Rigid IC Package Substrates Market Overview
1.1 Product Definition
1.2 Rigid IC Package Substrates by Type
1.2.1 Global Rigid IC Package Substrates Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 WB CSP
1.2.3 FC BGA
1.2.4 FC CSP
1.2.5 Others
1.3 Rigid IC Package Substrates by Application
1.3.1 Global Rigid IC Package Substrates Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phone
1.3.3 PC
1.3.4 Wearable Device
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Rigid IC Package Substrates Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Rigid IC Package Substrates Production Estimates and Forecasts (2020-2031)
1.4.4 Global Rigid IC Package Substrates Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Rigid IC Package Substrates Production Market Share by Manufacturers (2020-2025)
2.2 Global Rigid IC Package Substrates Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of Rigid IC Package Substrates, Industry Ranking, 2023 VS 2024
2.4 Global Rigid IC Package Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Rigid IC Package Substrates Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Rigid IC Package Substrates, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Rigid IC Package Substrates, Product Offered and Application
2.8 Global Key Manufacturers of Rigid IC Package Substrates, Date of Enter into This Industry
2.9 Rigid IC Package Substrates Market Competitive Situation and Trends
2.9.1 Rigid IC Package Substrates Market Concentration Rate
2.9.2 Global 5 and 10 Largest Rigid IC Package Substrates Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Rigid IC Package Substrates Production by Region
3.1 Global Rigid IC Package Substrates Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Rigid IC Package Substrates Production Value by Region (2020-2031)
3.2.1 Global Rigid IC Package Substrates Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Rigid IC Package Substrates by Region (2026-2031)
3.3 Global Rigid IC Package Substrates Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Rigid IC Package Substrates Production Volume by Region (2020-2031)
3.4.1 Global Rigid IC Package Substrates Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Rigid IC Package Substrates by Region (2026-2031)
3.5 Global Rigid IC Package Substrates Market Price Analysis by Region (2020-2025)
3.6 Global Rigid IC Package Substrates Production and Value, Year-over-Year Growth
3.6.1 North America Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Rigid IC Package Substrates Production Value Estimates and Forecasts (2020-2031)
4 Rigid IC Package Substrates Consumption by Region
4.1 Global Rigid IC Package Substrates Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Rigid IC Package Substrates Consumption by Region (2020-2031)
4.2.1 Global Rigid IC Package Substrates Consumption by Region (2020-2025)
4.2.2 Global Rigid IC Package Substrates Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Rigid IC Package Substrates Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Rigid IC Package Substrates Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Rigid IC Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Rigid IC Package Substrates Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Rigid IC Package Substrates Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Rigid IC Package Substrates Production by Type (2020-2031)
5.1.1 Global Rigid IC Package Substrates Production by Type (2020-2025)
5.1.2 Global Rigid IC Package Substrates Production by Type (2026-2031)
5.1.3 Global Rigid IC Package Substrates Production Market Share by Type (2020-2031)
5.2 Global Rigid IC Package Substrates Production Value by Type (2020-2031)
5.2.1 Global Rigid IC Package Substrates Production Value by Type (2020-2025)
5.2.2 Global Rigid IC Package Substrates Production Value by Type (2026-2031)
5.2.3 Global Rigid IC Package Substrates Production Value Market Share by Type (2020-2031)
5.3 Global Rigid IC Package Substrates Price by Type (2020-2031)
6 Segment by Application
6.1 Global Rigid IC Package Substrates Production by Application (2020-2031)
6.1.1 Global Rigid IC Package Substrates Production by Application (2020-2025)
6.1.2 Global Rigid IC Package Substrates Production by Application (2026-2031)
6.1.3 Global Rigid IC Package Substrates Production Market Share by Application (2020-2031)
6.2 Global Rigid IC Package Substrates Production Value by Application (2020-2031)
6.2.1 Global Rigid IC Package Substrates Production Value by Application (2020-2025)
6.2.2 Global Rigid IC Package Substrates Production Value by Application (2026-2031)
6.2.3 Global Rigid IC Package Substrates Production Value Market Share by Application (2020-2031)
6.3 Global Rigid IC Package Substrates Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Unimicron
7.1.1 Unimicron Rigid IC Package Substrates Company Information
7.1.2 Unimicron Rigid IC Package Substrates Product Portfolio
7.1.3 Unimicron Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Unimicron Main Business and Markets Served
7.1.5 Unimicron Recent Developments/Updates
7.2 Ibiden
7.2.1 Ibiden Rigid IC Package Substrates Company Information
7.2.2 Ibiden Rigid IC Package Substrates Product Portfolio
7.2.3 Ibiden Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Ibiden Main Business and Markets Served
7.2.5 Ibiden Recent Developments/Updates
7.3 Semco
7.3.1 Semco Rigid IC Package Substrates Company Information
7.3.2 Semco Rigid IC Package Substrates Product Portfolio
7.3.3 Semco Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Semco Main Business and Markets Served
7.3.5 Semco Recent Developments/Updates
7.4 Nan Ya PCB Corporation
7.4.1 Nan Ya PCB Corporation Rigid IC Package Substrates Company Information
7.4.2 Nan Ya PCB Corporation Rigid IC Package Substrates Product Portfolio
7.4.3 Nan Ya PCB Corporation Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Nan Ya PCB Corporation Main Business and Markets Served
7.4.5 Nan Ya PCB Corporation Recent Developments/Updates
7.5 Shinko
7.5.1 Shinko Rigid IC Package Substrates Company Information
7.5.2 Shinko Rigid IC Package Substrates Product Portfolio
7.5.3 Shinko Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Shinko Main Business and Markets Served
7.5.5 Shinko Recent Developments/Updates
7.6 Simmtech
7.6.1 Simmtech Rigid IC Package Substrates Company Information
7.6.2 Simmtech Rigid IC Package Substrates Product Portfolio
7.6.3 Simmtech Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Simmtech Main Business and Markets Served
7.6.5 Simmtech Recent Developments/Updates
7.7 Kinsus
7.7.1 Kinsus Rigid IC Package Substrates Company Information
7.7.2 Kinsus Rigid IC Package Substrates Product Portfolio
7.7.3 Kinsus Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Kinsus Main Business and Markets Served
7.7.5 Kinsus Recent Developments/Updates
7.8 Daeduck
7.8.1 Daeduck Rigid IC Package Substrates Company Information
7.8.2 Daeduck Rigid IC Package Substrates Product Portfolio
7.8.3 Daeduck Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Daeduck Main Business and Markets Served
7.8.5 Daeduck Recent Developments/Updates
7.9 LG Innotek
7.9.1 LG Innotek Rigid IC Package Substrates Company Information
7.9.2 LG Innotek Rigid IC Package Substrates Product Portfolio
7.9.3 LG Innotek Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.9.4 LG Innotek Main Business and Markets Served
7.9.5 LG Innotek Recent Developments/Updates
7.10 Kyocera
7.10.1 Kyocera Rigid IC Package Substrates Company Information
7.10.2 Kyocera Rigid IC Package Substrates Product Portfolio
7.10.3 Kyocera Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Kyocera Main Business and Markets Served
7.10.5 Kyocera Recent Developments/Updates
7.11 ASE Material
7.11.1 ASE Material Rigid IC Package Substrates Company Information
7.11.2 ASE Material Rigid IC Package Substrates Product Portfolio
7.11.3 ASE Material Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.11.4 ASE Material Main Business and Markets Served
7.11.5 ASE Material Recent Developments/Updates
7.12 Shennan Circuit
7.12.1 Shennan Circuit Rigid IC Package Substrates Company Information
7.12.2 Shennan Circuit Rigid IC Package Substrates Product Portfolio
7.12.3 Shennan Circuit Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Shennan Circuit Main Business and Markets Served
7.12.5 Shennan Circuit Recent Developments/Updates
7.13 AT&S
7.13.1 AT&S Rigid IC Package Substrates Company Information
7.13.2 AT&S Rigid IC Package Substrates Product Portfolio
7.13.3 AT&S Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.13.4 AT&S Main Business and Markets Served
7.13.5 AT&S Recent Developments/Updates
7.14 Korea Circuit
7.14.1 Korea Circuit Rigid IC Package Substrates Company Information
7.14.2 Korea Circuit Rigid IC Package Substrates Product Portfolio
7.14.3 Korea Circuit Rigid IC Package Substrates Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Korea Circuit Main Business and Markets Served
7.14.5 Korea Circuit Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Rigid IC Package Substrates Industry Chain Analysis
8.2 Rigid IC Package Substrates Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Rigid IC Package Substrates Production Mode & Process Analysis
8.4 Rigid IC Package Substrates Sales and Marketing
8.4.1 Rigid IC Package Substrates Sales Channels
8.4.2 Rigid IC Package Substrates Distributors
8.5 Rigid IC Package Substrates Customer Analysis
9 Rigid IC Package Substrates Market Dynamics
9.1 Rigid IC Package Substrates Industry Trends
9.2 Rigid IC Package Substrates Market Drivers
9.3 Rigid IC Package Substrates Market Challenges
9.4 Rigid IC Package Substrates Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of Tables
 Table 1. Global Rigid IC Package Substrates Market Value by Type, (US$ Million) & (2024 VS 2031)
 Table 2. Global Rigid IC Package Substrates Market Value by Application, (US$ Million) & (2024 VS 2031)
 Table 3. Global Rigid IC Package Substrates Production Capacity (K Units) by Manufacturers in 2024
 Table 4. Global Rigid IC Package Substrates Production by Manufacturers (2020-2025) & (K Units)
 Table 5. Global Rigid IC Package Substrates Production Market Share by Manufacturers (2020-2025)
 Table 6. Global Rigid IC Package Substrates Production Value by Manufacturers (2020-2025) & (US$ Million)
 Table 7. Global Rigid IC Package Substrates Production Value Share by Manufacturers (2020-2025)
 Table 8. Global Key Players of Rigid IC Package Substrates, Industry Ranking, 2023 VS 2024
 Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Rigid IC Package Substrates as of 2024)
 Table 10. Global Market Rigid IC Package Substrates Average Price by Manufacturers (US$/Unit) & (2020-2025)
 Table 11. Global Key Manufacturers of Rigid IC Package Substrates, Manufacturing Base Distribution and Headquarters
 Table 12. Global Key Manufacturers of Rigid IC Package Substrates, Product Offered and Application
 Table 13. Global Key Manufacturers of Rigid IC Package Substrates, Date of Enter into This Industry
 Table 14. Global Rigid IC Package Substrates Manufacturers Market Concentration Ratio (CR5 and HHI)
 Table 15. Mergers & Acquisitions, Expansion Plans
 Table 16. Global Rigid IC Package Substrates Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Table 17. Global Rigid IC Package Substrates Production Value (US$ Million) by Region (2020-2025)
 Table 18. Global Rigid IC Package Substrates Production Value Market Share by Region (2020-2025)
 Table 19. Global Rigid IC Package Substrates Production Value (US$ Million) Forecast by Region (2026-2031)
 Table 20. Global Rigid IC Package Substrates Production Value Market Share Forecast by Region (2026-2031)
 Table 21. Global Rigid IC Package Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 22. Global Rigid IC Package Substrates Production (K Units) by Region (2020-2025)
 Table 23. Global Rigid IC Package Substrates Production Market Share by Region (2020-2025)
 Table 24. Global Rigid IC Package Substrates Production (K Units) Forecast by Region (2026-2031)
 Table 25. Global Rigid IC Package Substrates Production Market Share Forecast by Region (2026-2031)
 Table 26. Global Rigid IC Package Substrates Market Average Price (US$/Unit) by Region (2020-2025)
 Table 27. Global Rigid IC Package Substrates Market Average Price (US$/Unit) by Region (2026-2031)
 Table 28. Global Rigid IC Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 29. Global Rigid IC Package Substrates Consumption by Region (2020-2025) & (K Units)
 Table 30. Global Rigid IC Package Substrates Consumption Market Share by Region (2020-2025)
 Table 31. Global Rigid IC Package Substrates Forecasted Consumption by Region (2026-2031) & (K Units)
 Table 32. Global Rigid IC Package Substrates Forecasted Consumption Market Share by Region (2026-2031)
 Table 33. North America Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 34. North America Rigid IC Package Substrates Consumption by Country (2020-2025) & (K Units)
 Table 35. North America Rigid IC Package Substrates Consumption by Country (2026-2031) & (K Units)
 Table 36. Europe Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 37. Europe Rigid IC Package Substrates Consumption by Country (2020-2025) & (K Units)
 Table 38. Europe Rigid IC Package Substrates Consumption by Country (2026-2031) & (K Units)
 Table 39. Asia Pacific Rigid IC Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Units)
 Table 40. Asia Pacific Rigid IC Package Substrates Consumption by Region (2020-2025) & (K Units)
 Table 41. Asia Pacific Rigid IC Package Substrates Consumption by Region (2026-2031) & (K Units)
 Table 42. Latin America, Middle East & Africa Rigid IC Package Substrates Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Units)
 Table 43. Latin America, Middle East & Africa Rigid IC Package Substrates Consumption by Country (2020-2025) & (K Units)
 Table 44. Latin America, Middle East & Africa Rigid IC Package Substrates Consumption by Country (2026-2031) & (K Units)
 Table 45. Global Rigid IC Package Substrates Production (K Units) by Type (2020-2025)
 Table 46. Global Rigid IC Package Substrates Production (K Units) by Type (2026-2031)
 Table 47. Global Rigid IC Package Substrates Production Market Share by Type (2020-2025)
 Table 48. Global Rigid IC Package Substrates Production Market Share by Type (2026-2031)
 Table 49. Global Rigid IC Package Substrates Production Value (US$ Million) by Type (2020-2025)
 Table 50. Global Rigid IC Package Substrates Production Value (US$ Million) by Type (2026-2031)
 Table 51. Global Rigid IC Package Substrates Production Value Market Share by Type (2020-2025)
 Table 52. Global Rigid IC Package Substrates Production Value Market Share by Type (2026-2031)
 Table 53. Global Rigid IC Package Substrates Price (US$/Unit) by Type (2020-2025)
 Table 54. Global Rigid IC Package Substrates Price (US$/Unit) by Type (2026-2031)
 Table 55. Global Rigid IC Package Substrates Production (K Units) by Application (2020-2025)
 Table 56. Global Rigid IC Package Substrates Production (K Units) by Application (2026-2031)
 Table 57. Global Rigid IC Package Substrates Production Market Share by Application (2020-2025)
 Table 58. Global Rigid IC Package Substrates Production Market Share by Application (2026-2031)
 Table 59. Global Rigid IC Package Substrates Production Value (US$ Million) by Application (2020-2025)
 Table 60. Global Rigid IC Package Substrates Production Value (US$ Million) by Application (2026-2031)
 Table 61. Global Rigid IC Package Substrates Production Value Market Share by Application (2020-2025)
 Table 62. Global Rigid IC Package Substrates Production Value Market Share by Application (2026-2031)
 Table 63. Global Rigid IC Package Substrates Price (US$/Unit) by Application (2020-2025)
 Table 64. Global Rigid IC Package Substrates Price (US$/Unit) by Application (2026-2031)
 Table 65. Unimicron Rigid IC Package Substrates Company Information
 Table 66. Unimicron Rigid IC Package Substrates Specification and Application
 Table 67. Unimicron Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 68. Unimicron Main Business and Markets Served
 Table 69. Unimicron Recent Developments/Updates
 Table 70. Ibiden Rigid IC Package Substrates Company Information
 Table 71. Ibiden Rigid IC Package Substrates Specification and Application
 Table 72. Ibiden Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 73. Ibiden Main Business and Markets Served
 Table 74. Ibiden Recent Developments/Updates
 Table 75. Semco Rigid IC Package Substrates Company Information
 Table 76. Semco Rigid IC Package Substrates Specification and Application
 Table 77. Semco Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 78. Semco Main Business and Markets Served
 Table 79. Semco Recent Developments/Updates
 Table 80. Nan Ya PCB Corporation Rigid IC Package Substrates Company Information
 Table 81. Nan Ya PCB Corporation Rigid IC Package Substrates Specification and Application
 Table 82. Nan Ya PCB Corporation Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 83. Nan Ya PCB Corporation Main Business and Markets Served
 Table 84. Nan Ya PCB Corporation Recent Developments/Updates
 Table 85. Shinko Rigid IC Package Substrates Company Information
 Table 86. Shinko Rigid IC Package Substrates Specification and Application
 Table 87. Shinko Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 88. Shinko Main Business and Markets Served
 Table 89. Shinko Recent Developments/Updates
 Table 90. Simmtech Rigid IC Package Substrates Company Information
 Table 91. Simmtech Rigid IC Package Substrates Specification and Application
 Table 92. Simmtech Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 93. Simmtech Main Business and Markets Served
 Table 94. Simmtech Recent Developments/Updates
 Table 95. Kinsus Rigid IC Package Substrates Company Information
 Table 96. Kinsus Rigid IC Package Substrates Specification and Application
 Table 97. Kinsus Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 98. Kinsus Main Business and Markets Served
 Table 99. Kinsus Recent Developments/Updates
 Table 100. Daeduck Rigid IC Package Substrates Company Information
 Table 101. Daeduck Rigid IC Package Substrates Specification and Application
 Table 102. Daeduck Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 103. Daeduck Main Business and Markets Served
 Table 104. Daeduck Recent Developments/Updates
 Table 105. LG Innotek Rigid IC Package Substrates Company Information
 Table 106. LG Innotek Rigid IC Package Substrates Specification and Application
 Table 107. LG Innotek Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 108. LG Innotek Main Business and Markets Served
 Table 109. LG Innotek Recent Developments/Updates
 Table 110. Kyocera Rigid IC Package Substrates Company Information
 Table 111. Kyocera Rigid IC Package Substrates Specification and Application
 Table 112. Kyocera Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 113. Kyocera Main Business and Markets Served
 Table 114. Kyocera Recent Developments/Updates
 Table 115. ASE Material Rigid IC Package Substrates Company Information
 Table 116. ASE Material Rigid IC Package Substrates Specification and Application
 Table 117. ASE Material Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 118. ASE Material Main Business and Markets Served
 Table 119. ASE Material Recent Developments/Updates
 Table 120. Shennan Circuit Rigid IC Package Substrates Company Information
 Table 121. Shennan Circuit Rigid IC Package Substrates Specification and Application
 Table 122. Shennan Circuit Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 123. Shennan Circuit Main Business and Markets Served
 Table 124. Shennan Circuit Recent Developments/Updates
 Table 125. AT&S Rigid IC Package Substrates Company Information
 Table 126. AT&S Rigid IC Package Substrates Specification and Application
 Table 127. AT&S Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 128. AT&S Main Business and Markets Served
 Table 129. AT&S Recent Developments/Updates
 Table 130. Korea Circuit Rigid IC Package Substrates Company Information
 Table 131. Korea Circuit Rigid IC Package Substrates Specification and Application
 Table 132. Korea Circuit Rigid IC Package Substrates Production (K Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)
 Table 133. Korea Circuit Main Business and Markets Served
 Table 134. Korea Circuit Recent Developments/Updates
 Table 135. Key Raw Materials Lists
 Table 136. Raw Materials Key Suppliers Lists
 Table 137. Rigid IC Package Substrates Distributors List
 Table 138. Rigid IC Package Substrates Customers List
 Table 139. Rigid IC Package Substrates Market Trends
 Table 140. Rigid IC Package Substrates Market Drivers
 Table 141. Rigid IC Package Substrates Market Challenges
 Table 142. Rigid IC Package Substrates Market Restraints
 Table 143. Research Programs/Design for This Report
 Table 144. Key Data Information from Secondary Sources
 Table 145. Key Data Information from Primary Sources
 Table 146. Authors List of This Report


List of Figures
 Figure 1. Product Picture of Rigid IC Package Substrates
 Figure 2. Global Rigid IC Package Substrates Market Value by Type, (US$ Million) & (2020-2031)
 Figure 3. Global Rigid IC Package Substrates Market Share by Type: 2024 VS 2031
 Figure 4. WB CSP Product Picture
 Figure 5. FC BGA Product Picture
 Figure 6. FC CSP Product Picture
 Figure 7. Others Product Picture
 Figure 8. Global Rigid IC Package Substrates Market Value by Application, (US$ Million) & (2020-2031)
 Figure 9. Global Rigid IC Package Substrates Market Share by Application: 2024 VS 2031
 Figure 10. Smart Phone
 Figure 11. PC
 Figure 12. Wearable Device
 Figure 13. Others
 Figure 14. Global Rigid IC Package Substrates Production Value (US$ Million), 2020 VS 2024 VS 2031
 Figure 15. Global Rigid IC Package Substrates Production Value (US$ Million) & (2020-2031)
 Figure 16. Global Rigid IC Package Substrates Production Capacity (K Units) & (2020-2031)
 Figure 17. Global Rigid IC Package Substrates Production (K Units) & (2020-2031)
 Figure 18. Global Rigid IC Package Substrates Average Price (US$/Unit) & (2020-2031)
 Figure 19. Rigid IC Package Substrates Report Years Considered
 Figure 20. Rigid IC Package Substrates Production Share by Manufacturers in 2024
 Figure 21. Global Rigid IC Package Substrates Production Value Share by Manufacturers (2024)
 Figure 22. Rigid IC Package Substrates Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
 Figure 23. The Global 5 and 10 Largest Players: Market Share by Rigid IC Package Substrates Revenue in 2024
 Figure 24. Global Rigid IC Package Substrates Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
 Figure 25. Global Rigid IC Package Substrates Production Value Market Share by Region: 2020 VS 2024 VS 2031
 Figure 26. Global Rigid IC Package Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 27. Global Rigid IC Package Substrates Production Market Share by Region: 2020 VS 2024 VS 2031
 Figure 28. North America Rigid IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 29. Europe Rigid IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 30. China Rigid IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 31. Japan Rigid IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 32. South Korea Rigid IC Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
 Figure 33. Global Rigid IC Package Substrates Consumption by Region: 2020 VS 2024 VS 2031 (K Units)
 Figure 34. Global Rigid IC Package Substrates Consumption Market Share by Region: 2020 VS 2024 VS 2031
 Figure 35. North America Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 36. North America Rigid IC Package Substrates Consumption Market Share by Country (2020-2031)
 Figure 37. U.S. Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 38. Canada Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 39. Europe Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 40. Europe Rigid IC Package Substrates Consumption Market Share by Country (2020-2031)
 Figure 41. Germany Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 42. France Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 43. U.K. Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 44. Italy Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 45. Netherlands Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 46. Asia Pacific Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 47. Asia Pacific Rigid IC Package Substrates Consumption Market Share by Region (2020-2031)
 Figure 48. China Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 49. Japan Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 50. South Korea Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 51. China Taiwan Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 52. Southeast Asia Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 53. India Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 54. Latin America, Middle East & Africa Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 55. Latin America, Middle East & Africa Rigid IC Package Substrates Consumption Market Share by Country (2020-2031)
 Figure 56. Mexico Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 57. Brazil Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 58. Israel Rigid IC Package Substrates Consumption and Growth Rate (2020-2031) & (K Units)
 Figure 59. Global Production Market Share of Rigid IC Package Substrates by Type (2020-2031)
 Figure 60. Global Production Value Market Share of Rigid IC Package Substrates by Type (2020-2031)
 Figure 61. Global Rigid IC Package Substrates Price (US$/Unit) by Type (2020-2031)
 Figure 62. Global Production Market Share of Rigid IC Package Substrates by Application (2020-2031)
 Figure 63. Global Production Value Market Share of Rigid IC Package Substrates by Application (2020-2031)
 Figure 64. Global Rigid IC Package Substrates Price (US$/Unit) by Application (2020-2031)
 Figure 65. Rigid IC Package Substrates Value Chain
 Figure 66. Channels of Distribution (Direct Vs Distribution)
 Figure 67. Bottom-up and Top-down Approaches for This Report
 Figure 68. Data Triangulation
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