3D TSV or silicon through-hole technology is one of the important technologies used in the semiconductor industry.A silicon through-hole is an electrical connection that passes vertically through a stack of silicon wafers or chips.3D TSV replaces 2D packaging techniques such as lead bonding and flip chip.It is widely used to improve non-memory and CMOS logic functions and memory in electronic devices such as tablets, smartphones and televisions.TSV is an enhanced performance interconnection, made of a columnar structure of silicon, copper, tungsten or polysilicon, that can be electrically interlinked via silicon chips or wafers.In the 2.5d structure, the bare sheet is not assembled on the bare sheet.

The global 3D TSV and 2.5D market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.

North American market for 3D TSV and 2.5D is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

Asia-Pacific market for 3D TSV and 2.5D is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

The global market for 3D TSV and 2.5D in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

The major global companies of 3D TSV and 2.5D include Toshiba, Taiwan Semiconductor, Samsung Electronics, Pure Storage, ASE Group, Amkor Technology, United Microelectronics, STMicroelectronics and Broadcom, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

This report aims to provide a comprehensive presentation of the global market for 3D TSV and 2.5D, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D TSV and 2.5D.

Report Scope

The 3D TSV and 2.5D market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D TSV and 2.5D market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the 3D TSV and 2.5D companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

Scope of TSV and 2.5D Market Report

Report Metric	Details
Report Name	TSV and 2.5D Market
Segment by Type	Memory MEMS CMOS Image Sensors Imaging and Optoelectronics Advanced LED Packaging Others
Segment by Application	Consumer Electronics Information and Communication Technology Automotive Military Aerospace and Defense Other
By Region	North America (United States, Canada) Europe (Germany, France, UK, Italy, Russia) Rest of Europe Nordic Countries Asia-Pacific (China, Japan, South Korea) Southeast Asia (India, Australia) Rest of Asia Latin America (Mexico, Brazil) Rest of Latin America Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of MEA)
By Company	Toshiba, Taiwan Semiconductor, Samsung Electronics, Pure Storage, ASE Group, Amkor Technology, United Microelectronics, STMicroelectronics, Broadcom, Intel Corporation, Jiangsu Changing Electronics Technology
Forecast units	USD million in value
Report coverage	Revenue and volume forecast, company share, competitive landscape, growth factors and trends

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D TSV and 2.5D companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

FAQ for this report

Who are the main players in the TSV and 2.5D Market report?

Ans: The main players in the TSV and 2.5D Market are Toshiba, Taiwan Semiconductor, Samsung Electronics, Pure Storage, ASE Group, Amkor Technology, United Microelectronics, STMicroelectronics, Broadcom, Intel Corporation, Jiangsu Changing Electronics Technology

What are the Application segmentation covered in the TSV and 2.5D Market report?

Ans: The Applications covered in the TSV and 2.5D Market report are Consumer Electronics, Information and Communication Technology, Automotive, Military, Aerospace and Defense, Other

What are the Type segmentation covered in the TSV and 2.5D Market report?

Ans: The Types covered in the TSV and 2.5D Market report are Memory, MEMS, CMOS Image Sensors, Imaging and Optoelectronics, Advanced LED Packaging, Others

1 Report Overview

1.1 Study Scope

1.2 Market Analysis by Type

1.2.1 Global 3D TSV and 2.5D Market Size Growth Rate by Type: 2019 VS 2023 VS 2030

1.2.2 Memory

1.2.3 MEMS

1.2.4 CMOS Image Sensors

1.2.5 Imaging and Optoelectronics

1.2.6 Advanced LED Packaging

1.2.7 Others

1.3 Market by Application

1.3.1 Global 3D TSV and 2.5D Market Growth by Application: 2019 VS 2023 VS 2030

1.3.2 Consumer Electronics

1.3.3 Information and Communication Technology

1.3.4 Automotive

1.3.5 Military

1.3.6 Aerospace and Defense

1.3.7 Other

1.4 Study Objectives

1.5 Years Considered

1.6 Years Considered

2 Global Growth Trends

2.1 Global 3D TSV and 2.5D Market Perspective (2019-2030)

2.2 3D TSV and 2.5D Growth Trends by Region

2.2.1 Global 3D TSV and 2.5D Market Size by Region: 2019 VS 2023 VS 2030

2.2.2 3D TSV and 2.5D Historic Market Size by Region (2019-2024)

2.2.3 3D TSV and 2.5D Forecasted Market Size by Region (2025-2030)

2.3 3D TSV and 2.5D Market Dynamics

2.3.1 3D TSV and 2.5D Industry Trends

2.3.2 3D TSV and 2.5D Market Drivers

2.3.3 3D TSV and 2.5D Market Challenges

2.3.4 3D TSV and 2.5D Market Restraints

3 Competition Landscape by Key Players

3.1 Global Top 3D TSV and 2.5D Players by Revenue

3.1.1 Global Top 3D TSV and 2.5D Players by Revenue (2019-2024)

3.1.2 Global 3D TSV and 2.5D Revenue Market Share by Players (2019-2024)

3.2 Global 3D TSV and 2.5D Market Share by Company Type (Tier 1, Tier 2, and Tier 3)

3.3 Players Covered: Ranking by 3D TSV and 2.5D Revenue

3.4 Global 3D TSV and 2.5D Market Concentration Ratio

3.4.1 Global 3D TSV and 2.5D Market Concentration Ratio (CR5 and HHI)

3.4.2 Global Top 10 and Top 5 Companies by 3D TSV and 2.5D Revenue in 2023

3.5 3D TSV and 2.5D Key Players Head office and Area Served

3.6 Key Players 3D TSV and 2.5D Product Solution and Service

3.7 Date of Enter into 3D TSV and 2.5D Market

3.8 Mergers & Acquisitions, Expansion Plans

4 3D TSV and 2.5D Breakdown Data by Type

4.1 Global 3D TSV and 2.5D Historic Market Size by Type (2019-2024)

4.2 Global 3D TSV and 2.5D Forecasted Market Size by Type (2025-2030)

5 3D TSV and 2.5D Breakdown Data by Application

5.1 Global 3D TSV and 2.5D Historic Market Size by Application (2019-2024)

5.2 Global 3D TSV and 2.5D Forecasted Market Size by Application (2025-2030)

6 North America

6.1 North America 3D TSV and 2.5D Market Size (2019-2030)

6.2 North America 3D TSV and 2.5D Market Growth Rate by Country: 2019 VS 2023 VS 2030

6.3 North America 3D TSV and 2.5D Market Size by Country (2019-2024)

6.4 North America 3D TSV and 2.5D Market Size by Country (2025-2030)

6.5 United States

6.6 Canada

7 Europe

7.1 Europe 3D TSV and 2.5D Market Size (2019-2030)

7.2 Europe 3D TSV and 2.5D Market Growth Rate by Country: 2019 VS 2023 VS 2030

7.3 Europe 3D TSV and 2.5D Market Size by Country (2019-2024)

7.4 Europe 3D TSV and 2.5D Market Size by Country (2025-2030)

7.5 Germany

7.6 France

7.7 U.K.

7.8 Italy

7.9 Russia

7.10 Nordic Countries

8 Asia-Pacific

8.1 Asia-Pacific 3D TSV and 2.5D Market Size (2019-2030)

8.2 Asia-Pacific 3D TSV and 2.5D Market Growth Rate by Region: 2019 VS 2023 VS 2030

8.3 Asia-Pacific 3D TSV and 2.5D Market Size by Region (2019-2024)

8.4 Asia-Pacific 3D TSV and 2.5D Market Size by Region (2025-2030)

8.5 China

8.6 Japan

8.7 South Korea

8.8 Southeast Asia

8.9 India

8.10 Australia

9 Latin America

9.1 Latin America 3D TSV and 2.5D Market Size (2019-2030)

9.2 Latin America 3D TSV and 2.5D Market Growth Rate by Country: 2019 VS 2023 VS 2030

9.3 Latin America 3D TSV and 2.5D Market Size by Country (2019-2024)

9.4 Latin America 3D TSV and 2.5D Market Size by Country (2025-2030)

9.5 Mexico

9.6 Brazil

10 Middle East & Africa

10.1 Middle East & Africa 3D TSV and 2.5D Market Size (2019-2030)

10.2 Middle East & Africa 3D TSV and 2.5D Market Growth Rate by Country: 2019 VS 2023 VS 2030

10.3 Middle East & Africa 3D TSV and 2.5D Market Size by Country (2019-2024)

10.4 Middle East & Africa 3D TSV and 2.5D Market Size by Country (2025-2030)

10.5 Turkey

10.6 Saudi Arabia

10.7 UAE

11 Key Players Profiles

11.1 Toshiba

11.1.1 Toshiba Company Detail

11.1.2 Toshiba Business Overview

11.1.3 Toshiba 3D TSV and 2.5D Introduction

11.1.4 Toshiba Revenue in 3D TSV and 2.5D Business (2019-2024)

11.1.5 Toshiba Recent Development

11.2 Taiwan Semiconductor

11.2.1 Taiwan Semiconductor Company Detail

11.2.2 Taiwan Semiconductor Business Overview

11.2.3 Taiwan Semiconductor 3D TSV and 2.5D Introduction

11.2.4 Taiwan Semiconductor Revenue in 3D TSV and 2.5D Business (2019-2024)

11.2.5 Taiwan Semiconductor Recent Development

11.3 Samsung Electronics

11.3.1 Samsung Electronics Company Detail

11.3.2 Samsung Electronics Business Overview

11.3.3 Samsung Electronics 3D TSV and 2.5D Introduction

11.3.4 Samsung Electronics Revenue in 3D TSV and 2.5D Business (2019-2024)

11.3.5 Samsung Electronics Recent Development

11.4 Pure Storage

11.4.1 Pure Storage Company Detail

11.4.2 Pure Storage Business Overview

11.4.3 Pure Storage 3D TSV and 2.5D Introduction

11.4.4 Pure Storage Revenue in 3D TSV and 2.5D Business (2019-2024)

11.4.5 Pure Storage Recent Development

11.5 ASE Group

11.5.1 ASE Group Company Detail

11.5.2 ASE Group Business Overview

11.5.3 ASE Group 3D TSV and 2.5D Introduction

11.5.4 ASE Group Revenue in 3D TSV and 2.5D Business (2019-2024)

11.5.5 ASE Group Recent Development

11.6 Amkor Technology

11.6.1 Amkor Technology Company Detail

11.6.2 Amkor Technology Business Overview

11.6.3 Amkor Technology 3D TSV and 2.5D Introduction

11.6.4 Amkor Technology Revenue in 3D TSV and 2.5D Business (2019-2024)

11.6.5 Amkor Technology Recent Development

11.7 United Microelectronics

11.7.1 United Microelectronics Company Detail

11.7.2 United Microelectronics Business Overview

11.7.3 United Microelectronics 3D TSV and 2.5D Introduction

11.7.4 United Microelectronics Revenue in 3D TSV and 2.5D Business (2019-2024)

11.7.5 United Microelectronics Recent Development

11.8 STMicroelectronics

11.8.1 STMicroelectronics Company Detail

11.8.2 STMicroelectronics Business Overview

11.8.3 STMicroelectronics 3D TSV and 2.5D Introduction

11.8.4 STMicroelectronics Revenue in 3D TSV and 2.5D Business (2019-2024)

11.8.5 STMicroelectronics Recent Development

11.9 Broadcom

11.9.1 Broadcom Company Detail

11.9.2 Broadcom Business Overview

11.9.3 Broadcom 3D TSV and 2.5D Introduction

11.9.4 Broadcom Revenue in 3D TSV and 2.5D Business (2019-2024)

11.9.5 Broadcom Recent Development

11.10 Intel Corporation

11.10.1 Intel Corporation Company Detail

11.10.2 Intel Corporation Business Overview

11.10.3 Intel Corporation 3D TSV and 2.5D Introduction

11.10.4 Intel Corporation Revenue in 3D TSV and 2.5D Business (2019-2024)

11.10.5 Intel Corporation Recent Development

11.11 Jiangsu Changing Electronics Technology

11.11.1 Jiangsu Changing Electronics Technology Company Detail

11.11.2 Jiangsu Changing Electronics Technology Business Overview

11.11.3 Jiangsu Changing Electronics Technology 3D TSV and 2.5D Introduction

11.11.4 Jiangsu Changing Electronics Technology Revenue in 3D TSV and 2.5D Business (2019-2024)

11.11.5 Jiangsu Changing Electronics Technology Recent Development

12 Analyst's Viewpoints/Conclusions

13 Appendix

13.1 Research Methodology

13.1.1 Methodology/Research Approach

13.1.2 Data Source

13.2 Disclaimer

13.3 Author Details

FEATURED COMPANIES

United Microelectronics

STMicroelectronics

Broadcom

Intel Corporation

Jiangsu Changing Electronics Technology

List of Tables

Table 1. Global 3D TSV and 2.5D Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030

Table 2. Key Players of Memory

Table 3. Key Players of MEMS

Table 4. Key Players of CMOS Image Sensors

Table 5. Key Players of Imaging and Optoelectronics

Table 6. Key Players of Advanced LED Packaging

Table 7. Key Players of Others

Table 8. Global 3D TSV and 2.5D Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030

Table 9. Global 3D TSV and 2.5D Market Size by Region (US$ Million): 2019 VS 2023 VS 2030

Table 10. Global 3D TSV and 2.5D Market Size by Region (2019-2024) & (US$ Million)

Table 11. Global 3D TSV and 2.5D Market Share by Region (2019-2024)

Table 12. Global 3D TSV and 2.5D Forecasted Market Size by Region (2025-2030) & (US$ Million)

Table 13. Global 3D TSV and 2.5D Market Share by Region (2025-2030)

Table 14. 3D TSV and 2.5D Market Trends

Table 15. 3D TSV and 2.5D Market Drivers

Table 16. 3D TSV and 2.5D Market Challenges

Table 17. 3D TSV and 2.5D Market Restraints

Table 18. Global 3D TSV and 2.5D Revenue by Players (2019-2024) & (US$ Million)

Table 19. Global 3D TSV and 2.5D Market Share by Players (2019-2024)

Table 20. Global Top 3D TSV and 2.5D Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D TSV and 2.5D as of 2023)

Table 21. Ranking of Global Top 3D TSV and 2.5D Companies by Revenue (US$ Million) in 2023

Table 22. Global 5 Largest Players Market Share by 3D TSV and 2.5D Revenue (CR5 and HHI) & (2019-2024)

Table 23. Key Players Headquarters and Area Served

Table 24. Key Players 3D TSV and 2.5D Product Solution and Service

Table 25. Date of Enter into 3D TSV and 2.5D Market

Table 26. Mergers & Acquisitions, Expansion Plans

Table 27. Global 3D TSV and 2.5D Market Size by Type (2019-2024) & (US$ Million)

Table 28. Global 3D TSV and 2.5D Revenue Market Share by Type (2019-2024)

Table 29. Global 3D TSV and 2.5D Forecasted Market Size by Type (2025-2030) & (US$ Million)

Table 30. Global 3D TSV and 2.5D Revenue Market Share by Type (2025-2030)

Table 31. Global 3D TSV and 2.5D Market Size by Application (2019-2024) & (US$ Million)

Table 32. Global 3D TSV and 2.5D Revenue Market Share by Application (2019-2024)

Table 33. Global 3D TSV and 2.5D Forecasted Market Size by Application (2025-2030) & (US$ Million)

Table 34. Global 3D TSV and 2.5D Revenue Market Share by Application (2025-2030)

Table 35. North America 3D TSV and 2.5D Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 36. North America 3D TSV and 2.5D Market Size by Country (2019-2024) & (US$ Million)

Table 37. North America 3D TSV and 2.5D Market Size by Country (2025-2030) & (US$ Million)

Table 38. Europe 3D TSV and 2.5D Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 39. Europe 3D TSV and 2.5D Market Size by Country (2019-2024) & (US$ Million)

Table 40. Europe 3D TSV and 2.5D Market Size by Country (2025-2030) & (US$ Million)

Table 41. Asia-Pacific 3D TSV and 2.5D Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030

Table 42. Asia-Pacific 3D TSV and 2.5D Market Size by Region (2019-2024) & (US$ Million)

Table 43. Asia-Pacific 3D TSV and 2.5D Market Size by Region (2025-2030) & (US$ Million)

Table 44. Latin America 3D TSV and 2.5D Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 45. Latin America 3D TSV and 2.5D Market Size by Country (2019-2024) & (US$ Million)

Table 46. Latin America 3D TSV and 2.5D Market Size by Country (2025-2030) & (US$ Million)

Table 47. Middle East & Africa 3D TSV and 2.5D Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030

Table 48. Middle East & Africa 3D TSV and 2.5D Market Size by Country (2019-2024) & (US$ Million)

Table 49. Middle East & Africa 3D TSV and 2.5D Market Size by Country (2025-2030) & (US$ Million)

Table 50. Toshiba Company Detail

Table 51. Toshiba Business Overview

Table 52. Toshiba 3D TSV and 2.5D Product

Table 53. Toshiba Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 54. Toshiba Recent Development

Table 55. Taiwan Semiconductor Company Detail

Table 56. Taiwan Semiconductor Business Overview

Table 57. Taiwan Semiconductor 3D TSV and 2.5D Product

Table 58. Taiwan Semiconductor Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 59. Taiwan Semiconductor Recent Development

Table 60. Samsung Electronics Company Detail

Table 61. Samsung Electronics Business Overview

Table 62. Samsung Electronics 3D TSV and 2.5D Product

Table 63. Samsung Electronics Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 64. Samsung Electronics Recent Development

Table 65. Pure Storage Company Detail

Table 66. Pure Storage Business Overview

Table 67. Pure Storage 3D TSV and 2.5D Product

Table 68. Pure Storage Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 69. Pure Storage Recent Development

Table 70. ASE Group Company Detail

Table 71. ASE Group Business Overview

Table 72. ASE Group 3D TSV and 2.5D Product

Table 73. ASE Group Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 74. ASE Group Recent Development

Table 75. Amkor Technology Company Detail

Table 76. Amkor Technology Business Overview

Table 77. Amkor Technology 3D TSV and 2.5D Product

Table 78. Amkor Technology Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 79. Amkor Technology Recent Development

Table 80. United Microelectronics Company Detail

Table 81. United Microelectronics Business Overview

Table 82. United Microelectronics 3D TSV and 2.5D Product

Table 83. United Microelectronics Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 84. United Microelectronics Recent Development

Table 85. STMicroelectronics Company Detail

Table 86. STMicroelectronics Business Overview

Table 87. STMicroelectronics 3D TSV and 2.5D Product

Table 88. STMicroelectronics Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 89. STMicroelectronics Recent Development

Table 90. Broadcom Company Detail

Table 91. Broadcom Business Overview

Table 92. Broadcom 3D TSV and 2.5D Product

Table 93. Broadcom Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 94. Broadcom Recent Development

Table 95. Intel Corporation Company Detail

Table 96. Intel Corporation Business Overview

Table 97. Intel Corporation 3D TSV and 2.5D Product

Table 98. Intel Corporation Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 99. Intel Corporation Recent Development

Table 100. Jiangsu Changing Electronics Technology Company Detail

Table 101. Jiangsu Changing Electronics Technology Business Overview

Table 102. Jiangsu Changing Electronics Technology 3D TSV and 2.5D Product

Table 103. Jiangsu Changing Electronics Technology Revenue in 3D TSV and 2.5D Business (2019-2024) & (US$ Million)

Table 104. Jiangsu Changing Electronics Technology Recent Development

Table 105. Research Programs/Design for This Report

Table 106. Key Data Information from Secondary Sources

Table 107. Key Data Information from Primary Sources

List of Figures

Figure 1. Global 3D TSV and 2.5D Market Size Comparison by Type (2024-2030) & (US$ Million)

Figure 2. Global 3D TSV and 2.5D Market Share by Type: 2023 VS 2030

Figure 3. Memory Features

Figure 4. MEMS Features

Figure 5. CMOS Image Sensors Features

Figure 6. Imaging and Optoelectronics Features

Figure 7. Advanced LED Packaging Features

Figure 8. Others Features

Figure 9. Global 3D TSV and 2.5D Market Size Comparison by Application (2024-2030) & (US$ Million)

Figure 10. Global 3D TSV and 2.5D Market Share by Application: 2023 VS 2030

Figure 11. Consumer Electronics Case Studies

Figure 12. Information and Communication Technology Case Studies

Figure 13. Automotive Case Studies

Figure 14. Military Case Studies

Figure 15. Aerospace and Defense Case Studies

Figure 16. Other Case Studies

Figure 17. 3D TSV and 2.5D Report Years Considered

Figure 18. Global 3D TSV and 2.5D Market Size (US$ Million), Year-over-Year: 2019-2030

Figure 19. Global 3D TSV and 2.5D Market Size, (US$ Million), 2019 VS 2023 VS 2030

Figure 20. Global 3D TSV and 2.5D Market Share by Region: 2023 VS 2030

Figure 21. Global 3D TSV and 2.5D Market Share by Players in 2023

Figure 22. Global Top 3D TSV and 2.5D Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D TSV and 2.5D as of 2023)

Figure 23. The Top 10 and 5 Players Market Share by 3D TSV and 2.5D Revenue in 2023

Figure 24. North America 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 25. North America 3D TSV and 2.5D Market Share by Country (2019-2030)

Figure 26. United States 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 27. Canada 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 28. Europe 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 29. Europe 3D TSV and 2.5D Market Share by Country (2019-2030)

Figure 30. Germany 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 31. France 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 32. U.K. 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 33. Italy 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 34. Russia 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 35. Nordic Countries 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 36. Asia-Pacific 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 37. Asia-Pacific 3D TSV and 2.5D Market Share by Region (2019-2030)

Figure 38. China 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 39. Japan 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 40. South Korea 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 41. Southeast Asia 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 42. India 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 43. Australia 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 44. Latin America 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 45. Latin America 3D TSV and 2.5D Market Share by Country (2019-2030)

Figure 46. Mexico 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 47. Brazil 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 48. Middle East & Africa 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 49. Middle East & Africa 3D TSV and 2.5D Market Share by Country (2019-2030)

Figure 50. Turkey 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 51. Saudi Arabia 3D TSV and 2.5D Market Size YoY Growth (2019-2030) & (US$ Million)

Figure 52. Toshiba Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 53. Taiwan Semiconductor Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 54. Samsung Electronics Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 55. Pure Storage Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 56. ASE Group Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 57. Amkor Technology Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 58. United Microelectronics Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 59. STMicroelectronics Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 60. Broadcom Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 61. Intel Corporation Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 62. Jiangsu Changing Electronics Technology Revenue Growth Rate in 3D TSV and 2.5D Business (2019-2024)

Figure 63. Bottom-up and Top-down Approaches for This Report

Figure 64. Data Triangulation

Figure 65. Key Executives Interviewed

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Global 3D TSV and 2.5D Market Research Report 2024

Published Date: February 2024

Report Code: QYRE-Auto-33I9383

Global 3D TSV and 2.5D Market Research Report 2024

FEATURED COMPANIES

TSV and 2.5D Market

Report Scope

Scope of TSV and 2.5D Market Report

Chapter Outline

FAQ for this report

Who are the main players in the TSV and 2.5D Market report?

What are the Application segmentation covered in the TSV and 2.5D Market report?

What are the Type segmentation covered in the TSV and 2.5D Market report?

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