The global market for SiC Wafer Thinning Equipment was valued at US$ 114 million in the year 2024 and is projected to reach a revised size of US$ 338 million by 2031, growing at a CAGR of 17.1% during the forecast period.

SiC Wafer Thinning Equipment Market

Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.

This report only studies Silicon Carbide Wafer Thinning Equipment.

The global SiC Wafer Thinning Equipment market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications. The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share. This trend is expected to continue due to the region's strong semiconductor industry, technological advancements, and growing demand for energy-efficient power devices.

The global key manufacturers of SiC Wafer Thinning Equipment include Disco, TSD, etc. In 2023, the global top five players had a share approximately 81% in terms of revenue.

Among different types of SiC wafer thinning equipment, fully automated systems dominate the market, capturing approximately 77% of the total share in 2024. This reflects the industry's growing demand for precision, scalability, and high-efficiency production processes. Fully automated equipment provides improved throughput and minimizes the risk of human error, making it the preferred choice for manufacturers aiming to scale their operations and ensure high-quality output.

Interms of applications, wafers sized 6 inches and below are the primary demand drivers. These smaller wafers make up approximately 70% of the market in 2024. The widespread use of smaller wafers in power electronics and semiconductor devices, particularly in electric vehicles and renewable energy applications, supports this demand. As SiC continues to gain traction in the power semiconductor sector, the demand for wafer thinning equipment for smaller wafer sizes is expected to increase.

Market Driving Factors

Expansion of the Electric Vehicle (EV) Market: SiC materials are particularly suitable for use in power modules for electric vehicles (EVs) due to their superior thermal conductivity and high voltage tolerance. With the rapid growth of the electric vehicle market, the demand for SiC wafers is increasing, which in turn drives the demand for wafer thinning equipment.

Advances in Energy Conversion and Storage Technologies: In high-efficiency energy conversion and storage fields, such as solar inverters and battery management systems, the use of SiC materials can significantly improve efficiency. The market's demand for high-performance components has driven the production and thinning of SiC wafers.

Demand for 5G and High-Frequency Electronics: The demand for SiC materials is rising in 5G networks and other high-frequency electronic devices due to SiC's excellent performance in high-frequency and high-power applications. This has led to an increase in the demand for SiC wafer production and processing equipment.

Market Restraints

Process Complexity: The wafer thinning process for SiC wafers involves high-precision techniques and is technically challenging. The instability of the process may lead to quality issues, affecting market confidence.

Intensifying Competition: As the SiC market rapidly develops, more companies are entering the field, and market competition is becoming increasingly intense. This may lead to price wars and margin compression.

Technological Iteration: With the fast pace of technological updates, the introduction of new technologies and equipment may quickly render existing equipment obsolete. Companies need to continue investing in research and development to maintain competitiveness.

Report Scope

This report aims to provide a comprehensive presentation of the global market for SiC Wafer Thinning Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Thinning Equipment.

The SiC Wafer Thinning Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global SiC Wafer Thinning Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the SiC Wafer Thinning Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of SiC Wafer Thinning Equipment Market Report

Report Metric	Details
Report Name	SiC Wafer Thinning Equipment Market
Accounted market size in year	US$ 114 million
Forecasted market size in 2031	US$ 338 million
CAGR	17.1%
Base Year	year
Forecasted years	2025 - 2031
by Type	Full-Automatic Semi-Automatic
by Application	6 Inch and Below 8 Inch and Above
Production by Region	North America Europe China Japan
Consumption by Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Asia-Pacific (China, Japan, South Korea, Taiwan) Southeast Asia (India) Latin America (Mexico, Brazil)
By Company	Disco, TSD, TOKYO SEIMITSU, Engis Corporation, Okamoto Semiconductor Equipment Division, Revasum, Koyo Machinery, G&N
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of SiC Wafer Thinning Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of SiC Wafer Thinning Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of SiC Wafer Thinning Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

FAQ for this report

How fast is SiC Wafer Thinning Equipment Market growing?

Ans: The SiC Wafer Thinning Equipment Market witnessing a CAGR of 17.1% during the forecast period 2025-2031.

What is the SiC Wafer Thinning Equipment Market size in 2031?

Ans: The SiC Wafer Thinning Equipment Market size in 2031 will be US$ 338 million.

What is the SiC Wafer Thinning Equipment Market share by region?

Ans: The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share.

What is the market share of major companies in SiC Wafer Thinning Equipment Market?

Ans: In 2023, the global top five players had a share approximately 81% in terms of revenue.

Who are the main players in the SiC Wafer Thinning Equipment Market report?

Ans: The main players in the SiC Wafer Thinning Equipment Market are Disco, TSD, TOKYO SEIMITSU, Engis Corporation, Okamoto Semiconductor Equipment Division, Revasum, Koyo Machinery, G&N

What are the Application segmentation covered in the SiC Wafer Thinning Equipment Market report?

Ans: The Applications covered in the SiC Wafer Thinning Equipment Market report are 6 Inch and Below, 8 Inch and Above

What are the Type segmentation covered in the SiC Wafer Thinning Equipment Market report?

Ans: The Types covered in the SiC Wafer Thinning Equipment Market report are Full-Automatic, Semi-Automatic

1 SiC Wafer Thinning Equipment Market Overview

1.1 Product Definition

1.2 SiC Wafer Thinning Equipment by Type

1.2.1 Global SiC Wafer Thinning Equipment Market Value Growth Rate Analysis by Type: 2024 VS 2031

1.2.2 Full-Automatic

1.2.3 Semi-Automatic

1.3 SiC Wafer Thinning Equipment by Application

1.3.1 Global SiC Wafer Thinning Equipment Market Value Growth Rate Analysis by Application: 2024 VS 2031

1.3.2 6 Inch and Below

1.3.3 8 Inch and Above

1.4 Global Market Growth Prospects

1.4.1 Global SiC Wafer Thinning Equipment Production Value Estimates and Forecasts (2020-2031)

1.4.2 Global SiC Wafer Thinning Equipment Production Capacity Estimates and Forecasts (2020-2031)

1.4.3 Global SiC Wafer Thinning Equipment Production Estimates and Forecasts (2020-2031)

1.4.4 Global SiC Wafer Thinning Equipment Market Average Price Estimates and Forecasts (2020-2031)

1.5 Assumptions and Limitations

2 Market Competition by Manufacturers

2.1 Global SiC Wafer Thinning Equipment Production Market Share by Manufacturers (2020-2025)

2.2 Global SiC Wafer Thinning Equipment Production Value Market Share by Manufacturers (2020-2025)

2.3 Global Key Players of SiC Wafer Thinning Equipment, Industry Ranking, 2023 VS 2024

2.4 Global SiC Wafer Thinning Equipment Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

2.5 Global SiC Wafer Thinning Equipment Average Price by Manufacturers (2020-2025)

2.6 Global Key Manufacturers of SiC Wafer Thinning Equipment, Manufacturing Base Distribution and Headquarters

2.7 Global Key Manufacturers of SiC Wafer Thinning Equipment, Product Offered and Application

2.8 Global Key Manufacturers of SiC Wafer Thinning Equipment, Date of Enter into This Industry

2.9 SiC Wafer Thinning Equipment Market Competitive Situation and Trends

2.9.1 SiC Wafer Thinning Equipment Market Concentration Rate

2.9.2 Global 5 and 10 Largest SiC Wafer Thinning Equipment Players Market Share by Revenue

2.10 Mergers & Acquisitions, Expansion

3 SiC Wafer Thinning Equipment Production by Region

3.1 Global SiC Wafer Thinning Equipment Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.2 Global SiC Wafer Thinning Equipment Production Value by Region (2020-2031)

3.2.1 Global SiC Wafer Thinning Equipment Production Value by Region (2020-2025)

3.2.2 Global Forecasted Production Value of SiC Wafer Thinning Equipment by Region (2026-2031)

3.3 Global SiC Wafer Thinning Equipment Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

3.4 Global SiC Wafer Thinning Equipment Production Volume by Region (2020-2031)

3.4.1 Global SiC Wafer Thinning Equipment Production by Region (2020-2025)

3.4.2 Global Forecasted Production of SiC Wafer Thinning Equipment by Region (2026-2031)

3.5 Global SiC Wafer Thinning Equipment Market Price Analysis by Region (2020-2025)

3.6 Global SiC Wafer Thinning Equipment Production and Value, Year-over-Year Growth

3.6.1 North America SiC Wafer Thinning Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.2 Europe SiC Wafer Thinning Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.3 China SiC Wafer Thinning Equipment Production Value Estimates and Forecasts (2020-2031)

3.6.4 Japan SiC Wafer Thinning Equipment Production Value Estimates and Forecasts (2020-2031)

4 SiC Wafer Thinning Equipment Consumption by Region

4.1 Global SiC Wafer Thinning Equipment Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031

4.2 Global SiC Wafer Thinning Equipment Consumption by Region (2020-2031)

4.2.1 Global SiC Wafer Thinning Equipment Consumption by Region (2020-2025)

4.2.2 Global SiC Wafer Thinning Equipment Forecasted Consumption by Region (2026-2031)

4.3 North America

4.3.1 North America SiC Wafer Thinning Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.3.2 North America SiC Wafer Thinning Equipment Consumption by Country (2020-2031)

4.3.3 U.S.

4.3.4 Canada

4.4 Europe

4.4.1 Europe SiC Wafer Thinning Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.4.2 Europe SiC Wafer Thinning Equipment Consumption by Country (2020-2031)

4.4.3 Germany

4.4.4 France

4.4.5 U.K.

4.4.6 Italy

4.4.7 Netherlands

4.5 Asia Pacific

4.5.1 Asia Pacific SiC Wafer Thinning Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031

4.5.2 Asia Pacific SiC Wafer Thinning Equipment Consumption by Region (2020-2031)

4.5.3 China

4.5.4 Japan

4.5.5 South Korea

4.5.6 China Taiwan

4.5.7 Southeast Asia

4.5.8 India

4.6 Latin America, Middle East & Africa

4.6.1 Latin America, Middle East & Africa SiC Wafer Thinning Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031

4.6.2 Latin America, Middle East & Africa SiC Wafer Thinning Equipment Consumption by Country (2020-2031)

4.6.3 Mexico

4.6.4 Brazil

4.6.5 Turkey

4.6.6 GCC Countries

5 Segment by Type

5.1 Global SiC Wafer Thinning Equipment Production by Type (2020-2031)

5.1.1 Global SiC Wafer Thinning Equipment Production by Type (2020-2025)

5.1.2 Global SiC Wafer Thinning Equipment Production by Type (2026-2031)

5.1.3 Global SiC Wafer Thinning Equipment Production Market Share by Type (2020-2031)

5.2 Global SiC Wafer Thinning Equipment Production Value by Type (2020-2031)

5.2.1 Global SiC Wafer Thinning Equipment Production Value by Type (2020-2025)

5.2.2 Global SiC Wafer Thinning Equipment Production Value by Type (2026-2031)

5.2.3 Global SiC Wafer Thinning Equipment Production Value Market Share by Type (2020-2031)

5.3 Global SiC Wafer Thinning Equipment Price by Type (2020-2031)

6 Segment by Application

6.1 Global SiC Wafer Thinning Equipment Production by Application (2020-2031)

6.1.1 Global SiC Wafer Thinning Equipment Production by Application (2020-2025)

6.1.2 Global SiC Wafer Thinning Equipment Production by Application (2026-2031)

6.1.3 Global SiC Wafer Thinning Equipment Production Market Share by Application (2020-2031)

6.2 Global SiC Wafer Thinning Equipment Production Value by Application (2020-2031)

6.2.1 Global SiC Wafer Thinning Equipment Production Value by Application (2020-2025)

6.2.2 Global SiC Wafer Thinning Equipment Production Value by Application (2026-2031)

6.2.3 Global SiC Wafer Thinning Equipment Production Value Market Share by Application (2020-2031)

6.3 Global SiC Wafer Thinning Equipment Price by Application (2020-2031)

7 Key Companies Profiled

7.1 Disco

7.1.1 Disco SiC Wafer Thinning Equipment Company Information

7.1.2 Disco SiC Wafer Thinning Equipment Product Portfolio

7.1.3 Disco SiC Wafer Thinning Equipment Production, Value, Price and Gross Margin (2020-2025)

7.1.4 Disco Main Business and Markets Served

7.1.5 Disco Recent Developments/Updates

7.2 TSD

7.2.1 TSD SiC Wafer Thinning Equipment Company Information

7.2.2 TSD SiC Wafer Thinning Equipment Product Portfolio

7.2.3 TSD SiC Wafer Thinning Equipment Production, Value, Price and Gross Margin (2020-2025)

7.2.4 TSD Main Business and Markets Served

7.2.5 TSD Recent Developments/Updates

7.3 TOKYO SEIMITSU

7.3.1 TOKYO SEIMITSU SiC Wafer Thinning Equipment Company Information

7.3.2 TOKYO SEIMITSU SiC Wafer Thinning Equipment Product Portfolio

7.3.3 TOKYO SEIMITSU SiC Wafer Thinning Equipment Production, Value, Price and Gross Margin (2020-2025)

7.3.4 TOKYO SEIMITSU Main Business and Markets Served

7.3.5 TOKYO SEIMITSU Recent Developments/Updates

7.4 Engis Corporation

7.4.1 Engis Corporation SiC Wafer Thinning Equipment Company Information

7.4.2 Engis Corporation SiC Wafer Thinning Equipment Product Portfolio

7.4.3 Engis Corporation SiC Wafer Thinning Equipment Production, Value, Price and Gross Margin (2020-2025)

7.4.4 Engis Corporation Main Business and Markets Served

7.4.5 Engis Corporation Recent Developments/Updates

7.5 Okamoto Semiconductor Equipment Division

7.5.1 Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Company Information

7.5.2 Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Product Portfolio

7.5.3 Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Production, Value, Price and Gross Margin (2020-2025)

7.5.4 Okamoto Semiconductor Equipment Division Main Business and Markets Served

7.5.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates

7.6 Revasum

7.6.1 Revasum SiC Wafer Thinning Equipment Company Information

7.6.2 Revasum SiC Wafer Thinning Equipment Product Portfolio

7.6.3 Revasum SiC Wafer Thinning Equipment Production, Value, Price and Gross Margin (2020-2025)

7.6.4 Revasum Main Business and Markets Served

7.6.5 Revasum Recent Developments/Updates

7.7 Koyo Machinery

7.7.1 Koyo Machinery SiC Wafer Thinning Equipment Company Information

7.7.2 Koyo Machinery SiC Wafer Thinning Equipment Product Portfolio

7.7.3 Koyo Machinery SiC Wafer Thinning Equipment Production, Value, Price and Gross Margin (2020-2025)

7.7.4 Koyo Machinery Main Business and Markets Served

7.7.5 Koyo Machinery Recent Developments/Updates

7.8 G&N

7.8.1 G&N SiC Wafer Thinning Equipment Company Information

7.8.2 G&N SiC Wafer Thinning Equipment Product Portfolio

7.8.3 G&N SiC Wafer Thinning Equipment Production, Value, Price and Gross Margin (2020-2025)

7.8.4 G&N Main Business and Markets Served

7.8.5 G&N Recent Developments/Updates

8 Industry Chain and Sales Channels Analysis

8.1 SiC Wafer Thinning Equipment Industry Chain Analysis

8.2 SiC Wafer Thinning Equipment Raw Material Supply Analysis

8.2.1 Key Raw Materials

8.2.2 Raw Materials Key Suppliers

8.3 SiC Wafer Thinning Equipment Production Mode & Process Analysis

8.4 SiC Wafer Thinning Equipment Sales and Marketing

8.4.1 SiC Wafer Thinning Equipment Sales Channels

8.4.2 SiC Wafer Thinning Equipment Distributors

8.5 SiC Wafer Thinning Equipment Customer Analysis

9 SiC Wafer Thinning Equipment Market Dynamics

9.1 SiC Wafer Thinning Equipment Industry Trends

9.2 SiC Wafer Thinning Equipment Market Drivers

9.3 SiC Wafer Thinning Equipment Market Challenges

9.4 SiC Wafer Thinning Equipment Market Restraints

10 Research Findings and Conclusion

11 Methodology and Data Source

11.1 Methodology/Research Approach

11.1.1 Research Programs/Design

11.1.2 Market Size Estimation

11.1.3 Market Breakdown and Data Triangulation

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Author List

11.4 Disclaimer

FEATURED COMPANIES

List of Tables

Table 1. Global SiC Wafer Thinning Equipment Market Value by Type, (US$ Million) & (2024 VS 2031)

Table 2. Global SiC Wafer Thinning Equipment Market Value by Application, (US$ Million) & (2024 VS 2031)

Table 3. Global SiC Wafer Thinning Equipment Production Capacity (Units) by Manufacturers in 2024

Table 4. Global SiC Wafer Thinning Equipment Production by Manufacturers (2020-2025) & (Units)

Table 5. Global SiC Wafer Thinning Equipment Production Market Share by Manufacturers (2020-2025)

Table 6. Global SiC Wafer Thinning Equipment Production Value by Manufacturers (2020-2025) & (US$ Million)

Table 7. Global SiC Wafer Thinning Equipment Production Value Share by Manufacturers (2020-2025)

Table 8. Global Key Players of SiC Wafer Thinning Equipment, Industry Ranking, 2023 VS 2024

Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in SiC Wafer Thinning Equipment as of 2024)

Table 10. Global Market SiC Wafer Thinning Equipment Average Price by Manufacturers (US$/Unit) & (2020-2025)

Table 11. Global Key Manufacturers of SiC Wafer Thinning Equipment, Manufacturing Base Distribution and Headquarters

Table 12. Global Key Manufacturers of SiC Wafer Thinning Equipment, Product Offered and Application

Table 13. Global Key Manufacturers of SiC Wafer Thinning Equipment, Date of Enter into This Industry

Table 14. Global SiC Wafer Thinning Equipment Manufacturers Market Concentration Ratio (CR5 and HHI)

Table 15. Mergers & Acquisitions, Expansion Plans

Table 16. Global SiC Wafer Thinning Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Table 17. Global SiC Wafer Thinning Equipment Production Value (US$ Million) by Region (2020-2025)

Table 18. Global SiC Wafer Thinning Equipment Production Value Market Share by Region (2020-2025)

Table 19. Global SiC Wafer Thinning Equipment Production Value (US$ Million) Forecast by Region (2026-2031)

Table 20. Global SiC Wafer Thinning Equipment Production Value Market Share Forecast by Region (2026-2031)

Table 21. Global SiC Wafer Thinning Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Table 22. Global SiC Wafer Thinning Equipment Production (Units) by Region (2020-2025)

Table 23. Global SiC Wafer Thinning Equipment Production Market Share by Region (2020-2025)

Table 24. Global SiC Wafer Thinning Equipment Production (Units) Forecast by Region (2026-2031)

Table 25. Global SiC Wafer Thinning Equipment Production Market Share Forecast by Region (2026-2031)

Table 26. Global SiC Wafer Thinning Equipment Market Average Price (US$/Unit) by Region (2020-2025)

Table 27. Global SiC Wafer Thinning Equipment Market Average Price (US$/Unit) by Region (2026-2031)

Table 28. Global SiC Wafer Thinning Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 29. Global SiC Wafer Thinning Equipment Consumption by Region (2020-2025) & (Units)

Table 30. Global SiC Wafer Thinning Equipment Consumption Market Share by Region (2020-2025)

Table 31. Global SiC Wafer Thinning Equipment Forecasted Consumption by Region (2026-2031) & (Units)

Table 32. Global SiC Wafer Thinning Equipment Forecasted Consumption Market Share by Region (2026-2031)

Table 33. North America SiC Wafer Thinning Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 34. North America SiC Wafer Thinning Equipment Consumption by Country (2020-2025) & (Units)

Table 35. North America SiC Wafer Thinning Equipment Consumption by Country (2026-2031) & (Units)

Table 36. Europe SiC Wafer Thinning Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 37. Europe SiC Wafer Thinning Equipment Consumption by Country (2020-2025) & (Units)

Table 38. Europe SiC Wafer Thinning Equipment Consumption by Country (2026-2031) & (Units)

Table 39. Asia Pacific SiC Wafer Thinning Equipment Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Units)

Table 40. Asia Pacific SiC Wafer Thinning Equipment Consumption by Region (2020-2025) & (Units)

Table 41. Asia Pacific SiC Wafer Thinning Equipment Consumption by Region (2026-2031) & (Units)

Table 42. Latin America, Middle East & Africa SiC Wafer Thinning Equipment Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (Units)

Table 43. Latin America, Middle East & Africa SiC Wafer Thinning Equipment Consumption by Country (2020-2025) & (Units)

Table 44. Latin America, Middle East & Africa SiC Wafer Thinning Equipment Consumption by Country (2026-2031) & (Units)

Table 45. Global SiC Wafer Thinning Equipment Production (Units) by Type (2020-2025)

Table 46. Global SiC Wafer Thinning Equipment Production (Units) by Type (2026-2031)

Table 47. Global SiC Wafer Thinning Equipment Production Market Share by Type (2020-2025)

Table 48. Global SiC Wafer Thinning Equipment Production Market Share by Type (2026-2031)

Table 49. Global SiC Wafer Thinning Equipment Production Value (US$ Million) by Type (2020-2025)

Table 50. Global SiC Wafer Thinning Equipment Production Value (US$ Million) by Type (2026-2031)

Table 51. Global SiC Wafer Thinning Equipment Production Value Market Share by Type (2020-2025)

Table 52. Global SiC Wafer Thinning Equipment Production Value Market Share by Type (2026-2031)

Table 53. Global SiC Wafer Thinning Equipment Price (US$/Unit) by Type (2020-2025)

Table 54. Global SiC Wafer Thinning Equipment Price (US$/Unit) by Type (2026-2031)

Table 55. Global SiC Wafer Thinning Equipment Production (Units) by Application (2020-2025)

Table 56. Global SiC Wafer Thinning Equipment Production (Units) by Application (2026-2031)

Table 57. Global SiC Wafer Thinning Equipment Production Market Share by Application (2020-2025)

Table 58. Global SiC Wafer Thinning Equipment Production Market Share by Application (2026-2031)

Table 59. Global SiC Wafer Thinning Equipment Production Value (US$ Million) by Application (2020-2025)

Table 60. Global SiC Wafer Thinning Equipment Production Value (US$ Million) by Application (2026-2031)

Table 61. Global SiC Wafer Thinning Equipment Production Value Market Share by Application (2020-2025)

Table 62. Global SiC Wafer Thinning Equipment Production Value Market Share by Application (2026-2031)

Table 63. Global SiC Wafer Thinning Equipment Price (US$/Unit) by Application (2020-2025)

Table 64. Global SiC Wafer Thinning Equipment Price (US$/Unit) by Application (2026-2031)

Table 65. Disco SiC Wafer Thinning Equipment Company Information

Table 66. Disco SiC Wafer Thinning Equipment Specification and Application

Table 67. Disco SiC Wafer Thinning Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 68. Disco Main Business and Markets Served

Table 69. Disco Recent Developments/Updates

Table 70. TSD SiC Wafer Thinning Equipment Company Information

Table 71. TSD SiC Wafer Thinning Equipment Specification and Application

Table 72. TSD SiC Wafer Thinning Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 73. TSD Main Business and Markets Served

Table 74. TSD Recent Developments/Updates

Table 75. TOKYO SEIMITSU SiC Wafer Thinning Equipment Company Information

Table 76. TOKYO SEIMITSU SiC Wafer Thinning Equipment Specification and Application

Table 77. TOKYO SEIMITSU SiC Wafer Thinning Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 78. TOKYO SEIMITSU Main Business and Markets Served

Table 79. TOKYO SEIMITSU Recent Developments/Updates

Table 80. Engis Corporation SiC Wafer Thinning Equipment Company Information

Table 81. Engis Corporation SiC Wafer Thinning Equipment Specification and Application

Table 82. Engis Corporation SiC Wafer Thinning Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 83. Engis Corporation Main Business and Markets Served

Table 84. Engis Corporation Recent Developments/Updates

Table 85. Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Company Information

Table 86. Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Specification and Application

Table 87. Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 88. Okamoto Semiconductor Equipment Division Main Business and Markets Served

Table 89. Okamoto Semiconductor Equipment Division Recent Developments/Updates

Table 90. Revasum SiC Wafer Thinning Equipment Company Information

Table 91. Revasum SiC Wafer Thinning Equipment Specification and Application

Table 92. Revasum SiC Wafer Thinning Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 93. Revasum Main Business and Markets Served

Table 94. Revasum Recent Developments/Updates

Table 95. Koyo Machinery SiC Wafer Thinning Equipment Company Information

Table 96. Koyo Machinery SiC Wafer Thinning Equipment Specification and Application

Table 97. Koyo Machinery SiC Wafer Thinning Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 98. Koyo Machinery Main Business and Markets Served

Table 99. Koyo Machinery Recent Developments/Updates

Table 100. G&N SiC Wafer Thinning Equipment Company Information

Table 101. G&N SiC Wafer Thinning Equipment Specification and Application

Table 102. G&N SiC Wafer Thinning Equipment Production (Units), Value (US$ Million), Price (US$/Unit) and Gross Margin (2020-2025)

Table 103. G&N Main Business and Markets Served

Table 104. G&N Recent Developments/Updates

Table 105. Key Raw Materials Lists

Table 106. Raw Materials Key Suppliers Lists

Table 107. SiC Wafer Thinning Equipment Distributors List

Table 108. SiC Wafer Thinning Equipment Customers List

Table 109. SiC Wafer Thinning Equipment Market Trends

Table 110. SiC Wafer Thinning Equipment Market Drivers

Table 111. SiC Wafer Thinning Equipment Market Challenges

Table 112. SiC Wafer Thinning Equipment Market Restraints

Table 113. Research Programs/Design for This Report

Table 114. Key Data Information from Secondary Sources

Table 115. Key Data Information from Primary Sources

Table 116. Authors List of This Report

List of Figures

Figure 1. Product Picture of SiC Wafer Thinning Equipment

Figure 2. Global SiC Wafer Thinning Equipment Market Value by Type, (US$ Million) & (2020-2031)

Figure 3. Global SiC Wafer Thinning Equipment Market Share by Type: 2024 VS 2031

Figure 4. Full-Automatic Product Picture

Figure 5. Semi-Automatic Product Picture

Figure 6. Global SiC Wafer Thinning Equipment Market Value by Application, (US$ Million) & (2020-2031)

Figure 7. Global SiC Wafer Thinning Equipment Market Share by Application: 2024 VS 2031

Figure 8. 6 Inch and Below

Figure 9. 8 Inch and Above

Figure 10. Global SiC Wafer Thinning Equipment Production Value (US$ Million), 2020 VS 2024 VS 2031

Figure 11. Global SiC Wafer Thinning Equipment Production Value (US$ Million) & (2020-2031)

Figure 12. Global SiC Wafer Thinning Equipment Production Capacity (Units) & (2020-2031)

Figure 13. Global SiC Wafer Thinning Equipment Production (Units) & (2020-2031)

Figure 14. Global SiC Wafer Thinning Equipment Average Price (US$/Unit) & (2020-2031)

Figure 15. SiC Wafer Thinning Equipment Report Years Considered

Figure 16. SiC Wafer Thinning Equipment Production Share by Manufacturers in 2024

Figure 17. Global SiC Wafer Thinning Equipment Production Value Share by Manufacturers (2024)

Figure 18. SiC Wafer Thinning Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024

Figure 19. The Global 5 and 10 Largest Players: Market Share by SiC Wafer Thinning Equipment Revenue in 2024

Figure 20. Global SiC Wafer Thinning Equipment Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)

Figure 21. Global SiC Wafer Thinning Equipment Production Value Market Share by Region: 2020 VS 2024 VS 2031

Figure 22. Global SiC Wafer Thinning Equipment Production Comparison by Region: 2020 VS 2024 VS 2031 (Units)

Figure 23. Global SiC Wafer Thinning Equipment Production Market Share by Region: 2020 VS 2024 VS 2031

Figure 24. North America SiC Wafer Thinning Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 25. Europe SiC Wafer Thinning Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 26. China SiC Wafer Thinning Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 27. Japan SiC Wafer Thinning Equipment Production Value (US$ Million) Growth Rate (2020-2031)

Figure 28. Global SiC Wafer Thinning Equipment Consumption by Region: 2020 VS 2024 VS 2031 (Units)

Figure 29. Global SiC Wafer Thinning Equipment Consumption Market Share by Region: 2020 VS 2024 VS 2031

Figure 30. North America SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 31. North America SiC Wafer Thinning Equipment Consumption Market Share by Country (2020-2031)

Figure 32. U.S. SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 33. Canada SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 34. Europe SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 35. Europe SiC Wafer Thinning Equipment Consumption Market Share by Country (2020-2031)

Figure 36. Germany SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 37. France SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 38. U.K. SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 39. Italy SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 40. Netherlands SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 41. Asia Pacific SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 42. Asia Pacific SiC Wafer Thinning Equipment Consumption Market Share by Region (2020-2031)

Figure 43. China SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 44. Japan SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 45. South Korea SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 46. China Taiwan SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 47. Southeast Asia SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 48. India SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 49. Latin America, Middle East & Africa SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 50. Latin America, Middle East & Africa SiC Wafer Thinning Equipment Consumption Market Share by Country (2020-2031)

Figure 51. Mexico SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 52. Brazil SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 53. Turkey SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 54. GCC Countries SiC Wafer Thinning Equipment Consumption and Growth Rate (2020-2031) & (Units)

Figure 55. Global Production Market Share of SiC Wafer Thinning Equipment by Type (2020-2031)

Figure 56. Global Production Value Market Share of SiC Wafer Thinning Equipment by Type (2020-2031)

Figure 57. Global SiC Wafer Thinning Equipment Price (US$/Unit) by Type (2020-2031)

Figure 58. Global Production Market Share of SiC Wafer Thinning Equipment by Application (2020-2031)

Figure 59. Global Production Value Market Share of SiC Wafer Thinning Equipment by Application (2020-2031)

Figure 60. Global SiC Wafer Thinning Equipment Price (US$/Unit) by Application (2020-2031)

Figure 61. SiC Wafer Thinning Equipment Value Chain

Figure 62. Channels of Distribution (Direct Vs Distribution)

Figure 63. Bottom-up and Top-down Approaches for This Report

Figure 64. Data Triangulation

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